A semiconductor high-speed spin cleaning and drying apparatus

Abstract

The utility model discloses a kind of semiconductor high-speed rotary cleaning spin-drying equipment, it is related to semiconductor cleaning technical field, the semiconductor high-speed rotary cleaning spin-drying equipment includes driver housing, the upper of driver housing is movably connected with wafer bearing table, and the upper of wafer bearing table is also equipped with multi-arm cleaner;Wherein, wafer bearing table includes recessed platform, recessed platform is opened with recess, and the section is set as inverted T type, the bottom of the recessed platform is arranged with water leakage hole in annular array, and the side of the recessed platform is arranged with side drain in annular array;The utility model, when recessed platform drives wafer high-speed rotation, can carry out quick spin-drying to wafer, and water leakage hole in recessed platform and side drain in side, which are arranged, can carry out quick spin-drying to water mark on the bottom and side of wafer, to improve spin-drying effect, and wafer does not need to be turned over and spin-dried, improve the efficiency of cleaning and spin-drying.

Description

Technical Field

[0001] This utility model specifically relates to the field of semiconductor cleaning technology, and more specifically to a high-speed rotating cleaning and drying device for semiconductors. Background Technology

[0002] Semiconductor high-speed rotary cleaning and drying equipment is a key piece of equipment used in the semiconductor manufacturing process for cleaning and drying semiconductor wafers and other devices. It typically uses methods such as spraying, immersion, or ultrasonic waves to uniformly apply cleaning fluid to the surface of the semiconductor wafer. Through chemical reaction, physical adsorption, or mechanical scouring between the cleaning fluid and impurities on the wafer surface, contaminants such as particles, organic matter, and metal ions are removed from the wafer surface.

[0003] The spray system sprays high-pressure cleaning fluid into the wafer surface in the form of fine droplets. The impact force of the droplets and the chemical action of the cleaning fluid are used to clean impurities. During drying, as the rotating shaft accelerates, the liquid on the wafer surface moves towards the edge under the action of centrifugal force and is eventually thrown off the wafer surface, thus achieving rapid drying.

[0004] However, in practice, it has been noted that due to the centrifugal force generated during high-speed rotation, the wafer needs to be fixed during wafer cleaning. However, the fixed position cannot be used for spin drying. Furthermore, after spin drying on one side, the wafer needs to be flipped over and then spin dried again. Therefore, the wafer needs to be operated twice, on both sides, resulting in low spin drying efficiency. Utility Model Content

[0005] The purpose of this invention is to provide a high-speed rotating cleaning and drying device for semiconductors. This device uses a stage with an inverted T-shaped groove to position the high-speed rotating wafer. Furthermore, the stage has water outlet holes or channels on its sides and bottom, eliminating the need for flipping during drying and thus improving drying efficiency. This addresses the technical problems mentioned in the background section.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A high-speed rotating cleaning and drying device for semiconductors includes a driver housing, a wafer carrier stage movably connected above the driver housing, and a multi-arm cleaner above the wafer carrier stage.

[0008] The wafer carrier stage includes a groove stage, on which a groove with an inverted T-shaped cross-section is formed. The bottom of the groove stage has drainage holes arranged in a ring array, and the sides of the groove stage have side drainage outlets arranged in a ring array.

[0009] As a further technical solution of this utility model, the bottom of the groove platform is integrally provided with a rotating shaft, and the other end of the rotating shaft is fixedly connected to a drive gear. An external gear ring is driven and fitted on the outside of the drive gear, and an extension rod that is movably connected to the rotating shaft is provided between the groove platform and the drive gear.

[0010] As a further technical solution of this utility model, a rotary motor is fixedly connected to the inner side of the driver housing, and the end of the rotary motor is fixedly connected to the end of the extension rod away from the rotation axis, and the outer gear ring is fixedly connected to the top of the driver housing.

[0011] As a further technical solution of this utility model, a splash guard is fixedly connected to the top of the driver housing, and the splash guard is sleeved on the outside of the wafer carrier stage. An L-shaped rotating bracket is also movably connected to the driver housing.

[0012] As a further technical solution of this utility model, the end of the L-shaped rotating bracket is fixedly connected to a rotating protective shell, and the bottom of the rotating protective shell is rotatably engaged with the multi-arm cleaner.

[0013] As a further technical solution of this utility model, the multi-arm cleaner includes a hollow liquid collection seat. A hollow shaft is integrally provided on the upper part of the hollow liquid collection seat and is movably connected to the rotating protective shell. The end of the hollow shaft passes through the rotating protective shell and is fixedly connected to a liquid supply pipe. The other end of the liquid supply pipe passes through the rotating protective shell and extends to the side.

[0014] As a further technical solution of this utility model, the hollow liquid collection seat has hollow outward arms fixedly connected to its side in a ring array, and each hollow outward arm is fixedly connected to a cleaning nozzle below it. The hollow liquid collection seat is connected to the inner side of the hollow shaft and the hollow outward arm respectively.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] In this invention, when the extension rod rotates, the meshing between the drive gear and the external gear ring causes the grooved platform at the end of the extension rod to rotate along with the extension rod, while the grooved platform also rotates on its own axis at the end of the extension rod. Combined with the transmission ratio between the drive gear and the external gear ring, the rotation speed during the spin-drying of the semiconductor is increased, thereby improving the spin-drying effect of the semiconductor.

[0017] This invention allows the wafer to be quickly spun dry when the grooved platform drives the wafer to rotate at high speed. The drainage holes in the grooved platform and the side drainage outlets on the side can quickly spun dry the water stains on the bottom and sides of the wafer, thereby improving the spun-drying effect. Furthermore, it eliminates the need to flip the wafer to spun dry, thus improving the efficiency of cleaning and spun-drying.

[0018] This invention uses a hollow liquid collection seat to drive the hollow outward arm to rotate, which, together with a slowly rotating wafer carrier stage, allows for multi-angle cleaning of the wafer. Furthermore, since the wafer carrier stage and the multi-arm cleaner rotate in opposite directions, the wafer can be rinsed multiple times, thereby improving the cleaning effect. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of this utility model in use.

[0020] Figure 2 This utility model Figure 1 A magnified view of a portion of the image.

[0021] Figure 3 This is a three-dimensional structural diagram of the multi-arm cleaner in this utility model.

[0022] Figure 4 This utility model Figure 3 A magnified view of a portion of the image.

[0023] Figure 5 This is a three-dimensional structural diagram of the wafer carrier stage in this utility model.

[0024] Figure 6 This utility model Figure 5 A magnified view of a portion of the image.

[0025] Figure 7 This utility model Figure 5 A schematic diagram of the bottom structure.

[0026] In the picture:

[0027] Driver housing-1, splash guard-2, wafer stage-3, guide plate-31, recessed stage-32, drain hole-33, rotating shaft-34, drive gear-35, extension rod-36, external gear ring-37, side drain port-38, L-shaped rotating bracket-4, rotating protective housing-5, multi-arm cleaner-6, hollow liquid collection seat-61, hollow shaft-62, hollow outward arm-63, cleaning nozzle-64, liquid supply pipe-7. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Please see Figure 1-7This utility model provides a high-speed rotating cleaning and drying device for semiconductors, including a driver housing 1, a wafer carrier stage 3 movably connected above the driver housing 1, and a multi-arm cleaner 6 above the wafer carrier stage 3.

[0030] The wafer carrier stage 3 includes a groove stage 32, on which a groove with an inverted T-shaped cross section is formed. The bottom of the groove stage 32 has drainage holes 33 arranged in a ring array, and the side of the groove stage 32 has side drainage outlets 38 arranged in a ring array.

[0031] By adopting the above technical solution, the groove stage 32 can quickly spin-dry the wafer when it rotates at high speed. The drainage hole 33 in the groove stage 32 and the side drainage port 38 on the side can quickly spin-dry the water stains on the bottom and side of the wafer, thereby improving the spin-drying effect. Furthermore, it eliminates the need to flip the wafer for spin-drying, thus improving the efficiency of cleaning and spin-drying.

[0032] Furthermore, the bottom of the groove platform 32 is integrally provided with a rotating shaft 34, and the other end of the rotating shaft 34 is fixedly connected to a drive gear 35. The outer side of the drive gear 35 is engaged with an external gear ring 37, and an extension rod 36 that is movably connected to the rotating shaft 34 is provided between the groove platform 32 and the drive gear 35.

[0033] Furthermore, a rotary motor is fixedly connected to the inner side of the driver housing 1, and the end of the rotary motor is fixedly connected to the end of the extension rod 36 away from the rotation shaft 34, and the outer gear ring 37 is fixedly connected to the top of the driver housing 1.

[0034] By adopting the above technical solution, when the extension rod 36 rotates, the meshing between the drive gear 35 and the external gear ring 37 causes the groove platform 32 at the end of the extension rod 36 to rotate along with the extension rod 36, while the groove platform 32 also rotates on its own at the end of the extension rod 36. In conjunction with the transmission ratio between the drive gear 35 and the external gear ring 37, the rotation speed during the spin drying of the semiconductor is increased, thereby improving the spin drying effect of the semiconductor.

[0035] More specifically, a splash shield 2 is fixedly connected to the top of the driver housing 1, and the splash shield 2 is sleeved on the outside of the wafer carrier stage 3. An L-shaped rotating bracket 4 is also movably connected to the driver housing 1.

[0036] Furthermore, the end of the L-shaped rotating bracket 4 is fixedly connected to a rotating protective shell 5, and the bottom of the rotating protective shell 5 is rotatably engaged with the multi-arm cleaner 6.

[0037] Furthermore, the multi-arm cleaner 6 includes a hollow liquid collection seat 61. A hollow shaft 62 is integrally provided on the upper part of the hollow liquid collection seat 61 and is movably connected to the rotating protective housing 5. The end of the hollow shaft 62 passes through the rotating protective housing 5 and is fixedly connected to a liquid supply pipe 7. The other end of the liquid supply pipe 7 passes through the rotating protective housing 5 and extends to the side.

[0038] More specifically, the hollow liquid collecting seat 61 has hollow outward arms 63 fixedly connected to its side in a ring array, and each hollow outward arm 63 is fixedly connected to a cleaning nozzle 64 below it. The hollow liquid collecting seat 61 is connected to the hollow shaft 62 and the inner side of the hollow outward arm 63 respectively.

[0039] By adopting the above technical solution, the hollow liquid collection seat 61 drives the hollow outward arm 63 to rotate, which, together with the slowly rotating wafer carrier stage 3, allows for multi-angle cleaning of the wafer. Furthermore, since the wafer carrier stage 3 and the multi-arm cleaner 6 rotate in opposite directions, the wafer can be rinsed multiple times, thereby improving the cleaning effect of the wafer.

[0040] Furthermore, a servo motor is installed in the rotating protective housing 5, and the servo motor is in transmission cooperation with one end of the hollow shaft 62 extending to the inside of the rotating protective housing 5. The servo motor drives the hollow shaft 62 to rotate through the transmission cooperation.

[0041] Furthermore, a steering motor is fixedly connected to the inner side of the drive housing 1, and the end of the steering motor is fixedly connected to the L-shaped rotating bracket 4. The steering motor drives the L-shaped rotating bracket 4 to rotate above the drive housing 1.

[0042] The working principle of this utility model is as follows: During use, the wafer is first placed in the groove platform 32. Since the inner side of the groove platform 32 has an inverted T-shaped groove, the wafer is positioned. Then, the rotary motor in the driver housing 1 slowly drives the extension rod 36 to rotate. The groove platform 32 at the other end of the extension rod 36 rotates along with the extension rod 36 via a rotating shaft 34. The drive gear 35 at the other end of the rotating shaft 34 meshes with the external gear ring 37, causing the groove platform 32 to rotate while following the extension rod 36. Simultaneously, the water pump delivers cleaning fluid through the supply pipe 7 and the hollow shaft 62 into the hollow collection seat 61. The cleaning fluid then passes through the hollow outward extension arm 63 and the cleaning nozzle 64 to clean the wafer. Liquid is sprayed onto the wafer surface, and the servo motor in the rotating protective housing 5 drives the hollow shaft 62 to rotate through the transmission connection, thereby causing the multi-arm cleaner 6 to rotate and rinse as a whole. After rinsing, the water pump stops supplying liquid, and then the rotation speed of the rotating motor in the driver housing 1 increases. Through the transmission ratio between the drive gear 35 and the external gear ring 37, the groove platform 32 rotates at high speed. At this time, the drainage holes 33 and side drain ports 38 opened on the groove platform 32 can quickly drain the water stains that are spun out, improving the spin-drying effect. Moreover, it can spin-dry both the top and bottom sides at the same time without flipping, improving the efficiency of spin-drying. The structure is simple, the operation is very convenient, and it effectively reduces the intensity of manual labor.

[0043] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0044] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor high-speed rotary cleaning and drying device, characterized in that: Includes a driver housing (1), a wafer carrier stage (3) is movably connected above the driver housing (1), and a multi-arm cleaner (6) is also provided above the wafer carrier stage (3). Among them, the wafer carrier stage (3) includes a groove stage (32), on which a groove with an inverted T-shaped cross section is provided. The bottom of the groove stage (32) is provided with drainage holes (33) in a ring array, and the side of the groove stage (32) is provided with side drain outlets (38) in a ring array.

2. The semiconductor high-speed rotary cleaning and drying equipment according to claim 1, characterized in that: The bottom of the groove platform (32) is integrally provided with a rotating shaft (34), and the other end of the rotating shaft (34) is fixedly connected to a drive gear (35). The outer side of the drive gear (35) is driven by an external gear ring (37), and an extension rod (36) is provided between the groove platform (32) and the drive gear (35) and is movably connected to the rotating shaft (34).

3. The semiconductor high-speed rotary cleaning and drying equipment according to claim 2, characterized in that: A rotary motor is fixedly connected to the inner side of the drive housing (1), and the end of the rotary motor is fixedly connected to the end of the extension rod (36) away from the rotation axis (34), and the outer gear ring (37) is fixedly connected to the top of the drive housing (1).

4. The semiconductor high-speed rotary cleaning and drying equipment according to claim 3, characterized in that: A splash shield (2) is fixedly connected above the driver housing (1), and the splash shield (2) is sleeved on the outside of the wafer carrier stage (3). An L-shaped rotating bracket (4) is also movably connected to the driver housing (1).

5. The semiconductor high-speed rotary cleaning and drying equipment according to claim 4, characterized in that: The L-shaped rotating bracket (4) is fixedly connected to a rotating protective shell (5) at its end, and the bottom of the rotating protective shell (5) is rotatably engaged with the multi-arm cleaner (6).

6. The semiconductor high-speed rotary cleaning and drying equipment according to claim 5, characterized in that: The multi-arm cleaner (6) includes a hollow liquid collection seat (61), and a hollow shaft (62) is integrally provided on the upper part of the hollow liquid collection seat (61) and is movably connected to the rotating protective shell (5). The end of the hollow shaft (62) passes through the rotating protective shell (5) and is fixedly connected to a liquid supply pipe (7). The other end of the liquid supply pipe (7) passes through the rotating protective shell (5) and extends to the side.

7. The semiconductor high-speed rotary cleaning and drying equipment according to claim 6, characterized in that: The hollow liquid collection seat (61) has hollow outward arms (63) fixedly connected in a ring array on its side, and each hollow outward arm (63) is fixedly connected to a cleaning nozzle (64) below it. The hollow liquid collection seat (61) is connected to the hollow shaft (62) and the inner side of the hollow outward arm (63) respectively.

Images