A tin nozzle automatic cleaning device and selective wave soldering equipment

Abstract

The utility model discloses a kind of tin nozzle automatic cleaning device and selective wave crest welding equipment, it is related to selective wave crest welding equipment technical field.The tin nozzle automatic cleaning device includes: cleaning liquid storage tank, flow control valve and cleaning liquid jet pipe.The cleaning liquid storage tank is used to store cleaning liquid;The flow control valve is communicated with the cleaning liquid storage tank, wherein the flow control valve is communicated with the selective wave crest welding equipment, and is configured to when the selective wave crest welding equipment is in tin wave height reduction state, the flow control valve starts;The cleaning liquid jet pipe is connected with the flow control valve, and the end of the cleaning liquid jet pipe is provided with cleaning liquid nozzle, wherein the opening direction of the cleaning liquid nozzle is vertically downward and can be opposite to the tin nozzle.By using the technology provided by the utility model, the problem that tin nozzle surface damage is easily caused by long-term brushing tin nozzle can be effectively solved.

Description

Technical Field

[0001] This utility model relates to the technical field of selective wave soldering equipment, specifically to an automatic solder nozzle cleaning device and selective wave soldering equipment. Background Technology

[0002] Selective wave soldering, compared to traditional wave soldering which completely immerses the PCB board's soldering surface in solder, allows for localized, targeted soldering based on preset soldering parameters (such as flux application position and wave height). The solder nozzle in selective wave soldering equipment primarily delivers molten solder to the PCB pads or leads to be soldered; therefore, selective wave soldering equipment requires high precision from the solder nozzle.

[0003] However, solder tips can oxidize in high-temperature molten soldering environments. This is due to the increased activity of metal molecules under high-temperature exposure, which reacts with oxygen, as well as the corrosion caused by solder components. Oxidation of the solder tip can lead to deformation of the tip orifice, resulting in poor solder joints and other serious impacts on soldering quality.

[0004] Therefore, to inhibit solder nozzle oxidation, the solder nozzles are typically manually cleaned with maintenance materials after the selective wave soldering equipment is shut down to remove oxides from their surface. However, this downtime maintenance is costly. Based on this, Chinese utility model patent (CN222902850U) discloses an automatic cleaning device for selective wave soldering nozzles. This device uses a combination of cleaning components (high-temperature resistant cleaning balls, a cleaning ball box, a heat insulation plate, a ball box base, and a ball box cover) and a rotating component with a power transmission component to rotate and clean the solder nozzles. However, this method still involves brushing the solder nozzles, and prolonged brushing can easily damage the nozzle surface. Utility Model Content

[0005] This invention provides an automatic solder nozzle cleaning device and a selective wave soldering equipment to solve the problem that long-term brushing of solder nozzles can easily cause damage to the surface of the solder nozzles in the prior art.

[0006] To solve the above-mentioned technical problems, the present invention provides an automatic solder nozzle cleaning device, which includes a cleaning fluid storage tank, a flow control valve, and a cleaning fluid spray pipe.

[0007] The cleaning fluid storage tank is used to store cleaning fluid; the flow control valve is connected to the cleaning fluid storage tank, wherein the flow control valve is communicatively connected to the selective wave soldering equipment and is configured to activate when the selective wave soldering equipment is in a state of reduced solder wave height; the cleaning fluid spray pipe is connected to the flow control valve, and the end of the cleaning fluid spray pipe is provided with a cleaning fluid nozzle, wherein the opening direction of the cleaning fluid nozzle is vertically downward and can be opposite to the solder nozzle.

[0008] The beneficial effects of the technical solution provided by this utility model compared to the prior art are as follows: By setting a flow control valve, the cleaning fluid spray pipe is activated to spray cleaning fluid when the selective wave soldering equipment is in the state of reduced solder wave height (solder falls back to the solder tank). Specifically, the cleaning fluid nozzle sprays the cleaning fluid vertically downward onto the surface and inner wall of the solder nozzle. When the solder wave rises, the oxidation on the surface of the solder nozzle can be removed, and the amount of cleaning fluid sprayed is preset by the flow control valve.

[0009] Compared to traditional brushing, the aforementioned non-contact rinsing method avoids damage to the solder tip surface plating. Furthermore, the cleaning solution spraying during solder wave height reduction utilizes the residual heat from soldering to enhance cleaning effectiveness and allows for increased cleaning frequency based on actual operational needs, reducing oxide buildup. In addition, the aforementioned automatic solder tip cleaning device has a simple structure, few components, and low cost per rinse, and can be retrofitted into existing selective wave soldering equipment.

[0010] In some embodiments, the automatic solder nozzle cleaning device further includes a mesh screen, wherein the flow control valve and the cleaning fluid spray pipe are located inside the mesh screen. Using the above technical solution, the mesh screen can act as a baffle for the flow control valve and the cleaning fluid spray pipe, preventing external dust and impurities from falling into the solder nozzle through the automatic solder nozzle cleaning device.

[0011] In some embodiments, one side of the drain cover extends into a mounting plate, and the cleaning fluid spray pipe and the flow control valve are arranged on the mounting plate, wherein the cleaning fluid spray pipe has a bent section.

[0012] By adopting the above technical solution, by extending one side of the mesh cover as a mounting plate for the cleaning liquid spray pipe and flow control valve, the automatic solder nozzle cleaning device can be modularized, making it easier to install into existing selective wave soldering equipment.

[0013] In some implementations, the cleaning fluid spray pipe is a straight pipe. As another embodiment, the straight-pipe cleaning fluid spray pipe can be directly installed in the selective wave soldering equipment, reducing space occupation. Simultaneously, a mesh cover is installed over the cleaning fluid spray pipe and flow control valve to further improve the protection against dust, impurities, etc., thus balancing the difficulty of installing the automatic solder nozzle cleaning device and the amount of space occupied on the selective wave soldering workbench.

[0014] In some embodiments, this application also provides a selective wave soldering apparatus, including the aforementioned automatic solder nozzle cleaning device, and further including: a selective wave soldering furnace, a frame, and a moving mechanism.

[0015] The selective wave soldering furnace has a protruding solder nozzle on its top; the frame includes a workbench and a accommodating space for placing the selective wave soldering furnace, wherein the automatic solder nozzle cleaning device is embedded in the workbench; the moving mechanism is located in the accommodating space and connected to the selective wave soldering furnace, for driving the solder nozzle of the selective wave soldering furnace to face the cleaning liquid nozzle of the automatic solder nozzle cleaning device.

[0016] By adopting the above technical solution, a moving mechanism drives the selective wave soldering furnace to ensure alignment between the furnace and the cleaning solution nozzle. In other words, the automatic nozzle cleaning device is fixed, while the nozzles are movable. Compared to a movable nozzle cleaning device, this further saves space in the selective wave soldering equipment. It also ensures the automatic positioning accuracy of the nozzles and improves the automation level of nozzle cleaning and maintenance in the selective wave soldering equipment. Furthermore, the selective wave soldering equipment possesses all the aforementioned technical advantages, which will not be elaborated upon here.

[0017] In some embodiments, the moving mechanism includes an X-axis moving component, a Y-axis moving component, and a Z-axis moving component, wherein the selective wave soldering furnace is fixed to the Z-axis moving component, and the X-axis moving component and the Y-axis moving component are slidably coupled.

[0018] By adopting the above technical solution, the solder nozzle can be accurately moved and positioned in any direction in space through the X-axis moving component, Y-axis moving component and Z-axis moving component, ensuring that the solder nozzle and cleaning fluid nozzle can be accurately aligned during cleaning operations.

[0019] In some implementations, the workbench further includes a PCB board holder, wherein the moving mechanism is used to drive the solder nozzle of the selective wave soldering furnace to face the bottom surface of the PCB to ensure proper positioning of the solder nozzle during soldering operations.

[0020] In some implementations, the selective wave soldering equipment further includes an upper working area, where the cleaning solution tank of the automatic solder nozzle cleaning device is located, or where the cleaning solution tank of the automatic solder nozzle cleaning device is located in the accommodating space. Using the above technical solution, the cleaning solution tank can be selected for a suitable storage location based on actual conditions, such as being stored in the accommodating space or the upper working area, and connected to a flow control valve via a conduit.

[0021] In some implementations, the workbench is provided with a mounting slot, wherein the drain cover of the automatic solder nozzle cleaning device is embedded in the mounting slot, and the flow control valve and the cleaning fluid spray pipe of the automatic solder nozzle cleaning device are located in the accommodating space.

[0022] In another embodiment, the workbench is provided with a mounting slot, wherein the mesh cover of the automatic solder nozzle cleaning device is placed in the mounting slot, and the cleaning fluid spray pipe of the automatic solder nozzle cleaning device passes through the mounting slot.

[0023] With the above technical solution, when the drain cover is embedded in the workbench, the flow control valve and the cleaning fluid spray pipe are completely located within the accommodating space, improving the compactness and ease of maintenance of the internal equipment; when the drain cover is installed in the mounting slot, the cleaning fluid spray pipe passes through the mounting slot, achieving a lower space occupancy rate compared to the previous embodiment. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein: Figure 1 This is a partial structural diagram of an embodiment of an automatic solder tip cleaning device provided by this utility model. Figure 1 ; Figure 2 This is a schematic diagram of the connection structure of an embodiment of the automatic cleaning device for solder tips provided by this utility model; Figure 3 This is a partial structural diagram of an embodiment of an automatic solder tip cleaning device provided by this utility model. Figure 2 ; Figure 4 This is a partial structural diagram of an embodiment of an automatic solder tip cleaning device provided by this utility model. Figure 3 ; Figure 5 This is a three-dimensional structural diagram of an embodiment of a selective wave soldering device provided by this utility model. Figure 1 ; Figure 6 This is a three-dimensional structural diagram of an embodiment of a selective wave soldering device provided by this utility model. Figure 2 ; Figure 7 This is a partial structural schematic diagram of an embodiment of a selective wave soldering device provided by this utility model; Figure 8 This is a three-dimensional structural schematic diagram of an embodiment of the moving mechanism of a selective wave soldering equipment provided by this utility model.

[0025] In the picture: 1. Automatic solder nozzle cleaning device; 10. Cleaning solution storage tank; 11. Flow control valve; 12. Cleaning solution spray pipe; 120. Cleaning solution nozzle; 13. Screen cover; 130. Mounting plate; 2. Selective wave soldering oven; 20. Solder nozzle; 3. Frame; 30. Worktable; 300. PCB board mounting bracket; 301. Mounting slot; 31. Accommodation space; 32. Upper working area; 4. Moving mechanism; 41. X-axis moving assembly; 42. Y-axis moving assembly; 43. Z-axis moving assembly. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0027] For ease of description, before describing the specific structure of the automatic solder tip cleaning device and the selective wave soldering equipment, this application first clarifies that the terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and are not used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of this application can be implemented in sequences other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and are not limited in number; for example, the first object can be one or more.

[0028] See Figures 1 to 3 As shown, Figure 1 A partial structural diagram of an embodiment of an automatic solder tip cleaning device 1 provided in this application is shown. Figure 1 ; Figure 2 This paper shows a schematic diagram of the connection structure of an embodiment of an automatic solder nozzle cleaning device 1 provided in this application; Figure 3 A partial structural diagram of an embodiment of an automatic solder tip cleaning device 1 provided in this application is shown. Figure 2 .

[0029] In some embodiments, the automatic solder tip cleaning device 1 includes: a cleaning fluid storage tank 10, a flow control valve 11, and a cleaning fluid spray pipe 12. The cleaning fluid storage tank 10 is used to store cleaning fluid; the flow control valve 11 is connected to the cleaning fluid storage tank 10, wherein the flow control valve 11 is communicatively connected to a selective wave soldering device and is configured to activate when the selective wave soldering device is in a state of reduced solder wave height; the cleaning fluid spray pipe 12 is connected to the flow control valve 11, and a cleaning fluid nozzle 120 is provided at the end of the cleaning fluid spray pipe 12, wherein the opening direction of the cleaning fluid nozzle 120 is vertically downward and can be opposite to the solder tip 20.

[0030] In this embodiment, the non-contact rinsing method avoids damage to the plating on the surface of the solder nozzle 20 compared to traditional brushing. The flow control valve 11, connected to the cleaning fluid tank 10, enables precise control of the flow rate. The flow control valve 11 is used to activate the cleaning fluid spray pipe 12 for spraying cleaning fluid when the selective wave soldering equipment is in a state of reduced solder wave height (molten solder falls back into the solder bath). For example, the cleaning fluid nozzle 120 sprays cleaning fluid vertically downwards onto the surface and inner wall of the solder nozzle 20. When the solder wave of the solder nozzle 20 rises (forming a peak), the oxidation on the surface of the solder nozzle 20 is removed.

[0031] The cleaning solution spraying method, which cleans when the solder wave height decreases, utilizes the residual heat from the soldering operation (residual temperature of the soldering process) of the solder nozzle 20 to improve the cleaning effect of the cleaning solution. It also allows for increased cleaning frequency based on actual operational needs, reducing oxide layer accumulation. Furthermore, the aforementioned automatic solder nozzle cleaning device 1 has a simple structure, few components, and low cost per rinse, and can be retrofitted into existing selective wave soldering equipment. The cleaning solution can be a neutral, environmentally friendly water-based cleaning agent. In some embodiments, the automatic solder nozzle cleaning device 1 further includes a drain screen 13, wherein the flow control valve 11 and the cleaning fluid spray pipe 12 are located inside the drain screen 13.

[0032] In the first embodiment, combined with Figure 3 As shown, one side of the drain screen 13 extends into a mounting plate 130, and the cleaning fluid spray pipe 12 and the flow control valve 11 are arranged on the mounting plate 130, wherein, combined with Figure 1 As shown, the cleaning fluid spray pipe 12 has a bent section. In this embodiment, by extending one side of the mesh cover 13 as a mounting plate 130 for the cleaning fluid spray pipe 12 and the flow control valve 11, the automatic solder nozzle cleaning device 1 can be modularized, making it easier to install into existing selective wave soldering equipment. Furthermore, the mesh cover 13 can serve as a baffle for the flow control valve 11 and the cleaning fluid spray pipe 12, preventing external dust and impurities from falling into the solder nozzle 20 through the automatic solder nozzle cleaning device 1.

[0033] In the second embodiment, combined with Figure 4As shown, Figure 4 A partial structural diagram of an embodiment of an automatic solder tip cleaning device 1 provided in this application is shown. Figure 3 Without the mounting plate 130, the cleaning fluid spray pipe 12 and the flow control valve 11 are installed on the body of the selective wave soldering equipment. The cleaning fluid spray pipe 12 is a straight pipe to reduce space occupation. At the same time, the mesh cover 13 covers the cleaning fluid spray pipe 12 and the flow control valve 11 to further improve the protection against dust, impurities, etc., so as to balance the difficulty of installing the automatic solder nozzle cleaning device 1 and the degree of occupation of the selective wave soldering workbench 30.

[0034] See Figures 5 to 6 As shown, Figure 5 This application provides a three-dimensional structural schematic diagram of an embodiment of a selective wave soldering apparatus. Figure 1 ; Figure 6 This application provides a three-dimensional structural schematic diagram of an embodiment of a selective wave soldering apparatus. Figure 2 .

[0035] In a second aspect, this application also provides a selective wave soldering apparatus, including the aforementioned automatic solder nozzle cleaning device 1, and further comprising: a selective wave soldering furnace 2, a frame 3, and a moving mechanism 4. The selective wave soldering furnace 2 has a solder nozzle 20 protruding from its top; the frame 3 includes a worktable 30 and a receiving space 31 for placing the selective wave soldering furnace 2, wherein the automatic solder nozzle cleaning device 1 is embedded in the worktable 30; the moving mechanism 4 is located in the receiving space 31 and connected to the selective wave soldering furnace 2, for driving the solder nozzle 20 of the selective wave soldering furnace 2 to face the cleaning fluid nozzle 120 of the automatic solder nozzle cleaning device 1.

[0036] In this embodiment, the selective wave soldering furnace 2 is moved by the moving mechanism 4 to ensure alignment between the selective wave soldering furnace 2 and the cleaning fluid nozzle 120. That is, the automatic solder nozzle cleaning device 1 is fixed, while the solder nozzle 20 is movable. Compared to a movable automatic solder nozzle cleaning device 1, this design further saves space in the selective wave soldering equipment. It also ensures the automatic positioning accuracy of the solder nozzle 20, improving the automation level of solder nozzle 20 cleaning and maintenance in the selective wave soldering equipment.

[0037] In some implementation schemes, such as Figure 6 As shown, the workbench 30 also includes a PCB board holder 300, wherein the moving mechanism 4 is used to drive the solder nozzle 20 of the selective wave soldering furnace 2 to face the bottom surface of the PCB to ensure that the solder nozzle 20 is positioned for normal soldering operation.

[0038] In some implementation schemes, such as Figure 5As shown, the selective wave soldering equipment also includes an upper working area 32, where the cleaning solution tank 10 of the automatic solder nozzle cleaning device 1 is located, or as shown in the diagram. Figure 6 As shown, the cleaning fluid storage tank 10 of the automatic solder tip cleaning device 1 is located in the accommodating space 31. In this embodiment, the cleaning fluid storage tank 10 can be stored in a suitable location according to the actual situation, such as in the accommodating space 31 or the upper working area 32, and is connected to the flow control valve 11 through a conduit. For example, the cleaning fluid storage tank 10 is located close to any openable cabinet door of the frame 3, making it convenient for staff to add cleaning fluid in a timely manner.

[0039] In some implementations, the workbench 30 is provided with a mounting groove 301, wherein the drain cover 13 of the automatic solder nozzle cleaning device 1 is embedded in the mounting groove 301, and the flow control valve 11 and the cleaning liquid spray pipe 12 of the automatic solder nozzle cleaning device 1 are located in the accommodating space 31.

[0040] In another implementation, exemplarily, such as Figure 7 As shown, Figure 7 A partial structural schematic diagram of an embodiment of a selective wave soldering apparatus provided in this application is shown. The workbench 30 is provided with a mounting groove 301, wherein the mesh cover 13 of the automatic solder nozzle cleaning device 1 is covered in the mounting groove 301, and the cleaning liquid spray pipe 12 of the automatic solder nozzle cleaning device 1 passes through the mounting groove 301.

[0041] In this embodiment, when the drain cover 13 is embedded in the workbench 30, the flow control valve 11 and the cleaning fluid spray pipe 12 are completely located within the accommodating space 31, improving the compactness and ease of maintenance of the internal equipment; when the drain cover 13 is covered in the mounting groove 301, the cleaning fluid spray pipe 12 is installed through the mounting groove 301, achieving a lower space occupancy rate compared to the previous embodiment.

[0042] See Figure 8 As shown, Figure 8 A three-dimensional structural schematic diagram of an embodiment of the moving mechanism 4 of a selective wave soldering equipment provided in this application is shown.

[0043] In some embodiments, the moving mechanism includes an X-axis moving assembly 41, a Y-axis moving assembly 42, and a Z-axis moving assembly 43. The selective wave soldering furnace 2 is fixed to the Z-axis moving assembly 43. The X-axis moving assembly 41 and the Y-axis moving assembly 42 are slidably engaged to achieve horizontal displacement of the solder nozzle 20. The Z-axis moving assembly 43 includes a bracket for supporting the selective wave soldering furnace 2 and a Z-axis guide rail (not shown in the figure) to achieve vertical displacement of the solder nozzle 20.

[0044] In this embodiment, the solder nozzle 20 is precisely moved and positioned in any direction in space by the X-axis moving component 41, the Y-axis moving component 42 and the Z-axis moving component 43, so as to ensure that the solder nozzle 20 and the cleaning liquid nozzle 120 can be precisely aligned when performing cleaning operations.

[0045] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, should be included within the protection scope of this utility model.

Claims

1. An automatic solder nozzle cleaning device for cleaning selective wave soldering equipment equipped with solder nozzles, characterized in that, include: A cleaning fluid storage tank, wherein the cleaning fluid storage tank is used to store cleaning fluid; A flow control valve is connected to the cleaning fluid storage tank, wherein the flow control valve is communicatively connected to the selective wave soldering equipment and is configured to activate when the selective wave soldering equipment is in a state of reduced solder wave height; A cleaning fluid spray pipe is connected to the flow control valve, and a cleaning fluid nozzle is provided at the end of the cleaning fluid spray pipe. The opening direction of the cleaning fluid nozzle is vertically downward and can be opposite to the solder tip.

2. The automatic solder tip cleaning device according to claim 1, characterized in that, The automatic cleaning device for solder tips also includes a drain screen, wherein the flow control valve and the cleaning fluid spray pipe are located inside the drain screen.

3. The automatic solder tip cleaning device according to claim 2, characterized in that, One side of the drain cover extends into a mounting plate, and the cleaning fluid spray pipe and the flow control valve are arranged on the mounting plate, wherein the cleaning fluid spray pipe has a bent section.

4. The automatic solder tip cleaning device according to claim 2, characterized in that, The cleaning fluid spray pipe is a straight pipe.

5. A selective wave soldering device, characterized in that, The automatic solder tip cleaning device according to any one of claims 1 to 4 further includes: A selective wave soldering oven, wherein a solder nozzle protrudes from the top of the selective wave soldering oven; A frame, the frame including a workbench and a accommodating space for placing a selective wave soldering furnace, wherein the automatic solder nozzle cleaning device is embedded in the workbench; A moving mechanism located in the accommodating space and used to drive the solder nozzle of the selective wave soldering furnace to face the cleaning fluid nozzle of the solder nozzle automatic cleaning device.

6. The selective wave soldering equipment according to claim 5, characterized in that, The moving mechanism includes an X-axis moving component, a Y-axis moving component, and a Z-axis moving component, wherein the selective wave soldering furnace is fixed to the Z-axis moving component, and the X-axis moving component and the Y-axis moving component are slidably coupled.

7. The selective wave soldering equipment according to claim 5, characterized in that, The workbench also includes a PCB board holder, wherein the moving mechanism is used to drive the solder nozzle of the selective wave soldering furnace to face the bottom surface of the PCB.

8. The selective wave soldering equipment according to claim 5, characterized in that, The selective wave soldering equipment also includes an upper working area, and the cleaning fluid storage tank of the automatic solder nozzle cleaning device is located in the upper working area, or the cleaning fluid storage tank of the automatic solder nozzle cleaning device is located in the accommodating space.

9. The selective wave soldering equipment according to any one of claims 6 to 8, characterized in that, The workbench is provided with an installation slot, in which the mesh cover of the automatic solder nozzle cleaning device is embedded in the installation slot, and the flow control valve and the cleaning liquid spray pipe of the automatic solder nozzle cleaning device are located in the accommodating space.

10. The selective wave soldering equipment according to any one of claims 6 to 8, characterized in that, The workbench is provided with an installation slot, wherein the mesh cover of the automatic solder nozzle cleaning device is installed in the installation slot, and the cleaning fluid spray pipe of the automatic solder nozzle cleaning device passes through the installation slot.

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