Electronic package
CN224698302UActive Publication Date: 2026-08-28SILICONWARE PRECISION IND CO LTD
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Patent Information
- Application Number
- CN202521507738.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2025-06-27
- Filing Date
- 2025-07-18
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-07-18
AI Technical Summary
Technical Problem
[0004]然而，现有半导体封装件1中，其电源供应来自于该电压调节模组6a，因而其与该电源管理芯片60保持一定的距离，导致该电源管理芯片60供应电源(如电路63)至该半导体封装件1的距离太远，因而造成延迟时间过长的问题，故该半导体封装件1的效能难以提升
Benefits of technology
[0017]由上可知，本申请的电子封装件主要将一电源管理元件接置在多个电子元件上，而整合于电子封装件中，因而能缩短电源供应至电子元件的距离，因而能缩短延迟时间，以有效提升电子封装件的效能，同时减少占用基板的面积，使最终产品符合微小化的需求。此外，通过在基板设计预留空间高度给存储器元件，即可改善其与电子元件不等高的问题。再者，通过桥接元件设于多个电子元件及多个存储器元件上，进而提升电子元件及存储器元件的电性连接效能。
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Figure CN224698302U_ABST
Abstract
An electronic package mainly includes a plurality of electronic elements and a plurality of memory elements disposed on a substrate, a power management element disposed and electrically connected to the plurality of electronic elements, and a plurality of bridge elements disposed and electrically connected to the plurality of electronic elements and the plurality of memory elements. The power management element is integrated in the electronic package to shorten the distance of power supply to the electronic elements, thereby effectively improving the performance of the electronic package.
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