A data center waste heat recovery device

Abstract

The utility model belongs to energy -conserving technical field relates to a data center waste heat recovery device. The device contains at least one heat exchange - refrigeration integrated module, each heat exchange - refrigeration integrated module includes heat exchange module, is provided with air - liquid cooling heat dissipation module in the upside and downside of heat exchange module, is equipped with high temperature liquid flow path for heat exchange cooling of high temperature liquid from heat source in heat exchange module, air - liquid cooling heat dissipation module is equipped with low temperature liquid flow path for heat exchange heating of low temperature liquid from main heat dissipation module, high temperature liquid flow path connects liquid storage pump tank and supplementary heat dissipation module in proper order through pipeline, and supplementary heat dissipation module is connected with heat source, heat exchange module and air - liquid cooling heat dissipation module are installed heat - electric refrigeration piece, when the temperature difference exists in high temperature liquid flow path and low temperature liquid flow path, voltage is produced between the positive and negative ends of heat - electric refrigeration piece, and heat - electric refrigeration piece is connected with voltage - reducing rectifier. The problem that the seasonality of existing data center waste heat recovery mode is strongly dependent has been solved.

Description

Technical Field

[0001] This utility model belongs to the field of energy-saving technology, and specifically relates to a waste heat recovery device for data centers. Background Technology

[0002] With the rapid development of information technology, data centers have become an indispensable infrastructure in modern society. However, data centers generate a large amount of waste heat during operation, which is usually directly released into the environment, causing not only energy waste but also thermal pollution to the surrounding environment. Statistics show that there are currently over 4 million data centers worldwide, including more than 500 hyperscale data centers. It is estimated that by 2020, global data center power consumption will account for 5% of total global electricity consumption, with most of this energy consumption being due to the dissipation of waste heat generated by processors during computing.

[0003] Currently, waste heat recovery technology for data centers has made some progress. For example, some data centers have installed heat recovery devices to reuse waste heat for district heating systems, achieving energy reuse. Tencent's Tianjin Data Center waste heat recovery project is a successful example. This project uses waste heat from chilled water for secondary heating to replace municipal heating, saving heating costs and reducing the power consumption of the cooling water system. In addition, immersion liquid cooling technology has also been applied to waste heat recovery in data centers, which can reduce heat dissipation energy consumption by 90%-95% and can use the recovered heat for municipal heating.

[0004] However, existing technologies still have shortcomings in data center waste heat recovery. First, because existing waste heat recovery systems rely on a single long liquid loop for heat transfer, the long pipeline distribution reduces the stability and reliability of the entire system. Furthermore, most existing waste heat recovery methods directly integrate waste heat into the air conditioning network for heat pump recovery, which is highly dependent on seasonality and increases the burden on the network. Therefore, developing an efficient, stable, and low-cost data center waste heat recovery device is of great significance for promoting the sustainable development of the data center industry. Utility Model Content

[0005] The purpose of this invention is to provide a waste heat recovery device for data centers, which solves the problem of strong seasonal dependence of existing waste heat recovery methods for data centers.

[0006] This utility model is achieved through the following technical solution: This utility model discloses a data center waste heat recovery device, which includes at least one integrated heat exchange-cooling module; Each heat exchange-cooling integrated module includes a heat exchange module, and an air-liquid cooling heat dissipation module is provided on the upper and lower sides of the heat exchange module. A cooling fan is installed on the outside of each air-liquid cooling heat dissipation module. The heat exchange module is equipped with a high-temperature liquid flow path for cooling the high-temperature liquid from the heat source. The air-liquid cooling module is equipped with a low-temperature liquid flow path, which is connected to the main heat dissipation module and is used for heat exchange and temperature increase of the low-temperature liquid in the future independent heat dissipation module. The high-temperature liquid flow path is connected to the liquid storage pump box and the supplementary heat dissipation module in sequence through pipelines, and the supplementary heat dissipation module is connected to the heat source; A thermoelectric cooling chip is installed between the heat exchange module and the air-liquid cooling module. The thermoelectric cooling chip is used to generate voltage between the positive and negative terminals of the thermoelectric cooling chip when there is a temperature difference between the high-temperature liquid flow path and the low-temperature liquid flow path. The thermoelectric cooling chip is connected to a step-down rectifier.

[0007] Furthermore, a temperature sensor is installed in the liquid storage pump box. When the temperature sensor detects that the temperature in the liquid storage pump box is higher than the set value, the supplementary heat dissipation module and the cooling fan are activated to dissipate heat.

[0008] Furthermore, the high-temperature liquid flow path is meanderingly arranged within the heat exchange module.

[0009] Furthermore, the cryogenic liquid flow path is meandering within the air-liquid cooling module.

[0010] Furthermore, the air-liquid cooling module is equipped with multiple heat dissipation fins for air cooling.

[0011] Furthermore, the inlet of the high-temperature liquid flow path is connected to a heat source, and the outlet is connected to a liquid storage pump box.

[0012] Furthermore, the inlet and outlet of the cryogenic liquid flow path are both connected to the main heat dissipation module to form a heat dissipation circuit.

[0013] Furthermore, the heat source is one or more heat-generating components of the data center server.

[0014] Furthermore, each heat exchange-cooling integrated module includes at least one high-temperature liquid flow path and at least one low-temperature liquid flow path, and the high-temperature liquid flow path and the low-temperature liquid flow path are not connected.

[0015] Furthermore, different liquids are used as heat dissipation media in the high-temperature liquid flow path and the low-temperature liquid flow path.

[0016] Compared with the prior art, the present invention has the following beneficial technical effects: This invention relates to a waste heat recovery device for data centers. High-temperature liquid from a heat source in the data center (such as a server) enters a heat exchange module, where it increases the heat exchange area through a high-temperature liquid flow path and exchanges heat with an air-liquid cooling module. After initial cooling, it flows into a storage pump tank. Low-temperature liquid from the main cooling module enters the air-liquid cooling module, absorbs ambient heat through a low-temperature liquid flow path (or is cooled with the aid of a thermoelectric cooling chip), and after heating, flows back to the main cooling module, achieving secondary utilization of heat. In the integrated heat exchange-cooling module, a thermoelectric cooling chip is installed between the heat exchange module containing the high-temperature liquid flow path and the air-liquid cooling module containing the low-temperature liquid flow path. A significant temperature difference exists between the two flow paths. Due to this temperature difference, a voltage is generated between the positive and negative terminals of the cooling chip. After boosting and rectification, the waste heat can be effectively recovered and converted into electricity. This maximizes the recovery of waste heat from the heat source, significantly improving the heat recovery rate compared to traditional single-cooling solutions.

[0017] This invention utilizes a liquid as the temperature conduction and cooling medium, combined with a heat exchange module, a liquid storage pump tank, a main heat dissipation module, and supplementary heat dissipation methods to recover waste heat generated by data centers. It can directly convert waste heat into electricity within a short, simple pipeline, ultimately improving energy efficiency. This device features a simple liquid pipeline structure, high energy recovery efficiency, good system stability, and low seasonal dependence, effectively addressing the energy utilization needs of data center waste heat recovery and promoting the sustainable development of the data center industry. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of a heat exchange-cooling integrated module of a data center waste heat recovery device according to the present invention; Figure 2 for Figure 1 Another perspective illustration; Figure 3 This is a partial cross-sectional schematic diagram of the heat exchange-cooling integrated module of this utility model; Figure 4 This is a schematic diagram of the heat exchange module of the integrated heat exchange-cooling module of this utility model; Figure 5 This is a cross-sectional schematic diagram of the heat exchange module of this utility model; Figure 6 This is a schematic diagram of the air-liquid cooling heat dissipation module of this utility model; Figure 7 This is another schematic diagram of the air-liquid cooling heat dissipation module of this utility model; Figure 8 This is a cross-sectional schematic diagram of the air-liquid cooling heat dissipation module of this utility model; Figure 9This is a schematic diagram of the flow path structure of a data center waste heat recovery device according to the present invention.

[0019] In the diagram: 101, heat exchange module; 102, thermoelectric cooling element; 103, air-liquid cooling module; 104, cooling fan; 1031, low-temperature liquid flow path; 1011, high-temperature liquid flow path; 001. Heat exchange-cooling integrated module; 002. Liquid storage pump box; 003. Supplementary heat dissipation module; 004. Heat source; 005. Main heat dissipation module. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of this utility model and are not intended to limit it; that is, the described embodiments are only a part of, and not all, of the embodiments of this utility model.

[0021] The components described and illustrated in the accompanying drawings and embodiments of this utility model can be arranged and designed in various different configurations. Therefore, the detailed description of the embodiments of this utility model provided in the following drawings is not intended to limit the scope of the claimed utility model, but merely to illustrate one selected embodiment of the utility model. All other embodiments obtained by those skilled in the art based on the accompanying drawings and embodiments of this utility model without inventive effort are within the protection scope of this utility model.

[0022] It should be noted that the terms “comprising,” “including,” or any other variations are intended to cover non-exclusive inclusion, such that a process, element, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to the process, element, method, article, or apparatus.

[0023] The features and performance of this utility model will be further described in detail below with reference to the embodiments.

[0024] like Figure 1 As shown, this utility model discloses a data center waste heat recovery device, comprising a heat exchange module 101, a thermoelectric cooling element 102, a wind-liquid cooling module 103, and a cooling fan 104. A wind-liquid cooling module 103 is provided on both the upper and lower sides of the heat exchange module 101, and a cooling fan 104 is installed on the outer side of each wind-liquid cooling module 103. A thermoelectric cooling element 102 is installed between the heat exchange module 101 and the wind-liquid cooling module 103.

[0025] Among them, such as Figure 2 and Figure 3As shown, the heat exchange module 101 is provided with a high-temperature liquid flow path 1011 for cooling the high-temperature liquid from the heat source 004, such as... Figure 8 and Figure 9 As shown, the air-liquid cooling heat dissipation module 103 is provided with a low-temperature liquid flow path 1031 for heat exchange and temperature rise of the low-temperature liquid in the future self-heating heat dissipation module 005. The above parts constitute a heat exchange-cooling integrated module 001.

[0026] Each heat exchange-cooling integrated module 001 includes at least one high-temperature liquid flow path 1011 and at least one low-temperature liquid flow path 1031, wherein the high-temperature liquid flow path 1011 and the low-temperature liquid flow path 1031 are not connected.

[0027] The liquids in the high-temperature liquid flow path 1011 and the low-temperature liquid flow path 1031 can be different liquids as heat dissipation media.

[0028] like Figure 9 As shown, the high-temperature liquid flow path 1011 is connected to the liquid storage pump box 002 by a pipeline, the liquid storage pump box 002 is connected to the supplementary heat dissipation module 003 by a pipeline, and the supplementary heat dissipation module 003 is connected to the heat source 004 by a pipeline, forming the first heat dissipation circuit.

[0029] The main heat dissipation module 005 is connected to the low-temperature liquid flow path 1031 in the heat exchange-cooling integrated module 001 through a pipeline, forming a second heat dissipation circuit.

[0030] The heat exchange process of the first heat dissipation circuit is as follows: In the first heat dissipation circuit, after the high-temperature liquid carries away heat from the heat source 004, it enters the heat exchange-cooling integrated module 001 through the pipeline and undergoes heat exchange and cooling in the high-temperature liquid flow path 1011. At this time, the temperature of the high-temperature liquid will drop significantly. The high-temperature liquid that has completed cooling enters the liquid storage pump box 002 through the pipeline. The liquid storage pump box 002 pumps the liquid into the supplementary heat dissipation module 003. After passing through the supplementary heat dissipation module 003, the liquid is pumped into the heat source 004 to continue to carry away heat.

[0031] The entire heat exchange process of the second heat dissipation circuit is as follows: the liquid cooled by the main heat dissipation module 005 flows through the pipeline to the low-temperature liquid flow path 1031 in the heat exchange-cooling integrated module 001 for heating, and the heat is transferred to the main heat dissipation module 005 through the pipeline.

[0032] The waste heat recovery process is as follows: A thermoelectric cooling chip 102 is installed between the heat exchange module 101 where the high-temperature liquid flow path 1011 is located and the air-liquid cooling heat dissipation module 103 where the low-temperature liquid flow path 1031 is located. Due to the temperature difference on both sides, a voltage will be generated between the positive and negative terminals of the thermoelectric cooling chip 102. There is a high temperature difference between the high-temperature liquid flow path 1011 and the low-temperature liquid flow path 1031, and a voltage of 9-12V can be generated between the positive and negative terminals of the device. After being stepped down and rectified by a step-down rectifier, the waste heat can be effectively recovered and converted into electricity.

[0033] Furthermore, the air-liquid cooling module 103 is equipped with multiple heat dissipation fins for air cooling.

[0034] Furthermore, a temperature sensor is installed in the liquid storage pump box 002. When the high-temperature liquid after heat exchange is completed enters the liquid storage pump box 002 and the heat exchange is incomplete, that is, when the temperature sensor detects that the temperature in the liquid storage pump box 002 is higher than the set value, the supplementary heat dissipation module 003 will start heat dissipation to reduce the temperature of the liquid entering the heat source 004 to the specified temperature condition. At the same time, the cooling fan 104 installed on the heat exchange-cooling integrated module 001 will start to ensure that the temperature of the liquid entering the heat source 004 in the heat dissipation circuit 1 is within the safe range.

[0035] If the temperature sensor detects that the temperature in the liquid storage pump tank 002 is lower than the set value, the heat dissipation module 003 will not start heat dissipation, and the liquid will directly enter the heat source 004.

[0036] Furthermore, when the ambient temperature facing the main heat dissipation module 005 is too high, the liquid temperature in the second heat dissipation circuit may not be able to effectively exchange heat and cool the liquid directly from the heat source 004 in the high-temperature liquid flow path 1011. Even after activating the aforementioned heat dissipation measures, it is still impossible to ensure that the temperature of the liquid entering the heat source 004 in the high-temperature liquid flow path 1011 is lower than the set value. At this time, the thermoelectric cooling chip 102 installed on the heat exchange-cooling integrated module 001 will be activated, that is, a reverse current will be passed between the positive and negative terminals to force the high-temperature liquid flow path 1011 to cool down and the liquid in the low-temperature liquid flow path 1031 to heat up, so as to ensure that the temperature of the liquid entering the heat source 004 is within the normal range.

[0037] This utility model discloses a data center waste heat recovery device. It utilizes a specially designed heat exchange-cooling integrated module 001 with a liquid flow path, a liquid storage pump box 002, a main heat dissipation module 005, and a liquid with a high specific heat capacity. Combined with a supplementary heat dissipation method, it can convert the liquid temperature in the flow path into electricity in a short time, thereby recovering the waste heat of the liquid in the flow path and ultimately achieving the purpose of waste heat recovery inside the data center.

[0038] It should be noted that the number of heat exchange-cooling integrated modules 001, the piping design, and the type of main heat dissipation module 005 in the data center waste heat recovery device described in this utility model are not specified and are only provided as examples. The number and size of the heat exchange-cooling integrated modules can be adjusted according to actual production and usage needs.

[0039] This utility model discloses a waste heat recovery device for data centers. Taking the waste heat recovery of a server's central processing unit (CPU) as an example, it illustrates the recovery of heat from a heat source. The specific operation is as follows: During server operation, the central processing unit (CPU) will generate more than 200W of heat power due to long-term and large-scale calculations, which can cause its surface temperature to reach more than 90°C.

[0040] Example 1 In this embodiment, normal heat dissipation conditions are simulated to perform heat recovery on the central processing unit (CPU). The ambient temperature is 21°C and the room temperature is 25°C. The entire heat exchange process of the first heat dissipation circuit is as follows: The CPU is connected to the high-temperature liquid flow path 1011 through a cold head. The CPU acts as a heat source 004. The liquid passing through the heat source 004 heats up while lowering the temperature of the heat source 004, and simultaneously increases its own temperature, becoming a high-temperature fluid. The measured liquid temperature rises from 24.7°C to 53.9°C, and the heat source temperature drops from 95.1°C when the heat dissipation module is not activated to 63.2°C. This fluid enters the integrated heat exchange-cooling module 001, raising the temperature of the heat exchange module and creating a temperature difference between the two sides of the thermoelectric cooling element 102. The measured temperature difference in the experiment was 22.5°C. At this time, a voltage difference can be generated between the positive and negative terminals of the thermoelectric cooling chip 102. The voltage difference was measured to be 8.5V in the experiment. This voltage difference can be stored in the energy storage unit after step-down rectification. In this example, a 1KWh lithium battery with a nominal voltage of 3.7V is selected as the energy storage unit. At the same time, the high-temperature fluid exchanges heat with the low-temperature fluid in the heat exchange-cooling integrated module 001. During the process, the temperature of the medium and high-temperature fluid gradually decreases. The high-temperature fluid that has been cooled down enters the liquid storage pump box 002 through the heat exchange pipeline. The liquid temperature in the liquid storage pump box 002 is measured to be 32.6℃. The liquid storage pump box 002 pumps the liquid into the supplementary heat dissipation module 003. The outlet temperature of the supplementary heat dissipation module 003 is measured to be 25.1℃, which meets the cooling requirements of the heat source. Repeating the above steps can effectively recover waste heat while reducing the temperature of the heat source.

[0041] The entire heat exchange process of the second heat dissipation circuit is as follows: the low-temperature fluid cooled by the main heat dissipation module 005 exchanges heat with the high-temperature fluid through the low-temperature fluid flow path 1031, and the temperature of the low-temperature fluid rises from 23.2℃ to 29.7℃. The low-temperature fluid is then cooled by the main heat dissipation module 005, and the temperature of the low-temperature fluid drops from 29.7℃ to 23.4℃. At the same time, the heat is transferred to the main heat dissipation module 005 through the heat exchange flow path and then transferred to the outside by the main heat dissipation module 005. The measured temperature of the heat exchange outlet of the main heat dissipation module 005 is 27℃.

[0042] After 3 hours of operation, the CPU heat source temperature stabilized at 65.4℃, the liquid storage pump box 002 temperature stabilized at 26.2℃, and the lithium battery charge increased from 32% to 45%, for a total charge of 13Wh.

[0043] Example 2 In this embodiment, extreme conditions are simulated, namely, excessively high external temperatures preventing the main heatsink from dissipating heat sufficiently. The external temperature is 34.2℃, and the room temperature is 27.6℃. The entire heat exchange process is as follows: The low-temperature fluid, cooled by the main heatsink module 005, fails to reach its effective temperature due to the excessively high external temperature. Under initial conditions, the CPU temperature remains at 78.6℃ due to poor heat dissipation, while the high-temperature fluid temperature only decreases from 65.3℃ to 48.7℃. At the outlet of the supplementary heatsink module 003, the high-temperature fluid temperature is 42.6℃, and the low-temperature fluid temperature only decreases from 43.2℃ to 35.7℃. The CPU cannot reach its optimal operating temperature range. The heat exchange-cooling integrated module 001 switches to cooling mode, activating the thermoelectric cooler 102, creating a temperature difference across it. The measured temperature difference in the experiment was 32℃. In the heat exchange-cooling integrated module 001, the high-temperature fluid exchanges heat with the thermoelectric cooler 102, resulting in cooling. The temperature of the liquid storage pump box 002 drops from 57.4℃ to 26℃, while the temperature of the low-temperature fluid rises from 35.2℃ to 60.1℃. After cooling through the main heat dissipation module 005, the low-temperature fluid temperature drops from 59.6℃ to 37.2℃. Simultaneously, heat is transferred through the heat exchange path to the main heat dissipation module 005 and then dissipated to the outside. The measured temperature at the heat exchange outlet of the main heat dissipation module 005 is 39.6℃. The CPU temperature drops from 78.6℃ to 62.1℃, meeting operational requirements. Repeating the above steps can effectively reduce the heat source temperature under extreme conditions.

[0044] After 3 hours of operation, the CPU heat source temperature stabilized at 62.9℃, the liquid storage pump box 002 temperature stabilized at 26.2℃, and the total power consumption was 495Wh.

[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and not to limit it. Although the utility model has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the specific implementation of this utility model. Any modifications or equivalent substitutions that do not depart from the spirit and scope of this utility model should be covered within the protection scope of the claims of this utility model.

Claims

1. A waste heat recovery device for a data center, characterized in that, It includes at least one heat exchange-cooling integrated module (001). Each heat exchange-cooling integrated module (001) includes a heat exchange module (101), and a wind-liquid cooling heat dissipation module (103) is provided on the upper and lower sides of the heat exchange module (101). A cooling fan (104) is installed on the outside of each wind-liquid cooling heat dissipation module (103). The heat exchange module (101) is provided with a high-temperature liquid flow path (1011) for exchanging heat and cooling the high-temperature liquid from the heat source (004); The air-liquid cooling heat dissipation module (103) is provided with a low-temperature liquid flow path (1031), which is connected to the main heat dissipation module (005) for heat exchange and temperature rise of the low-temperature liquid in the future self-heating heat dissipation module (005); The high-temperature liquid flow path (1011) is connected in sequence to the liquid storage pump box (002) and the supplementary heat dissipation module (003) through pipelines. The supplementary heat dissipation module (003) is connected to the heat source (004). A thermoelectric cooling chip (102) is installed between the heat exchange module (101) and the air-liquid cooling heat dissipation module (103). The thermoelectric cooling chip (102) is used to generate voltage between the positive and negative terminals of the thermoelectric cooling chip (102) when there is a temperature difference between the high temperature liquid flow path (1011) and the low temperature liquid flow path (1031). The thermoelectric cooling element (102) is connected to a step-down rectifier.

2. The data center waste heat recovery device according to claim 1, characterized in that, A temperature sensor is installed in the liquid storage pump box (002). When the temperature sensor detects that the temperature in the liquid storage pump box (002) is higher than the set value, the supplementary heat dissipation module (003) and the cooling fan (104) are in the heat dissipation state.

3. The data center waste heat recovery device according to claim 1, characterized in that, The high-temperature liquid flow path (1011) is meandered in the heat exchange module (101).

4. The data center waste heat recovery device according to claim 1, characterized in that, The cryogenic liquid flow path (1031) is meandered in the air-liquid cooling heat dissipation module (103).

5. A data center waste heat recovery device according to claim 1, characterized in that, The air-liquid cooling module (103) is provided with multiple heat dissipation fins for air cooling.

6. A data center waste heat recovery device according to claim 1, characterized in that, The inlet of the high-temperature liquid flow path (1011) is connected to the heat source (004), and the outlet is connected to the liquid storage pump box (002).

7. A data center waste heat recovery device according to claim 1, characterized in that, The inlet and outlet of the cryogenic liquid flow path (1031) are both connected to the main heat dissipation module (005) to form a heat dissipation circuit.

8. A data center waste heat recovery device according to claim 1, characterized in that, The heat source (004) is one or more heat-generating components of a data center server.

9. A data center waste heat recovery device according to claim 1, characterized in that, Each heat exchange-cooling integrated module (001) includes at least one high-temperature liquid flow path (1011) and at least one low-temperature liquid flow path (1031), and the high-temperature liquid flow path (1011) and the low-temperature liquid flow path (1031) are not connected.

10. A data center waste heat recovery device according to claim 1, characterized in that, The high-temperature liquid flow path (1011) and the low-temperature liquid flow path (1031) use different liquids as heat dissipation media.

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