Electromagnetic heating base and electromagnetic heating device

Abstract

The application relates to an electromagnetic heating base and an electromagnetic heating device. The electromagnetic heating base comprises a shell, a mounting cavity, a first air duct and a second air duct formed in the mounting cavity and arranged in a laminated mode along the thickness direction of the shell, the first air duct and the second air duct being independent of each other, a fan arranged in the mounting cavity and provided with an air outlet on one side, one end of the first air duct being provided with a first air duct inlet, the same end of the second air duct being provided with a second air duct inlet, the fan being used for discharging air flow to the first air duct inlet and the second air duct inlet at the same time, an electromagnetic coil disc arranged in the first air duct, and a plurality of electronic components arranged in the second air duct. Compared with the scheme of adopting multiple fans in the related art, the application can reduce the noise superposition problem caused by the multiple fans, there is no space position conflict problem caused by the multiple fans, in addition, the whole machine complexity, cost and fan power consumption can be reduced.

Description

Technical Field

[0001] This application relates to the field of household appliance technology, and in particular to an electromagnetic heating base and electromagnetic heating device. Background Technology

[0002] Currently, household appliances such as induction cookers, induction heating cookware, and rice cookers all use electromagnetic heating bases, which are widely used due to their efficient and clean heating characteristics. Their core working principle relies on power electronic devices and high-frequency electromagnetic coils to generate an alternating magnetic field. These key components continuously generate considerable heat during operation. Effective heat dissipation is crucial for ensuring safe and reliable operation of the equipment, improving energy efficiency, and preventing component thermal decay damage. However, the current technology that simultaneously dissipates heat from both the power electronic devices and the high-frequency electromagnetic coil suffers from complex overall structure, high cost, and high power consumption. Utility Model Content

[0003] Therefore, it is necessary to address the problems of complex overall structure, high cost, and high power consumption associated with methods that simultaneously dissipate heat from power electronic devices and high-frequency electromagnetic coils in related technologies. A solution should be provided: an electromagnetic heating base and electromagnetic heating device.

[0004] This application provides an electromagnetic heating base, comprising:

[0005] The housing has a mounting cavity, in which a first air duct and a second air duct are formed stacked along the thickness direction of the housing, and the first air duct and the second air duct are independent of each other.

[0006] A fan is installed inside an installation cavity and has an air outlet on one side. One end of a first air duct forms a first air duct inlet, and the same end of a second air duct forms a second air duct inlet. The fan is used to simultaneously discharge airflow to both the first and second air duct inlets.

[0007] An electromagnetic coil disc is located within the first air duct; and

[0008] Multiple electronic components are located in the second air duct.

[0009] In one embodiment, the electronic components include a power device, and the electromagnetic heating base also includes a heat sink, with the power device disposed on the heat sink, which is used to dissipate heat from the power device.

[0010] The radiator is positioned near the inlet of the second air duct.

[0011] In one embodiment, the radiator includes a plurality of heat dissipation fins, all of which are disposed close to the inlet of the second air duct and are spaced apart along a second direction, with each heat dissipation fin extending along a third direction; wherein the second direction is perpendicular to the axial direction of the inlet of the second air duct, and the third direction is parallel to the axial direction of the inlet of the second air duct.

[0012] In one embodiment, at least some of the heat dissipation fins have different lengths, and heat dissipation space is formed between the heat dissipation fins of different lengths, with the power device disposed within the heat dissipation space.

[0013] In one embodiment, the other end of the second air duct forms a second air duct outlet, and the second air duct inlet and the second air duct outlet are arranged opposite to each other along the radiator.

[0014] In one embodiment, along the thickness direction of the housing, the top surface of the electromagnetic coil disk and the top surface of the first air duct are spaced apart to form a first flow gap for airflow, and the outer peripheral surface of the electromagnetic coil disk and the inner peripheral surface of the first air duct are spaced apart to form a second flow gap for airflow.

[0015] In one embodiment, the first air duct includes a first air inlet air duct, a buffer air duct, and a first air outlet air duct. One end of the first air inlet air duct is connected to the first air duct inlet, and the two ends of the buffer air duct are respectively connected to the other end of the first air inlet air duct and one end of the first air outlet air duct. The other end of the first air outlet air duct forms the first air duct outlet. The electromagnetic coil is disposed in the buffer air duct.

[0016] The cross-sectional area of ​​the first air inlet duct adjacent to the buffer duct is smaller than that of the buffer duct, and the cross-sectional area of ​​the first air outlet duct adjacent to the buffer duct is smaller than that of the buffer duct; and the cross-sectional area of ​​the first air inlet duct gradually decreases along the airflow direction, while the cross-sectional area of ​​the first air outlet duct, at least the portion adjacent to the outlet of the first duct, gradually increases along the airflow direction.

[0017] In one embodiment, the other end of the first air duct forms a first air duct outlet, and the first air duct inlet and the first air duct outlet are arranged opposite each other along the electromagnetic coil disk.

[0018] In one embodiment, the housing includes a bottom shell, a panel assembly, and a coil support. A mounting cavity is formed between the bottom shell and the panel assembly, and the coil support is disposed within the mounting cavity. Along the thickness direction of the housing, the panel assembly and the coil support are spaced apart to form a first air duct, the coil support is spaced apart from the bottom shell, and a second air duct is formed between the panel assembly, the coil support, and the panel assembly.

[0019] A second aspect of this application also provides an electromagnetic heating device, including the electromagnetic heating base in any of the above embodiments.

[0020] The aforementioned electromagnetic heating base and electromagnetic heating device, by employing a stacked arrangement of the first and second air ducts along the thickness direction of the housing and using a single fan, can simultaneously dissipate heat from the electromagnetic coil disc in the first air duct and the electronic components in the second air duct. Compared to related technologies that use multiple fans, this application reduces the noise superposition problem caused by multiple fans, eliminates spatial conflicts caused by multiple fans, and further reduces overall complexity, cost, and fan power consumption. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the electromagnetic heating base structure in one or more embodiments of this application.

[0022] Figure 2 for Figure 1 A schematic diagram of the electromagnetic heating base from another perspective.

[0023] Figure 3 for Figure 1 The diagram shows an exploded view of the electromagnetic heating base.

[0024] Figure 4 for Figure 1 The diagram shows a cross-sectional structure of the electromagnetic heating base.

[0025] Figure 5 for Figure 1 The front view of the air outlet of the fan in the electromagnetic heating base shown.

[0026] Figure 6 for Figure 1 The diagram shown is a structural schematic of the electromagnetic heating base with part of the panel assembly removed.

[0027] Figure 7 for Figure 1 An exploded view of the panel assembly in the electromagnetic heating base shown.

[0028] Figure 8 for Figure 1 The diagram shows a partial structural design of the electromagnetic heating base.

[0029] Figure 9 for Figure 1 A bottom view of the panel assembly in the electromagnetic heating base shown.

[0030] Figure 10 for Figure 1 The diagram shows the structure of the coil support in the electromagnetic heating base.

[0031] Figure 11 for Figure 1 A schematic diagram of another part of the electromagnetic heating base shown.

[0032] Explanation of reference numerals in the attached figures:

[0033] 100. Electromagnetic heating base; 10. Housing; 11. Mounting cavity; 12. Bottom shell; 121. Air inlet; 13. Panel assembly; 131. Cover; 132. Top cover; 133. Microcrystalline plate; 134. Second sealing edge; 1341. Second arc-shaped edge; 1342. Second inlet connection edge; 1343. Second outlet connection edge; 14. Coil bracket; 141. Bottom support structure; 1411. Circular support platform; 1412. First guide surface; 1413. Second guide surface; 142. First sealing edge; 1421. First arc-shaped edge; 1422. First inlet connection edge; 1423. 143. First outlet connecting edge; 20. Connecting part; 21. Fan; 22. Air outlet; 30. Electromagnetic coil disc; 40. First air duct; 41. First air duct inlet; 42. First air inlet air duct; 43. Buffer air duct; 44. First air outlet air duct; 45. First air duct outlet; 50. Second air duct; 51. Second air duct inlet; 52. Second air duct outlet; 60. Power device; 70. Heat sink; 71. Heat sink fins; 80. Circuit board; A1. First flow gap; A2. Second flow gap; AA. First air outlet area; BB. Second air outlet area; DL. Separator line. Detailed Implementation

[0034] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0035] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0036] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0037] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0038] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0039] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0040] See Figures 1-4 An embodiment of this application provides an electromagnetic heating base 100, including a housing 10, a fan 20, and an electromagnetic coil 30. The electromagnetic heating base 100 of this application embodiment can be applied to induction cookers, rice cookers, electromagnetic heating pots, and electromagnetic heating kettles. Of course, it can also be applied to other devices that are suitable for electromagnetic heating bases 100, and there are no specific limitations.

[0041] The housing 10 is the structure that supports the other components of the entire electromagnetic heating base 100. The housing 10 can form a hollow inner cavity for installing other components. Specifically, the housing 10 has a mounting cavity 11, in which the fan 20 and the electromagnetic coil disc 30 are both located.

[0042] The housing 10 may specifically include a bottom shell 12 and a panel assembly 13, which can be joined to form the aforementioned mounting cavity 11. Exemplarily, the bottom shell 12 and the panel assembly 13 can be joined by a snap-fit ​​mechanism or by fasteners such as screws. The bottom shell 12 may have an opening at its top, and the panel assembly 13 can be installed at this opening to cover it. Figure 7 The panel assembly 13 may include a cover 131, a face cover 132, and a microcrystalline plate 133. The face cover 132 is placed on one side of the cover 131, and the microcrystalline plate 133 is located at a circular mounting hole that passes through the panel and the cover 131. All three are mounted on the bottom shell 12.

[0043] The fan 20 is a device that converts mechanical energy into gas kinetic energy. In the embodiments of this application, an air outlet 21 is formed on one side of the fan 20. The fan 20 can generate an exhaust airflow through the air outlet 21. The exhaust airflow can pass through the electromagnetic coil disk 30 and other electronic components located in the mounting cavity 11, thereby dissipating heat from them. Optionally, the fan 20 is a centrifugal fan 20. Compared with a traditional axial flow fan 20, the centrifugal fan 20 has a controllable exhaust direction and higher air pressure.

[0044] In addition, the fan 20 also has an air inlet 22. When the fan 20 is a centrifugal fan 20, the air inlet 22 of the fan 20 can be located on both sides of its axial direction, that is, on opposite sides of the fan housing 10 along the axial direction of the fan 20. Specifically, the axial direction of the fan 20 is parallel to the thickness direction of the housing 10. Therefore, the air inlet 22 of the fan 20 can face the bottom shell 12 and the panel assembly 13. Further, the bottom surface of the bottom shell 12 has a plurality of through air inlets 121. The air inlet 22 of the fan 20 facing the bottom shell 12 covers a portion of all the air inlets 121, and the other portion of the air inlets 121 communicates with the receiving cavity, so that the gas entering from the other portion of the air inlets 121 can be drawn into the air inlet 22 of the fan 20 facing the panel assembly 13. In this way, dual air inlets 22 are used to draw air, improving the air intake and exhaust efficiency of the fan 20.

[0045] At the rear end of the air outlet 21 of the fan 20, specifically, a first air duct 40 is formed within the mounting cavity 11 of the housing 10. The electromagnetic coil disk 30 is disposed within the first air duct 40, and the air outlet 21 of the fan 20 is connected to the first air duct 40. In this way, the airflow discharged from the air outlet 21 of the fan 20 can enter the first air duct 40 to dissipate heat from the electromagnetic coil disk 30.

[0046] In addition, a second air duct 50 is formed inside the mounting cavity 11 of the housing 10, and multiple electronic components are disposed within the second air duct 50. The air outlet 21 of the fan 20 is connected to the second air duct 50. In this way, the airflow discharged from the air outlet 21 of the fan 20 can enter the second air duct 50 to dissipate heat from the multiple electronic components.

[0047] In the embodiments of this application, the first air duct 40 and the second air duct 50 are stacked along the thickness direction of the housing 10, and the first air duct 40 and the second air duct 50 are independent of each other.

[0048] The thickness direction of the housing 10 is the same as the vertical direction of the electromagnetic heating base 100 during normal use, that is... Figure 4 The vertical direction is shown. Normally, the first air duct 40 is located above the second air duct 50. The independence of the first air duct 40 and the second air duct 50 means that the airflow in the first air duct 40 and the airflow in the second air duct 50 do not mix or interact, thus allowing the components within each duct to dissipate heat independently.

[0049] Since the first air duct 40 and the second air duct 50 in this application are stacked along the thickness of the housing 10, the space occupied in the direction perpendicular to the thickness of the housing 10 can be reduced. Furthermore, the stacked arrangement allows for a more compact arrangement between the two air ducts, resulting in a thinner overall structure for the electromagnetic heating base 100. Specifically, the direction perpendicular to the thickness of the housing 10 includes both the length direction and the width direction of the housing 10.

[0050] Specifically, the projection of the first air duct 40 along the thickness direction of the housing 10 toward the second air duct 50 falls into the second air duct 50.

[0051] In other words, the first air duct 40 and the second air duct 50 have a high degree of overlap in the thickness direction. This can further reduce the space occupied by the first air duct 40 and the second air duct 50 in the thickness direction perpendicular to the housing 10, making the overall structure more compact.

[0052] In addition, in this embodiment of the application, the first air duct 40 and the second air duct 50 share the same fan 20.

[0053] It is understandable that part of the airflow discharged from the air outlet 21 of the fan 20 enters the first air duct 40 and the other part enters the second air duct 50.

[0054] Thus, a single fan 20 can simultaneously dissipate heat from the electromagnetic coil disk 30 and the electronic components. Compared to related technologies that use multiple fans 20, this application can reduce the noise superposition problem caused by multiple fans 20, and there is no spatial conflict caused by the setting of multiple fans 20. In addition, the overall complexity, cost and power consumption of the fan 20 can be reduced.

[0055] Specifically, a first air duct inlet 41 is formed at one end of the first air duct 40, and a second air duct inlet 51 is formed at the same end of the second air duct 50. The first air duct inlet 41 and the second air duct inlet 51 are both oriented towards and directly opposite the air outlet 21.

[0056] The arrangement of the first air duct inlet 41 and the second air duct inlet 51 directly opposite the air outlet 21 means that the axial direction of the first air duct inlet 41 and the axial direction of the second air duct inlet 51 are parallel to the axial direction of the air outlet 21, so that the air discharged from the air outlet 21 of the fan 20 can directly enter the first air duct inlet 41 and the second air duct inlet 51. Specifically, the first air duct inlet 41 and the second air duct inlet 51 are located at the same end, and the fan 20 can be installed at this end, so that the first air duct inlet 41 and the second air duct inlet 51 of the fan 20 face the air outlet 21.

[0057] In this way, the airflow discharged from the air outlet 21 can smoothly enter the first air duct 40 and the second air duct 50, reducing air loss and improving heat dissipation efficiency. In addition, when a centrifugal fan 20 is selected for the fan 20, because the airflow discharged from the air outlet 21 of the fan 20 is concentrated, has high air pressure and precise direction, when the first air duct inlet 41 and the second air duct inlet 51 are both oriented and directly opposite the air outlet 21, the airflow can be more accurately guided and distributed to the first air duct inlet 41 and the second air duct inlet 51.

[0058] Optionally, the projected areas of the first air duct inlet 41 and the second air duct inlet 51 along the axial direction towards the air outlet 21 cover the entire area of ​​the air outlet 21. In this way, the airflow discharged from the air outlet 21 of the fan 20 can be completely absorbed by the first air duct inlet 41 and the second air duct inlet 51, avoiding airflow loss and improving the heat dissipation efficiency of the electromagnetic coil disk 30 and electronic components.

[0059] Combination Figure 5In order to further improve the heat dissipation effect of the airflow in the first air duct 40 on the electromagnetic coil disk 30, in the embodiments of this application, the area of ​​the first air outlet region AA of the air outlet 21 of the fan 20 corresponding to the first air duct inlet 41 is smaller than the area of ​​the second air outlet region BB of the air outlet 21 of the fan 20 corresponding to the second air duct inlet 42.

[0060] Specifically, there is a partition wall between the first air duct inlet 41 and the second air duct inlet 42. The centerline of the partition wall is projected onto the air outlet to form a partition line DL. The partition line DL divides the air outlet into a first air outlet area AA corresponding to the first air duct inlet 41 and a second air outlet area BB corresponding to the second air duct inlet 42.

[0061] It can be understood that the area of ​​the first air outlet area AA corresponds to the air inlet area of ​​the first air duct inlet 41, and the area of ​​the second air outlet area BB corresponds to the air inlet area of ​​the second air duct inlet 42.

[0062] The airflow rate of the blower 20 is constant. When there are no components installed in the first air duct 40 and the second air duct 50, but the area of ​​the first air outlet region AA is smaller than the area of ​​the second air outlet region BB, the gas flow rate entering the first air duct inlet 41 should be proportionally smaller than the gas flow rate entering the second air duct inlet 51. However, since the first air duct 40 of this application is equipped with an electromagnetic coil disk 30, and the second air duct 50 is equipped with multiple electronic components, the resistance of the multiple electronic components to the airflow is greater than that of the electromagnetic coil disk 30. This will slow down the airflow velocity in the second air duct 50, that is, reduce the flow velocity, and at the same time, the gas flow rate entering the second air duct 50 will also decrease. The reduced gas flow rate will enter the first air duct 40. According to the gas flow rate Q = air inlet area A × flow velocity V, when the air inlet area A is constant, the gas flow rate in the first air duct 40 increases, and the gas flow velocity in the first air duct 40 will increase to a certain extent.

[0063] Therefore, when the area of ​​the first air outlet region AA of the air outlet 21 of the fan 20 corresponding to the first air duct inlet 41 is smaller than the area of ​​the second air outlet region BB of the air outlet 21 of the fan 20 corresponding to the second air duct inlet 42, since the same fan 20 is used to discharge airflow to both the first air duct 40 and the second air duct 50, the gas velocity of the first air duct inlet 41 with the smaller area increases, and the gas flow rate in the first air duct 40 increases. This not only improves the heat dissipation effect on the electromagnetic coil disk 30 in the first air duct 40, but also reduces the difference between the gas flow rate in the first air duct 40 and the gas flow rate in the second air duct 50, making the airflow distribution more uniform.

[0064] Optionally, the ratio of the area of ​​the first air outlet area AA to the area of ​​the second air outlet area BB is 1 / 1+y; where 0.5≤y≤1.

[0065] The study found that when the ratio of the area of ​​the first air outlet region AA to the area of ​​the second air outlet region BB is 1 / 1+y, where 0.5≤y≤1, compared with the traditional dual-fan technology that dissipates heat from the first air duct 40 and the second air duct 50 respectively, the heat dissipation efficiency of this application can be improved by about 20%.

[0066] The specific value of y can be determined based on the size, position, and quantity of the specific electronic components installed in the second air duct 50.

[0067] More specifically, the dividing line DL is parallel to the center line of symmetry of the air outlet 21 and along the thickness direction of the housing 10. The first air outlet area AA has a first height, and the second air outlet area BB has a second height. The ratio of the first height to the second height is 1 / 1+y; where 0.5≤y≤1.

[0068] When the air outlet 21 has a symmetrical center line, the shape of the air outlet 21 is a regular shape, such as a circle, rectangle, ellipse, or rhombus. Therefore, the area ratio between the first air outlet area AA and the second air outlet area BB can be directly determined by the height ratio of the first air outlet area AA and the second air outlet area BB. This method is more direct and can improve the reliability of the area design of the air outlet 21, the first air duct inlet 41, and the second air duct inlet 42.

[0069] The first air duct 40 inside the housing 10 is described in detail below.

[0070] See Figure 4 and Figure 6 In the embodiments of this application, the first air duct 40 includes a first air inlet duct 42, a buffer duct 43, and a first air outlet duct 44. One end of the first air inlet duct 42 is connected to the first air duct inlet 41, and both ends of the buffer duct 43 are respectively connected to the other end of the first air inlet duct 42 and one end of the first air outlet duct 44. The other end of the first air outlet duct 44 forms the first air duct outlet 45. The electromagnetic coil disk 30 is disposed in the buffer duct 43. It can be understood that the first air inlet duct 42, the buffer duct 43, and the first air outlet duct 44 are connected sequentially along the airflow direction.

[0071] Thus, after the exhaust airflow enters from the first air duct inlet 41, it first flows through the first air inlet duct 42, then through the buffer duct 43 where the electromagnetic coil disk 30 is located to dissipate heat from the electromagnetic coil disk 30, and then is discharged from the first air outlet duct 44.

[0072] The first air inlet duct 42 and the first air outlet duct 44 are located at both ends of the buffer duct 43, which can guide the airflow entering the buffer duct 43 and the airflow exiting the buffer duct 43, thereby ensuring that the airflow can flow through the electromagnetic coil disk 30 in the buffer duct 43 in a concentrated and high-speed manner.

[0073] Specifically, the cross-sectional area of ​​the first air inlet duct 42 adjacent to the buffer duct 43 is smaller than the cross-sectional area of ​​the buffer duct 43, and the cross-sectional area of ​​the first air outlet duct 44 adjacent to the buffer duct 43 is smaller than the cross-sectional area of ​​the buffer duct 43.

[0074] The cross-sectional area referred to here is the area captured at the corresponding position of the cross-section air duct. This cross-section is perpendicular to the airflow direction, and specifically, it can be a cross-section parallel to the thickness direction of the shell 10.

[0075] The electromagnetic coil disk 30 typically has a large radial dimension, resulting in a correspondingly large cross-sectional area for the buffer duct 43. Therefore, if the airflow discharged from the outlet 21 of the fan 20 directly enters the buffer duct 43 and blows directly onto the electromagnetic coil disk 30, significant air loss will occur, and the airflow directional guidance effect will be poor. Therefore, by setting the first air inlet duct 42 at the front end of the buffer duct 43, and ensuring that the cross-sectional area of ​​the first air inlet duct 42 adjacent to the buffer duct 43 is smaller than that of the buffer duct 43, the incoming airflow can be guided to a certain extent. Furthermore, as the cross-sectional area increases, the airflow velocity decreases, allowing for better contact with the electromagnetic coil disk 30 within the buffer duct 43, thus improving heat dissipation. The first air outlet duct 44 is located at the rear end of the buffer duct 43, and the cross-sectional area of ​​the first air outlet duct 44 adjacent to the buffer duct 43 is smaller than that of the buffer duct 43. This allows the air to be discharged more concentratedly from the buffer duct 43 to the first air outlet duct 44, and the air velocity of the outlet air is also increased to a certain extent compared with the air velocity in the buffer duct 43, thus improving the air outlet efficiency and enhancing the heat dissipation effect.

[0076] Furthermore, the cross-sectional area of ​​the first air inlet duct 42 gradually decreases along the airflow direction, while the cross-sectional area of ​​at least the portion of the first air outlet duct 44 adjacent to the first air outlet 45 gradually increases along the airflow direction.

[0077] This causes the airflow to accelerate to a certain extent within the first air inlet duct 42 before entering the buffer duct 43, thus improving the air delivery efficiency. The airflow discharged from the buffer duct 43 can then be discharged into a wider area of ​​the first air outlet duct 44, adjacent to the rear end of the first air outlet 45, further improving the exhaust efficiency.

[0078] In addition, the cross-sectional area of ​​the portion of the first air outlet duct 44 adjacent to the first air duct inlet 41 gradually decreases along the airflow direction.

[0079] In this way, when the airflow enters the first air outlet duct 44 from the buffer channel 43, the airflow velocity can be increased more stably, thereby improving the heat dissipation efficiency.

[0080] To improve heat dissipation for the electromagnetic coil disk 30 within the first air duct 40, in this embodiment, a first flow gap A1 for airflow is formed between the top surface of the electromagnetic coil disk 30 and the top surface of the first air duct 40 along the thickness direction of the housing 10. A second flow gap A2 for airflow is formed between the outer peripheral surface of the electromagnetic coil disk 30 and the inner peripheral surface of the first air duct 40. Both the first flow gap A1 and the second flow gap A2 are formed within the aforementioned buffer air duct 43.

[0081] The top surface of the electromagnetic coil disk 30 refers to one side surface of the electromagnetic coil disk 30 along the axial direction, while the outer peripheral surface of the electromagnetic coil disk 30 refers to the surface surrounding the electromagnetic coil disk 30.

[0082] In this way, the airflow entering the first air duct 40 can flow through the first fluid gap and the second flow gap A2 to the top surface and outer periphery of the electromagnetic coil disk 30, resulting in a large heat dissipation area and higher heat dissipation efficiency for the electromagnetic coil disk 30.

[0083] The bottom surface of the electromagnetic coil disk 30 and the bottom surface of the first air duct 40 do not form a gap for airflow. This is to better support the electromagnetic coil disk 30 and improve its installation reliability. Specifically, the bottom surface of the first air duct 40 includes a support surface for supporting the electromagnetic coil disk 30.

[0084] Combination Figures 8-10 As described above, the housing 10 includes a bottom shell 12 and a panel assembly 13, with a mounting cavity 11 formed between the bottom shell 12 and the panel assembly 13. To further separate the first air duct 40 and the second air duct 50 within the mounting cavity 11, the housing 10 also includes a coil support 14 disposed within the mounting cavity 11. Along the thickness direction of the housing 10, the panel assembly 13 and the coil support 14 are positioned opposite each other and spaced apart, and are sealed together to form the first air duct 40. The coil support 14 supports the electromagnetic coil disc 30.

[0085] Therefore, the coil support 14 can not only support the electromagnetic coil disk 30, but also be used to form a sealed first air duct 40 with the panel assembly 13. On the one hand, since the coil support 14 and the panel assembly 13 form the first air duct 40 through a sealed fit, the airflow will not leak out from the gap between the coil support 14 and the panel assembly 13 after entering the first air duct 40, except for the first air duct outlet 45. Furthermore, external hot airflow will not enter the first air duct 40 through this gap and cause crosstalk, thus improving the heat dissipation efficiency of the airflow. On the other hand, using the coil support 14, which supports the electromagnetic coil disk 30, as part of forming the first air duct 40 simplifies the internal structure of the housing 10 and allows the airflow to be closer to the electromagnetic coil disk 30 that needs heat dissipation, reducing wind resistance and thus improving the heat dissipation effect.

[0086] Specifically, the coil support 14 includes a bottom support structure 141 and two first sealing edges 142. The two first sealing edges 142 protrude from the bottom support structure 141 on the side facing the panel assembly 13, and are arranged opposite to each other. The corresponding panel assembly 13 has two second sealing edges 134 protruding from the side facing the coil support 14. Each first sealing edge 142 and each second sealing edge 134 extends along the airflow direction of the first air duct 40. Each first sealing edge 142 and its corresponding second sealing edge 134 are sealed together along a first direction, forming a first air duct 40 between the two first sealing edges 142 and / or the two second sealing edges 134. The first direction is perpendicular to the thickness direction of the housing 10. The term "and / or" here includes three options: forming a first air duct 40 between the two first sealing edges 142 and / or the two second sealing edges 134; forming a first air duct 40 between the two first sealing edges 142; and forming a first air duct 40 between the two second sealing edges 134.

[0087] By providing a protruding first sealing edge 142 on the coil support 14 and a protruding second sealing edge 134 on the panel assembly 13 for sealing engagement, the sealing method between the coil support 14 and the panel assembly 13 can be simplified. Furthermore, both the first sealing edge 142 and the second sealing edge 134 extend along the airflow direction of the first air duct 40. Therefore, airflow will not leak from the gaps between the coils and the panel assembly 13 along the airflow path, improving the efficiency of airflow heat dissipation. In addition, the first sealing edge 142 and the second sealing edge 134 are sealed in a first direction perpendicular to the thickness direction of the housing 10. The first sealing edge 142 and the second sealing edge 134 have larger dimensions in this first direction, resulting in a larger sealing surface area and further improving the reliability of the seal.

[0088] Optionally, each first sealing edge 142 and a corresponding second sealing edge 134 are fitted together along a first direction to achieve a sealing fit. The fitting method is simple, and the fitted surfaces form corresponding sealing surfaces with a larger area, resulting in higher sealing reliability. In other embodiments, an elastic sealing element can be provided between the first sealing edge 142 and the second sealing edge 134, achieving a seal by compressing the elastic sealing element with the first sealing edge 142 and the second sealing edge 134. However, compared to direct fitting, the elastic sealing element increases the assembly difficulty between the first sealing edge 142 and the second sealing edge 134, thus increasing the assembly difficulty between the coil support 14 and the panel assembly 13. In other embodiments, sealant can be applied between the first sealing edge 142 and the second sealing edge 134 to achieve a sealing fit.

[0089] Furthermore, the bottom support structure 141 includes a circular support platform 1411, which supports the electromagnetic coil disk 30. That is, the circular support platform 1411 has the aforementioned support surface. More specifically, the circular support platform 1411 can fit against the bottom surface of the electromagnetic coil disk 30, thereby supporting the electromagnetic coil disk 30. Additionally, the projection of the electromagnetic coil disk 30 along its axial direction toward the coil support 14 falls within the circular support platform 1411 of the coil support 14, thus improving the reliability of the support.

[0090] Each first sealing edge 142 includes a first arc-shaped edge 1421 disposed on the edge of the circular support platform 1411, and each second sealing edge 134 includes a second arc-shaped edge 1341 that seals with the first arc-shaped edge 1421. Each first arc-shaped edge 1421 is sealed with a corresponding second arc-shaped edge 1341. A buffer air duct 43 is formed between the two first arc-shaped edges 1421 and / or the two second arc-shaped edges 1341. An arc-shaped second flow gap A2 is formed between each first arc-shaped edge 1421 or each second arc-shaped edge 1341 and the outer peripheral surface of the electromagnetic coil disk 30.

[0091] The arc-shaped second flow gap A2 can match the circular outer periphery of the electromagnetic coil disk 30, allowing airflow to pass evenly along the outer periphery of the electromagnetic coil disk 30. Therefore, it can make the heat dissipation of the outer periphery of the electromagnetic coil disk 30 uniform.

[0092] It should be noted that the centers of the two first arc-shaped edges 1421 can coincide with the central axis of the circular support platform 1411, so that the width of the second flow gaps A2 on both sides remains consistent, thereby improving the uniformity of airflow. However, the two first arc-shaped edges 1421 may not be symmetrically arranged relative to the central axis of the circular support platform 1411. For example, the arc length of one first arc-shaped edge 1421 may be greater than the arc length of the other first arc-shaped edge 1421. Of course, in some embodiments, the two first arc-shaped edges 1421 may also be symmetrically arranged relative to the central axis of the circular support platform 1411.

[0093] In embodiments of this application, the coil support 14 further includes at least three connecting portions 143 disposed outside the first sealing edge 142. All connecting portions 143 are spaced apart from each other around the circular support platform 1411, and each connecting portion 143 is fixedly connected to the panel assembly 13 via a corresponding connector. Since all connecting portions 143 are spaced apart from each other around the circular support platform 1411, the outer periphery of the electromagnetic coil disk 30 supported by the circular support platform 1411 is subjected to uniform force, improving the connection reliability between the coil support 14 and the panel assembly 13, and thus improving the reliability of the sealing fit between the two. Optionally, the number of connecting portions 143 is three, each connecting portion 143 protruding outside the first sealing edge 142, and the connection between the coil support 14 and the panel assembly 13 is achieved by bolts or screws passing through the threaded holes of the cover 131 of the panel assembly 13.

[0094] Furthermore, the bottom support structure 141 also includes a first guide surface 1412, which is connected to the support surface and is positioned closer to the first air duct inlet 41 than the support surface. Along the airflow direction, the first guide surface 1412 is inclined relative to the support surface from the bottom end to the top end of the housing 10. A first air inlet duct 42 is formed on one side of the first guide surface 1412.

[0095] In other words, the first guiding surface 1412 can guide the airflow entering the first air duct inlet 41 from bottom to top into the buffer air duct 43 where the electromagnetic coil disk 30 is located. Since the electromagnetic coil disk 30 is supported on the supporting surface, when the airflow rushes into the buffer air duct 43 from bottom to top, it can be more reliably guided to flow above the electromagnetic coil disk 30, that is, into the first flow gap A1 formed between the top surface of the electromagnetic coil disk 30 and the top surface of the panel assembly 13, reducing the wind loss caused by the airflow directly impacting the electromagnetic coil disk 30 and improving the heat dissipation effect.

[0096] Each first sealing edge 142 further includes a first inlet connecting edge 1422, one end of which is located near the first air duct inlet 41 of the first air duct 40, and the other end is connected to the first arc-shaped edge 1421; each second sealing edge 134 further includes a second inlet connecting edge 1342 that is sealingly fitted with the first inlet connecting edge 1422; a first air inlet duct 42 is formed between the two first inlet connecting edges 1422 and / or the two second inlet connecting edges 1342. The first inlet connecting edge 1422 protrudes from the first guide surface 1412 toward the panel assembly 13.

[0097] Thus, the two first inlet connecting edges 1422, the first guide surface 1412 and the panel assembly 13 enclose and form the first air inlet duct 42.

[0098] Furthermore, the distance between the two first inlet connecting edges 1422 and / or the two second inlet connecting edges 1342 gradually increases along the airflow direction. This not only buffers the airflow entering the first air duct inlet 41 from the outlet 21 of the fan 20, but also expands the purging range to adapt to the larger cross-sectional area of ​​the buffer air duct 43, thereby directionally and fully dissipating heat from the electromagnetic coil disk 30 within the buffer air duct 43.

[0099] Optionally, the first guiding surface 1412 is an arc surface, which can further reduce the resistance to airflow and allow the airflow to be guided more smoothly into the buffer duct 43.

[0100] The bottom support structure 141 also includes a second guide surface 1413, which is connected to the support surface and is positioned closer to the first air duct outlet 45 than the support surface. Along the airflow direction, the second guide surface 1413 is inclined relative to the support surface from the top to the bottom of the housing 10. A first air outlet duct 44 is formed on one side of the second guide surface 1413.

[0101] In other words, the second guide surface 1413 can guide the airflow entering the buffer air duct 43 from top to bottom to the first air duct outlet 45, which can increase the cross-sectional area of ​​the first air duct outlet 45 in the thickness direction of the housing 10, improve the airflow discharge efficiency, and thus improve the heat dissipation effect.

[0102] Optionally, the second guide surface 1413 is an arc surface, which can further reduce the resistance to airflow, allowing the airflow to be guided more smoothly from the buffer air duct 43 to the first air duct outlet 45.

[0103] Each first sealing edge 142 further includes a first outlet connecting edge 1423, one end of which is connected to the first arc-shaped edge 1421, and the other end is disposed near the first air duct outlet 45 of the first air duct 40; each second sealing edge 134 further includes a second outlet connecting edge 1343 that is sealed to the first outlet connecting edge 1423; a first air outlet duct 44 is formed between the two first outlet connecting edges 1423 and / or the two second outlet connecting edges 1343. The first outlet connecting edge 1423 protrudes from the second guide surface 1413 toward the panel assembly 13.

[0104] Thus, the two first outlet connecting edges 1423, the second guide surface 1413 and the panel assembly 13 enclose each other to form a second air outlet duct.

[0105] Furthermore, the distance between the two first outlet connecting edges 1423 and / or the two second outlet connecting edges 1343 gradually decreases along the airflow direction. In this way, the airflow from the buffer duct 43 can be converged, thereby increasing the airflow velocity at the first duct outlet 45 and improving heat dissipation efficiency.

[0106] In the embodiments of this application, the first air duct inlet 41 and the first air duct outlet 45 are arranged opposite to each other along the electromagnetic coil disk 30. In other words, the first air duct inlet 41 and the second air duct outlet 52 are arranged opposite to each other on both sides of the electromagnetic coil disk 30.

[0107] In this way, the airflow entering the location of the electromagnetic coil disk 30 can be quickly discharged after passing through the electromagnetic coil disk 30, thus reducing the existence of eddies, backflows or airflow dead zones. In addition, the relative arrangement also allows the airflow to directly pass through the core heat-generating area where the electromagnetic coil disk 30 is located, thereby improving the overall heat dissipation efficiency.

[0108] In summary, the first air duct 40 of this application embodiment can guide the airflow discharged from the air outlet 21 of the fan 20 from bottom to top into the buffer air duct 43 where the electromagnetic coil disk 30 is located through the first air inlet air duct 42. This allows the airflow to be more concentrated in the first flow gap A1 formed between the top surface of the electromagnetic coil disk 30 and the top surface of the panel assembly 13, so as to dissipate heat from the electromagnetic coil disk 30 over a large area. The second flow gap A2 formed between the outer peripheral surface of the electromagnetic coil disk 30 and the inner peripheral surface of the buffer air duct 43 can further dissipate heat from the outer peripheral surface of the electromagnetic coil disk 30. After the airflow that has absorbed the heat of the electromagnetic coil disk 30 enters the first air outlet air duct 44, it can converge and increase the airflow velocity, so that the airflow can be discharged quickly.

[0109] The second air duct 50 is described in detail below.

[0110] See Figure 4 and Figure 11 As mentioned above, the second air duct 50 is equipped with multiple electronic components, and the airflow discharged from the air outlet 21 of the fan 20 can dissipate heat from the multiple electronic components in the second air duct 50.

[0111] Along the thickness direction of the housing 10, the coil support 14 and the bottom housing 12 are spaced apart, and the second air duct 50 can be formed by the bottom housing 12, the panel assembly 13, and the coil support 14 together. Specifically, the bottom housing 12 and the cover 131 in the panel assembly 13 are fastened together. The fastening method is simple, and the positioning and connection are reliable.

[0112] The electronic components include a power device 60, and the electromagnetic heating base 100 also includes a heat sink 70. The power device 60 is disposed on the heat sink 70, and the airflow entering the second air duct 50 can dissipate heat from the power device 60 through the heat sink 70.

[0113] The power device 60 can be an IGBT or MOSFET power module. The power device 60 actually generates a large amount of heat; therefore, with the help of airflow and the heat sink 70, the heat dissipation of the power device 60 can be accelerated, improving the heat dissipation effect.

[0114] Specifically, the radiator 70 includes a plurality of heat dissipation fins 71, all of which are located close to the second air duct inlet 51 and are arranged at intervals along the second direction, with each heat dissipation fin 71 extending along the third direction; wherein the second direction is perpendicular to the axial direction of the second air duct inlet 51 and the third direction is parallel to the axial direction of the second air duct inlet 51.

[0115] The axial direction of the second air duct inlet 51 refers to the direction of its central axis. When all the heat dissipation fins 71 are positioned close to the second air duct inlet 51, the airflow entering the second air duct inlet 51 can contact the heat-generating core components within the second air duct 50 with zero loss. Furthermore, when all the heat dissipation fins 71 are spaced apart along the first direction, and each heat dissipation fin 71 extends along the second direction, a heat dissipation gap will be formed between any two adjacent heat dissipation fins 71, and the airflow entering the second air duct inlet 51 will flow downstream along the heat dissipation gap. This not only reduces the energy loss of the airflow due to the heat dissipation fins 71, but also ensures that the airflow fully contacts the heat dissipation fins 71, thus improving the heat dissipation efficiency.

[0116] Optionally, the number of heat dissipation fins 71 is not limited, and can be 10 to 20.

[0117] Furthermore, at least some of the heat dissipation fins 71 have different lengths, and heat dissipation spaces are formed between the heat dissipation fins 71 of different lengths, with the power device 60 disposed within the heat dissipation space.

[0118] In this way, the heat dissipation fins 71 can be arranged around the outer periphery of the power device 60, thereby better dissipating heat from the power device 60 and improving heat dissipation efficiency.

[0119] Specifically, the power device 60 includes multiple components, and the heat dissipation space also includes multiple components, with each heat dissipation space housing a corresponding power device 60. Optionally, the power device 60 includes three components, and the heat dissipation space also includes three corresponding components.

[0120] In embodiments of this application, the electronic components also include a circuit board 80, such as a PCBA (Printed Circuit Board Assembly) motherboard. The aforementioned heat sink 70 and power device 60 can both be mounted on the PCBA motherboard. The PCBA motherboard can be entirely housed within the second air duct 50, allowing airflow to dissipate heat from it via the PCBA motherboard.

[0121] In the embodiments of this application, a second air duct outlet 52 is also formed at one end of the second air duct 50, and the first air duct outlet 45 is disposed opposite to the first air duct outlet 45 along the radiator 70. In other words, the first air duct inlet 41 and the second air duct outlet 52 are disposed opposite to each other on both sides of the radiator 70.

[0122] In this way, the airflow entering the location of the radiator 70 can quickly pass through the radiator 70 and be discharged, thus reducing the existence of eddies, backflows or dead zones. In addition, the relative arrangement also allows the airflow to pass directly through the core heat-generating area where the radiator 70 is located, thus improving the overall heat dissipation efficiency.

[0123] In addition, on the airflow path from the second air duct inlet 51 to the second air duct outlet 52, the electronic components on the PCBA motherboard should avoid the space downstream of the heat sink 70, so that the hot air flowing out of the heat sink 70 can be discharged through the second air duct outlet 52 as soon as possible.

[0124] In summary, the second air duct 50 of this embodiment allows cold air entering from the second air duct inlet 51 to directly blow onto the heat dissipation fins 71 of the radiator 70 with zero loss, and the power device 60 is also positioned forward, improving the efficient heat exchange to the core heat-generating area.

[0125] Based on the same inventive concept, this application also provides an electromagnetic heating device, including the electromagnetic heating base 100 in any of the above embodiments.

[0126] The electromagnetic heating device can be any one of an induction cooker, rice cooker, electromagnetic heating pot, or electromagnetic heating kettle. Of course, it can also be other electromagnetic heating devices, and there are no specific restrictions.

[0127] The advantages of the electromagnetic heating base 100 and electromagnetic heating device of this application embodiment compared with the prior art include at least the following:

[0128] By setting up stacked double-layer air ducts vertically in the thickness direction of the housing 10, the internal space layout of the housing 10 can be greatly optimized, and the overall structure is thinner and more compact.

[0129] Using a single fan 20 as the drive source and simultaneously setting up independent air ducts on the upper and lower levels not only reduces the complexity, cost, and power consumption of the entire system, but also avoids the noise superposition and space conflict caused by multiple fans 20. Furthermore, the upper air duct inlet adopts an air intake area smaller than that of the lower air duct inlet, which increases the airflow velocity in the upper air duct to improve the heat dissipation effect on the electromagnetic coil disk 30, while also reducing the airflow difference between the upper and lower air ducts, making the airflow distribution more uniform.

[0130] The fan 20 adopts a centrifugal fan 20 instead of a traditional axial fan 20. Its airflow is concentrated, the air pressure is high and the direction is precise. Therefore, when the inlets of the upper and lower air ducts are set to face the air outlet 21 of the fan 20, the airflow can be more accurately guided and distributed to the inlets of the upper and lower air ducts.

[0131] The upper and lower air ducts are sealed by physical isolation; the upper air duct, which is the first air inlet air duct 42, is sealed by the sealing relationship between the panel assembly 13 and the coil bracket 14, which reduces air leakage and crosstalk between hot and cold air, and also reduces wind resistance and improves heat dissipation.

[0132] In addition, each air duct has an optimized directional airflow path inside, ensuring that the airflow can be concentrated and flow at high speed through its corresponding key heat-generating area, reducing ineffective flow (no eddies / backflow, etc.) and ensuring efficient use of airflow. Furthermore, each air duct has an independent exhaust port at its end to quickly exhaust hot air.

[0133] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0134] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An electromagnetic heating base, characterized in that, include: The housing has a mounting cavity, in which a first air duct and a second air duct are formed stacked along the thickness direction of the housing, and the first air duct and the second air duct are independent of each other; A fan is disposed in the mounting cavity and has an air outlet on one side. One end of the first air duct forms a first air duct inlet, and the same end of the second air duct forms a second air duct inlet. The fan is used to simultaneously discharge airflow to the first air duct inlet and the second air duct inlet. as well as An electromagnetic coil is installed inside the first air duct; as well as Multiple electronic components are located within the second air duct.

2. The electromagnetic heating base according to claim 1, characterized in that, The electronic components include power devices, and the electromagnetic heating base also includes a heat sink. The power devices are disposed on the heat sink, and the heat sink is used to dissipate heat from the power devices. The radiator is located near the inlet of the second air duct.

3. The electromagnetic heating base according to claim 2, characterized in that, The radiator includes multiple heat dissipation fins, all of which are located close to the second air duct inlet and are spaced apart along a second direction. Each heat dissipation fin extends along a third direction. The second direction is perpendicular to the axial direction of the second air duct inlet, and the third direction is parallel to the axial direction of the second air duct inlet.

4. The electromagnetic heating base according to claim 3, characterized in that, At least some of the heat dissipation fins have different lengths, and heat dissipation spaces are formed between the heat dissipation fins of different lengths, with the power device disposed within the heat dissipation space.

5. The electromagnetic heating base according to claim 2, characterized in that, The other end of the second air duct forms a second air duct outlet, and the second air duct inlet and the second air duct outlet are arranged opposite to each other along the radiator.

6. The electromagnetic heating base according to any one of claims 1 to 5, characterized in that, Along the thickness direction of the housing, the top surface of the electromagnetic coil disk and the top surface of the first air duct are spaced apart to form a first flow gap for airflow, and the outer peripheral surface of the electromagnetic coil disk and the inner peripheral surface of the first air duct are spaced apart to form a second flow gap for airflow.

7. The electromagnetic heating base according to any one of claims 1 to 5, characterized in that, The first air duct includes a first air inlet duct, a buffer duct, and a first air outlet duct. One end of the first air inlet duct is connected to the first air duct inlet. The two ends of the buffer duct are respectively connected to the other end of the first air inlet duct and one end of the first air outlet duct. The other end of the first air outlet duct forms the first air duct outlet. The electromagnetic coil is disposed in the buffer duct. The cross-sectional area of ​​the first air inlet duct adjacent to the buffer duct is smaller than the cross-sectional area of ​​the buffer duct, and the cross-sectional area of ​​the first air outlet duct adjacent to the buffer duct is smaller than the cross-sectional area of ​​the buffer duct; and the cross-sectional area of ​​the first air inlet duct gradually decreases along the airflow direction, while the cross-sectional area of ​​at least the portion of the first air outlet duct adjacent to the outlet of the first duct gradually increases along the airflow direction.

8. The electromagnetic heating base according to claim 1, characterized in that, The other end of the first air duct forms the first air duct outlet, and the first air duct inlet and the first air duct outlet are arranged opposite to each other along the electromagnetic coil disk.

9. The electromagnetic heating base according to claim 1, characterized in that, The housing includes a bottom shell, a panel assembly, and a coil support. The mounting cavity is formed between the bottom shell and the panel assembly, and the coil support is disposed within the mounting cavity. Along the thickness direction of the housing, the panel assembly and the coil support are spaced apart to form a first air duct, the coil support is spaced apart from the bottom shell, and a second air duct is formed between the panel assembly, the coil support, and the panel assembly.

10. An electromagnetic heating device, characterized in that, Includes the electromagnetic heating base as described in any one of claims 1 to 9.

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