A material box for a semiconductor product

Abstract

The utility model belongs to the technical field of semiconductor packaging, disclose a kind of material box for semiconductor product. Material box for semiconductor product includes box body and at least one movable component, box body is equipped with at least one installation chamber, the top of installation chamber is equipped with inlet, the inner wall of installation chamber is equipped with two first slot groups, two first slot groups are oppositely arranged, each first slot group includes at least one first slot, and the first slot is set along vertical direction extension;At least one movable component is set one by one with at least one installation chamber, and movable component can move linearly in installation chamber, and movable component is equipped with at least two second slot groups, wherein two second slot groups are respectively one by one with two first slot groups, and each second slot group includes at least one second slot, and the second slot is set along vertical direction extension. The utility model can improve the use efficiency of material box for semiconductor product, increase applicability while reducing development cost, in addition, it is convenient to install semiconductor product.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a material box for semiconductor products. Background Technology

[0002] The semiconductor manufacturing process generally consists of wafer fabrication, wafer testing, chip packaging, and packaging and testing. Different forms of semi-finished products are generated at each stage, and these semi-finished products can all be semiconductor products. During the production process, semiconductor products need to be placed in containers for temporary storage.

[0003] In existing technologies, the dimensions of storage boxes for semiconductor products are fixed, and they are all dedicated boxes that can only store semiconductor products of one size. Each time a new semiconductor size is added, a new dedicated box needs to be developed, increasing development costs. Furthermore, if a certain size of semiconductor is not being produced temporarily, the boxes suitable for that size will be shelved, resulting in low box utilization efficiency and poor box applicability. Utility Model Content

[0004] The purpose of this utility model is to provide a semiconductor product material box that reduces development costs, improves the efficiency of semiconductor product material boxes, increases applicability, and facilitates the installation of semiconductor products.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A semiconductor product kit, comprising:

[0007] The box body has at least one installation chamber, the top of the installation chamber has an entrance, and the inner wall of the installation chamber has two first groove groups, which are arranged opposite to each other. Each first groove group includes at least one first slot, and the first slot extends vertically.

[0008] At least one movable component is provided in a one-to-one correspondence with at least one of the mounting chambers. The movable component is capable of linear movement within the mounting chamber. The movable component is provided with at least two second slot groups, wherein the two second slot groups correspond one-to-one with the two first slot groups respectively. Each second slot group includes at least one second slot. The second slot extends vertically. Both the first slot and the second slot are used for insertion with the end of a semiconductor product.

[0009] In some possible implementations, the mounting chamber is provided, and the movable component includes two movable members, which are arranged opposite to each other and can move linearly within the mounting chamber. Each movable member is provided with a second slot group, and the second slot group corresponds one-to-one with the first slot group.

[0010] In some possible implementations, the two opposite walls of the mounting chamber are recessed with grooves that extend along the length of the mounting chamber, and both ends of the movable member are connected to rollers that can roll within the grooves.

[0011] In some possible implementations, the groove extends through the outer surface of the housing.

[0012] In some possible implementations, the groove includes a through groove and a guide groove, the guide groove communicating with the through groove, the roller including a connecting shaft and a wheel body, one end of the connecting shaft being fixed to the movable member, the other end of the connecting shaft passing through the through groove and connected to the wheel body, the wheel body being able to roll within the guide groove.

[0013] In some possible implementations, the box body includes a box body and a first side panel, the first side panel being detachably connected to the box body, and the box body having the groove extending through the side of the box body near the first side panel.

[0014] In some possible implementations, the box body includes an L-shaped plate, a second side plate, and a third side plate. The second side plate and the third side plate are disposed on both sides of the L-shaped plate. Both the second side plate and the third side plate are provided with insertion slots. The first side plate is provided with corresponding insertion protrusions. The insertion slots and the insertion protrusions are inserted into each other in the vertical direction.

[0015] In some possible implementations, the semiconductor product kit further includes a limiting member and a fastener. The limiting member is fixed to the top of the kit body and has an elongated hole that extends along the length of the mounting chamber. The top of the movable member has a mounting hole, and the fastener passes through the elongated hole and is fixedly connected to the mounting hole.

[0016] In some possible implementations, the movable element is a long plate.

[0017] In some possible implementations, both ends of the long plate can fit against the cavity wall of the mounting chamber.

[0018] The beneficial effects of this utility model are:

[0019] This invention provides a semiconductor product cassette, comprising a cassette body and at least one movable component. Two first slot groups are arranged opposite each other, each first slot group including at least one first slot. The movable component has at least two second slot groups, each second slot group including at least one second slot. The two second slot groups correspond one-to-one with the two first slot groups. The ends of the semiconductor products are respectively inserted into the first slot and the second slot. When the movable component has two second slot groups, the semiconductor product cassette can simultaneously store semiconductor products of two different sizes. Since the movable component can move linearly within the mounting cavity, the position of the second slot group relative to the first slot group can be adjusted, changing the distance between the first and second slots, thereby allowing the storage of semiconductor products of more sizes. Therefore, this invention can store semiconductor products of different sizes, and different sizes of semiconductor products can use the same semiconductor product cassette, reducing development costs while improving the efficiency and applicability of the semiconductor product cassette. In addition, the top of the mounting chamber is provided with an entrance, the first slot extends vertically and the second slot extends vertically. During installation, the semiconductor product is inserted into the mounting chamber from top to bottom, which makes installation easier and less labor-intensive. Attached Figure Description

[0020] Figure 1 This is a first-view structural schematic diagram of the semiconductor product material box provided by this utility model;

[0021] Figure 2 This is a second-view structural schematic diagram of the semiconductor product material box provided by this utility model;

[0022] Figure 3 This is a partial structural schematic diagram of the semiconductor product material box involved in this utility model;

[0023] Figure 4 This is a schematic diagram of the structure of the first side plate involved in this utility model.

[0024] In the picture:

[0025] 1. Box body; 11. Installation chamber; 12. Inlet; 13. First groove group; 131. First slot; 14. Groove; 141. Through groove; 142. Guide groove; 15. First side plate; 151. Insertion protrusion; 16. L-shaped plate; 17. Second side plate; 18. Third side plate; 19. Insertion groove; 2. Movable component; 21. Second groove group; 211. Second slot; 22. Movable part; 23. Roller; 231. Wheel body;

[0026] 100. Semiconductor products. Detailed Implementation

[0027] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar parts or parts having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0028] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0029] In the description of this utility model, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0030] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0031] like Figures 1 to 4 As shown, this utility model provides a semiconductor product material box, which includes a box body 1 and at least one movable component 2. The box body 1 is provided with at least one mounting chamber 11, and the top of the mounting chamber 11 is provided with an inlet 12, such as... Figure 2 As shown, the inner wall of the installation chamber 11 is provided with two first groove groups 13, which are arranged opposite to each other. Each first groove group 13 includes at least one first slot 131, which extends vertically.

[0032] At least one movable component 2 is provided in a one-to-one correspondence with at least one mounting chamber 11. The movable component 2 can move linearly within the mounting chamber 11. The movable component 2 is provided with at least two second slot groups 21, wherein the two second slot groups 21 correspond one-to-one with two first slot groups 13 respectively. Each second slot group 21 includes at least one second slot 211. The second slot 211 extends vertically. Both the first slot 131 and the second slot 211 are used for insertion with the end of the semiconductor product 100.

[0033] Two first slot groups 13 are arranged opposite each other, each first slot group 13 including at least one first slot 131. The movable component 2 is provided with at least two second slot groups 21, each second slot group 21 including at least one second slot 211. The two second slot groups 21 correspond one-to-one with the two first slot groups 13. The ends of the semiconductor products 100 are respectively inserted into the first slot 131 and the second slot 211. When the movable component 2 is provided with two second slot groups 21, the semiconductor product cassette can store semiconductor products 100 of two different sizes simultaneously. Since the movable component 2 can move linearly within the mounting chamber 11, the position of the second slot group 21 relative to the first slot group 13 can be adjusted, changing the distance between the first slot 131 and the second slot 211, thereby storing semiconductor products 100 of more sizes. Therefore, this invention can store semiconductor products 100 of different sizes, and semiconductor products 100 of different sizes can use the same semiconductor product cassette, reducing development costs while improving the efficiency of the semiconductor product cassette and increasing its applicability. In addition, the top of the mounting chamber 11 is provided with an inlet 12, the first slot 131 extends vertically, and the second slot 211 extends vertically. During installation, the semiconductor product 100 is inserted into the mounting chamber 11 from top to bottom, which makes installation easier and more convenient.

[0034] Optionally, in this embodiment, to save processing costs, the mounting chamber 11 is provided, and the movable component 2 includes two movable parts 22, which are arranged opposite to each other and can move linearly within the mounting chamber 11. Each movable part 22 is provided with a second slot group 21, which corresponds one-to-one with the first slot group 13. Of course, multiple mounting chambers 11 and movable components 2 can be provided to store more semiconductor products 100 of different sizes.

[0035] Optionally, in other embodiments, the mounting chamber 11 is provided with a movable component 2 including a movable member 22, and two second slot groups 21 are provided on both sides of the movable member 22. The two second slot groups 21 are arranged back to back, and the second slot groups 21 correspond one-to-one with the first slot group 13. This configuration results in a simpler structure and lower cost.

[0036] Alternatively, the mounting chamber 11 may be provided with a movable component 2 comprising two movable members 22, each movable member 22 having a second slot group 21 on both sides, that is, the movable component 2 has four second slot groups 21, wherein two of the second slot groups 21 correspond one-to-one with two first slot groups 13, and the other two second slot groups 21 are arranged opposite to each other. With this arrangement, a semiconductor product 100 of one size can also be installed between the two movable members 22.

[0037] Optionally, in this embodiment, grooves 14 are recessed on both opposite walls of the mounting chamber 11, extending along the length of the mounting chamber 11. Rollers 23 are connected to both ends of the movable member 22, and the rollers 23 can roll within the grooves 14. By rolling the rollers 23, linear movement of the movable member 22 is achieved, facilitating the operator's pushing of the movable member 22 and saving manpower. Optionally, in other embodiments, both ends of the movable member 22 are slidably connected to the two grooves 14 respectively, as long as linear movement of the movable member 22 is achieved; this embodiment is not the limitation.

[0038] Furthermore, in this embodiment, the groove 14 penetrates the outer surface of the box body 1. This design facilitates observation of the wear condition of the roller 23 and allows for timely replacement of the roller 23.

[0039] Furthermore, in this embodiment, the groove 14 includes a through groove 141 and a guide groove 142, the guide groove 142 communicating with the through groove 141. The roller 23 includes a connecting shaft and a wheel body 231. One end of the connecting shaft is fixed to the movable member 22, and the other end of the connecting shaft passes through the through groove 141 and is connected to the wheel body 231. The wheel body 231 can roll within the guide groove 142. By providing the guide groove 142, the rolling direction of the roller 23 can be restricted, thereby enabling the movable member 22 to move linearly within the mounting chamber 11.

[0040] Optionally, in this embodiment, the box body 1 includes a box body and a first side plate 15. The first side plate 15 is detachably connected to the box body. The box body has a groove 14 that penetrates the side of the box body near the first side plate 15. This arrangement facilitates the installation of the movable part 22 with rollers 23 into the mounting chamber 11. During installation, the movable part 22 with rollers 23 is inserted into the box body from the left side. During this process, the rollers 23 enter the groove 14 from the left side. After installation, the first side plate 15 is installed on the box body.

[0041] Optionally, in this embodiment, the box body includes an L-shaped plate 16, a second side plate 17, and a third side plate 18. The second side plate 17 and the third side plate 18 are disposed on both sides of the L-shaped plate 16. Both the second side plate 17 and the third side plate 18 are provided with insertion slots 19, and the first side plate 15 is provided with corresponding insertion protrusions 151. The insertion slots 19 and the insertion protrusions 151 are inserted vertically. During installation, the second side plate 17 and the third side plate 18 are inserted into the insertion protrusions 151 of the first side plate 15 through the insertion slots 19, and then the installed structure is fixed on the L-shaped plate 16. This arrangement facilitates the disassembly, assembly, and replacement of the box 1, and the structure is relatively simple. Specifically, both the second side plate 17 and the third side plate 18 are provided with grooves 14. The groove 14 corresponding to the second side plate 17 communicates with the corresponding insertion slot 19 of the second side plate 17, and the groove 14 corresponding to the third side plate 18 communicates with the corresponding insertion slot 19 of the third side plate 18. In other embodiments, the second side plate 17 and the third side plate 18 are both provided with insertion protrusions 151, and the first side plate 15 is provided with a corresponding insertion groove 19, which is inserted into the insertion protrusions 151 in the vertical direction.

[0042] Optionally, to better meet the fixing requirements of the semiconductor product 100 and make the fixing more reliable, in this embodiment, the semiconductor product housing also includes a limiting member and a fastener. The limiting member is fixed to the top of the housing 1 and has an elongated hole that extends along the length of the mounting chamber 11. The top of the movable member 22 has a mounting hole, and the fastener passes through the elongated hole and is fixedly connected to the mounting hole. With the above arrangement, the movable member 22 can be reliably fixed while adjusting its position. Specifically, the fastener is a screw, which is threaded into the mounting hole. It is understood that the limiting member and fastener can also be omitted, allowing the movable members 22 to abut against each other. Figure 2 As shown, a semiconductor product 100 can be installed between the first slot group 13 on the left and the second slot group 21 on the left, and another semiconductor product 100 can be installed between the first slot group 13 on the right and the second slot group 21 on the right. When both semiconductor products 100 are located in the mounting chamber 11, the two movable parts 22 abut against each other, and the position of the movable parts 22 is restricted by the semiconductor product 100.

[0043] For ease of processing, the movable part 22 may optionally be a long plate. Furthermore, both ends of the long plate can be in contact with the cavity wall surface of the mounting chamber 11. When the movable part 22 moves linearly within the mounting chamber 11, both ends of the long plate are in contact with the cavity wall surface of the mounting chamber 11, and the long plate can serve as a guide.

[0044] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A semiconductor product material box, characterized in that, include: The box body (1) is provided with at least one installation chamber (11), the top of the installation chamber (11) is provided with an entrance (12), the inner wall of the installation chamber (11) is provided with two first slot groups (13), the two first slot groups (13) are arranged opposite to each other, each first slot group (13) includes at least one first slot (131), the first slot (131) extends in the vertical direction; At least one movable component (2) is provided in a one-to-one correspondence with at least one of the mounting chambers (11). The movable component (2) is capable of linear movement within the mounting chamber (11). The movable component (2) is provided with at least two second slot groups (21), wherein the two second slot groups (21) correspond one-to-one with the two first slot groups (13). Each second slot group (21) includes at least one second slot (211). The second slot (211) extends vertically. Both the first slot (131) and the second slot (211) are used for insertion into the end of the semiconductor product (100).

2. The semiconductor product material box according to claim 1, characterized in that, The installation chamber (11) is provided, and the movable component (2) includes two movable parts (22). The two movable parts (22) are arranged opposite to each other and can move linearly within the installation chamber (11). Each movable part (22) is provided with a second groove group (21), and the second groove group (21) corresponds one-to-one with the first groove group (13).

3. The semiconductor product material box according to claim 2, characterized in that, The mounting chamber (11) has two opposite cavity walls with recessed grooves (14), which extend along the length of the mounting chamber (11). Both ends of the movable part (22) are connected to rollers (23), which can roll in the grooves (14).

4. The semiconductor product material box according to claim 3, characterized in that, The groove (14) penetrates the outer surface of the box (1).

5. The semiconductor product kit according to claim 4, characterized in that, The groove (14) includes a through groove (141) and a guide groove (142). The guide groove (142) communicates with the through groove (141). The roller (23) includes a connecting shaft and a wheel body (231). One end of the connecting shaft is fixed to the movable part (22). The other end of the connecting shaft passes through the through groove (141) and is connected to the wheel body (231). The wheel body (231) can roll in the guide groove (142).

6. The semiconductor product kit according to claim 3, characterized in that, The box body (1) includes a box body and a first side plate (15). The first side plate (15) is detachably connected to the box body. The box body is provided with the groove (14), which penetrates the side of the box body near the first side plate (15).

7. The semiconductor product kit according to claim 6, characterized in that, The box body includes an L-shaped plate (16), a second side plate (17) and a third side plate (18). The second side plate (17) and the third side plate (18) are disposed on both sides of the L-shaped plate (16). The second side plate (17) and the third side plate (18) are both provided with insertion slots (19). The first side plate (15) is provided with corresponding insertion protrusions (151). The insertion slots (19) and the insertion protrusions (151) are inserted in the vertical direction.

8. The semiconductor product kit according to claim 3, characterized in that, The semiconductor product material box also includes a limiting member and a fastener. The limiting member is fixed to the top of the box body (1). The limiting member has an elongated hole that extends along the length of the mounting chamber (11). The top of the movable member (22) has a mounting hole. The fastener passes through the elongated hole and is fixedly connected to the mounting hole.

9. The semiconductor product material box according to claim 3, characterized in that, The movable part (22) is a long plate.

10. The semiconductor product kit according to claim 9, characterized in that, Both ends of the long plate can fit against the cavity wall of the mounting chamber (11).

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