A round glue filling control plate

Abstract

This utility model provides a circular potting control board, belonging to the field of electrical component technology, including a control board assembly. The control board assembly consists of a shell. This utility model, by designing the shell, circuit board assembly, and heat-dissipating aluminum substrate in a circular shape, perfectly matches the circular installation space of the screw pump, making full use of the installation space. Compared with a square potting control board, it reduces the length dimension, alleviates the limitation of pump length space, and adapts to a wider range of pump specifications. The circuit board assembly is installed inside the shell for control. A potting compound layer is laid on the surface of the circuit board assembly inside the shell, providing double protection from the shell and external factors such as dust, water, oil, and mechanical vibration, effectively resisting the influence of these factors and providing a good working environment for electronic components. This greatly improves the reliability and service life of the control board. The heat-dissipating aluminum substrate contacts the circuit board assembly for effective heat transfer, resulting in a larger heat dissipation area and better heat dissipation effect compared to existing square structures.

Description

Technical Field

[0001] This utility model relates to the field of electrical component technology, specifically a circular potting control board. Background Technology

[0002] In the operating systems of water pumps such as screw pumps and impeller pumps, the control board, as a core control component, plays a crucial role in the stable operation and performance of the pump. However, the control boards currently used for screw pumps on the market have the following problems: Traditional control boards are mostly square in structure, which is poorly compatible with the circular installation space of screw pumps, resulting in insufficient space utilization; Traditional control boards have poor heat dissipation performance. During long-term operation, the heat generated by electronic components is difficult to dissipate effectively, which will cause the control board temperature to rise, affecting the performance and stability of electronic components, and may even lead to safety accidents; Existing rectangular shells suffer from uneven heating of materials during vacuum forming, and are prone to burrs at right angles. In addition, due to the limitation of the control board, the shell height is relatively high, resulting in problems such as high processing difficulty, uneven thickness, and deformation. Utility Model Content

[0003] The purpose of this invention is to provide a circular glue-potting control board to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a circular potting control board, including a control board assembly;

[0005] The control board assembly consists of a housing, which is circular in shape. A circuit board assembly is installed inside the housing. A potting compound layer is laid on the surface of the circuit board assembly inside the housing. A heat-dissipating aluminum substrate is installed on the top of the housing. Both the heat-dissipating aluminum substrate and the circuit board assembly are designed to fit the circular shape of the housing. The heat-dissipating aluminum substrate is in contact with the circuit board assembly.

[0006] The circuit board assembly consists of a PCB board, on the surface of which are MOS devices, and the heat-dissipating aluminum substrate is attached to the bottom surface of the MOS devices.

[0007] As a preferred embodiment of this utility model: a circular opening is provided on the top of the outer shell, the diameter of the circular opening being slightly smaller than the diameter of the heat dissipation aluminum substrate, and the bottom of the heat dissipation aluminum substrate is placed in contact with the outer shell.

[0008] As a preferred embodiment of this utility model: the surface of the heat dissipation aluminum substrate has a potting notch in the middle and around the perimeter, and the surface of the circuit board assembly is connected with a connecting wire, which is inserted into the potting notch.

[0009] As a preferred embodiment of this utility model, the potting compound layer is made of oil-resistant epoxy resin potting compound.

[0010] As a preferred embodiment of this utility model, the outer shell is made by vacuum forming.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] (1) By designing the housing, circuit board assembly and heat dissipation aluminum substrate into a circular shape, it perfectly matches the circular installation space of the screw pump, making full use of the installation space. Compared with the square potting control board, the length dimension is reduced, reducing the limitation of the pump length space and adapting to a wider range of pump specifications. The circuit board assembly is installed inside the housing for control. The inside of the housing is covered with a potting layer on the surface of the circuit board assembly. The double protection of the housing and the protective housing can effectively resist the influence of external factors such as dust, water, oil and mechanical vibration, providing a good working environment for electronic components and greatly improving the reliability and service life of the control board. The heat dissipation aluminum substrate is in contact with the circuit board assembly to facilitate effective heat transfer. Compared with the existing square structure, the heat dissipation area is larger and the heat dissipation effect is better.

[0013] (2) The circuit board assembly consists of a PCB board. The PCB board surface is equipped with MOS devices. The MOS devices are high heat-generating components. After being mounted on a heat-dissipating aluminum substrate, they are attached to the bottom surface of the MOS devices, so that they can better conduct heat and dissipate heat. Attached Figure Description

[0014] Figure 1 This is a schematic cross-sectional view of the present invention.

[0015] Figure 2 This is a schematic diagram of the mounting structure of the heat dissipation aluminum substrate of this utility model;

[0016] Figure 3 This is a schematic diagram of the connection wire installation structure of this utility model.

[0017] In the diagram: 1. Control board assembly; 101. Housing; 102. Circuit board assembly; 1021. PCB board; 1022. MOS device; 103. Encapsulating layer; 104. Heat dissipation aluminum substrate; 2. Circular opening; 3. Encapsulation notch; 4. Connecting wire. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0019] Please see Figure 1-3 A circular potting control board, comprising: a control board assembly 1;

[0020] Please see Figure 1 , Figure 2 The control board assembly 1 consists of a housing 101, which is circular in shape. A circuit board assembly 102 is installed inside the housing 101. A potting compound layer 103 is laid on the surface of the circuit board assembly 102 inside the housing 101. A heat dissipation aluminum substrate 104 is installed on the top of the housing 101. Both the heat dissipation aluminum substrate 104 and the circuit board assembly 102 are designed to fit the circular shape of the housing 101. The heat dissipation aluminum substrate 104 is in contact with the circuit board assembly 102.

[0021] In practical use: By designing the housing 101, circuit board assembly 102, and heat dissipation aluminum substrate 104 into a circular shape, it perfectly matches the circular installation space of the screw pump, making full use of the installation space. Compared with the square potting control board, it reduces the length dimension, reduces the limitation of water pump length space, and adapts to a wider range of pump specifications. The circuit board assembly 102 is installed inside the housing 101 for control. The inside of the housing 101 is covered with a potting compound layer 103 and a protective housing 101 on the surface of the circuit board assembly 102, which can effectively resist the influence of external factors such as dust, water, oil, and mechanical vibration, providing a good working environment for electronic components and greatly improving the reliability and service life of the control board. The heat dissipation aluminum substrate 104 is in contact with the circuit board assembly 102 for effective heat transfer. Compared with the existing square structure, it has a larger heat dissipation area and better heat dissipation effect.

[0022] Please see Figure 1 The circuit board assembly 102 is composed of a PCB board 1021. A MOS device 1022 is provided on the surface of the PCB board 1021, and a heat dissipation aluminum substrate 104 is attached to the bottom surface of the MOS device 1022.

[0023] In practical use: the circuit board assembly 102 is composed of a PCB board 1021. The surface of the PCB board 1021 is provided with a MOS device 1022. The MOS device 1022 is a high heat generation component. After being installed by the heat dissipation aluminum substrate 104, it is attached to the bottom surface of the MOS device 1022, so that it can better play a role in heat conduction and heat dissipation.

[0024] Please see Figure 2 The top of the outer casing 101 has a circular opening 2, the diameter of which is slightly smaller than the diameter of the heat dissipation aluminum substrate 104, and the bottom of the heat dissipation aluminum substrate 104 is placed on the outer casing 101.

[0025] In practical use: The top of the outer casing 101 has a circular opening 2, the diameter of which is slightly smaller than the diameter of the heat dissipation aluminum substrate 104, so that the bottom surface of the heat dissipation aluminum substrate 104 can be placed on the outer casing 101, ensuring that there is space for potting glue at the bottom.

[0026] Please see Figure 2 , Figure 3 The surface of the heat dissipation aluminum substrate 104 has a potting notch 3 in the middle and around the perimeter. The surface of the circuit board assembly 102 is connected to a connecting line 4, which is inserted inside the potting notch 3.

[0027] In practical use: The surface of the heat dissipation aluminum substrate 104 has a potting notch 3 in the middle and around the perimeter. The connecting wires 4 connected to the surface of the circuit board assembly 102 pass through the potting notch 3 to facilitate wiring.

[0028] Please see Figure 1 The potting compound 103 is made of oil-resistant epoxy resin potting compound.

[0029] In practical application: The potting compound 103 is made of oil-resistant epoxy resin potting compound, which has excellent oil resistance, insulation, water resistance and mechanical strength. The potting compound 103 completely seals and wraps all electronic components on the circular circuit board, forming a dense protective layer that can effectively prevent oil penetration and prevent electronic components from being corroded by direct contact with oil. In addition, the potting compound 103 also has good flexibility and elasticity, which can absorb the vibration and impact generated during pump operation, reduce damage to electronic components, prevent components from loosening, and improve the shock resistance of the control board.

[0030] Please see Figure 3 The outer shell 101 is made using a vacuum forming process.

[0031] In practical use: the outer shell 101 adopts a vacuum forming process, with uniform circular size, which solves the problem of outward expansion and deformation. The height is reduced, which reduces the difficulty of vacuum forming. The deformation after vacuum forming is small, and thinner vacuum forming raw materials can be used to reduce costs. At the same time, by fitting the shape of the outer shell 101 to the circuit board assembly 102, the amount of glue is reduced, saving costs, increasing the strength of the vacuum-formed shell, and reducing the deformation of the plastic shell.

[0032] By designing the housing 101, circuit board assembly 102, and heat dissipation aluminum substrate 104 into a circular shape, it perfectly matches the circular installation space of the screw pump, making full use of the installation space. Compared with a square potting control board, it reduces the length dimension, alleviates the limitation of water pump length space, and adapts to a wider range of pump specifications. The circuit board assembly 102 is installed inside the housing 101 for control. The interior of the housing 101 is covered with a potting compound layer 103 and a protective housing 101 on the surface of the circuit board assembly 102, which provides double protection and can effectively resist the influence of external factors such as dust, water, oil, and mechanical vibration. It provides a good working environment for electronic components and greatly improves the reliability and service life of the control board. The heat dissipation aluminum substrate 104 is in contact with the circuit board assembly 102, which facilitates effective heat transfer. Compared with the existing square structure, it has a larger heat dissipation area and better heat dissipation effect.

[0033] The contents not described in detail in this description are existing technologies known to those skilled in the art. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A circular potting control board, characterized in that, include: The control board assembly (1) is composed of a shell (101), which is circular in shape. A circuit board assembly (102) is installed inside the shell (101). A potting compound layer (103) is laid on the surface of the circuit board assembly (102) inside the shell (101). A heat dissipation aluminum substrate (104) is installed on the top of the shell (101). Both the heat dissipation aluminum substrate (104) and the circuit board assembly (102) are circular in shape to fit the shell (101). The heat dissipation aluminum substrate (104) is in contact with the circuit board assembly (102). The circuit board assembly (102) is composed of a PCB board (1021), on which a MOS device (1022) is provided, and the heat dissipation aluminum substrate (104) is attached to the bottom surface of the MOS device (1022).

2. The control board according to claim 1, characterized in that: The top of the outer shell (101) has a circular opening (2), the diameter of which is slightly smaller than the diameter of the heat dissipation aluminum substrate (104), and the bottom of the heat dissipation aluminum substrate (104) is placed on the outer shell (101).

3. The control board according to claim 1, characterized in that: The heat dissipation aluminum substrate (104) has a potting notch (3) in the middle and around the perimeter of its surface. The circuit board assembly (102) is connected to a connecting line (4), which is inserted inside the potting notch (3).

4. The control board according to claim 1, characterized in that: The potting compound layer (103) is made of oil-resistant epoxy resin potting compound.

5. The control board according to claim 1, characterized in that: The outer shell (101) is made using a vacuum forming process.

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