heat dissipating device

Abstract

This application discloses a heat dissipation device, relating to the field of server technology. The heat dissipation device includes: a main heat sink, comprising a heat-conducting structure, a first base, and a first heat dissipation structure, wherein the heat-conducting structure is located between the component to be cooled and the first base; the first heat dissipation structure is disposed on the first base; an auxiliary heat sink; and a first heat-conducting pipe, the two ends of which are in contact with the first base and the auxiliary heat sink, respectively, for conducting heat from the first base to the auxiliary heat sink; the first heat-conducting pipe is made of a first heat-conducting material, wherein the carrier material of the first heat-conducting material accounts for 20wt%-50wt%, and the heat-conducting filler of the first heat-conducting material is fibrous high thermal conductivity carbon nanotubes or graphite, accounting for 30wt%-60wt%. This application solves the problems of heat sinks used for cooling servers in related technologies being prone to deformation and having a large overall weight.

Description

Technical Field

[0001] This application relates to the field of server technology, and in particular to a heat dissipation device. Background Technology

[0002] Currently, in the field of technology, large electronic devices such as servers and switches generate a lot of heat during operation. If this heat cannot be dissipated in a timely and effective manner, it will cause the equipment to overheat, affecting its performance and lifespan.

[0003] In existing cooling solutions, servers and switches are cooled by heat sinks, which typically consist of heat pipes and heatsinks. The heat pipes are usually made of copper.

[0004] However, heat pipes made of copper are relatively soft and lack elasticity. When subjected to impacts or vibrations during transportation, handling, or equipment use, they are prone to plastic deformation, which can lead to a decrease in heat sink performance or damage. In addition, copper itself is relatively heavy, increasing the overall weight of the device, which is detrimental to portability and energy consumption control. Utility Model Content

[0005] This application provides a heat dissipation device to at least solve the problems of heat sinks used for cooling servers in related technologies being prone to deformation and having a large overall weight.

[0006] This application provides a heat dissipation device, comprising: a main heat sink, including a heat-conducting structure, a first base, and a first heat dissipation structure, wherein the heat-conducting structure is located between the component to be cooled and the first base for conducting heat from the component to be cooled to the first base; the first heat dissipation structure is disposed on the first base for dissipating heat from the first base; an auxiliary heat sink; and a first heat-conducting pipe, wherein both ends of the first heat-conducting pipe are in contact with the first base and the auxiliary heat sink respectively for conducting heat from the first base to the auxiliary heat sink; wherein the first heat-conducting pipe is made of a first heat-conducting material, the carrier material of the first heat-conducting material is ethylene-octene copolymer or ethylene-vinyl acetate copolymer and accounts for 20wt%-50wt%, and the heat-conducting filler of the first heat-conducting material is fibrous high thermal conductivity carbon nanotubes or graphite and accounts for 30wt%-60wt%.

[0007] Furthermore, the auxiliary heat sink includes a second base and a second heat dissipation structure, the second heat dissipation structure being disposed on the second base for dissipating heat from the second base; the two ends of the first heat pipe are in contact with the first base and the second base respectively; at least one of the first base, the second base, the first heat dissipation structure and the second heat dissipation structure is made of a composite aluminum material containing 0.4 to 0.5 wt% nano-zeolite and 1 to 1.5 wt% graphene; and / or, the carrier material of the first heat-conducting material is an ethylene-octene copolymer or an ethylene-vinyl acetate copolymer.

[0008] Furthermore, the first base has a first mounting recess, and the first heat dissipation structure has a mounting hole; the heat dissipation device also includes a second heat pipe, the second heat pipe comprising: a main pipe section, a portion of which is disposed within the first mounting recess to limit and cooperate with the first mounting recess; and a branch pipe section, one end of which is connected to the main pipe section and extends into the mounting hole and contacts the hole wall; wherein, there is one second heat pipe; or, there are multiple second heat pipes, the multiple second heat pipes being spaced apart along the width direction and / or length direction of the first base.

[0009] Furthermore, the first heat dissipation structure has a mounting port, and another part of the main pipe section is located inside the mounting port to fit into the mounting port.

[0010] Furthermore, the second heat pipe is made of a second heat-conducting material. The carrier material of the second heat-conducting material is ethylene-octene copolymer or ethylene-vinyl acetate copolymer, accounting for 20wt%-50wt%. The heat-conducting filler of the second heat-conducting material is fibrous high thermal conductivity carbon nanotubes or graphite, accounting for 30wt%-60wt%.

[0011] Furthermore, the first thermally conductive material further includes 3wt%-8wt% of reinforcing resin, 0.5wt%-2.0wt% of dispersant, 5wt%-15wt% of lubricant, 0.1wt%-0.5wt% of antioxidant, and 1wt%-2wt% of coupling agent; and / or, the second thermally conductive material further includes 3wt%-8wt% of reinforcing resin, 0.5wt%-2.0wt% of dispersant, 5wt%-15wt% of lubricant, 0.1wt%-0.5wt% of antioxidant, and 1wt%-2wt% of coupling agent.

[0012] Furthermore, the reinforcing resin includes carbon fiber; and / or, the dispersant includes magnesium stearate; and / or, the lubricant includes paraffin wax; and / or, the coupling agent includes γ-aminopropyltriethoxysilane.

[0013] Furthermore, the first heat dissipation structure has a plurality of first honeycomb holes, which are spaced apart along the length and / or width direction of the first base; and / or, the second heat dissipation structure has a plurality of second honeycomb holes, which are spaced apart along the length and / or width direction of the second base.

[0014] Furthermore, there are multiple first mounting recesses, with the main pipe section disposed in at least a portion of the first mounting recesses, and the first end of the second heat pipe disposed in at least another portion of the first mounting recesses; the second base has a second mounting recess, and the second end of the second heat pipe is disposed in the second mounting recess.

[0015] Further, the first mounting recess is a first groove, which has a first plane, a second plane, a third plane, and a fourth plane connected in sequence. The first plane and the fourth plane are parallel to each other and opposite to each other. The first plane and the second plane are at a first angle, the second plane and the third plane are at a second angle, and the third plane and the fourth plane are at a third angle. At least a portion of the outer surface of the main pipe section and at least a portion of the outer surface of the second heat pipe are in contact with the first plane, the second plane, the third plane, and the fourth plane. And / or, the second mounting recess is a second groove, which has a fifth plane, a sixth plane, a seventh plane, and an eighth plane connected in sequence. The fifth plane and the eighth plane are parallel to each other and opposite to each other. The fifth plane and the sixth plane are at a fourth angle, the sixth plane and the seventh plane are at a fifth angle, and the seventh plane and the eighth plane are at a sixth angle. At least a portion of the outer surface of the second heat pipe is in contact with the fifth plane, the sixth plane, the seventh plane, and the eighth plane.

[0016] Furthermore, the first heat pipe has a hexagonal cross-section; and / or, the second heat pipe has a hexagonal cross-section.

[0017] By applying the technical solution of this application, since the proportion of carrier material in the first thermally conductive material is controlled at 20wt%-50wt% and the content of high thermal conductivity carbon nanotubes or graphite fillers is controlled at 30wt%-60wt%, the material has both high thermal conductivity and high fatigue resistance, thereby ensuring the reliability and stability of the first heat pipe in long-term use. Even under repeated mechanical vibration and stress, the risk of breakage can be effectively reduced, and the service life of the heat dissipation device can be extended. This solves the problem in related technologies that heat sinks for cooling servers are prone to deformation and have a large overall weight. Attached Figure Description

[0018] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a three-dimensional structural diagram of the heat dissipation device provided in the embodiments of this application;

[0020] Figure 2 for Figure 1 A three-dimensional structural diagram of the heat dissipation device from another angle;

[0021] Figure 3 for Figure 1 Front view of the heat dissipation device in the middle;

[0022] Figure 4 for Figure 1 Left view of the heat dissipation device in the middle;

[0023] Figure 5 for Figure 1 Right view of the heat dissipation device in the middle;

[0024] Figure 6 for Figure 1 A three-dimensional structural diagram of the main heat sink of the heat dissipation device in the middle;

[0025] Figure 7 for Figure 6 A three-dimensional structural diagram of the first heat dissipation structure of the main heat sink in the middle;

[0026] Figure 8 for Figure 6 A three-dimensional structural diagram of the first base of the main heat sink;

[0027] Figure 9 for Figure 8 Side view of the first base in the middle;

[0028] Figure 10 for Figure 6 A three-dimensional structural diagram of the heat conduction structure of the main heat sink in the image;

[0029] Figure 11 for Figure 1 A three-dimensional structural diagram of the auxiliary heat sink in the heat dissipation device;

[0030] Figure 12 for Figure 1 A three-dimensional schematic diagram of the second heat pipe of the heat dissipation device.

[0031] The above figures include the following reference numerals:

[0032] 10. Main heat sink; 11. Thermal conduction structure; 111. Flexible thermal conductive sheet; 112. Rigid thermal conductive plate; 12. First base; 121. First mounting recess; 1211. First plane; 1212. Second plane; 1213. Third plane; 1214. Fourth plane; 13. First heat dissipation structure; 131. Mounting hole; 132. Mounting opening; 133. First honeycomb hole;

[0033] 20. Auxiliary heat sink; 21. Second base; 211. Second mounting recess; 22. Second heat dissipation structure; 221. Second honeycomb hole;

[0034] 30. First heat pipe; 40. Second heat pipe; 41. Main pipe section; 42. Branch pipe section. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0036] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0037] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0038] In order to solve the problems of heat sinks used for cooling servers in related technologies being prone to deformation and having a large overall weight, this application provides a heat dissipation device.

[0039] like Figures 1 to 12As shown, the heat dissipation device includes a main heat sink 10, an auxiliary heat sink 20, and a first heat pipe 30. The main heat sink 10 includes a heat-conducting structure 11, a first base 12, and a first heat dissipation structure 13. The heat-conducting structure 11 is located between the component to be cooled and the first base 12 to conduct heat from the component to the first base 12. The first heat dissipation structure 13 is disposed on the first base 12 to dissipate heat from the first base 12. The two ends of the first heat pipe 30 are in contact with the first base 12 and the second base 21, respectively, to conduct heat from the first base 12 to the second base 21. The first heat pipe 30 is made of a first thermally conductive material, the carrier material of which accounts for 20wt%-50wt%, and the thermally conductive filler material, which is fibrous high thermal conductivity carbon nanotubes or graphite, accounting for 30wt%-60wt%.

[0040] By applying the technical solution of this embodiment, since the proportion of carrier material in the first thermally conductive material is controlled at 20wt%-50wt% and the content of high thermal conductivity carbon nanotubes or graphite fillers is controlled at 30wt%-60wt%, the material has both high thermal conductivity and high fatigue resistance, thereby ensuring the reliability and stability of the first heat pipe 30 in long-term use. Even under repeated mechanical vibration and stress, the risk of breakage can be effectively reduced, and the service life of the heat dissipation device can be extended. This solves the problem in related technologies that heat sinks for cooling servers are prone to deformation and have a large overall weight.

[0041] like Figure 2 As shown, the heat-conducting structure 11 includes a flexible heat-conducting sheet 111 and a rigid heat-conducting plate 112. The flexible heat-conducting sheet 111 is disposed on the rigid heat-conducting plate 112 to contact the component to be cooled.

[0042] Optionally, the auxiliary heat sink 20 includes a second base 21 and a second heat dissipation structure 22, the second heat dissipation structure 22 being disposed on the second base 21 for dissipating heat from the second base 21. The two ends of the first heat pipe 30 are in contact with the first base 12 and the second base 21, respectively. At least one of the first base 12, the second base 21, the first heat dissipation structure 13, and the second heat dissipation structure 22 is made of a composite aluminum material containing 0.4–0.5 wt% nano-zeolite and 1–1.5 wt% graphene; and / or, the carrier material of the first thermally conductive material is an ethylene-octene copolymer or an ethylene-vinyl acetate copolymer. Thus, the composite aluminum material formed from 0.4–0.5 wt% nano-zeolite and 1–1.5 wt% graphene can maintain or even improve thermal conductivity while having a lower density compared to pure aluminum or other heavy metal materials, significantly reducing the overall weight of the heat dissipation device and facilitating lightweight design of the equipment. In addition, nano-zeolite and graphene give the materials higher strength and elasticity, which makes the first base 12, the first heat dissipation structure 13, the second base 21 and the second heat dissipation structure 22 have better resistance to deformation and shock resistance when they encounter external impact or vibration, ensuring the stability and reliability of the heat dissipation device in harsh environments.

[0043] In this embodiment, the first base 12, the second base 21, the first heat dissipation structure 13, and the second heat dissipation structure 22 are all made of composite aluminum containing 0.4–0.5 wt% nano-zeolite and 1–1.5 wt% graphene. The addition of nano-zeolite and graphene significantly improves the thermal conductivity of the composite aluminum, allowing heat to be conducted more quickly from the component to be cooled to the first base 12, and further dissipated through the first heat dissipation structure 13 and the second heat dissipation structure 22, thereby improving the overall heat dissipation efficiency. Compared to traditional materials, this composite material can more effectively dissipate heat, reduce the operating temperature of the equipment, and extend its service life.

[0044] like Figure 1 , Figure 6 , Figure 7 as well as Figure 12As shown, the first base 12 has a first mounting recess 121, and the first heat dissipation structure 13 has a mounting hole 131. The heat dissipation device also includes a second heat pipe 40, which includes a main pipe section 41 and a branch pipe section 42. A portion of the main pipe section 41 is disposed within the first mounting recess 121 for a limiting fit. One end of the branch pipe section 42 communicates with the main pipe section 41, and the branch pipe section 42 extends into the mounting hole 131 and contacts the hole wall of the mounting hole 131. In this way, the main pipe section 41 of the second heat pipe 40 is embedded in the first mounting recess 121 of the first base 12, and the limiting fit ensures a tight contact between the heat pipe and the base, reducing thermal resistance and accelerating the transfer of heat from the first base 12 to the second heat pipe 40. The branch pipe section 42 extends into the mounting hole 131 of the first heat dissipation structure 13, directly contacting the hole wall, further improving the efficiency of heat conduction and ensuring that heat can be quickly and evenly transferred from the base to the heat dissipation structure, thereby accelerating the heat dissipation speed of the entire system.

[0045] In this embodiment, by providing a first mounting recess 121 on the first base 12, not only can the main pipe section 41 be accommodated, but the heat pipe is also kept from contacting surrounding components while maintaining a compact structure, thus reducing additional thermal conductivity and electromagnetic interference. The branch pipe section 42 directly contacts the first heat dissipation structure 13 through the mounting hole 131, which not only optimizes the layout of the heat dissipation structure but also makes full use of the limited space, allowing heat to flow efficiently along a predetermined path, enhancing the applicability and design flexibility of the heat dissipation device in confined spaces.

[0046] Optionally, there may be one second heat pipe 40; or, there may be multiple second heat pipes 40, which are spaced apart along the width and / or length of the first base 12. This arrangement allows for greater flexibility in selecting the number of second heat pipes 40 to meet different usage requirements and operating conditions, and also improves the processing flexibility for workers.

[0047] like Figure 7 As shown, the first heat dissipation structure 13 has a mounting port 132, and another part of the main pipe section 41 is located within the mounting port 132 to fit into the mounting port 132. In this way, a part of the main pipe section 41 is precisely positioned within the mounting port 132 of the first heat dissipation structure 13, and the fitting ensures stable contact between the heat pipe and the heat dissipation structure. This effectively avoids interruption of the heat conduction path or reduction in efficiency caused by minor displacement due to vibration or equipment operation, thereby ensuring the continuity of heat conduction from the first base 12 to the first heat dissipation structure 13.

[0048] In this embodiment, the mounting port 132 not only defines the position of the main pipe section 41, but also assists in adjusting the distribution of heat flow inside the first heat dissipation structure 13. Due to the close contact between the main pipe section 41 and the mounting port 132, heat can be diffused evenly and effectively inside the heat dissipation structure, avoiding the generation of local hot spots, improving the heat exchange capacity of the entire heat dissipation structure, and further enhancing the heat dissipation efficiency.

[0049] Optionally, the second heat pipe 40 is made of a second thermally conductive material. The carrier material of the second thermally conductive material is ethylene-octene copolymer or ethylene-vinyl acetate copolymer, accounting for 20wt%-50wt%, and the thermally conductive filler of the second thermally conductive material is fibrous high thermal conductivity carbon nanotubes or graphite, accounting for 30wt%-60wt%. Thus, by controlling the proportion of the carrier material in the second thermally conductive material to 20wt%-50wt% and the content of the high thermal conductivity carbon nanotubes or graphite filler to 30wt%-60wt%, the material possesses both high thermal conductivity and high fatigue resistance, thereby ensuring the reliability and stability of the second heat pipe 40 during long-term use. Even under repeated mechanical vibration and stress, it can effectively reduce the risk of breakage, extend the service life of the heat dissipation device, and thus solve the problems of easy deformation and large overall weight of heat sinks used for cooling servers in related technologies.

[0050] Optionally, the first thermally conductive material further includes 3wt%-8wt% of reinforcing resin, 0.5wt%-2.0wt% of dispersant, 5wt%-15wt% of lubricant, 0.1wt%-0.5wt% of antioxidant, and 1wt%-2wt% of coupling agent; and / or, the second thermally conductive material further includes 3wt%-8wt% of reinforcing resin, 0.5wt%-2.0wt% of dispersant, 5wt%-15wt% of lubricant, 0.1wt%-0.5wt% of antioxidant, and 1wt%-2wt% of coupling agent. Thus, by precisely proportioning and adding reinforcing resin, dispersant, lubricant, antioxidant, and coupling agent to the first and / or second thermally conductive materials, not only are the mechanical and processing properties of the thermally conductive materials improved, but the efficiency and stability of heat transfer are also optimized, ensuring the reliability and durability of the heat pipe in various complex environments.

[0051] In this embodiment, the aforementioned reinforcement of the resin significantly enhances the mechanical strength and toughness of the thermally conductive material, enabling the first and second thermally conductive tubes 30 and 40 to withstand external impacts and vibrations in complex application environments, maintaining structural integrity and stability, preventing material performance degradation or damage due to environmental factors, and extending the service life of the thermally conductive tubes. The addition of dispersants and lubricants, at proportions of 0.5wt%-2.0wt% and 5wt%-15wt% respectively, improves the material's processing performance, ensuring uniform distribution of thermally conductive fillers (such as carbon nanotubes and graphite) during manufacturing, thereby improving the uniformity and efficiency of heat conduction. Simultaneously, the use of lubricants reduces the material's coefficient of friction, making the thermally conductive tubes easier to install and use. The aforementioned antioxidant enhances the material's oxidation resistance, preventing oxidative aging of the thermally conductive material at high temperatures, and improving thermal stability and long-term performance. The aforementioned coupling agent promotes interfacial bonding between the thermally conductive filler and the carrier material, reducing interfacial thermal resistance and improving the overall thermal conductivity of the thermally conductive material. This chemical bonding further enhances the strength and stability of the material, ensuring that the heat pipe maintains efficient and stable thermal conductivity under various application conditions.

[0052] Optionally, the reinforcing resin includes carbon fiber; and / or, the dispersant includes magnesium stearate; and / or, the lubricant includes paraffin wax; and / or, the coupling agent includes γ-aminopropyltriethoxysilane.

[0053] In this embodiment, the reinforcing resin is carbon fiber, the dispersant is magnesium stearate, the lubricant is paraffin wax, and the coupling agent is γ-aminopropyltriethoxysilane.

[0054] Optionally, the first heat dissipation structure 13 has a plurality of first honeycomb holes 133, which are spaced apart along the length and / or width direction of the first base 12; and / or, the second heat dissipation structure 22 has a plurality of second honeycomb holes 221, which are spaced apart along the length and / or width direction of the second base 21. In this way, the honeycomb hole structure significantly increases the surface area for heat dissipation by forming a large number of tiny air channels in the heat dissipation structure, thereby increasing the area in contact with air and enhancing heat exchange efficiency. Simultaneously, the spaced arrangement of the multiple honeycomb holes along the length and width directions of the base forms a uniformly distributed airflow path, which helps guide airflow through the heat dissipation structure, promotes airflow and heat dissipation efficiency, reduces wind resistance, reduces noise generation, and improves overall heat dissipation performance and user experience.

[0055] In this embodiment, the honeycomb structure, with its high porosity and lightweight characteristics, achieves a balance between structural strength and lightweight design. By spacing the honeycomb structure along the length and width of the base, the heat dissipation structure maintains sufficient strength and rigidity to withstand vibrations and stresses during daily operation while reducing material usage, thus achieving lightweight design. This helps reduce the overall weight and energy consumption of the equipment, improving its portability and energy efficiency.

[0056] Optionally, there are multiple first mounting recesses 121, with the main pipe section 41 disposed within at least a portion of the first mounting recesses 121, and the first end of the second heat pipe 40 disposed within at least another portion of the first mounting recesses 121; the second base 21 has a second mounting recess 211, and the second end of the second heat pipe 40 is disposed within the second mounting recess 211. In this way, one end of the second heat pipe 40 and the main pipe section 41 are both mounted on the first base 12. This arrangement allows the main pipe section 41 and the first end of the second heat pipe 40 to contact the first base 12 in a more dispersed and closer manner, thereby reducing thermal resistance during heat conduction and ensuring that heat can be quickly and efficiently conducted from the first base 12 to the first heat dissipation structure 13 and the auxiliary heat sink 20. Simultaneously, the increased contact area between the heat pipe and the base improves the reliability of heat conduction and reduces the risk of heat dissipation failure due to poor contact.

[0057] like Figure 9As shown, the first mounting recess 121 is a first groove, which has a first plane 1211, a second plane 1212, a third plane 1213, and a fourth plane 1214 connected in sequence. The first plane 1211 and the fourth plane 1214 are parallel to each other and arranged opposite to each other. The first plane 1211 and the second plane 1212 are arranged at a first angle, the second plane 1212 and the third plane 1213 are arranged at a second angle, and the third plane 1213 and the fourth plane 1214 are arranged at a third angle. At least a portion of the outer surface of the main pipe section 41 and at least a portion of the outer surface of the second heat pipe 40 are both connected to the first... A first plane 1211, a second plane 1212, a third plane 1213, and a fourth plane 1214 are in contact with each other; and / or, the second mounting recess 211 is a second groove, the second groove having a fifth plane, a sixth plane, a seventh plane, and an eighth plane connected in sequence, the fifth plane and the eighth plane being parallel to each other and arranged opposite to each other, the fifth plane and the sixth plane forming a fourth angle, the sixth plane and the seventh plane forming a fifth angle, and the seventh plane and the eighth plane forming a sixth angle; wherein, at least a portion of the outer surface of the second heat pipe 40 is in contact with the fifth plane, the sixth plane, the seventh plane, and the eighth plane. Thus, the special geometric design of the mounting recess not only significantly improves the efficiency and reliability of heat conduction, but also optimizes heat flow distribution, enhances structural strength and durability, provides an efficient and stable thermal management solution for electronic devices, and increases the flexibility and adaptability of heat sink design.

[0058] In this embodiment, the outer surfaces of the main pipe section 41 and the second heat pipe 40 are in contact with multiple planes (first plane 1211 to fourth plane 1214) of the groove, increasing the contact area between the heat pipe and the first base 12 and reducing the thermal resistance during heat conduction. Simultaneously, the omnidirectional contact between the heat pipe and the groove improves the positioning accuracy and stability of the heat pipe, ensuring good physical contact even when the equipment is subjected to vibration or impact, thus ensuring the continuity and reliability of heat conduction. Furthermore, the contact between the second heat pipe 40 and multiple planes within the second groove significantly increases the contact area between the heat pipe and the second base 21, thereby reducing thermal resistance and improving heat conduction efficiency. This multi-faceted contact structure significantly enhances the physical stability and mechanical fixation of the heat pipe, ensuring that even during equipment operation, when encountering vibration or bumps, the heat pipe maintains good contact with the base, guaranteeing the continuity and stability of the heat conduction path and improving the reliability and efficiency of the heat dissipation system.

[0059] Optionally, the first heat pipe 30 has a hexagonal cross-section; and / or, the second heat pipe 40 has a hexagonal cross-section. This configuration makes the heat pipes hexagonal prisms, which on the one hand increases the heat conduction area of ​​the heat pipes and improves the heat dissipation efficiency of the heat dissipation device; on the other hand, it enhances the structural strength of the heat pipes, thereby extending the service life of the heat dissipation device.

[0060] As can be seen from the above description, the embodiments of this utility model achieve the following technical effects:

[0061] Because the proportion of carrier material in the first heat-conducting material is controlled at 20wt%-50wt% and the content of high thermal conductivity carbon nanotubes or graphite fillers is controlled at 30wt%-60wt%, the material has both high thermal conductivity and high fatigue resistance, thus ensuring the reliability and stability of the first heat-conducting pipe in long-term use. Even under repeated mechanical vibration and stress, it can effectively reduce the risk of breakage and extend the service life of the heat dissipation device. This solves the problem in related technologies that heat sinks for cooling servers are prone to deformation and have a large overall weight.

[0062] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A heat dissipation device, characterized in that, include: The main heat sink (10) includes a heat-conducting structure (11), a first base (12), and a first heat dissipation structure (13). The heat-conducting structure (11) is located between the heat-dissipating component and the first base (12) to conduct heat from the heat-dissipating component to the first base (12). The first heat dissipation structure (13) is disposed on the first base (12) to dissipate heat from the first base (12). Auxiliary heat sink (20); The first heat pipe (30) has two ends in contact with the first base (12) and the auxiliary heat sink (20) respectively, so as to conduct heat from the first base (12) to the auxiliary heat sink (20). The first heat pipe (30) is made of a first heat-conducting material, the carrier material of the first heat-conducting material accounts for 20wt%-50wt%, and the heat-conducting filler of the first heat-conducting material is fibrous high thermal conductivity carbon nanotubes or graphite accounting for 30wt%-60wt%.

2. The heat dissipation device according to claim 1, characterized in that, The auxiliary heat sink (20) includes a second base (21) and a second heat dissipation structure (22). The second heat dissipation structure (22) is disposed on the second base (21) for dissipating heat from the second base (21). The two ends of the first heat pipe (30) are in contact with the first base (12) and the second base (21) respectively. At least one of the first base (12), the second base (21), the first heat dissipation structure (13) and the second heat dissipation structure (22) is made of composite aluminum material containing 0.4 to 0.5 wt% nano zeolite and 1 to 1.5 wt% graphene. And / or, the carrier material of the first heat-conducting material is ethylene-octene copolymer or ethylene-vinyl acetate copolymer.

3. The heat dissipation device according to claim 2, characterized in that, The first base (12) has a first mounting recess (121), and the first heat dissipation structure (13) has a mounting hole (131); the heat dissipation device further includes a second heat pipe (40), the second heat pipe (40) comprising: Main section (41), a portion of which is disposed within the first mounting recess (121) to limit and engage with the first mounting recess (121); Branch pipe section (42), one end of which is connected to the main pipe section (41), the branch pipe section (42) extends into the mounting hole (131) and contacts the hole wall of the mounting hole (131); There is one second heat pipe (40); or there are multiple second heat pipes (40), which are spaced apart along the width and / or length of the first base (12).

4. The heat dissipation device according to claim 3, characterized in that, The first heat dissipation structure (13) has a mounting port (132), and another part of the main pipe section (41) is located inside the mounting port (132) to limit and cooperate with the mounting port (132).

5. The heat dissipation device according to claim 3, characterized in that, The second heat pipe (40) is made of a second heat-conducting material. The carrier material of the second heat-conducting material is ethylene-octene copolymer or ethylene-vinyl acetate copolymer and accounts for 20wt%-50wt%. The heat-conducting filler of the second heat-conducting material is fibrous high thermal conductivity carbon nanotube or graphite and accounts for 30wt%-60wt%.

6. The heat dissipation device according to claim 5, characterized in that, The first thermally conductive material further includes 3wt%-8wt% of reinforcing resin, 0.5wt%-2.0wt% of dispersant, 5wt%-15wt% of lubricant, 0.1wt%-0.5wt% of antioxidant, and 1wt%-2wt% of coupling agent; and / or, The second thermally conductive material also includes 3wt%-8wt% of reinforcing resin, 0.5wt%-2.0wt% of dispersant, 5wt%-15wt% of lubricant, 0.1wt%-0.5wt% of antioxidant, and 1wt%-2wt% of coupling agent.

7. The heat dissipation device according to claim 6, characterized in that, The reinforcing resin includes carbon fiber; and / or, The dispersant comprises magnesium stearate; and / or, The lubricant includes paraffin wax; and / or, The coupling agent includes γ-aminopropyltriethoxysilane.

8. The heat dissipation device according to claim 2, characterized in that, The first heat dissipation structure (13) has a plurality of first honeycomb holes (133), which are spaced apart along the length and / or width of the first base (12); and / or, The second heat dissipation structure (22) has a plurality of second honeycomb holes (221), which are spaced apart along the length and / or width of the second base (21).

9. The heat dissipation device according to claim 3, characterized in that, The first mounting recess (121) is multiple, the main pipe section (41) is disposed in at least a portion of the first mounting recess (121), and the first end of the second heat pipe (40) is disposed in at least another portion of the first mounting recess (121); the second base (21) has a second mounting recess (211), and the second end of the second heat pipe (40) is disposed in the second mounting recess (211).

10. The heat dissipation device according to claim 9, characterized in that, The first mounting recess (121) is a first groove, which has a first plane (1211), a second plane (1212), a third plane (1213), and a fourth plane (1214) connected in sequence. The first plane (1211) and the fourth plane (1214) are parallel to each other and opposite to each other. The first plane (1211) and the second plane (1212) are arranged at a first angle, the second plane (1212) and the third plane (1213) are arranged at a second angle, and the third plane (1213) and the fourth plane (1214) are arranged at a third angle. At least a portion of the outer surface of the main pipe section (41) and at least a portion of the outer surface of the second heat pipe (40) are in contact with the first plane (1211), the second plane (1212), the third plane (1213), and the fourth plane (1214). The second mounting recess (211) is a second groove, which has a fifth plane, a sixth plane, a seventh plane and an eighth plane connected in sequence. The fifth plane and the eighth plane are parallel to each other and are arranged opposite to each other. The fifth plane and the sixth plane are arranged at a fourth angle, the sixth plane and the seventh plane are arranged at a fifth angle, and the seventh plane and the eighth plane are arranged at a sixth angle. At least a portion of the outer surface of the second heat pipe (40) is in contact with the fifth plane, the sixth plane, the seventh plane and the eighth plane.

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