Infrared temperature measuring device for nickel smelting discharge port

By installing an infrared thermometer at the nickel smelting outlet and combining it with a semiconductor cooling chip and a cooling fan, the safety risks and discontinuous measurement problems of traditional temperature measurement methods are solved, enabling real-time and continuous temperature monitoring of the nickel smelting process and reducing costs and manpower consumption.

CN224681678UActive Publication Date: 2026-08-25JINCHUAN GROUP NICKEL COBALT CO LTD
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Patent Information

Application Number
CN202521050468.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-05-27
Publication Date
2026-08-25
Estimated Expiration
2035-05-27

AI Technical Summary

Technical Problem

In the existing nickel smelting process, traditional temperature measurement methods have problems such as safety risks, large errors, inability to achieve continuous real-time monitoring, and easy damage to sensors in high-temperature environments.

Method used

An infrared thermometer is combined with a semiconductor cooling chip and a cooling fan. The infrared thermometer is cooled by a heat-conducting plate and a semiconductor cooling chip, ensuring that it can work normally in high-temperature environments and achieve continuous real-time temperature measurement.

Benefits of technology

It enables real-time and continuous temperature monitoring of infrared thermometers, reduces manpower consumption, improves temperature measurement efficiency, and has a simple structure and low cost.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a nickel smelting discharge port infrared temperature measuring device, including mount, the mount, be equipped with infrared temperature measuring instrument on the mount, infrared temperature measuring instrument's both sides each is equipped with a heat conduction plate, be equipped with the arc structure's clamping groove on the heat conduction plate, infrared temperature measuring instrument is located in the clamping groove, the heat conduction plate is equipped with semiconductor refrigeration piece in the side away from the clamping groove side, one side of semiconductor refrigeration piece forms refrigeration surface, and the other side forms the radiating surface, and the refrigeration surface is in abutment on the heat conduction plate. The utility model sets up semiconductor refrigeration piece in infrared temperature measuring instrument both sides, and the infrared temperature measuring instrument cooling is cooled through semiconductor refrigeration piece, effectively prevents infrared temperature measuring instrument long time in nickel smelting discharge port place temperature rise, influences normal use, and further can install infrared temperature measuring instrument in nickel smelting discharge port, carries out real -time temperature measurement to melt, saves manpower, improves monitoring efficiency, simple structure, low cost.
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Description

Technical Field

[0001] This utility model belongs to the technical field of temperature monitoring equipment, and relates to an infrared temperature measuring device for a nickel smelting outlet. Background Technology

[0002] The top-blown furnace employs an oxygen-enriched nickel smelting process. The system's process flow utilizes oxygen-enriched top-blown immersion lance smelting followed by PS blowing. In this top-blown nickel smelting system, precise control of the melt temperature is crucial for product quality and process stability. Traditional temperature measurement methods involve personnel holding a temperature gun and inserting the tip into the melt at the discharge port to monitor the melt temperature during discharge. This operation not only poses safety risks but also introduces errors due to the instability of human operation. Furthermore, wired thermocouple temperature monitoring is discontinuous, and the measurement time is highly dependent on the operator, allowing only measurements at a specific point in time and failing to provide real-time continuous temperature monitoring throughout the discharge process, resulting in a measurement blind spot. If a temperature sensor is installed at the nickel smelting discharge port for continuous temperature measurement, the sensor is easily damaged due to prolonged exposure to high temperatures, rendering it unable to perform normal detection. Utility Model Content

[0003] The purpose of this utility model is to provide an infrared temperature measuring device for nickel smelting outlets, addressing the problems existing in the prior art.

[0004] Therefore, the present invention adopts the following technical solution: An infrared temperature measuring device for a nickel smelting outlet includes a mounting frame. An infrared thermometer is mounted on the mounting frame. A heat-conducting plate is provided on each side of the infrared thermometer. The heat-conducting plate has an arc-shaped slot. The infrared thermometer is located in the slot. A semiconductor refrigeration chip is provided on the side of the heat-conducting plate away from the slot. One side of the semiconductor refrigeration chip forms a cooling surface, and the other side forms a heat dissipation surface. The cooling surface abuts against the heat-conducting plate.

[0005] Furthermore, the heat-conducting plate is fixed to the mounting bracket.

[0006] Furthermore, a heat sink is provided on the heat dissipation surface of the semiconductor cooling chip, and the heat sink is mounted on a mounting bracket.

[0007] Furthermore, a cooling fan is installed on the heat sink.

[0008] The beneficial effects of this utility model are as follows: semiconductor cooling chips are set on both sides of the infrared thermometer, and the infrared thermometer is cooled down by the semiconductor cooling chips, which effectively prevents the infrared thermometer from rising in temperature at the nickel smelting outlet for a long time, affecting normal use. In addition, the infrared thermometer can be installed at the nickel smelting outlet to measure the temperature of the melt in real time, saving manpower and improving monitoring efficiency; the structure is simple and the cost is low. Attached Figure Description

[0009] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic rear view of the structure of this utility model; In the diagram, 1-mounting bracket, 2-infrared thermometer, 3-heat conduction plate, 4-card slot, 5-semiconductor cooling chip, 501-cooling surface, 502-heat dissipation surface, 6-heat sink, 7-cooling fan. Detailed Implementation

[0010] The present invention will now be described in detail with reference to the accompanying drawings: like Figure 1 and 2 As shown, an infrared temperature measuring device for a nickel smelting outlet includes a mounting frame 1, which can be installed at the outlet of a smelting furnace. An infrared thermometer 2 is mounted on the mounting frame 1. The infrared thermometer 2 is a conventional infrared thermometer with a cylindrical structure, capable of measuring the temperature of the molten material at the outlet. A heat-conducting plate 3 is located on each side of the infrared thermometer 2, fixed to the mounting frame 1. The heat-conducting plate 3 is made of a conventional metal material with good thermal conductivity. A semi-circular slot 4 is provided on the heat-conducting plate 3 to increase the contact area between the heat-conducting plate 3 and the infrared thermometer 2, improving the cooling effect. The infrared thermometer 2 is located within the slot 4. A semiconductor cooling chip 5 is located on the side of the heat-conducting plate 3 away from the slot 4. The semiconductor cooling chip 5 is a conventional semiconductor cooling chip. One side of the semiconductor cooling chip 5 forms a cooling surface 501, and the other side forms a heat dissipation surface 502. During use… The cooling surface 501 cools down the infrared thermometer 2, while the heat dissipation surface 502 heats up the infrared thermometer 2. The cooling surface 501 is pressed against the heat-conducting plate 3, and cooling is achieved through the cooling surface 501, which in turn cools the heat-conducting plate 3, thereby cooling the infrared thermometer 2 and keeping it within a suitable temperature range to prevent overheating in high-temperature environments. Since the semiconductor cooling chip 5 has a good cooling effect, it can ensure rapid and timely cooling of the infrared thermometer 2. In order to cool down the heat dissipation surface 502 and dissipate its temperature in a timely manner to prevent the heat dissipation surface 502 from overheating, a heat sink 6 is provided on the heat dissipation surface 502 of the semiconductor cooling chip 5. The heat sink 6 is mounted on the mounting bracket 1. The heat sink 6 can be a conventional computer CPU heat sink. A cooling fan 7 is also installed on the heat sink 6. The cooling fan 7 can be a conventional computer CPU cooling fan.

[0011] The method of using this utility model is as follows: Install the mounting bracket 1 at the discharge port of the smelting furnace. The infrared thermometer 2 on the mounting bracket 1 can continuously measure the temperature of the melt at the discharge port of the smelting furnace. When in use, the semiconductor cooling chip 5 can be turned on to cool the infrared thermometer 2 through the cooling surface 501 of the semiconductor cooling chip 5 and the heat conduction plate 3 to cool the infrared thermometer 2. This prevents the infrared thermometer 2 from overheating and becoming unusable in a high-temperature environment for a long time, and ensures that the temperature of the infrared thermometer 2 is within the normal range. While cooling the infrared thermometer 2, the cooling fan 7 also needs to be turned on to cool the heat dissipation surface 502 of the semiconductor cooling chip 5 through the heat sink 6 to prevent the heat dissipation surface 502 from overheating.

[0012] This device can effectively prevent the infrared thermometer 2 from being unable to function properly due to excessively high temperature at the furnace outlet for extended periods, thereby enabling the infrared thermometer 2 to continuously measure the temperature of the melt in real time.

Claims

1. An infrared temperature measuring device for a nickel smelting outlet, characterized in that, The device includes a mounting bracket (1), on which an infrared thermometer (2) is mounted. A heat-conducting plate (3) is provided on each side of the infrared thermometer (2). A slot (4) with a semi-circular structure is provided on the heat-conducting plate (3). The infrared thermometer (2) is located in the slot (4). A semiconductor cooling chip (5) is provided on the side of the heat-conducting plate (3) away from the slot (4). One side of the semiconductor cooling chip (5) forms a cooling surface (501) and the other side forms a heat dissipation surface (502). The cooling surface (501) abuts against the heat-conducting plate (3).

2. The infrared temperature measuring device for a nickel smelting outlet according to claim 1, characterized in that, The heat-conducting plate (3) is fixed on the mounting bracket (1).

3. The infrared temperature measuring device for a nickel smelting outlet according to claim 1, characterized in that, The semiconductor cooling chip (5) has a heat dissipation surface (502) provided with a heat sink (6), and the heat sink (6) is mounted on the mounting bracket (1).

4. The infrared temperature measuring device for a nickel smelting outlet according to claim 3, characterized in that, A cooling fan (7) is installed on the heat sink (6).