Precise single-crystal corundum resin bond grinding wheel

Abstract

The utility model belongs to abrasive disc technical field especially relates to a kind of precision single-crystal corundum resin bond abrasive disc, including annular matrix, transition ring, positioning ring and mounting ring, transition ring, positioning ring and mounting ring are sequentially arranged from outside to inside at the center position of annular matrix, and the annular matrix is adhesively fixed with transition ring, the transition ring is adhesively fixed with positioning ring, the positioning ring is adhesively fixed with mounting ring;By setting chip removal groove and grinding groove, the chip generated during the grinding process of annular matrix to object can be effectively excluded, avoid the adverse effect of chip on grinding process, by setting multiple heat dissipation holes, the large amount of heat generated during the grinding process of annular matrix to object can be quickly dissipated, reduce the heating degree of the device during use, improve the service life of the device.

Description

Technical Field

[0001] This utility model belongs to the field of grinding wheel technology, and in particular relates to a precision single-crystal corundum resin-bonded grinding wheel. Background Technology

[0002] Grinding wheels are important cutting tools used in grinding machines, primarily made of abrasive materials. The suitability of the grinding wheel selection directly affects the grinding performance and machining accuracy of the grinding machine; therefore, the grinding wheel is a crucial factor in maximizing the performance of a grinding machine. When determining the specifications of the grinding wheel, the main factors to consider are: the workpiece material and hardness, grinding parameters and accuracy requirements, grinding method, grinding wheel speed, grinding contact area, and the intensity of the grinding process.

[0003] There are many types of grinding wheels, in various shapes and sizes. Due to differences in abrasive materials, bonding agents, and manufacturing processes, different grinding wheels have different working properties. Each grinding wheel has a specific range of applications based on its characteristics. Therefore, during grinding, it is essential to select the appropriate grinding wheel according to the specific circumstances; otherwise, improper selection will directly affect machining accuracy, surface roughness, and production efficiency.

[0004] For example, Chinese patent CN217097330U discloses a durable grinding wheel, including a grinding wheel assembly and a support plate, and further includes a fixing mechanism connected to the support plate for fixing the grinding wheel assembly. The fixing mechanism includes an elastic element, a guide post, a pressing plate, and a limiting component. The guide post is fixedly connected to the pressing plate, and the guide post slides in a limiting groove on the support plate. The guide post is connected to the limiting component, and the elastic element is located in the limiting groove and fixedly connected to the support plate and the guide post. This utility model belongs to the field of grinding wheel technology. The mechanism of this utility model can reasonably utilize the elastic element to provide a reaction force to the pressing plate. This reaction force pushes the pressing plate to press against the inner wall of the grinding wheel assembly, thereby achieving rapid fixing and installation of the grinding wheel assembly. Moreover, the grinding wheel assembly has three types of grinding wheels, enabling the device to be used in different working environments.

[0005] This patent has several drawbacks in its application. For example, when the grinding wheel grinds an object, it generates debris and a large amount of heat. The grinding wheel in this patent cannot effectively guide the debris generated during grinding, causing it to easily bounce back between the object and the grinding wheel, resulting in secondary grinding. This secondary grinding inevitably requires reprocessing the object, reducing grinding accuracy and processing efficiency. Furthermore, the grinding wheel in this patent cannot effectively dissipate the heat generated by friction during grinding. After prolonged use, the grinding wheel's temperature rises sharply, its hardness decreases, and over time, its lifespan cannot be effectively guaranteed. Therefore, we propose a precision single-crystal corundum resin-bonded grinding wheel. Utility Model Content

[0006] The purpose of this invention is to provide a precision single-crystal corundum resin-bonded grinding wheel to solve the problems mentioned in the background art.

[0007] In view of this, the present invention provides a precision single-crystal corundum resin-bonded grinding wheel, comprising:

[0008] The annular base comprises a transition ring, a positioning ring, and a mounting ring. From the outside to the inside, the transition ring, positioning ring, and mounting ring are sequentially arranged at the center of the annular base. The annular base is bonded and fixed to the transition ring, the transition ring is bonded and fixed to the positioning ring, and the positioning ring is bonded and fixed to the mounting ring. The upper and lower surfaces of the annular base are symmetrically provided with chip removal grooves distributed at equal intervals around the circumference. A grinding section is provided on the circumferential sidewall of the annular base, and the grinding section has multiple grinding grooves, each of which is connected to two corresponding upper and lower chip removal grooves. The upper and lower sides of the grinding section are provided with inclined angles.

[0009] A heat dissipation mechanism is provided on the annular base and near the grinding part, and is used to quickly dissipate the heat generated by the annular base during the grinding process.

[0010] In the above technical solution, the heat dissipation mechanism further includes:

[0011] Multiple heat dissipation holes are formed on an annular base and are distributed at equal intervals around the circumference. The heat dissipation holes have a circular hole structure and the diameter of the heat dissipation holes ranges from 5 to 10 mm.

[0012] In the above technical solution, the chip removal groove has a structure that is wider on the inside and narrower on the outside. The width of the outer end of the chip removal groove is 2-3 mm, the width of the inner end of the chip removal groove is 5-6 mm, and the depth of the chip removal groove is 10-15 mm.

[0013] In the above technical solution, a plurality of uniformly distributed reinforcing holes are further provided on the annular base and located between two adjacent chip removal grooves. The reinforcing holes have a regular pentagonal structure and the inner diameter of the reinforcing holes ranges from 13 to 16 mm.

[0014] In the above technical solution, the tilt angle is further defined as 20°-30°.

[0015] In the above technical solution, further, the annular base is provided with symmetrical grooves at the center, and the circumferential sidewall of the transition ring is provided with a slot corresponding to the convex edge formed by the two grooves, and the slot is engaged and fixed with the convex edge.

[0016] In the above technical solution, the positioning ring is further provided with a plurality of positioning holes that are distributed circumferentially at equal intervals.

[0017] The beneficial effects of this utility model are:

[0018] 1. This precision single-crystal corundum resin-bonded grinding wheel, by setting chip removal grooves and grinding grooves, can effectively remove the chips generated during the grinding process of the annular matrix, thus avoiding the adverse effects of chips on the grinding process.

[0019] 2. This precision single-crystal corundum resin-bonded grinding wheel, with multiple heat dissipation holes, can quickly dissipate the large amount of heat generated during the grinding of the annular substrate, reducing the heat generation of the device during use and extending its service life. Attached Figure Description

[0020] Figure 1 One of the overall structural schematic diagrams of this utility model (oblique view);

[0021] Figure 2 This is the second schematic diagram of the overall structure of this utility model (top view);

[0022] Figure 3 This is an exploded view of the overall structure of this utility model.

[0023] The markings in the diagram are as follows:

[0024] 1. Annular base; 2. Transition ring; 3. Positioning ring; 4. Mounting ring; 5. Chip removal groove; 6. Grinding groove; 7. Reinforcing hole; 8. Grinding section; 9. Heat dissipation hole; 10. Groove; 11. Slot; 12. Positioning hole. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0026] In the description of this application, it should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. For ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items, and therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0027] It should be noted that the terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and are not limited in number; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character "" generally indicates that the preceding and following objects have an "or" relationship.

[0028] It should be noted that in the description of this application, the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application. The directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0029] It should be noted that, in this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples. Example

[0030] Please see Figure 1 - Figure 3 As shown, this embodiment provides a precision single-crystal corundum resin-bonded grinding wheel, comprising:

[0031] The annular base 1, transition ring 2, positioning ring 3, and mounting ring 4 are arranged sequentially from the outside to the inside at the center of the annular base 1. The annular base 1 is bonded and fixed to the transition ring 2, the transition ring 2 is bonded and fixed to the positioning ring 3, and the positioning ring 3 is bonded and fixed to the mounting ring 4. The upper and lower surfaces of the annular base 1 are symmetrically provided with chip removal grooves 5 distributed at equal intervals in a circle. The circumferential sidewall of the annular base 1 is provided with a grinding part 8. Multiple grinding grooves 6 are provided on the grinding part 8, and each grinding groove 6 is connected to the corresponding upper and lower chip removal grooves 5. The upper and lower sides of the grinding part 8 are provided with an inclined angle.

[0032] A heat dissipation mechanism is provided on the annular base 1 and near the grinding part 8, and is used to quickly dissipate the heat generated by the annular base 1 during the grinding process.

[0033] In this embodiment, the heat dissipation mechanism includes:

[0034] Multiple heat dissipation holes 9 are formed on the annular base 1 and are distributed at equal intervals around the circumference. The heat dissipation holes 9 have a circular hole structure and the diameter of the heat dissipation holes 9 ranges from 5 to 10 mm.

[0035] The working principle of this device is as follows:

[0036] During installation, this device is plugged into the output end of the grinding machine and fixed. This is existing technology and should be well known to those skilled in the art, so it will not be described in detail. When this device rotates, the grinding part 8 is aligned with the part of the object that needs to be ground and grinds it. During the rotation, the grinding chips generated are guided by the grinding groove 6 and enter the upper and lower chip removal grooves 5 respectively. They move from the outer end to the inner end of the chip removal groove 5 and are discharged at the end of the chip removal groove 5. At the same time, a large amount of heat generated by friction is dissipated through multiple heat dissipation holes 9.

[0037] It is worth noting that the annular matrix 1 is made by mixing single-crystal corundum abrasive, semi-brittle corundum, vanadium iron powder, chromium corundum abrasive, kyanite, boron carbide micro powder, silicon dioxide, black manganese ore, borax, diatomaceous earth, epoxy resin liquid, and celestite, followed by pressing, drying, and calcination. Furthermore, a fiber web is added to the raw materials in the annular matrix 1 during the mixing process. The fiber web is composed of multiple interwoven monofilaments. The specific manufacturing process of the grinding wheel is existing technology and should be well known to those skilled in the art. This application will not elaborate on it further. Example

[0038] This embodiment provides a precision single-crystal corundum resin-bonded grinding wheel. In addition to the technical solutions of the above embodiments, it also has the following technical features: the chip removal groove 5 has an inner wide and outer narrow structure, the width of the outer end of the chip removal groove 5 is 2-3mm, the width of the inner end of the chip removal groove 5 is 5-6mm, and the depth of the chip removal groove 5 is 10-15mm.

[0039] In this process, the chips enter the head of the chip discharge groove 5 at one of the outer sides through the grinding groove 6, and are squeezed along the inner wall of the chip discharge groove 5, thus being discharged from the inner end of the chip discharge groove 5.

[0040] By setting chip removal groove 5 and grinding groove 6, the chips generated by the annular substrate 1 during the grinding process of the object can be effectively removed, thus avoiding the adverse effects of chips on the grinding process. Example

[0041] This embodiment provides a precision single-crystal corundum resin-bonded grinding wheel. In addition to the technical solutions of the above embodiments, it also has the following technical features: a plurality of uniformly distributed reinforcing holes 7 are provided on the annular substrate 1 at the position between two adjacent chip removal grooves 5. The reinforcing holes 7 have a regular pentagonal structure and the inner diameter of the reinforcing holes 7 ranges from 13 to 16 mm.

[0042] By setting the reinforcing hole 7, the self-weight of the annular base 1 is effectively reduced, and the overall material loss of the device is reduced. At the same time, by setting the pentagonal structure, the stress generated by the annular base 1 during rotation can be released, thereby improving the structural strength and stability of the device. Example

[0043] This embodiment provides a precision single-crystal corundum resin-bonded grinding wheel, which, in addition to the technical solutions of the above embodiments, also has the following technical features: the tilt angle is 20°-30°.

[0044] The edge of the polishing part 8 is rounded.

[0045] By setting a reasonable tilt angle, the grinding accuracy of this device can be improved. Example

[0046] This embodiment provides a precision single-crystal corundum resin-bonded grinding wheel. In addition to the technical solutions of the above embodiments, it also has the following technical features: grooves 10 are symmetrically opened at the center of the annular base 1, and slots 11 corresponding to the convex edges formed by the two grooves 10 are opened on the circumferential sidewall of the transition ring 2. The slots 11 are engaged and fixed with the convex edges.

[0047] The structural stability of the device is improved by setting the slot 11 and the protruding edge. Example

[0048] This embodiment provides a precision single-crystal corundum resin-bonded grinding wheel, which, in addition to the technical solutions of the above embodiments, also has the following technical features: the positioning ring 3 has a plurality of positioning holes 12 distributed circumferentially at equal intervals.

[0049] The positioning hole 12 facilitates the positioning of the device when it is fixed to the grinding machine.

[0050] The embodiments of this application have been described above with reference to the accompanying drawings. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. This application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A precision single-crystal corundum resin-bonded grinding wheel, characterized in that, include: The annular base (1), transition ring (2), positioning ring (3) and mounting ring (4) are arranged sequentially from the outside to the inside at the center of the annular base (1). The annular base (1) is bonded and fixed to the transition ring (2), the transition ring (2) is bonded and fixed to the positioning ring (3), and the positioning ring (3) is bonded and fixed to the mounting ring (4). The upper and lower surfaces of the annular base (1) are symmetrically provided with chip removal grooves (5) distributed at equal intervals in a circle. The circumferential sidewall of the annular base (1) is provided with a grinding part (8). The grinding part (8) is provided with multiple grinding grooves (6), and each grinding groove (6) is connected to the corresponding upper and lower chip removal grooves (5). The upper and lower sides of the grinding part (8) are provided with an inclined angle. The heat dissipation mechanism is disposed on the annular base (1) and near the grinding part (8), and is used to quickly dissipate the heat generated by the annular base (1) during the grinding process.

2. The precision single-crystal corundum resin-bonded grinding wheel according to claim 1, characterized in that, The heat dissipation mechanism includes: Multiple heat dissipation holes (9) are formed on the annular base (1) and are distributed at equal intervals around the circumference. The heat dissipation holes (9) have a circular hole structure and the diameter of the heat dissipation holes (9) ranges from 5 to 10 mm.

3. The precision single-crystal corundum resin-bonded grinding wheel according to claim 1, characterized in that, The chip removal groove (5) has a structure that is wider on the inside and narrower on the outside. The width of the outer end of the chip removal groove (5) is 2-3 mm, the width of the inner end of the chip removal groove (5) is 5-6 mm, and the depth of the chip removal groove (5) is 10-15 mm.

4. The precision single-crystal corundum resin-bonded grinding wheel according to claim 1, characterized in that, Multiple uniformly distributed reinforcing holes (7) are provided on the annular base (1) and located between two adjacent chip removal grooves (5). The reinforcing holes (7) have a regular pentagonal structure and the inner diameter of the reinforcing holes (7) ranges from 13 to 16 mm.

5. A precision single-crystal corundum resin-bonded grinding wheel according to claim 1, characterized in that, The tilt angle is 20°-30°.

6. A precision single-crystal corundum resin-bonded grinding wheel according to claim 1, characterized in that, The annular base (1) has symmetrical grooves (10) at its center, and the circumferential sidewall of the transition ring (2) has a slot (11) corresponding to the convex edge formed by the two grooves (10), and the slot (11) is engaged and fixed with the convex edge.

7. A precision single-crystal corundum resin-bonded grinding wheel according to claim 1, characterized in that, The positioning ring (3) has multiple positioning holes (12) that are evenly spaced around the circumference.

Images