Pyrolytic adhesive bonding machine

Abstract

This invention provides a pyrolytic adhesive bonding machine, comprising a base, a pyrolytic adhesive platform assembly, a glass platform assembly, and a wafer bonding mechanism. The pyrolytic adhesive platform assembly and the glass platform assembly are slidably mounted on the base, and the wafer bonding mechanism is rotatably mounted above the pyrolytic adhesive platform assembly and the glass platform assembly. One side of the flip-up adsorption plate of the wafer bonding mechanism is the adsorption surface. When the wafer bonding mechanism flips to the bonding position, the adsorption surface faces the pyrolytic adhesive platform assembly or the glass platform assembly; when the wafer bonding mechanism flips to the loading position, the adsorption surface faces upward. This pyrolytic adhesive bonding machine uses solid pyrolytic adhesive, enabling efficient bonding of wafers and glass substrates using the pyrolytic adhesive platform assembly, glass platform assembly, and wafer bonding mechanism. This reduces operational complexity, and subsequent separation of the wafers and glass substrates is easily achieved through heating, allowing for the recycling of the pyrolytic adhesive. Overall, the machine is highly efficient and cost-effective.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment, and in particular to a pyrolysis adhesive bonding machine. Background Technology

[0002] In semiconductor manufacturing, the thinness of wafers significantly reduces their mechanical strength, making them prone to warping or breakage during processing. Therefore, a glass carrier is bonded to one side of the wafer. The glass carrier provides necessary support, ensuring the accuracy and yield of subsequent processing, such as polishing. Current technology typically involves coating one side of the wafer with a soluble bonding agent (e.g., bonding wax) and then attaching the glass carrier to that side. This coating process is relatively inefficient. Furthermore, after polishing, the soluble bonding agent needs to be removed using a cleaning agent to separate the wafer from the glass carrier. The removed soluble bonding agent also needs to be recovered, making the cleaning and recovery process complex, inefficient, and costly.

[0003] Therefore, it is necessary to provide a pyrolytic adhesive bonding machine to solve the above-mentioned technical problems. Utility Model Content

[0004] This invention provides a pyrolytic adhesive bonding machine to solve the problems of complex and inefficient wafer bonding processes, as well as high coating and recycling costs in the prior art.

[0005] To solve the above-mentioned technical problems, the technical solution of this utility model is as follows: a pyrolysis adhesive bonding machine, which includes: a base, a pyrolysis adhesive platform assembly, a glass platform assembly, and a wafer bonding mechanism, wherein the pyrolysis adhesive platform assembly and the glass platform assembly are slidably disposed on the base, and the wafer bonding mechanism is rotatably disposed above the pyrolysis adhesive platform assembly and the glass platform assembly;

[0006] The wafer bonding mechanism includes a flip-up adsorption plate, one side of which is an adsorption surface for picking up wafers. The wafer bonding mechanism includes a bonding position and a loading position on its rotation trajectory. When the wafer bonding mechanism is located at the bonding position, the adsorption surface is opposite to the pyrolysis adhesive platform assembly or the glass platform assembly. When the wafer bonding mechanism is located at the loading position, the adsorption surface faces upward.

[0007] In this utility model, the pyrolysis adhesive platform assembly includes a fixing plate, a pyrolysis adhesive platform plate, a tilt control cylinder, and a patch adhesive roller.

[0008] The adhesive roller is vertically mounted on one side of the pyrolysis adhesive platform plate, which is located above the fixed plate. The end of the pyrolysis adhesive platform plate near the adhesive roller is rotatably connected to the fixed plate. The rotation axis of the pyrolysis adhesive platform is parallel to the adsorption surface and perpendicular to the sliding trajectory of the pyrolysis adhesive platform assembly. The end of the pyrolysis adhesive platform plate away from the adhesive roller is rotatably connected to the output end of the tilt control cylinder, which is fixedly connected to the fixed plate.

[0009] The pyrolysis adhesive platform plate has a pyrolysis adhesive positioning groove on one side, and a plurality of first suction holes are provided in the pyrolysis adhesive positioning groove.

[0010] In addition, the pyrolysis adhesive platform assembly includes a first fine-tuning platform and a first lifting drive module. The first fine-tuning platform is connected between the fixed plate and the output end of the first lifting drive module. The first fine-tuning platform includes X-axis movement, Y-axis movement and rotation adjustment. The X-axis movement and Y-axis movement are perpendicular to each other and parallel to the pyrolysis adhesive platform plate. The rotation axis of the rotation adjustment is perpendicular to the pyrolysis adhesive platform plate.

[0011] In this utility model, the glass platform assembly includes a mounting base, a glass platform plate, an attachment cylinder, a second fine-tuning platform, and a second lifting drive module;

[0012] The glass platform plate is slidably and vertically connected to the top of the mounting base. The attachment cylinder is disposed between the mounting base and the glass platform plate. The output end of the attachment cylinder is connected to the glass platform plate. The second fine-tuning platform is connected between the mounting base and the output end of the second lifting drive module. The second fine-tuning platform includes X-axis movement, Y-axis movement, and rotation adjustment. The X-axis movement and Y-axis movement are perpendicular to each other and parallel to the glass platform plate. The rotation axis of the rotation adjustment is perpendicular to the glass platform plate.

[0013] The glass platform plate has a glass positioning groove on one side, and a plurality of second suction holes are provided in the glass positioning groove.

[0014] In this utility model, the wafer mounting mechanism further includes a flip drive module, two vertical mounting plates, a first limiting cylinder, a first limiting rod, a second limiting cylinder, a second limiting rod, and a limiting plate;

[0015] The flipping adsorption plate is rotatably disposed between the two vertical mounting plates. The flipping drive module, the first limiting cylinder, and the second limiting cylinder are all fixedly connected to one of the vertical mounting plates. The flipping adsorption plate is connected to the output end of the flipping drive module. The side of the flipping adsorption plate closest to the first limiting cylinder is fixedly connected to the limiting plate. The first limiting cylinder and the second limiting cylinder are located on both sides of the rotation trajectory of the limiting plate. The first limiting rod is connected to the output end of the first limiting cylinder, and the second limiting rod is connected to the output end of the second limiting cylinder.

[0016] When the wafer mounting mechanism is located at the loading position, the limiting plate is pressed between the first limiting rod and the vertical mounting plate. When the wafer mounting mechanism is located at the mounting position, the limiting plate is pressed between the second limiting rod and the vertical mounting plate.

[0017] Furthermore, a wafer positioning groove is provided on the adsorption surface, and a plurality of third suction holes are provided in the wafer positioning groove;

[0018] The flipping adsorption plate is rotatably connected to the two vertical mounting plates via a hollow rotating shaft. One end of the hollow rotating shaft is closed and connected to the output end of the flipping drive module. The other end of the hollow rotating shaft is rotatably connected to a rotary joint. The rotary joint connects the output end of the vacuum equipment and the inner cavity of the hollow rotating shaft. A transfer joint is provided on the circumferential side of the hollow rotating shaft. The transfer joint is used to connect the third suction hole and the inner cavity of the hollow rotating shaft.

[0019] In this invention, the pyrolysis adhesive platform assembly and the glass platform assembly are connected to the same linear drive module, and the wafer attachment mechanism is located above the center of the linear drive module.

[0020] In this invention, the pyrolysis adhesive bonding machine further includes an ionizer, which is located on one side above the pyrolysis adhesive platform assembly, the glass platform assembly, and the wafer bonding mechanism.

[0021] Compared with the prior art, the advantages of this utility model are as follows: The pyrolysis adhesive bonding machine of this utility model uses solid pyrolysis adhesive, which enables the use of pyrolysis adhesive platform components, glass platform components and wafer bonding mechanism to efficiently bond wafers and glass sheets, reducing the complexity of the work. At the same time, the wafers and glass sheets can be easily separated by heating in the later stage, and the pyrolysis adhesive can be recycled. The whole process is efficient and low cost. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments are briefly introduced below. The drawings described below are only the corresponding drawings of some embodiments of this utility model.

[0023] Figure 1 This is a schematic diagram of the pyrolysis adhesive bonding machine of this utility model.

[0024] Figure 2 This is a schematic diagram of the pyrolysis adhesive platform component of the pyrolysis adhesive bonding machine of this utility model.

[0025] Figure 3 This is a schematic diagram of the glass platform assembly of the pyrolysis adhesive bonding machine of this utility model.

[0026] Figure 4 This is a structural schematic diagram of the pyrolysis adhesive bonding machine of this utility model from another perspective.

[0027] Figure 5 This is a schematic diagram of the hollow rotating shaft of the pyrolysis adhesive bonding machine of this utility model. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0029] The directional terms mentioned in this utility model, such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", "top" and "bottom", are only for reference to the orientation of the accompanying drawings. The directional terms used are for the purpose of explaining and understanding this utility model, and are not intended to limit this utility model.

[0030] The terms "first" and "second" in this utility model are used for descriptive purposes only and should not be construed as indicating or implying relative importance, nor as a restriction on the order of events.

[0031] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, a connection can be a detachable connection or a connection of an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0032] In existing technologies, a soluble bonding agent is typically coated on one side of a wafer, and then a glass substrate is attached to the side of the wafer coated with the soluble bonding agent. This coating process is relatively inefficient. Furthermore, after subsequent polishing, the soluble bonding agent needs to be cleaned with a cleaning agent to separate the wafer from the glass substrate. After separation, the cleaned soluble bonding agent also needs to be recovered. These cleaning and recovery processes are complex, inefficient, and costly.

[0033] The following is a preferred embodiment of a pyrolytic adhesive bonding machine provided by this utility model, which can solve the above-mentioned technical problems.

[0034] Please refer to Figure 1 ,in Figure 1 This is a schematic diagram of the pyrolysis adhesive bonding machine of this utility model.

[0035] In the diagram, units with similar structures are represented by the same labels.

[0036] This embodiment provides a pyrolytic adhesive bonding machine, which includes a base 11, a pyrolytic adhesive platform assembly 12, a glass platform assembly 13, and a wafer bonding mechanism 14. The pyrolytic adhesive platform assembly 12 and the glass platform assembly 13 are slidably disposed on the base 11, and the wafer bonding mechanism 14 is rotatably disposed above the pyrolytic adhesive platform assembly 12 and the glass platform assembly 13.

[0037] The wafer mounting mechanism 14 includes a flip-up adsorption plate 141, one side of which is an adsorption surface for picking up wafers. The wafer mounting mechanism 14 has a mounting position and a loading position along its rotational trajectory. When the wafer mounting mechanism 14 is in the mounting position, the adsorption surface faces either the pyrolysis adhesive platform assembly 12 or the glass platform assembly 13, to facilitate the mounting of pyrolysis adhesive films or glass sheets. When the wafer mounting mechanism 14 is in the loading position, the adsorption surface faces upwards, facilitating the loading of wafers and the removal of the pyrolysis adhesive film attached to the wafers.

[0038] In this embodiment, the flipping axis of the wafer attachment mechanism 14 is parallel to the adsorption surface and perpendicular to the sliding trajectory of the pyrolysis adhesive platform assembly 12 and the glass platform assembly 13.

[0039] Reference Figure 2 In this embodiment, the pyrolysis adhesive platform assembly 12 includes a fixing plate 122, a pyrolysis adhesive platform plate 121, a tilt control cylinder 123, and a patch adhesive roller 124.

[0040] The adhesive roller 124 is raised and lowered on one side of the pyrolysis adhesive platform plate 121. A lifting drive cylinder 1241 is fixedly installed on one side of the fixing plate 122. The adhesive roller 124 is connected to the output end of the lifting drive cylinder 1241 through a connecting frame.

[0041] The pyrolysis adhesive platform plate 121 is located above the fixed plate 122. The end of the pyrolysis adhesive platform plate 121 closest to the bonding roller 124 is rotatably connected to the fixed plate 122 around a rotating shaft 127. The axis of the rotating shaft 127 is parallel to the adsorption surface and perpendicular to the sliding trajectory of the pyrolysis adhesive platform assembly 12. The end of the pyrolysis adhesive platform plate 121 furthest from the bonding roller 124 is rotatably connected to the output end of a tilt control cylinder 123, which is fixedly connected to the fixed plate 122. The tilt control cylinder 123 controls the pyrolysis adhesive platform plate 121 to be tilted relative to the adsorption surface when it is in the attachment position, so that the pyrolysis adhesive sheet can be gradually attached to the wafer as the pyrolysis adhesive platform assembly 12 slides.

[0042] Please refer to Figure 2 The pyrolysis adhesive platform plate 121 has a pyrolysis adhesive positioning groove 1211 on one side. The pyrolysis adhesive positioning groove 1211 has a plurality of first suction holes. The pyrolysis adhesive sheet can be positioned and placed in the pyrolysis adhesive positioning groove 1211. The first suction holes are attracted by an external vacuum device. The first suction holes can then hold the pyrolysis adhesive sheet.

[0043] Please refer to Figure 2 Additionally, the pyrolysis adhesive platform assembly 12 includes a first fine-tuning platform 125 and a first lifting drive module 126. The first fine-tuning platform 125 is connected between the fixed plate 122 and the output end of the first lifting drive module 126. The first fine-tuning platform 125 includes X-axis movement, Y-axis movement, and rotation adjustment. The X-axis movement and Y-axis movement are perpendicular to each other and parallel to the pyrolysis adhesive platform plate 121, and the rotation axis of the rotation adjustment is perpendicular to the pyrolysis adhesive platform plate 121.

[0044] The first fine-tuning platform 125 is a combination structure formed by the sliding and rotating cooperation of multiple sliding plates. Multiple sliding plates can be adjusted by adjusting the screw to achieve the purpose of X-axis movement, Y-axis movement and rotation adjustment.

[0045] The first lifting drive module 126 in this embodiment may include a motor, a lead screw assembly, a lifting plate, and a lifting fixed base. The lifting plate is vertically mounted within the fixed base, and the lead screw assembly is horizontally mounted within the fixed base. The lead screw nut of the lead screw assembly and the lifting plate are respectively provided with mutually slidingly engaged inclined blocks. When the motor drives the lead screw nut to move horizontally, the inclined sliding engagement of the two inclined blocks drives the lifting plate to rise and fall, thus controlling the lifting of the pyrolysis platform plate 121. This first lifting drive module 126 has a more compact structure and can reduce the overall height of the pyrolysis platform assembly 12.

[0046] Please refer to Figure 3 In this embodiment, the glass platform assembly 13 includes a mounting base 132, a glass platform plate 131, an attachment cylinder 133, a second fine-tuning platform 134, and a second lifting drive module 135. The structural principle of the second fine-tuning platform 134 is basically the same as that of the first fine-tuning platform 125, and the structural principle of the second lifting drive module 135 is basically the same as that of the first lifting drive module 126. Therefore, the second fine-tuning platform 134 and the second lifting drive module 135 will not be described in detail here.

[0047] A glass platform plate 131 is slidably and vertically connected to the top of the mounting base 132. An attachment cylinder 133 is positioned between the mounting base 132 and the glass platform plate 131, with its output end connected to the glass platform plate 131. A second fine-tuning platform 134 is connected between the mounting base 132 and the output end of the second lifting drive module 135. The second fine-tuning platform 134 includes X-axis movement, Y-axis movement, and rotation adjustment. The X-axis and Y-axis movements are perpendicular to each other and parallel to the glass platform plate 131, while the rotation axis of the rotation adjustment is perpendicular to the glass platform plate 131.

[0048] When the glass sheet on the glass platform plate 131 needs to be attached to the wafer, the second lifting drive module 135 first drives the mounting base 132 to rise, bringing the glass platform plate 131 closer to the flip-up adsorption plate 141. When the glass platform plate 131 and the flip-up adsorption plate 141 are within a small set distance, the second lifting drive module 135 stops driving, and then the attachment cylinder 133 drives the glass platform plate 131 to rise and attach the glass sheet to the pyrolytic adhesive sheet on the flip-up adsorption plate 141. The attachment cylinder 133 has a preset driving pressure, which ensures the attachment yield without damaging the wafer.

[0049] The glass platform plate 131 has a glass positioning groove 1311 on one side, and multiple second suction holes are provided in the glass positioning groove 1311. The glass sheet can be positioned and placed in the glass positioning groove 1311, and the second suction holes can be attracted by the external vacuum equipment.

[0050] Please refer to Figure 4In this embodiment, the wafer mounting mechanism 14 further includes a flip drive module 142, two vertical mounting plates 143, a first limiting cylinder 144, a first limiting rod 146, a second limiting cylinder 145, a second limiting rod 147, and a limiting plate 148.

[0051] The flip adsorption plate 141 is rotatably mounted between two vertical mounting plates 143. The flip drive module 142, the first limiting cylinder 144, and the second limiting cylinder 145 are all fixedly connected to one of the vertical mounting plates 143. The flip adsorption plate 141 is connected to the output end of the flip drive module 142. The side of the flip adsorption plate 141 closest to the first limiting cylinder 144 is fixedly connected to the limiting plate 148. The first limiting cylinder 144 and the second limiting cylinder 145 are located on both sides of the rotation trajectory of the limiting plate 148. The first limiting rod 146 is connected to the output end of the first limiting cylinder 144, and the second limiting rod 147 is connected to the output end of the second limiting cylinder 145.

[0052] When the wafer mounting mechanism 14 is in the loading position, the limiting plate 148 is pressed between the first limiting rod 146 and the vertical mounting plate 143. When the wafer mounting mechanism 14 is in the mounting position, the limiting plate 148 is pressed between the second limiting rod 147 and the vertical mounting plate 143. Through the pressing of the first limiting rod 146 and the second limiting rod 147, the wafer mounting mechanism 14 can be stably maintained in the loading position or the mounting position.

[0053] In this embodiment, a wafer positioning groove 1411 is provided on the adsorption surface, and a plurality of third suction holes are provided in the wafer positioning groove 1411. The wafer can be positioned and placed in the wafer positioning groove 1411, and an external vacuum device generates an adsorption force on the third suction holes, which can then adsorb the wafer.

[0054] More specifically, the flipping adsorption plate 141 is rotatably connected to two vertical mounting plates 143 via a hollow rotating shaft 149. One end of the hollow rotating shaft 149 is closed and connected to the output end of the flipping drive module 142. The other end of the hollow rotating shaft 149 is rotatably connected to a rotary joint 1491. The rotary joint 1491 connects the output end of the vacuum equipment and the inner cavity of the hollow rotating shaft 149. A transfer joint 1492 is provided on the circumferential side of the hollow rotating shaft 149. The transfer joint 1492 is used to connect the third suction hole and the inner cavity of the hollow rotating shaft 149.

[0055] The flip-up adsorption plate 141 can be provided with a gas guide channel connecting multiple third suction holes, and a gas guide pipe connects the intermediate connector 1492 and the gas guide channel. In this way, the flip-up adsorption plate 141, the hollow rotating shaft 149, and the intermediate connector 1492 can rotate together. The hollow rotating shaft 149 is connected to the vacuum equipment through the rotary connector 1491. The rotary connector 1491 can not only rotate with the hollow rotating shaft 149, but also ensure stable vacuum pressure transmission between the hollow rotating shaft 149 and the vacuum equipment. At the same time, there is no problem of the gas guide pipe getting tangled during the rotation of the flip-up adsorption plate 141.

[0056] In this embodiment, the pyrolysis adhesive platform assembly 12 and the glass platform assembly 13 are connected to the same linear drive module 15, and the wafer attachment mechanism 14 is located above the center of the linear drive module 15.

[0057] In this embodiment, the pyrolysis adhesive bonding machine also includes an ionization bar 16, which is located on one side above the pyrolysis adhesive platform assembly 12, the glass platform assembly 13, and the wafer bonding mechanism 14. The ionization bar 16 can remove dust and static electricity from the pyrolysis adhesive sheet, the glass sheet, and the wafer.

[0058] The working principle of this utility model is as follows: The pyrolysis adhesive platform plate 121 is rotated to a horizontal position, a pyrolysis adhesive sheet is placed on the pyrolysis adhesive platform plate 121, a glass sheet is placed on the glass platform plate 131, the wafer bonding mechanism 14 is flipped to the loading position, and a wafer is placed on the flipping adsorption plate 141. After the wafer is placed, the wafer bonding mechanism 14 is flipped to the bonding position.

[0059] Understandably, the placement of pyrolytic films, glass sheets, and wafers can be done manually or automatically using robotic arms.

[0060] The pyrolysis adhesive platform assembly 12 slides below the wafer attachment mechanism 14, and the pyrolysis adhesive platform plate 121 rotates to an inclined state. The pyrolysis adhesive platform plate 121 rises, and the adhesive roller 124 rises to press the end of the pyrolysis adhesive sheet on the pyrolysis adhesive platform plate 121 onto the wafer on the flip-adsorption plate 141.

[0061] Then, the bonding roller 124 slides along with the pyrolysis adhesive platform assembly 12, and the bonding roller 124 gradually rolls the pyrolysis adhesive sheet onto the wafer on the flip-up adsorption plate 141.

[0062] After the pyrolytic adhesive film is applied, the pyrolytic adhesive platform assembly 12 slides away from the wafer attachment mechanism 14, and the wafer attachment mechanism 14 flips to the loading position, whereby the pyrolytic adhesive film applied to the wafer is peeled off manually or by a robotic arm.

[0063] Then, the wafer mounting mechanism 14 flips to the mounting position, the glass platform assembly 13 slides below the wafer mounting mechanism 14, and the glass platform assembly 13 rises to attach the glass sheet to the pyrolytic adhesive sheet on the flip adsorption plate 141.

[0064] After the glass sheet is attached, the glass platform assembly 13 slides away from the wafer attachment mechanism 14, and the wafer attachment mechanism 14 flips to the loading position, where the attached wafer product is picked up manually or by a robotic arm.

[0065] This completes the process of bonding glass sheets and wafers using a pyrolytic adhesive bonding machine according to this preferred embodiment.

[0066] The pyrolytic adhesive bonding machine of this preferred embodiment uses solid pyrolytic adhesive, which enables the use of a pyrolytic adhesive platform assembly, a glass platform assembly, and a wafer bonding mechanism to efficiently bond wafers and glass sheets, reducing the complexity of the work. At the same time, the wafers and glass sheets can be easily separated by heating, and the pyrolytic adhesive can be recycled. Overall, it is efficient and low in cost.

[0067] In summary, although the present invention has been disclosed above with reference to preferred embodiments, the above preferred embodiments are not intended to limit the present invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope defined in the claims.

Claims

1. A pyrolytic adhesive bonding machine, characterized in that, include: The device includes a base, a pyrolysis adhesive platform assembly, a glass platform assembly, and a wafer mounting mechanism. The pyrolysis adhesive platform assembly and the glass platform assembly are slidably disposed on the base, and the wafer mounting mechanism is rotatably disposed above the pyrolysis adhesive platform assembly and the glass platform assembly. The wafer bonding mechanism includes a flip-up adsorption plate, one side of which is an adsorption surface for picking up wafers. The wafer bonding mechanism includes a bonding position and a loading position on its rotation trajectory. When the wafer bonding mechanism is located at the bonding position, the adsorption surface is opposite to the pyrolysis adhesive platform assembly or the glass platform assembly. When the wafer bonding mechanism is located at the loading position, the adsorption surface faces upward.

2. The pyrolytic adhesive bonding machine according to claim 1, characterized in that, The pyrolysis adhesive platform assembly includes a fixed plate, a pyrolysis adhesive platform plate, a tilt control cylinder, and a patch adhesive roller. The adhesive roller is vertically mounted on one side of the pyrolysis adhesive platform plate, which is located above the fixed plate. The end of the pyrolysis adhesive platform plate near the adhesive roller is rotatably connected to the fixed plate. The rotation axis of the pyrolysis adhesive platform is parallel to the adsorption surface and perpendicular to the sliding trajectory of the pyrolysis adhesive platform assembly. The end of the pyrolysis adhesive platform plate away from the adhesive roller is rotatably connected to the output end of the tilt control cylinder, which is fixedly connected to the fixed plate.

3. The pyrolytic adhesive bonding machine according to claim 2, characterized in that, One side of the pyrolysis adhesive platform plate is provided with a pyrolysis adhesive positioning groove, and a plurality of first suction holes are provided in the pyrolysis adhesive positioning groove.

4. The pyrolytic adhesive bonding machine according to claim 2, characterized in that, The pyrolysis adhesive platform assembly includes a first fine-tuning platform and a first lifting drive module. The first fine-tuning platform is connected between the fixed plate and the output end of the first lifting drive module. The first fine-tuning platform includes X-axis movement, Y-axis movement and rotation adjustment. The X-axis movement and Y-axis movement are perpendicular to each other and parallel to the pyrolysis adhesive platform plate. The rotation axis of the rotation adjustment is perpendicular to the pyrolysis adhesive platform plate.

5. The pyrolytic adhesive bonding machine according to claim 1, characterized in that, The glass platform assembly includes a mounting base, a glass platform plate, an attachment cylinder, a second fine-tuning platform, and a second lifting drive module. The glass platform plate is slidably and vertically connected to the top of the mounting base. The attachment cylinder is disposed between the mounting base and the glass platform plate. The output end of the attachment cylinder is connected to the glass platform plate. The second fine-tuning platform is connected between the mounting base and the output end of the second lifting drive module. The second fine-tuning platform includes X-axis movement, Y-axis movement, and rotation adjustment. The X-axis movement and Y-axis movement are perpendicular to each other and parallel to the glass platform plate. The rotation axis of the rotation adjustment is perpendicular to the glass platform plate.

6. The pyrolytic adhesive bonding machine according to claim 5, characterized in that, One side of the glass platform plate is provided with a glass positioning groove, and a plurality of second suction holes are provided in the glass positioning groove.

7. The pyrolytic adhesive bonding machine according to claim 1, characterized in that, The wafer mounting mechanism also includes a flip drive module, two vertical mounting plates, a first limiting cylinder, a first limiting rod, a second limiting cylinder, a second limiting rod, and a limiting plate; The flipping adsorption plate is rotatably disposed between the two vertical mounting plates. The flipping drive module, the first limiting cylinder, and the second limiting cylinder are all fixedly connected to one of the vertical mounting plates. The flipping adsorption plate is connected to the output end of the flipping drive module. The side of the flipping adsorption plate closest to the first limiting cylinder is fixedly connected to the limiting plate. The first limiting cylinder and the second limiting cylinder are located on both sides of the rotation trajectory of the limiting plate. The first limiting rod is connected to the output end of the first limiting cylinder, and the second limiting rod is connected to the output end of the second limiting cylinder. When the wafer mounting mechanism is located at the loading position, the limiting plate is pressed between the first limiting rod and the vertical mounting plate. When the wafer mounting mechanism is located at the mounting position, the limiting plate is pressed between the second limiting rod and the vertical mounting plate.

8. The pyrolytic adhesive bonding machine according to claim 7, characterized in that, A wafer positioning groove is provided on the adsorption surface, and a plurality of third suction holes are provided in the wafer positioning groove; The flipping adsorption plate is rotatably connected to the two vertical mounting plates via a hollow rotating shaft. One end of the hollow rotating shaft is closed and connected to the output end of the flipping drive module. The other end of the hollow rotating shaft is rotatably connected to a rotary joint. The rotary joint connects the output end of the vacuum equipment and the inner cavity of the hollow rotating shaft. A transfer joint is provided on the circumferential side of the hollow rotating shaft. The transfer joint is used to connect the third suction hole and the inner cavity of the hollow rotating shaft.

9. The pyrolytic adhesive bonding machine according to claim 1, characterized in that, The pyrolysis adhesive platform assembly and the glass platform assembly are connected to the same linear drive module, and the wafer attachment mechanism is located above the center of the linear drive module.

10. The pyrolytic adhesive bonding machine according to claim 1, characterized in that, The pyrolysis adhesive bonding machine also includes an ionizer, which is located on one side above the pyrolysis adhesive platform assembly, the glass platform assembly, and the wafer bonding mechanism.

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