Circuit board and variable frequency drive

Abstract

The application discloses a circuit board and a variable frequency driver. The circuit board comprises a circuit board body and a solder pad arranged on the circuit board body. The surface layer of the solder pad on the circuit board body is a copper foil layer used for soldering electronic components. The solder pad has a tin stealing part and a tin trailing part. Both the tin stealing part and the tin trailing part are triangular, and the tin stealing part and the tin trailing part have a common side. The line between the top corner opposite to the common side of the tin stealing part and the top corner opposite to the common side of the tin trailing part is consistent with a first direction, and the extension line of the common side is consistent with a second direction. During the movement of the circuit board along the first direction, the solder tin first contacts the tin stealing part, so that the surface tension of the solder tin is uniformly distributed, and with the movement of the circuit board, the solder tin covers the pins of the electronic components and the solder pad to complete the soldering. Then, the tin trailing part guides the trailing of the solder tin to gather in the inside of the tin trailing part, reduces the tin connection phenomenon between adjacent solder pads, and reduces the safety hidden danger in the operation of the circuit board.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and more specifically, to a circuit board and a frequency converter driver. Background Technology

[0002] Circuit boards typically have pads for soldering electronic components. However, due to the close spacing between the pads on existing circuit boards, solder bridging can easily occur during the soldering process, causing short circuits between electronic component modules and posing a safety hazard during circuit board operation.

[0003] In conclusion, how to reduce solder bridging to minimize safety hazards during circuit board operation is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] In view of this, the purpose of this application is to provide a circuit board and frequency converter to reduce solder bridging and reduce safety hazards during circuit board operation.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] A circuit board includes: a circuit board body and solder pads; the circuit board body has an opening, the solder pads are disposed at the opening, the surface layer of the solder pads on the circuit board body is a copper foil layer, and the solder pads are used for soldering electronic components; the solder pads have a solder-stealing portion and a solder-dragging portion; both the solder-stealing portion and the solder-dragging portion are triangular, and the solder-stealing portion and the solder-dragging portion share a common side; the line connecting the vertex A opposite to the common side of the solder-stealing portion and the vertex B opposite to the common side of the solder-dragging portion is a line AB, the line AB is consistent with a first direction, and the extension of the common side is consistent with a second direction; wherein, the first direction is the reflow direction.

[0007] A frequency converter driver includes a circuit board; the circuit board includes a circuit board body and pads, the circuit board body has an opening, the pads are disposed at the opening, the pads are used for soldering electronic components, and the surface layer of the pads on the circuit board body is a copper foil layer; the pads are configured with a solder-stealing portion and a solder-dragging portion; both the solder-stealing portion and the solder-dragging portion are triangular, and the solder-stealing portion and the solder-dragging portion share a side; the line connecting the vertex A opposite to the common side of the solder-stealing portion and the vertex B opposite to the common side of the solder-dragging portion is AB, the line AB is consistent with a first direction, and the extension of the common side is consistent with a second direction; there are at least two pads, and the at least two pads are distributed sequentially along the second direction; the pads have through holes, the center M of the through holes coincides with the center point of the common side; the first direction is the reflow direction, and the first direction is perpendicular to the second direction.

[0008] The circuit board provided in this application includes a circuit board body and pads disposed at openings in the circuit board body. The surface layer of the pads on the circuit board body is a copper foil layer for soldering electronic components. The pads have a solder-stealing portion and a solder-dragging portion, both of which are triangular. The triangular shape of the solder-stealing and dragging portions improves the guidance of solder and increases the capacity for accommodating excess solder. Furthermore, the solder-stealing and dragging portions share a common side, forming an integral structure. The line AB connecting the vertex A opposite to the common side of the solder-stealing portion and the vertex B opposite to the common side of the dragging portion is consistent with the first direction. The first direction is the reflow direction, and the extension line of the common side is consistent with the second direction. In this way, during the process of the circuit board moving along the first direction to solder electronic components onto the pads, the solder first contacts the solder-stealing part, so that the surface tension of the solder is evenly distributed. As the circuit board moves, the solder covers the electronic component pins and pads to complete the soldering. Then, as the circuit board continues to move, the solder-dragging part guides the solder tail to gather in the top corner of the solder-dragging part away from the common side, so that the solder is isolated inside the solder-dragging part, reducing the solder bridging phenomenon between adjacent pads and reducing safety hazards during the operation of the circuit board. Attached Figure Description

[0009] The accompanying drawings used in the embodiments of this application will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings.

[0010] Figure 1 This is a schematic diagram of the circuit board structure provided in an embodiment of this application;

[0011] Figure 2 This is a schematic diagram of the structure of a solder pad provided in an embodiment of this application;

[0012] Figure 3 This is a schematic diagram of another pad structure provided in an embodiment of this application;

[0013] Figure 4 This is a schematic diagram of another pad structure provided in an embodiment of this application.

[0014] Explanation of reference numerals in the attached figures:

[0015] 100 - Circuit board body;

[0016] 200 - pad, 201 - through hole, 210 - solder stealing section, 220 - solder dragging section. Detailed Implementation

[0017] The embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. The following embodiments are examples used to illustrate the technical solutions of this application, and should not be used to limit the scope of protection of this application. Those skilled in the art will understand that, without conflict, the following embodiments and features can be combined with each other.

[0018] It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, relational terms such as "first," "second," etc., in the description of this application are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, article, or apparatus.

[0019] Furthermore, the term "and / or" in this application is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0020] like Figures 1-4As shown, the circuit board provided in this embodiment includes a circuit board body 100 and solder pads 200. The circuit board body 100 has openings, and solder pads 200 are disposed at the openings of the circuit board body 100. The surface layer of the solder pads 200 on the circuit board body 100 is a copper foil layer, so that the solder pads 200 can be used to solder electronic components. The solder pads 200 have a solder-stealing part 210 and a solder-dragging part 220, both of which are triangular. The triangular shape of the solder-stealing part 210 and the solder-dragging part 220 improves the guidance of solder and increases the capacity for excess solder. The solder-stealing part 210 and the solder-dragging part 220 share a common side, so that the solder-stealing part 210 and the solder-dragging part 220 form an integral structure. The line connecting the vertex A opposite to the common side of the solder-stealing part 210 and the vertex B opposite to the common side of the solder-dragging part 220 is AB. The line AB is consistent with the first direction, which is the reflow direction of the circuit board body 100. The extension of the common side is consistent with the second direction, and the second... The first direction is perpendicular to the second direction; there are at least two pads, and the at least two pads 200 are distributed alternately along the second direction. By arranging the pads 200 alternately along the second direction, the solder bridging between adjacent pads 200 can be reduced during the movement of the circuit board body 100 along the first direction. At the same time, during the process of soldering electronic components onto the pads 200 while the circuit board moves along the first direction, the solder first contacts the solder trapping part 210, so that the surface tension of the solder is evenly distributed. As the circuit board moves, the solder covers the pins of the electronic components and the pads 200 to complete the soldering. Then, as the circuit board continues to move, the solder dragging part 220 guides the solder tail to gather in the apex corner of the solder dragging part 220 away from the common side, so that the solder is isolated inside the solder dragging part 220, reducing the solder bridging between adjacent pads 200 and reducing safety hazards during the operation of the circuit board.

[0021] It should be noted that the solder-stealing part 210 is the position that first comes into contact with the solder during the reflow soldering process of the pad 200. It first absorbs and captures excess solder, reducing solder flow, so as to "steal" the excess solder. The solder-dragging part 220 guides the solder path after the soldering of the electronic component pins is completed during the reflow soldering process of the pad 200, so that the solder tail gathers inside the solder-dragging part 220, thereby completing the "dragging" of the solder and reducing the solder bridging between adjacent pads 200.

[0022] It should be noted that the surface of the circuit board body 100 includes a copper foil layer and a solder mask layer covering the copper foil layer. By opening a window in the solder mask layer, the copper foil layer of the circuit board body 100 is exposed to form a pad 200. Thus, the pad 200 is part of the copper foil layer in the circuit board body 100. The copper foil layer is exposed through the pad 200 to enable the soldering of electronic components to the pad 200.

[0023] In practice, the circuit board needs to be placed on the conveyor belt of the welding machine. The circuit board moves synchronously with the conveyor belt through the welding machine to achieve the welding of electronic components and pads 200. Therefore, the first direction in this embodiment is the direction in which the circuit board passes through the welding machine.

[0024] It should be noted that the angle between the first direction and the second direction can be acute, right, or obtuse. In this embodiment of the application, in order to further reduce the solder bridging phenomenon between the pads 200, the first direction and the second direction are set perpendicularly.

[0025] like Figures 2-4 As shown, the pad 200 has a through hole 201 that penetrates the circuit board body 100. The center M of the through hole 201 coincides with the center point of the common side between the solder stealing part 210 and the solder dragging part 220. The inner wall of the through hole 201 is provided with a copper foil layer. During the soldering process, the pins of the electronic components are placed into the through hole 201, and the pins of the electronic components are soldered to the inner wall of the through hole 201, as well as the solder stealing part 210 and the solder dragging part 220, to improve the soldering strength and stability between the electronic components and the pad 200, and further reduce the safety hazards of the circuit board during operation.

[0026] like Figures 2-4 As shown, the diameter of the through hole 201 is b, where b = the cross-sectional dimension of the electronic component pin + 0.15mm. This ensures that the through hole 201 has sufficient space to accommodate the electronic component pin, allowing it to be inserted into the through hole 201 and facilitating subsequent soldering operations. Simultaneously, after the solder enters the through hole 201, the gap between the through hole 201 and the electronic component pin provides space for solder flow, enabling the solder to fill both the through hole 201 and the electronic component pin, thereby improving soldering strength.

[0027] It should be noted that the pin dimensions of electronic components are the geometric dimensions of the pin cross-section + the effective length of the pin extending out of the component body + tolerance. In practice, these dimensions can be calculated through parameter measurement. The dimensions of the pad 200 are designed based on the pin dimensions of the electronic components to be soldered, so that the pad 200 meets the soldering requirements of the electronic components.

[0028] like Figures 2-4 As shown, the distance between a common vertex C on the common side of the solder-stealing part 210 and the solder-dragging part 220 and the center M of the through hole 201 is a, a = b + γ, where γ ≥ 0.1 mm. The intersection of the perimeter of the through hole 210 and the collinear part includes at least one intersection point m, which is close to the vertex C. γ is the line connecting the intersection point m and the vertex C. This ensures that the pad 200 has space to accommodate solder, thereby increasing the soldering strength between the electronic components and the pad 200 and further reducing safety hazards on the circuit board during operation.

[0029] like Figures 2-4 As shown, the vertical distance between the solder-stealing part 210 and the vertex A opposite to the common edge is c; the vertical distance between the solder-dragging part 220 and the vertex B opposite to the common edge is d; where c > 1.5 mm, in order to increase the contact time between the solder and the solder-stealing part 210, increase the balance zone of the solder surface tension, enhance the adsorption effect between the solder and the solder-stealing part 210, and further reduce the solder bridging phenomenon.

[0030] In some embodiments, such as Figure 2 As shown, c=d, making the solder-stealing part 210 and the solder-dragging part 220 congruent triangles, and making the solder pad 200 form a symmetrical rhomboid structure, so as to reduce solder bridging under the action of the solder-stealing part 210 and the solder-dragging part 220, and reduce safety hazards in the circuit board operation process.

[0031] In some other embodiments, such as Figure 3 As shown, c > d, which makes the length of the solder-stealing part 210 greater than the length of the solder-dragging part 220, so that the solder-stealing part 210 can further make the surface tension of the solder more uniform, improve the uniformity of the soldering process, and improve the soldering strength between electronic components and solder pads 200.

[0032] In other embodiments, such as Figure 4 As shown, c < d, which makes the length of the solder stealing part 210 less than the length of the solder dragging part 220, so that the solder dragging part 220 has a longer space to accommodate the solder tail, further reducing the solder bridging phenomenon.

[0033] During the circuit board operation provided in this application embodiment, as the circuit board moves along the first direction, the solder first contacts the solder trapping part 210, so that the surface tension of the solder is evenly distributed. As the circuit board moves, the solder covers the electronic component pins and pads 200 to complete the soldering. Then, as the circuit board continues to move, the solder dragging part 220 guides the solder tail to gather in the apex corner of the solder dragging part 220 away from the common side, so that the solder is isolated inside the solder dragging part 220, reducing the solder bridging phenomenon between adjacent pads 200 and reducing safety hazards during the operation of the circuit board.

[0034] This application embodiment also provides a frequency converter driver, including a circuit board, wherein the circuit board includes a circuit board body 100 and solder pads 200. The circuit board body 100 has openings, and the solder pads 200 are disposed at the openings of the circuit board body 100. The surface layer of the solder pads 200 on the circuit board body 100 is a copper foil layer, so that the solder pads 200 can be used for soldering electronic components. The solder pads 200 have a solder-stealing portion 210 and a solder-dragging portion 220, both of which are triangular, and the solder-stealing portion 210 and the solder-dragging portion 220 share a common side. The line AB connecting the vertex A opposite to the common side of the solder-stealing portion 210 and the vertex B opposite to the common side of the solder-dragging portion 220 is consistent with a first direction, which is the reflow direction of the circuit board body 100. The extension of the common side is consistent with a second direction, and the first direction and the second direction are perpendicular. There are at least two solder pads, and at least two solder pads 200 are along the second direction. The pads 200 are spaced apart in sequence along the second direction, which reduces solder bridging between adjacent pads 200 as the circuit board body 100 moves along the first direction. Simultaneously, as the circuit board moves along the first direction to solder electronic components onto the pads 200, the solder first contacts the solder trapping section 210, resulting in a uniform distribution of solder surface tension. As the circuit board moves, the solder covers the electronic component leads and the pads 200 to complete the soldering. Then, as the circuit board continues to move, the solder dragging section 220 guides the solder tail to gather in the corner of the dragging section 220 away from the common edge, isolating the solder inside the dragging section 220. This reduces solder bridging between adjacent pads 200 and minimizes safety hazards during circuit board operation.

[0035] It should be noted that the angle between the first direction and the second direction can be acute, right, or obtuse. In this embodiment of the application, in order to further reduce the solder bridging phenomenon between the pads 200, the first direction and the second direction are set perpendicularly.

[0036] like Figures 2-4 As shown, the pad 200 has a through hole 201 that penetrates the circuit board body 100. The center M of the through hole 201 coincides with the center point of the common side between the solder stealing part 210 and the solder dragging part 220. The inner wall of the through hole 201 is provided with a copper foil layer. During the soldering process, the pins of the electronic components are placed into the through hole 201, and the pins of the electronic components are soldered to the inner wall of the through hole 201, as well as the solder stealing part 210 and the solder dragging part 220, to improve the soldering strength and stability between the electronic components and the pad 200, and further reduce the safety hazards of the circuit board during operation.

[0037] like Figures 2-4As shown, the diameter of the through hole 201 is b, where b = the cross-sectional dimension of the electronic component pin + 0.15mm. This ensures that the through hole 201 has sufficient space to accommodate the electronic component pin, allowing it to be inserted into the through hole 201 and facilitating subsequent soldering operations. Simultaneously, after the solder enters the through hole 201, the gap between the through hole 201 and the electronic component pin provides space for solder flow, enabling the solder to fill both the through hole 201 and the electronic component pin, thereby improving soldering strength.

[0038] It should be noted that the pin dimensions of electronic components are the geometric dimensions of the pin cross-section + the effective length of the pin extending out of the component body + tolerance. In practice, these dimensions can be calculated through parameter measurement. The dimensions of the pad 200 are designed based on the pin dimensions of the electronic components to be soldered, so that the pad 200 meets the soldering requirements of the electronic components.

[0039] like Figures 2-4 As shown, the distance between a common vertex C on the common side of the solder-stealing part 210 and the solder-dragging part 220 and the center M of the through hole 201 is a, a = b + γ, where γ ≥ 0.1 mm. The intersection of the perimeter of the through hole 210 and the collinear part includes at least one intersection point m, which is close to the vertex C. γ is the line connecting the intersection point m and the vertex C. This ensures that the pad 200 has space to accommodate solder, thereby increasing the soldering strength between the electronic components and the pad 200 and further reducing safety hazards on the circuit board during operation.

[0040] like Figures 2-4 As shown, the vertical distance between the solder-stealing part 210 and the vertex A opposite to the common edge is c; the vertical distance between the solder-dragging part 220 and the vertex B opposite to the common edge is d; where c > 1.5 mm, in order to increase the contact time between the solder and the solder-stealing part 210, increase the balance zone of the solder surface tension, enhance the adsorption effect between the solder and the solder-stealing part 210, and further reduce the solder bridging phenomenon.

[0041] In some embodiments, such as Figure 2 As shown, c=d, making the solder-stealing part 210 and the solder-dragging part 220 congruent triangles, and making the solder pad 200 form a symmetrical rhomboid structure, so as to reduce solder bridging under the action of the solder-stealing part 210 and the solder-dragging part 220, and reduce safety hazards in the circuit board operation process.

[0042] In some other embodiments, such as Figure 3 As shown, c > d, which makes the length of the solder-stealing part 210 greater than the length of the solder-dragging part 220, so that the solder-stealing part 210 can further make the surface tension of the solder more uniform, improve the uniformity of the soldering process, and improve the soldering strength between electronic components and solder pads 200.

[0043] In other embodiments, such as Figure 4 As shown, c < d, which makes the length of the solder stealing part 210 less than the length of the solder dragging part 220, so that the solder dragging part 220 has a longer space to accommodate the solder tail, further reducing the solder bridging phenomenon.

[0044] In the operation of the frequency converter driver provided in this application embodiment, the circuit board reduces solder bridging due to the action of the solder pads 200, thereby reducing safety hazards during the circuit board operation and thus lowering the safety risks during the operation of the frequency converter driver.

[0045] For the same or similar parts among the various embodiments in this specification, please refer to each other.

[0046] In addition, the functional modules in the various embodiments of this application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0047] The above specific examples illustrate the principles and implementation methods of the present invention. The descriptions of these embodiments are merely for the purpose of helping to understand the technical solutions and core ideas of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the protection scope of the present invention.

Claims

1. A circuit board, characterized in that, Comprising: A circuit board body (100) and a pad (200); The circuit board body (100) has an opening, the pad (200) is disposed at the opening position, the surface layer of the pad (200) on the circuit board body (100) is a copper foil layer, and the pad (200) is used for soldering electronic components; The pad (200) has a tin stealing portion (210) and a tin dragging portion (220); Both the tin stealing portion (210) and the tin dragging portion (220) are triangular, and the tin stealing portion (210) and the tin dragging portion (220) have a common side; The connection line between the vertex angle A opposite to the common side of the tin stealing portion (210) and the vertex angle B opposite to the common side of the tin dragging portion (220) is the connection line AB, the connection line AB is in the same direction as the first direction, and the extension line of the common side is in the same direction as the second direction; Wherein, the first direction is the through - furnace direction.

2. The circuit board according to claim 1, characterized in that, There are at least two pads (200), and at least two pads (200) are sequentially spaced along the second direction.

3. The circuit board according to claim 1, characterized in that, The pad (200) is provided with a through - hole (201); the first direction is perpendicular to the second direction, The center M of the through - hole (201) coincides with the center point of the common side.

4. The circuit board according to claim 3, characterized in that, The diameter of the through - hole (201) is b; b = the size of the cross - section of the electronic component pin+0.15 mm.

5. The circuit board according to claim 4, characterized in that, The distance from a common vertex angle C of the tin stealing portion (210) and the tin dragging portion (220) to the center M of the through - hole (201) is a; a = b + γ, γ≥0.1 mm; Wherein, the circumferential line of the through - hole (201) intersects with the common side at least including an intersection point m, the intersection point m is close to the vertex angle C, and γ is the connection line between the intersection point m and the vertex angle C.

6. The circuit board according to any one of claims 1-5, characterized in that, The perpendicular distance from the vertex angle A opposite to the common side of the tin stealing portion (210) to the common side is c; The perpendicular distance from the vertex angle B opposite to the common side of the tin dragging portion (220) to the common side is d; the relationship between c and d satisfies: c = d; or c > d; or c < d; where c > 1.5 mm.

7. A variable frequency drive, characterized in that, Including a circuit board; The circuit board includes a circuit board body (100) and a pad (200), the circuit board body (100) has an opening, the pad (200) is disposed at the opening position, the surface layer of the pad (200) on the circuit board body (100) is a copper foil layer, and the pad (200) is used for soldering electronic components; The pad (200) has a tin stealing portion (210) and a tin dragging portion (220); Both the tin stealing portion (210) and the tin dragging portion (220) are triangular, and the tin stealing portion (210) and the tin dragging portion (220) have a common side; The connection line between the vertex angle A opposite to the common side of the tin stealing portion (210) and the vertex angle B opposite to the common side of the tin dragging portion (220) is AB, the connection line AB is in the same direction as the first direction, and the extension line of the common side is in the same direction as the second direction; The pad (200) is at least two, and at least two pads (200) are sequentially spaced along the second direction; The pad (200) is provided with a through - hole (201), The center M of the through hole (201) coincides with the center point of the common side; The first direction is the furnace passing direction, and the first direction is perpendicular to the second direction.

8. The frequency converter driver according to claim 7, characterized in that, The diameter of the through hole (201) is b; b = the size of the cross-section of the electronic component pin + 0.15 mm.

9. The frequency converter driver according to claim 8, characterized in that, The distance from a common vertex C of the tin stealing part (210) and the tin dragging part (220) to the center M of the through hole (201) is a; a = b + γ, γ ≥ 0.1 mm; Among them, the intersection of the circumferential line of the through hole (201) and the common side includes at least the intersection point m, the intersection point m is close to the vertex C, and γ is the connection line between the intersection point m and the vertex C.

10. The frequency converter driver according to any one of claims 7-9, characterized in that, The vertical distance from the vertex A of the tin stealing part (210) opposite to the common side to the common side is c; The vertical distance from the vertex B of the tin dragging part (220) opposite to the common side to the common side is d; Among them, c > 1.5 mm, and the relationship between c and d satisfies: c = d; or c > d; or c < d; where c > 1.5 mm.

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