Electrical power cabinet cooling device

Abstract

This utility model relates to the field of power cabinet technology, specifically a cooling device for electrical power cabinets. It includes an electrical power cabinet, double-leaf doors, a circuit breaker, and a main busbar compartment. The double-leaf doors are hinged and installed on both sides of the front of the electrical power cabinet. Air inlet and outlet grilles are provided on both the double-leaf doors and the rear sidewalls of the electrical power cabinet opposite the double-leaf doors. Two sets of semiconductor cooling blocks are symmetrically and detachably installed on both side walls of the electrical power cabinet. Power supply components are plugged into the bottom of the semiconductor cooling blocks, and the cooling ends of the semiconductor cooling blocks contact the side walls of the electrical power cabinet. Multiple sets of built-in heat-conducting strips are evenly distributed on the inner sidewalls of the electrical power cabinet, avoiding control components and other electrical structures. These built-in heat-conducting strips are thermally connected to the cooling ends of the semiconductor cooling blocks on both sides. This device is easy to install and disassemble, provides sufficient cooling and heat dissipation, is simple to operate, and saves resources.

Description

Technical Field

[0001] This utility model relates to the field of power cabinet technology, specifically a cooling device for electrical power cabinets. Background Technology

[0002] Electrical cabinets (also known as power distribution cabinets) are core devices in power systems used for distributing, controlling, and protecting electrical equipment. They are widely used in industries, construction, and energy sectors.

[0003] Existing power cabinets require cooling during operation. A common cooling method is to install a cooling fan inside the cabinet and use airflow to remove heat from the cabinet. However, this cooling method has a problem: in hot environments, the temperature of the gas generated by the cooling fan is too high to fully remove the heat inside the cabinet; in low-temperature environments, the temperature of the generated gas is almost the same as the external ambient temperature, so the effect is generally limited. Therefore, in view of the above-mentioned problems, this technical solution proposes a cooling device for electrical power cabinets. Utility Model Content

[0004] The purpose of this utility model is to provide a cooling device for electrical power cabinets to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: A cooling device for an electrical power cabinet includes an electrical power cabinet, double-leaf doors, a circuit breaker, and a main busbar compartment. The double-leaf doors are hinged and installed on both sides of the front of the electrical power cabinet. The circuit breaker is installed in the middle area inside the electrical power cabinet for short-circuit / overload protection. The main busbar compartment is located at the top inside the electrical power cabinet for connecting the main incoming cable and distributing power. A cable compartment is also located at the bottom inside for sealing the incoming and outgoing cables. Control elements (not shown in the figure) are located on the inner sides of the electrical power cabinet. Air inlet and outlet grilles (not shown in the figure) are provided on the double-leaf doors and the back side wall of the electrical power cabinet opposite the double-leaf doors. The electrical power cabinet is equipped with two sets of semiconductor cooling blocks that are symmetrically and detachably installed on both sides. The bottom of the semiconductor cooling blocks is plugged into the power supply components. The cooling end of the semiconductor cooling block contacts the side wall of the electrical power cabinet, transferring the low-temperature energy it generates to the interior of the electrical power cabinet for diffusion, thereby achieving a cooling effect. Multiple sets of built-in heat-conducting strips are evenly arranged on the inner side wall of the electrical power cabinet, avoiding electrical structures such as control components. The built-in heat-conducting strips are thermally connected to the cooling ends of the semiconductor cooling blocks on both sides, thereby rapidly and evenly diffusing the low-temperature energy generated by the semiconductor cooling blocks inside the electrical power cabinet, thus achieving an efficient cooling and heat dissipation function.

[0006] Compared with the prior art, the beneficial effects of this utility model are: by detachably installing semiconductor cooling blocks on both sides of the electrical power cabinet, the cooling function of the semiconductor cooling blocks is used in conjunction with the built-in heat-conducting strips set inside the electrical power cabinet to diffuse cold air towards the inside of the electrical power cabinet, and combined with the airflow of the cooling fan, the inside of the electrical power cabinet is cooled down fully and quickly. By detachably connecting the semiconductor cooling block to the electrical power cabinet, the cooling can be selectively installed based on the external ambient temperature without occupying much space in the electrical power cabinet, ensuring full utilization of resources and effective cooling of the interior of the electrical power cabinet. Attached Figure Description

[0007] Figure 1 This is a three-dimensional structural diagram of a cooling device for an electrical power cabinet.

[0008] Figure 2 This is a front view schematic diagram of the internal structure of a cooling device for an electrical power cabinet.

[0009] Figure 3 This is a three-dimensional structural diagram of a semiconductor cooling block in an electrical power cabinet cooling device.

[0010] Figure 4 This is a schematic diagram of the internal operation of a semiconductor cooling block in an electrical power cabinet cooling device.

[0011] Among them: electrical power cabinet 10, double-leaf cabinet door 11, circuit breaker 12, main busbar compartment 13, fan box 14, cooling fan 15, cooling mounting slot 16, heat transfer plate 17, built-in heat-conducting strip 18, power supply compartment 19, external socket 20, socket 21, power supply 22, card plate 23, magnetic block 24, telescopic wire 25, plug 26, card slot 27, magnetic metal block 28, semiconductor cooling block 29. Detailed Implementation

[0012] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0013] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0014] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0015] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0016] Please see Figures 1-4A cooling device for an electrical power cabinet includes an electrical power cabinet 10, double-leaf cabinet doors 11, a circuit breaker 12, and a main busbar compartment 13. The double-leaf cabinet doors 11 are hinged and installed on both sides of the front of the electrical power cabinet 10. The circuit breaker 12 is installed in the central area inside the electrical power cabinet 10 for short-circuit / overload protection. The main busbar compartment 13 is located at the top inside the electrical power cabinet 10 for connecting the main incoming cable and distributing electrical energy. A cable compartment is also provided at the bottom inside for sealing the incoming and outgoing lines. Control elements (not shown in the figure) are also provided on the inner sides of the electrical power cabinet 10. Air inlet and outlet grilles (not shown in the figure) are provided on the double-leaf cabinet doors 11 and the back side wall of the electrical power cabinet 10 opposite to the double-leaf cabinet doors 11. To facilitate the flow of gas inside and outside the electrical power cabinet 10, two sets of semiconductor cooling blocks 29 are symmetrically and detachably installed on both sides of the electrical power cabinet 10. The bottom of the semiconductor cooling block 29 is plugged into a power supply component. The cooling end of the semiconductor cooling block 29 contacts the side wall of the electrical power cabinet 10, transferring the low-temperature energy it generates to the interior of the electrical power cabinet 10 for diffusion, thereby achieving a cooling effect. Multiple sets of built-in heat-conducting strips 18 are evenly arranged on the inner side wall of the electrical power cabinet 10, avoiding electrical structures such as control components. The built-in heat-conducting strips 18 are thermally connected to the cooling ends of the semiconductor cooling blocks 29 on both sides, thereby rapidly and evenly diffusing the low-temperature energy generated by the semiconductor cooling blocks 29 inside the electrical power cabinet 10, thereby achieving an efficient cooling and heat dissipation function.

[0017] In this embodiment of the invention, a set of fan boxes 14 are installed at the top inside the electrical power cabinet 10. The bottom of the fan box 14 is set as a grid structure. A cooling fan 15 is installed inside the fan box 14. The output end of the cooling fan 15 is distributed towards the grid structure, that is, the gas generated by it diffuses from the top towards the inside of the electrical power cabinet 10. Combined with the low temperature output by the built-in heat-conducting strip 18, the internal temperature of the electrical power cabinet 10 is rapidly and fully cooled. The connections, specific distribution locations, and operating principles of the circuit breakers 12, main busbar compartment 13, control components, and other structures inside the electrical power cabinet 10 will not be elaborated here. When distributing them, they can be reasonably arranged with the built-in heat-conducting strips 18 and fan boxes 14 according to the actual situation.

[0018] In one embodiment of the present invention, a set of power compartments 19 are provided at the bottom of the electrical power cabinet 10. A power supply 22 is provided inside the power compartment 19. The power supply 22 is connected to an external socket 20 installed on the outer wall of the electrical power cabinet 10 below the semiconductor cooling block 29 via a connecting wire. A socket 21 is provided at the top center of the external socket 20. The socket 21 is electrically connected to the semiconductor cooling block 29 by a plug-in connection. The semiconductor cooling block 29 is configured as a side-mounted U-shaped structure, with symmetrically heat-insulated connecting plates 23 at both ends. Magnetic blocks 24 are installed at the ends of the plates 23. A slot 27 is provided on the outer wall of the electrical cabinet 10 corresponding to the plates 23. A magnetic metal block 28 is installed on the inner side of the slot 27 corresponding to the position of the magnetic block 24. The semiconductor cooling block 29 is securely installed on the outer wall of the electrical cabinet 10 by the engagement of the plates 23 and the slots 27, and the magnetic attraction between the magnetic blocks 24 and the magnetic metal block 28. At the same time, a heat transfer plate is provided on the side of the semiconductor cooling block 29 located on the same side as the plates 23. 17. The heat transfer plate 17 corresponds to the cooling end of the semiconductor cooling block 29. The low temperature generated at the cooling end is transferred through the heat transfer plate 17. The electrical power cabinet 10 between the two sets of slots 27 corresponding to the heat transfer plate 17 is provided with a cooling installation groove 16. After the card 23 is snapped into the slot 27, the heat transfer plate 17 simultaneously contacts and connects with the cooling installation groove 16. At the same time, the inner side of the cooling installation groove 16 is connected to the adjacent built-in heat-conducting plate strip 18 through the heat-conducting plate, thereby transferring the low temperature generated in the semiconductor cooling block 29 to the built-in heat-conducting plate strip 18, and then diffusing and cooling towards the inside of the electrical power cabinet 10. The bottom of the semiconductor cooling block 29 is connected to a telescopic wire 25, and the bottom end of the telescopic wire 25 is connected to a plug 26, which is plugged into the socket 21. Specifically, the internal operating principle of the semiconductor cooling block 29 is as follows: After the semiconductor cooling block (29) is installed on the outer wall of the electrical power cabinet (10), the cooling end of the semiconductor cooling block (29) faces the electrical power cabinet (10) and forms a thermally conductive connection with the built-in thermally conductive strip (18) through the heat transfer plate (17), the cooling mounting groove (16) and the heat-conducting plate, so as to transfer the low temperature generated by the cooling end to the interior of the electrical power cabinet (10); the hot end of the semiconductor cooling block (29) is located on the side of the semiconductor cooling block (29) away from the electrical power cabinet (10), and the heat generated by the hot end is discharged towards the external environment of the electrical power cabinet (10). Thus, the cold end of the semiconductor cooling block (29) forms a cooling path with the interior of the electrical power cabinet (10), and the hot end forms a heat dissipation path with the exterior of the electrical power cabinet (10), avoiding the heat from the hot end entering the interior of the electrical power cabinet (10) and affecting the cooling effect; After power is applied: Electrons flow from the N-type semiconductor to the P-type semiconductor, absorbing heat at the cold end (cooling).

[0019] Holes flow from the P-type semiconductor to the N-type semiconductor, releasing heat at the hot end (a heat sink is required).

[0020] Heat transfer: The cold end contacts the heat transfer plate 17 of the target object and absorbs its heat.

[0021] Heat is discharged from the outside of the hot end.

[0022] The operating principle of the semiconductor cooling block 29 is described simply. Since it is existing technology, the details will not be elaborated here.

[0023] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A cooling device for an electrical power cabinet, characterized in that, The device includes an electrical power cabinet (10), a double-leaf cabinet door (11), a circuit breaker (12), and a main busbar compartment (13). The double-leaf cabinet door (11) is hinged and installed on both sides of the front of the electrical power cabinet (10). The circuit breaker (12) is installed in the middle area inside the electrical power cabinet (10). The main busbar compartment (13) is located at the top inside the electrical power cabinet (10), and a cable compartment is provided at the bottom inside. Control elements are provided on the side inside the electrical power cabinet (10). Air inlet and outlet grilles are provided on the double-leaf cabinet door (11) and the back side wall of the electrical power cabinet (10) opposite to the double-leaf cabinet door (11). 0) Two sets of semiconductor cooling blocks (29) are symmetrically and detachably installed on both sides. The bottom of the semiconductor cooling block (29) is connected to the power supply component. The cooling end of the semiconductor cooling block (29) faces the electrical power cabinet (10) and is in thermal contact with the side wall of the electrical power cabinet (10). The hot end of the semiconductor cooling block (29) is located on the side away from the electrical power cabinet (10) and dissipates heat towards the outside of the electrical power cabinet (10). Multiple sets of built-in heat-conducting strips (18) are evenly arranged on the inner side wall of the electrical power cabinet (10) away from the electrical structure. The built-in heat-conducting strips (18) are thermally connected to the cooling ends of the semiconductor cooling blocks (29) on both sides.

2. The electrical power cabinet cooling device according to claim 1, characterized in that, A set of fan boxes (14) is installed on the top of the electrical power cabinet (10). The bottom of the fan box (14) is set as a grid structure. A cooling fan (15) is installed inside the fan box (14). The output end of the cooling fan (15) is distributed towards the grid structure.

3. The electrical power cabinet cooling device according to claim 2, characterized in that, The electrical power cabinet (10) has a set of power compartments (19) at the bottom. The power compartments (19) are equipped with power supplies (22). The power supplies (22) are connected to an external socket (20) installed on the outer wall of the electrical power cabinet (10) below the semiconductor cooling block (29) via connecting wires. The external socket (20) has a socket (21) at the top center. The socket (21) is electrically connected to the semiconductor cooling block (29) by plugging in.

4. The electrical power cabinet cooling device according to claim 3, characterized in that, The semiconductor cooling block (29) is configured as a side-mounted U-shaped structure with symmetrical heat-insulated card plates (23) at both ends. A magnetic block (24) is installed at the end of the card plate (23). A card slot (27) is opened on the outer wall of the electrical power cabinet (10) corresponding to the card plate (23). A magnetic metal block (28) is installed on the inner side of the card slot (27) corresponding to the position of the magnetic block (24).

5. The electrical power cabinet cooling device according to claim 4, characterized in that, A heat transfer plate (17) is provided on the side of the semiconductor refrigeration block (29) located on the same side as the card plate (23). The heat transfer plate (17) corresponds to the cooling end of the semiconductor refrigeration block (29). The low temperature generated by the cooling end is transferred through the heat transfer plate (17). A cooling installation groove (16) is provided on the outer wall of the electrical power cabinet (10) between the two sets of card slots (27) corresponding to the heat transfer plate (17). After the card plate (23) is snapped into the card slot (27), the heat transfer plate (17) is simultaneously connected to the cooling installation groove (16). The inner side of the cooling installation groove (16) is connected to the adjacent built-in heat-conducting plate strip (18) through the heat-conducting plate. The hot end of the semiconductor refrigeration block (29) is located on the side of the semiconductor refrigeration block (29) away from the heat transfer plate (17) for dissipating heat to the outside of the electrical power cabinet (10).

6. The electrical power cabinet cooling device according to claim 5, characterized in that, The bottom of the semiconductor cooling block (29) is connected to a telescopic wire (25), and the bottom end of the telescopic wire (25) is connected to a plug (26). The plug (26) is plugged into the socket (21).

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