A fully integrated intelligent power module

Abstract

This utility model relates to the field of power electronics technology and discloses a fully integrated intelligent power module, including a motor control IC chip, a driver IC chip, and a power MOSFET chip. The motor control IC chip, driver IC chip, and power MOSFET chip are integrated into the same package and connected by metal wire bonding. The PWM output pin of the motor control IC chip is connected to the input pin of the driver IC chip. The power MOSFET chip includes three PMOS transistors and three NMOS transistors, forming a three-phase bridge circuit structure. In this utility model, by integrating the MCU, driver IC chip, and power MOSFET chip into a single package and interconnecting them using internal metal wire bonding, the complex PCB traces such as external phase current sampling resistors found in traditional solutions are completely eliminated, resulting in a more streamlined external system and reduced system cost and layout complexity for the client.

Description

Technical Field

[0001] This utility model relates to the field of power electronics technology, and in particular to a fully integrated intelligent power module. Background Technology

[0002] Intelligent power modules (IPMs) are modular products that integrate drive and power functions. One type of IPM integrates control, drive, and power functions, and is also a type of intelligent power module. Currently, intelligent power modules on the market are available in two main forms: one-chip and multi-package. The one-chip solution integrates control, drive, and power into a single chip, packaged, and connected to pins by metal wires. The multi-package solution differs from the one-chip solution in that it separates the control, drive, and power functions into three different types of chips, which are then packaged and connected to pins according to the circuit structure to form a module.

[0003] While current integrated solutions achieve a certain degree of integration, a large number of discrete components are still required outside the module to implement functions such as voltage sampling, current sampling, and ESD protection. This results in complex circuits, low reliability, and poor anti-interference capabilities, making it impossible to truly meet the application requirements of high performance and high integration. Furthermore, the core control relies on a dedicated motor MCU, which limits chip selection and increases costs. Therefore, it is necessary to develop a fully integrated intelligent power module. Utility Model Content

[0004] To overcome the above shortcomings, this utility model provides a fully integrated intelligent power module, which aims to improve the problems of low integration, many peripheral circuits, poor ESD protection of packaged chips, and reliance on motor-specific MCUs.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a fully integrated intelligent power module, comprising a motor control IC chip, a driver IC chip, and a power MOSFET chip. The motor control IC chip, driver IC chip, and power MOSFET chip are integrated in the same package and connected by metal wire bonding. The PWM output pin of the motor control IC chip is connected to the input pin of the driver IC chip. The power MOSFET chip includes three PMOS transistors and three NMOS transistors. The three PMOS transistors serve as the upper arm of the three-phase inverter circuit, and the three NMOS transistors serve as the lower arm of the three-phase inverter circuit. The drive output pins of the three-phase upper arm and three-phase lower arm of the driver IC chip are respectively connected to the gate of the power MOSFET chip.

[0006] Preferably, the driver IC chip integrates an operational amplifier, and the phase current of two phases is sampled by the internal resistance of the power MOSFET chip.

[0007] Preferably, the driver IC chip has NU, NV, and NW pins, which are connected to the sources of three lower bridge arm NMOS transistors respectively via metal wire bonding.

[0008] Preferably, the NU, NV, and NW pins inside the driver IC chip are equipped with ESD protection diodes to ground.

[0009] Preferably, the driver IC chip integrates a signal sampling resistor network connected to the U, NU, V, and NV pins.

[0010] Preferably, the driver IC chip integrates a bus voltage divider resistor, and the output of the voltage divider resistor network is connected to the ADC input pin of the motor control IC chip through metal wire bonding.

[0011] Preferably, the driver IC chip integrates an LDO regulator, the input terminal of which is connected to the bus voltage pin, and the output terminal of which is connected to the motor control IC chip via a metal wire bonding.

[0012] Preferably, the ADC input pin of the motor control IC chip is directly connected to the output terminals of the operational amplifier and the bus voltage divider resistor integrated inside the driver IC chip via metal wire bonding.

[0013] Preferably, the type of motor control IC chip is not limited.

[0014] Preferably, the type of driver IC chip is not limited, and it can integrate one or more peripheral functions such as zero standby power consumption and PWM enable control. The operational amplifier of the driver IC chip can be set independently and connected to the motor control IC and MOSFET respectively through metal bonding.

[0015] This utility model has the following beneficial effects:

[0016] 1. In this utility model, by integrating the motor control IC, drive IC and power MOSFET into a single package and interconnecting them with internal metal wire bonding, the external phase current sampling resistor, bus voltage divider resistor, LDO power supply circuit and related complex PCB traces in the traditional solution are completely eliminated, making the peripheral system more streamlined and reducing the system cost and layout difficulty for the client.

[0017] 2. In this utility model, the module uses the internal resistance of the MOS transistor to replace the phase current sampling resistor, realizing dual-resistance control. The MCU is no longer limited to a dedicated MCU for motors, and a general-purpose MCU can also be used in the fully integrated intelligent power module. At the same time, the integrated design reduces parasitic parameters and noise interference, improves current sampling accuracy, power quality and overall module reliability, and enhances ESD protection capabilities, ultimately making the motor control system more compact, efficient and high-performing. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the electrical wiring principle of a fully integrated intelligent power module proposed in this utility model. Detailed Implementation

[0019] The technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0020] Reference Figure 1 The present invention provides an embodiment of a fully integrated intelligent power module, comprising a motor control IC chip, a driver IC chip, and a power MOSFET chip. The motor control IC chip, the driver IC chip, and the power MOSFET chip are integrated in the same package and connected by metal wire bonding. The PWM output pin of the motor control IC chip is connected to the input pin of the driver IC chip. The power MOSFET chip includes three PMOS transistors and three NMOS transistors. The three PMOS transistors serve as the upper arm of the three-phase inverter circuit, and the three NMOS transistors serve as the lower arm of the three-phase inverter circuit. The drive output pins of the three-phase upper arm and the three-phase lower arm of the driver IC chip are respectively connected to the gate of the power MOSFET chip.

[0021] Specifically, the motor control IC chip, or MCU, consists of six power MOSFET chips. The motor control IC chip, a low-voltage 3-phase PN driver, and the six power MOSFETs are packaged together as a single unit, forming a fully integrated intelligent power module. Electrical interconnection between the chips is achieved through wire bonding, which is not limited by the package's size, pin spacing, or pin count. Three of the six power MOSFETs are PMOS transistors (Q1, Q2, Q3), and three are NMOS transistors (Q4, Q5, Q6). The three PMOS transistors act as the upper arm switches for the three phases, while the three NMOS transistors act as the lower arm switches, forming a three-phase bridge circuit structure. The motor control IC chip outputs PWM control signals through its I / O pins, which are transmitted to the input pins of the driver IC chip via wire bonding. The driver IC chip then... Upon receiving the PWM signal, its internal circuitry processes and amplifies it, outputting corresponding three-phase upper bridge arm drive signals (HO1, HO2, HO3) and lower bridge arm drive signals (LO, LO2, LO3). These HO / LO signals are then directly connected to the gates of the corresponding power MOSFET chips via metal bonding, thereby precisely controlling their on / off states. The driver IC chip is a low-voltage 3-phase PN driver. In addition to fulfilling basic drive functions, the low-voltage 3-phase PN driver can be supplemented with different functions, such as VTS, LDO, and zero standby functions. Corresponding functions can be added according to different applications. The motor control IC chip is a general-purpose MCU or dedicated ASIC with ADC, serial port, and timer functions. By integrating control, drive, and power execution into a single package, the number of external components and module size are greatly reduced, improving system integration, reliability, and anti-interference capabilities.

[0022] Reference Figure 1 The driver IC chip integrates an operational amplifier, which samples the phase current of two phases through the internal resistance of the power MOSFET chip;

[0023] Specifically, the operational amplifier is connected to the source pins (NU, NV) and drain pins (U, V) of the lower bridge arm NMOS transistor via metal bonding. It acquires the voltage signal between the drain and source in real time, and by amplifying and processing this signal, accurately reconstructs the phase current information during motor operation. This integrated sampling method eliminates the need for external discrete sampling resistors, significantly simplifying the peripheral circuit structure and reducing overall cost. Furthermore, by integrating the chip internally, it effectively avoids measurement errors caused by parasitic inductance and resistance of the leads in traditional external sampling schemes, improving current sampling accuracy and system reliability. This provides accurate feedback information for the high-performance field-oriented control algorithm of the motor.

[0024] Reference Figure 1The driver IC chip has NU, NV, and NW pins, which are connected to the sources of three lower bridge arm NMOS transistors via metal wire bonding; the NU, NV, and NW pins inside the driver IC chip are equipped with ESD protection diodes to ground; the driver IC chip integrates a signal sampling resistor network that is connected to the U, NU, V, and NV pins.

[0025] Specifically, one end of the ESD diode is connected one-to-one to the NU, NV, and NW sampling pads, and the other end is connected to the ground pad of the driver IC to enhance the module's electrostatic discharge (ESD) protection capability. The NU, NV, and NW pins of the driver IC chip are directly connected to the sources of the three lower-arm NMOS power transistors via metal wire bonding, achieving seamless connection between the phase current sampling path and the power circuit. Since the NU, NV, and NW pins of the driver IC chip all integrate ESD protection diodes to ground, high-voltage spikes introduced to the sampling node due to electrostatic discharge or switching surges can be effectively discharged, protecting the delicate internal sampling circuit from damage. Furthermore, the driver... The internal signal sampling resistor network of the dynamic IC chip is integrated with the U, NU, V, and NV pins. When the NMOS transistor is turned on, the voltage signal between the drain and source can be sent to the internal operational amplifier. The fully integrated design eliminates the external discrete sampling resistors and their related PCB traces required in traditional solutions, which greatly simplifies customer application design, saves layout space and BOM costs, and fundamentally eliminates the measurement errors caused by the parameter dispersion of external discrete components and the parasitic inductance of leads. This improves the consistency and accuracy of phase current sampling and lays a solid foundation for high-performance closed-loop control of motors.

[0026] Reference Figure 1 The driver IC chip integrates a bus voltage divider resistor, and the output of the voltage divider resistor network is connected to the ADC input pin of the motor control IC chip through metal wire bonding.

[0027] Specifically, the voltage divider resistor network safely reduces the high voltage of the bus to the acceptable voltage range of the ADC of the motor control IC chip through the built-in voltage divider network. The voltage signal after voltage division is directly led out from the output terminal of the voltage divider resistor network, connected to a dedicated output pad through the internal wiring of the chip, and then connected to a specific ADC input pin of the motor control IC chip through metal wire bonding. This enables direct real-time sampling of the bus voltage, completely eliminating the external voltage divider resistor circuit and related PCB layout space that are indispensable in traditional applications. This not only significantly simplifies the peripheral circuit and reduces material costs, but also avoids measurement errors caused by temperature drift and parasitic parameters of external discrete resistors through the high integration inside the chip. This greatly improves the accuracy, stability and anti-interference capability of bus voltage sampling, and provides accurate and reliable voltage feedback information for the system to achieve efficient overvoltage protection, energy recovery and advanced control algorithms.

[0028] Reference Figure 1 The driver IC chip integrates an LDO regulator. The input terminal of the LDO regulator is connected to the bus voltage pin, and the output terminal of the LDO regulator is connected to the motor control IC chip through a metal wire.

[0029] Specifically, the input terminal of the LDO regulator is directly connected to the bus voltage pin (VBUS) of the module through internal circuitry, enabling it to withstand a wide input voltage range. The LDO regulator can convert the fluctuating bus voltage into a high-precision, low-noise, stable DC voltage. The regulated output voltage is led to a dedicated output pad through the metal wiring inside the driver IC chip, and then directly connected to the power input pin of the motor control IC chip via metal bonding, thereby providing it with a clean and stable core operating voltage.

[0030] Reference Figure 1 The ADC input pin of the motor control IC chip is directly connected to the output of the operational amplifier and the bus voltage divider resistor integrated inside the driver IC chip via metal wire bonding.

[0031] Specifically, for phase current sampling, the operational amplifier amplifies the tiny voltage drop signal generated by the internal resistance of the NMOS transistor in real time. For bus voltage sampling, the voltage divider resistor network attenuates the high-voltage bus signal proportionally to the range that the ADC can acquire. The processed analog voltage signal is directly led out from the corresponding output terminal of the driver chip and transmitted to the ADC pin of the motor control IC chip through the shortest path metal wire. This realizes a drive link from PWM to the power stage without external wiring. The motor control IC chip is no longer limited to a dedicated MCU for motors. General-purpose MCUs can also be used in fully integrated intelligent power modules. The fully integrated signal path enhances the consistency and reliability of the module, providing accurate and fast feedback information for high-performance closed-loop control of the motor. It also avoids noise interference and parasitic parameter effects introduced by long-distance external wiring, and significantly improves the accuracy, stability and anti-interference capability of current and voltage sampling.

[0032] Reference Figure 1 The types of motor control IC chips are not limited; the types of driver IC chips are not limited, and they can integrate one or more peripheral functions such as zero standby power consumption and PWM enable control. The operational amplifier of the driver IC chip can be set independently and connected to the motor control IC and MOSFET respectively through metal bonding.

[0033] Specifically, the motor control IC chip can be either an MCU or an ASIC, not limited to any particular type of motor control IC chip. This allows for flexible requirements on control performance and integration for different application scenarios. The driver IC chip can be replaced by a single driver chip and an independent fixed-gain amplifier. This provides a more cost-effective and flexible drive solution while improving system energy efficiency and enhancing control reliability. The independent amplifier is connected to the motor control IC and MOSFET respectively via metal wire bonding, which can improve signal conditioning accuracy while optimizing the system's anti-interference capability.

[0034] Working Principle: After the module is powered on, the external VBUS voltage enters the package through the pins and is fed into the LDO regulator inside the driver chip via metal wire bonding. The LDO regulator outputs a stable low-voltage power supply, which then supplies power to the motor control IC chip and internal analog circuitry via the metal wire bonding. Simultaneously, the bus voltage divider resistor integrated within the driver IC chip attenuates the high VBUS voltage. The low-voltage sampling signal is directly sent to the ADC of the motor control IC chip via the internal interconnect of the package as real-time feedback of the bus voltage. Based on this voltage value and the preset speed control curve, the motor control IC chip calculates the duty cycle of six PWM signals, which are output from the PWM1H, PWM2H, PWM3H, PWM1L, PWM2L, and PWM3L pins. These signals then enter the gate logic of the driver IC chip via corresponding metal wire bonding. The driver IC chip converts these signals into gate drive signals for the three-phase upper and lower bridge arms, which are then transmitted via the same internal interconnect through the metal wire bonding. The wires are respectively sent to the gate pads of PMOS Q1, Q2, Q3 and NMOS Q4, Q5, Q6 to form a three-phase bridge inverter. During the conduction phase, a millivolt-level voltage drop is generated between the drain and source of the lower bridge NMOS. This voltage drop enters the operational amplifier inside the driver chip through the H03 metal wire bonding. Using the on-resistance of the NMOS itself as a sampling element, the signal is amplified to form a two-phase current signal. This signal is then fed back to the ADC of the motor control IC chip through the internal interconnection of the package to realize the phase current reconstruction required by the dual-resistance algorithm. This module encapsulates the motor control IC, driver IC and six power MOSFETs in the same package. It uses internal metal wire bonding to complete power supply, PWM drive, bus voltage divider sampling and MOS internal resistance current detection, thereby eliminating the need for external sampling resistors, operational amplifiers and a large number of traces. This achieves the effect of no external circuitry required, further improving the integration of the module, reducing external circuitry and lowering the overall cost for the client.

[0035] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A fully integrated intelligent power module, comprising a motor control IC chip, a drive IC chip, a power MOSFET chip, characterized in that: The motor control IC chip, driver IC chip, and power MOSFET chip are integrated in the same package and connected by metal wire bonding. The PWM output pin of the motor control IC chip is connected to the input pin of the driver IC chip. The power MOSFET chip includes three PMOS transistors and three NMOS transistors. The three PMOS transistors serve as the upper arm of the three-phase inverter circuit, and the three NMOS transistors serve as the lower arm of the three-phase inverter circuit. The drive output pins of the three-phase upper arm and three-phase lower arm of the driver IC chip are respectively connected to the gate of the power MOSFET chip.

2. The fully integrated intelligent power module according to claim 1, characterized in that: The driver IC chip integrates an operational amplifier and samples the phase current of two phases through the internal resistance sampling of the power MOSFET chip.

3. The fully integrated intelligent power module according to claim 1, characterized in that: The driver IC chip has NU, NV, and NW pins, which are connected to the sources of three lower bridge arm NMOS transistors via metal wire bonding.

4. The fully integrated intelligent power module according to claim 3, characterized in that: The NU, NV, and NW pins inside the driver IC chip are equipped with ESD protection diodes to ground.

5. A fully integrated intelligent power module according to claim 3, characterized in that: The driver IC chip integrates a signal sampling resistor network that is connected to the U, NU, V, and NV pins.

6. The fully integrated intelligent power module according to claim 1, characterized in that: The driver IC chip integrates a bus voltage divider resistor, and the output of the voltage divider resistor network is connected to the ADC input pin of the motor control IC chip through metal wire bonding.

7. The fully integrated intelligent power module according to claim 1, characterized in that: The driver IC chip integrates an LDO regulator. The input terminal of the LDO regulator is connected to the bus voltage pin, and the output terminal of the LDO regulator is connected to the motor control IC chip via a metal wire bonding.

8. A fully integrated intelligent power module according to claim 2, characterized in that: The ADC input pin of the motor control IC chip is directly connected to the output of the operational amplifier and the bus voltage divider resistor integrated inside the driver IC chip via metal wire bonding.

9. A fully integrated intelligent power module according to claim 2, characterized in that: There are no restrictions on the type of motor control IC chip.

10. A fully integrated intelligent power module according to claim 2, characterized in that: The type of driver IC chip is not limited, and it can integrate one or more peripheral functions such as zero standby power consumption and PWM enable control. The operational amplifier of the driver IC chip can be set independently and connected to the motor control IC and MOSFET respectively through metal bonding.

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