A heat dissipation plate for power modules

Abstract

This utility model discloses a heat dissipation cold plate for power modules, relating to the field of automotive electronic control components technology. The utility model includes a substrate and a cold plate; the cold plate is disposed at the bottom of the substrate, and the substrate has an inner cavity flow channel one, while the cold plate has an inner cavity flow channel two. A manifold one is disposed on the right side of the substrate, and a manifold two is disposed on the left side. This utility model facilitates the flow distribution within the inner cavity flow channel one through the manifold one and two, improving temperature uniformity. The refrigerant flows into the inner cavity flow channel one of the substrate through an inlet, and then flows through the power module mounting area via the mutually open manifold one. Through phase change, heat is carried away and discharged to the outlet through the manifold two, resulting in higher heat exchange efficiency, better reliability, and higher space utilization.

Description

Technical Field

[0001] This utility model belongs to the technical field of automotive electronic control components, and in particular relates to a heat dissipation plate for power modules. Background Technology

[0002] The power module is the component that generates the most heat inside the controller. Especially under peak operating conditions, the instantaneous temperature rise of the module chip is very high. If it exceeds the junction temperature of the chip, it will cause the chip to malfunction or even damage the entire controller.

[0003] Indirect liquid cooling uses a flat-bottomed heat sink substrate with a layer of thermal grease applied underneath, which is then placed in close contact with a liquid cooling plate. Coolant flows through the liquid cooling plate, and the heat dissipation path is: chip - DBC substrate - flat-bottomed heat sink substrate - thermal grease - liquid cooling plate - coolant. In other words, the chip is the heat source, and heat is primarily conducted to the liquid cooling plate through the DBC substrate, the flat-bottomed heat sink substrate, and the thermal grease. The liquid cooling plate then dissipates the heat through liquid convection. In indirect liquid cooling, the IGBT power module does not directly contact the coolant, resulting in low heat dissipation efficiency and thus limiting the power density increase of the power module.

[0004] Direct liquid cooling employs a pin-type heat sink substrate. The heat sink substrate located at the bottom of the power module features a pin-fin-shaped heat dissipation structure, allowing direct cooling via the coolant through a sealing ring. The heat dissipation path is: chip - DBC substrate - pin-type heat sink substrate - coolant, eliminating the need for thermal grease. This method allows the IGBT power module to directly contact the coolant, reducing the overall thermal resistance of the module by approximately 30%. The pin-fin structure significantly increases the heat dissipation surface area, thus improving heat dissipation efficiency. However, it still cannot fully meet the heat exchange requirements of the power module.

[0005] The primary cause of power module failure is thermal stress due to excessive temperature. Effective thermal management is crucial for the stability and reliability of power modules. New energy vehicle motor controllers are typical high-power-density components, and this power density continues to increase with rising performance demands in new energy vehicles. Prolonged operation and frequent switching of the power module within the motor controller generate significant heat. As temperature rises, the probability of power module failure increases substantially, ultimately affecting the motor's output performance and the reliability of the vehicle's drive system. Therefore, to maintain stable operation of the power module, a reliable heat dissipation design and unobstructed heat dissipation channels are necessary to quickly and effectively reduce internal heat and meet reliability requirements. To address these issues, we provide a heat dissipation plate for power modules. Utility Model Content

[0006] The purpose of this invention is to provide a heat dissipation plate for power modules. By using manifold one and manifold two, the flow of the inner cavity channel one is facilitated, improving temperature uniformity. The refrigerant flows into the inner cavity channel one of the substrate through the inlet, and then flows through the power module mounting area through the mutually open manifold one. The heat is carried away by the phase change and discharged to the air outlet through manifold two. The heat exchange efficiency is higher, the reliability is better, and the space utilization rate is higher, solving the problems of existing heat dissipation plates for automotive power modules.

[0007] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0008] This utility model is a heat dissipation cold plate for power modules, including a substrate and a cold plate; the cold plate is disposed at the bottom of the substrate, the substrate has an inner cavity flow channel one, the cold plate has an inner cavity flow channel two, a current collector one is disposed on the right side of the substrate, and a current collector two is disposed on the left side of the substrate.

[0009] The present invention is further configured such that a power module mounting area is provided on the substrate, and two cold plates are provided in total, with the two cold plates being respectively located at the left and right ends of the bottom sidewall of the substrate, and the cold plate located on the left side of the substrate being located directly below the power module mounting area.

[0010] The present invention is further configured such that the inner cavity flow channel is laterally disposed in the substrate, and there are multiple inner cavity flow channels, which are unevenly distributed in the substrate.

[0011] The present invention is further configured such that the internal flow channels located in and near the power module installation area are densely distributed, while the internal flow channels further away from the power module installation area are sparsely distributed.

[0012] The present invention is further configured such that the second inner cavity flow channel is vertically arranged in the cold plate, and there are multiple second inner cavity flow channels, and the multiple second inner cavity flow channels are equally spaced.

[0013] This utility model has the following beneficial effects: By setting up a substrate, a cold plate, a first manifold, and a second manifold, the inner cavity flow channels of the substrate and the cold plate are integrally stretched and formed with a multi-rib structure, which can effectively increase the heat exchange area and enhance the heat exchange efficiency. The first and second manifolds adopt a high-frequency welded pipe scheme, which can facilitate the flow distribution of the first inner cavity flow channel and improve the temperature uniformity. On the other hand, it can also effectively improve the welding qualification rate. The refrigerant flows into the first inner cavity flow channel of the substrate through the inlet, and then flows through the power module installation area through the mutually open first manifold. The heat is carried away through the phase change and discharged to the air outlet through the second manifold. The heat exchange efficiency is higher, the reliability is better, and the space utilization rate is higher. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of a heat dissipation plate for a power module.

[0016] Figure 2 This is a cross-sectional view of a heat dissipation plate for a power module.

[0017] Figure 3 This is a longitudinal half-section view of the substrate structure.

[0018] Figure 4 This is a longitudinal half-section view of the cold plate structure.

[0019] Figure 5 This is a horizontal half-section view of the cold plate structure.

[0020] Figure 6 This is a horizontal half-section view of the substrate structure.

[0021] The attached diagram lists the components represented by each number as follows:

[0022] 1-Substrate, 101-Inner cavity flow channel one, 2-Power module mounting area, 3-Current collector one, 4-Current collector two, 5-Cold plate, 501-Inner cavity flow channel two. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model. Example 1

[0024] Please see Figure 1-3 This utility model is a heat dissipation cold plate for power modules, including a base plate 1, a first manifold 3 and a second manifold 4 and a cold plate 5. The first manifold 3 and the second manifold 4 facilitate the flow distribution in the inner cavity channel 1 and improve temperature uniformity.

[0025] Specifically, a power module mounting area 2 is provided on the upper left side wall of the substrate 1, a current collector 3 is installed on the right side wall of the substrate 1, a current collector 4 is installed on the left side wall of the substrate 1, and a cold plate 5 is installed on the bottom side wall of the substrate 1.

[0026] Furthermore, there are two cold plates 5, which are respectively located at both ends of the bottom sidewall of the substrate 1. The cold plate 5 located on the left side of the substrate 1 is located directly below the power module mounting area 2. Example 2

[0027] Please see Figure 4 Based on Example 1, an inner cavity flow channel 101 and an inner cavity flow channel 2 501 are also provided. Through the inner cavity flow channel 101 and the inner cavity flow channel 2 501, the heat exchange efficiency is higher, the reliability is better, and the space utilization is higher.

[0028] Specifically, the substrate 1 has an internal cavity flow channel 101, and the cold plate 5 has an internal cavity flow channel 501.

[0029] Furthermore, the inner cavity flow channel 101 is horizontally arranged in the substrate 1, and the inner cavity flow channel 2 501 is vertically arranged in the cold plate 5. There are multiple inner cavity flow channels 2 501, and the multiple inner cavity flow channels 2 501 are equally spaced. There are multiple inner cavity flow channels 101, and the inner cavity flow channels 101 are unevenly distributed in the substrate 1. The inner cavity flow channels 101 located in the power module mounting area 2 and close to the power module mounting area 2 are densely distributed, while the inner cavity flow channels 101 further away from the power module mounting area 2 are sparsely distributed.

[0030] The operation process of this embodiment is as follows: The inner cavity flow channel one of the substrate and the inner cavity flow channel two of the cold plate adopt a multi-rib structure and are integrally stretched and formed, which can effectively increase the heat exchange area and enhance the heat exchange efficiency. The high-frequency welding pipe solution of the manifold one and the manifold two can facilitate the flow distribution of the inner cavity flow channel one, improve the temperature uniformity, and effectively improve the welding qualification rate. The refrigerant flows into the inner cavity flow channel one of the substrate through the inlet, and then flows through the power module installation area through the mutually open manifold one. The heat is carried away by the phase change and discharged to the air outlet through the manifold two. The power module and the cold plate are fixed together with screws and filled with thermal grease in the middle. The cold plate can be assembled with the whole vehicle through four mounting brackets.

[0031] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0032] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A heat dissipation plate for a power module, comprising a substrate (1) and a cold plate (5); characterized in that: The cold plate (5) is disposed at the bottom of the substrate (1). The substrate (1) is provided with an inner cavity flow channel one (101) and the cold plate (5) is provided with an inner cavity flow channel two (501). The substrate (1) is provided with a flow collector one (3) on the right side and a flow collector two (4) on the left side.

2. The heat dissipation plate for a power module according to claim 1, characterized in that, The substrate (1) is provided with a power module mounting area (2), and there are two cold plates (5). The two cold plates (5) are respectively located at the left and right ends of the bottom sidewall of the substrate (1). The cold plate (5) located on the left side of the substrate (1) is located directly below the power module mounting area (2).

3. The heat dissipation plate for a power module according to claim 1, characterized in that, The inner cavity flow channel (101) is arranged laterally in the substrate (1). There are multiple inner cavity flow channels (101), and the inner cavity flow channels (101) are not evenly distributed in the substrate (1).

4. A heat dissipation plate for a power module according to claim 3, characterized in that, The inner cavity flow channels (101) near the power module installation area (2) are densely distributed, while the inner cavity flow channels (101) far from the power module installation area (2) are sparsely distributed.

5. A heat dissipation plate for a power module according to claim 1, characterized in that, The inner cavity flow channel 2 (501) is vertically arranged in the cold plate (5). There are multiple inner cavity flow channels 2 (501), and the multiple inner cavity flow channels 2 (501) are arranged at equal intervals.

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