A PLC controller heat dissipation assembly

Abstract

The utility model relates to a kind of PLC controller heat dissipation components, including controller main body, the outside of controller main body is provided with refrigeration heat dissipation structure, the refrigeration heat dissipation structure includes shell, the outside of controller main body is sleeved with shell, the inside of shell is provided with liquid storage chamber, the inner top of liquid storage chamber is fixedly installed with semiconductor refrigerator, the inner bottom wall of liquid storage chamber is fixedly installed with submersible pump.The PLC controller heat dissipation components, by the setting of refrigeration heat dissipation structure and auxiliary structure, device main body can be installed, while in the use process of controller main body, by heat conduction, refrigeration, air cooling three kinds of heat dissipation mode to the four around of controller main body are rapidly heat dissipation cooling, avoid the heat and high temperature that controller main body generates in use process cannot be rapidly heat dissipation cooling, cause the phenomenon that the internal electronic device of controller main body is influenced by high temperature and accelerates ageing and damage.

Description

Technical Field

[0001] This utility model relates to the field of PLC controller technology, specifically a PLC controller heat dissipation component. Background Technology

[0002] With the development of society, coal preparation plants are gradually moving towards intelligent control. Centralized control systems are the core part of the automation upgrade of coal preparation plants. By building a unified control platform, centralized monitoring, unified scheduling and coordinated control of all equipment in the plant can be achieved. Centralized control systems usually adopt advanced control technologies such as PLC and DCS, combined with industrial control software, to achieve precise control of the production process.

[0003] A search revealed a PLC controller with heat dissipation function disclosed in Chinese Patent Publication No. CN220776372U. This PLC controller with heat dissipation function utilizes a first heat dissipation fin on the back of the PLC controller body, providing a large contact area with the body and quickly dissipating heat generated by the PLC controller. Simultaneously, a cooling fan drives airflow, resulting in good heat dissipation. The inclusion of a mounting bracket and limiting slots facilitates the installation and removal of the cooling fan, while also absorbing some of the vibration during fan operation, reducing noise and improving the stability of the PLC controller body.

[0004] However, the PLC controller with heat dissipation function has a relatively simple heat dissipation structure, which only uses common heat dissipation structures such as heat sink fins and fans to dissipate heat from the controller. This structure has limited heat dissipation efficiency and cannot dissipate heat from the controller quickly. Therefore, a PLC controller heat dissipation component is proposed. Summary of the Invention

[0005] To overcome the shortcomings of the prior art, the present invention provides a PLC controller heat dissipation component, which has the advantages of facilitating rapid heat dissipation and cooling of the PLC controller, and solves the problem that the heat dissipation structure of the existing device needs to be optimized.

[0006] The technical solution adopted by this invention to solve its technical problem is:

[0007] A PLC controller heat dissipation assembly includes a controller body, a cooling and heat dissipation structure disposed on the outside of the controller body, and an auxiliary structure disposed on the outside of the controller body.

[0008] The cooling and heat dissipation structure includes a housing, which is fitted over the controller body. A liquid storage chamber is located inside the housing. A semiconductor cooler is fixedly installed at the top of the liquid storage chamber. A submersible pump is fixedly installed on the bottom wall of the liquid storage chamber. A cold transfer chamber is opened inside the housing. A support block is fixedly installed inside the cold transfer chamber. A heat exchange coil is fixedly installed inside the support block. A first fan is fixedly installed inside the cold transfer chamber. A second fan is fixedly installed inside the air-cooling hole.

[0009] Furthermore, the auxiliary structure includes a heat-conducting plate, a heat-conducting plate is fixedly installed on the top of the controller body, a heat-conducting rod is fixedly installed on the top of the heat-conducting plate, heat dissipation fins are fixedly installed on the outer surface of the controller body, a base block is fixedly installed on the bottom of the controller body, and an installation plate is fixedly installed on the outer surface of the outer shell.

[0010] Furthermore, the liquid storage chamber is filled with coolant, the cooling end of the semiconductor cooler is fixedly installed inside the liquid storage chamber, the heat dissipation end of the semiconductor cooler penetrates the inner top wall of the liquid storage chamber and extends to the outside of the outer shell, and the heat dissipation end of the semiconductor cooler is equipped with a heat exchange fan.

[0011] Furthermore, two submersible pumps are fixedly installed on the inner bottom wall of the liquid storage chamber, and a water pumping pipe is fixedly installed on the outer surface of each submersible pump. Cooling chambers are opened on both the left and right sides of the outer shell. There are two heat exchange coils, and nine support blocks are fixedly installed on the outer surface of each heat exchange coil. The eighteen support blocks are respectively fixedly installed on the inner left and inner right walls of the two cooling chambers.

[0012] Furthermore, one end of each of the two heat exchange coils is fixedly connected to the output end of each of the two submersible pumps, and the other end of each of the two heat exchange coils penetrates the inner top wall of each of the two cooling chambers and extends into the interior of the liquid storage chamber. A first fan is fixedly installed inside each of the cooling chambers. A through hole is opened on the side of each of the two cooling chambers near the controller body. Two air-cooling holes are opened at the bottom of the outer shell, and a second fan is fixedly installed inside each of the air-cooling holes.

[0013] Furthermore, both the heat-conducting plate and the heat-conducting rods are made of aluminum. Fourteen heat-conducting rods are fixedly installed on the top of the heat-conducting plate, and the top of each heat-conducting rod extends into the interior of the liquid storage chamber.

[0014] Furthermore, a number of heat dissipation fins are fixedly installed on both the left and right sides of the controller body. The opposite sides of the heat dissipation fins are fixedly connected to the inner left and inner right walls of the outer shell, respectively. A number of four base blocks are fixedly installed at the bottom of the controller body. The bottom of the four base blocks is fixedly connected to the inner bottom wall of the outer shell. A number of four mounting plates are fixedly installed on both the left and right sides of the outer shell, respectively.

[0015] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0016] This PLC controller heat dissipation component, through the design of a cooling and heat dissipation structure and auxiliary structures, allows for the installation of the main unit. During the use of the main unit, it rapidly dissipates and cools the surrounding area of ​​the main unit through three heat dissipation methods: heat conduction, cooling, and air cooling. This prevents the main unit from generating heat and high temperatures that cannot be quickly dissipated and cooled, which could lead to accelerated aging and damage to the internal electronic components of the main unit due to high temperatures. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a partial three-dimensional structural diagram of the present invention;

[0019] Figure 3 This is a front sectional view of the present invention.

[0020] Figure 4 This is a side view of the cooling chamber structure of this utility model;

[0021] Figure 5 This is a bottom view of the outer shell structure of this utility model.

[0022] In the diagram: 1. Controller body; 2. Cooling and heat dissipation structure; 201. Outer shell; 202. Liquid storage chamber; 203. Semiconductor cooler; 204. Submersible pump; 205. Cold transfer chamber; 206. Support block; 207. Heat exchange coil; 208. First fan; 209. Air cooling hole; 210. Second fan; 3. Auxiliary structure; 301. Heat conduction plate; 302. Heat conduction rod; 303. Heat dissipation fins; 304. Base block; 305. Mounting plate. Detailed Implementation

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0024] Please see Figure 1-5A PLC controller heat dissipation component includes a controller body 1, a cooling and heat dissipation structure 2 disposed on the outside of the controller body 1, and an auxiliary structure 3 disposed on the outside of the controller body 1.

[0025] The cooling and heat dissipation structure 2 includes a housing 201. The housing 201 is sleeved on the outside of the controller body 1. A liquid storage chamber 202 is provided inside the housing 201. A semiconductor cooler 203 is fixedly installed on the top of the liquid storage chamber 202. A submersible pump 204 is fixedly installed on the bottom wall of the liquid storage chamber 202. A cooling chamber 205 is opened inside the housing 201. A support block 206 is fixedly installed inside the cooling chamber 205. A heat exchange coil 207 is fixedly installed inside the support block 206. A first fan 208 is fixedly installed inside the cooling chamber 205. A cooling vent 209 is opened inside the housing 201. A second fan 210 is fixedly installed inside the cooling vent 209.

[0026] Furthermore, the auxiliary structure 3 includes a heat-conducting plate 301, a heat-conducting plate 301 fixedly installed on the top of the controller body 1, a heat-conducting rod 302 fixedly installed on the top of the heat-conducting plate 301, heat dissipation fins 303 fixedly installed on the outer surface of the controller body 1, a base block 304 fixedly installed on the bottom of the controller body 1, and an installation plate 305 fixedly installed on the outer surface of the outer shell 201.

[0027] Specifically, such as Figure 3 As shown, the entire device can be installed using the mounting plate 305 and bolts. During the use of the controller body 1, the semiconductor cooler 203 is turned on, and the cooling end of the semiconductor cooler 203 cools the coolant inside the liquid storage chamber 202. Then, the heat-conducting rod 302 conducts a cooling process to the heat-conducting plate 301. Finally, the heat-conducting plate 301 conducts a cooling process to the top of the controller body 1, thus performing preliminary heat dissipation and cooling of the controller body 1.

[0028] Specifically, such as Figure 3 As shown, the submersible pump 204 is then turned on to extract the cooled liquid and send it into the heat exchange coil 207. The heat exchange coil 207 exchanges heat with the air inside the cooling chamber 205 to generate cold air. Then, the first fan 208 is turned on to blow the cooled air through the through hole to the left and right sides of the controller body 1 and the heat dissipation fins 303 on the left and right sides, so as to cool the controller body 1 again. Finally, the second fan 210 is turned on to cool the bottom of the controller body 1, so as to quickly cool the four sides of the controller body 1.

[0029] Specifically, such as Figure 3As shown, the semiconductor cooler 203 consists of a cooling chip, a heat sink, and a DC power supply. All of these are devices that utilize the thermoelectric effect of semiconductors to generate cooling. The cooling chip is mostly an insulating ceramic sheet with a first metal conductor at the bottom. The heat sink contains an insulating ceramic sheet with a second metal conductor on top. The two metal conductors are connected by N-type and P-type bismuth telluride semiconductors. When the DC power supply is energized, the Peltier effect in the semiconductor generates heat absorption and dissipation, thereby cooling the coolant.

[0030] In summary, the PLC controller heat dissipation assembly, through the cooling and heat dissipation structure 2 and the auxiliary structure 3, enables the installation of the main body of the device. At the same time, during the use of the main body of the controller 1, the heat dissipation is rapidly cooled down around the main body of the controller 1 through three heat dissipation methods: heat conduction, cooling, and air cooling. This avoids the phenomenon that the heat and high temperature generated by the main body of the controller 1 cannot be quickly cooled down, which would cause the internal electronic components of the main body of the controller 1 to be affected by high temperature and accelerate aging and damage.

Claims

1. A heat dissipation assembly for a PLC controller, comprising a controller body (1), characterized in that: The controller body (1) is provided with a cooling and heat dissipation structure (2) on its exterior, and an auxiliary structure (3) is provided on its exterior. The cooling and heat dissipation structure (2) includes a shell (201). The shell (201) is sleeved on the outside of the controller body (1). A liquid storage chamber (202) is provided inside the shell (201). A semiconductor cooler (203) is fixedly installed on the top of the liquid storage chamber (202). A submersible pump (204) is fixedly installed on the bottom wall of the liquid storage chamber (202). A cooling chamber (205) is opened inside the shell (201). A support block (206) is fixedly installed inside the cooling chamber (205). A heat exchange coil (207) is fixedly installed inside the support block (206). A first fan (208) is fixedly installed inside the cooling chamber (205). A cooling hole (209) is opened inside the shell (201). A second fan (210) is fixedly installed inside the cooling hole (209).

2. The PLC controller heat dissipation assembly according to claim 1, characterized in that: The auxiliary structure (3) includes a heat-conducting plate (301), the top of the controller body (1) is fixedly installed with the heat-conducting plate (301), the top of the heat-conducting plate (301) is fixedly installed with a heat-conducting rod (302), the outer surface of the controller body (1) is fixedly installed with heat dissipation fins (303), the bottom of the controller body (1) is fixedly installed with a base block (304), and the outer surface of the outer shell (201) is fixedly installed with an mounting plate (305).

3. The PLC controller heat dissipation assembly according to claim 1, characterized in that: The liquid storage chamber (202) is filled with coolant. The cooling end of the semiconductor cooler (203) is fixedly installed inside the liquid storage chamber (202). The heat dissipation end of the semiconductor cooler (203) penetrates the inner top wall of the liquid storage chamber (202) and extends to the outside of the outer shell (201). The heat dissipation end of the semiconductor cooler (203) is equipped with a heat exchange fan.

4. A PLC controller heat dissipation assembly according to claim 1, characterized in that: Two submersible pumps (204) are fixedly installed on the inner bottom wall of the liquid storage chamber (202). A water pump pipe is fixedly installed on the outer surface of each submersible pump (204). Cooling chambers (205) are opened on the left and right sides of the outer shell (201). There are two heat exchange coils (207). Nine support blocks (206) are fixedly installed on the outer surface of each heat exchange coil (207). The eighteen support blocks (206) are respectively fixedly installed on the inner left and inner right walls of the two cooling chambers (205).

5. A PLC controller heat dissipation assembly according to claim 1, characterized in that: One end of each of the two heat exchange coils (207) is fixedly connected to the output end of each of the two submersible pumps (204). The other end of each of the two heat exchange coils (207) passes through the inner top wall of each of the two cooling chambers (205) and extends into the interior of the liquid storage chamber (202). A first fan (208) is fixedly installed inside each of the cooling chambers (205). A through hole is opened on the side of each of the two cooling chambers (205) near the controller body (1). Two air-cooling holes (209) are opened at the bottom of the outer shell (201). A second fan (210) is fixedly installed inside each of the air-cooling holes (209).

6. A PLC controller heat dissipation assembly according to claim 2, characterized in that: The heat-conducting plate (301) and the heat-conducting rod (302) are both made of aluminum. Fourteen heat-conducting rods (302) are fixedly installed on the top of the heat-conducting plate (301), and the top of each heat-conducting rod (302) extends into the interior of the liquid storage chamber (202).

7. A PLC controller heat dissipation assembly according to claim 2, characterized in that: The controller body (1) has several heat dissipation fins (303) fixedly installed on both the left and right sides. The opposite sides of the heat dissipation fins (303) are fixedly connected to the inner left and inner right walls of the outer shell (201), respectively. The controller body (1) has four base blocks (304) fixedly installed at the bottom. The bottom of the four base blocks (304) is fixedly connected to the inner bottom wall of the outer shell (201). The outer shell (201) has four mounting plates (305) fixedly installed on both the left and right sides, respectively.

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