Semiconductor refrigeration headgear

Abstract

The utility model belongs to helmet technical field relates to a kind of semiconductor refrigeration helmet, comprising: shell, semiconductor refrigeration piece, fin, control module, fan, air inlet, interlayer, air duct and air outlet, the semiconductor refrigeration piece is located on the helmet upper end behind brain position, and refrigeration is realized using the thermoelectric effect of semiconductor material, one side of the refrigeration piece is connected with the inside of the helmet, and the other side is connected with the fin by heat conduction, the fin is located on the outside of the helmet, and is connected with the hot end of the semiconductor refrigeration piece, the control module is located in the inside or outside of the helmet, for regulating and controlling the working condition of the semiconductor refrigeration piece, the fan is located in the central of the helmet, for the outside air is inhaled into the inside of the helmet by the air inlet. While improving wearing comfort, it also provides strong guarantee for work in special environment.

Description

Technical Field

[0001] This utility model relates to the field of helmet technology, and more specifically, to a semiconductor cooling helmet. Background Technology

[0002] Traditional helmets can easily cause overheating of the head after prolonged wear, affecting comfort and health. Existing helmets often have inadequate heat dissipation designs, making it difficult to effectively dissipate heat and leading to internal temperature buildup. Traditional helmets lack intelligent temperature control mechanisms, making it difficult to meet individual needs. Furthermore, existing helmets are poorly designed in terms of air circulation, easily leading to stuffy internal air and affecting respiratory health. Utility Model Content

[0003] To address the aforementioned deficiencies in the prior art, this utility model provides a semiconductor cooling helmet, comprising:

[0004] The helmet comprises a shell, a thermoelectric cooler, a heat sink, a control module, a fan, an air inlet, a partition, an air duct, and an air outlet. The thermoelectric cooler is located at the top of the helmet near the back of the head and utilizes the thermoelectric effect of semiconductor materials to achieve cooling. One side of the cooler is connected to the interior of the helmet, and the other side is connected to the heat sink via heat conduction. The heat sink is located on the exterior of the helmet and connected to the hot end of the thermoelectric cooler. The control module is located inside or outside the helmet and is used to regulate the working state of the thermoelectric cooler. The fan is located in the center of the helmet and is used to draw outside air into the helmet through the air inlet and circulate the air inside the helmet. The air inlet is located at the top of the helmet and is used to introduce outside air. The air outlets are distributed on both sides of the air duct inside the helmet and are used to blow the cooled air towards the wearer's head. The partition is located inside the helmet and is used to isolate the cooled area from the non-cooled area. The thermoelectric cooler, the heat sink, the control module, and the fan are electrically connected, and the shell and the heat sink are connected by fasteners.

[0005] Preferably, the control module includes: pin 1 of linear charging management chip IC1 is connected to one end of resistor R1 and pin 3 of linear charging management chip IC1 respectively; pin 2 of linear charging management chip IC1 is connected to one end of resistor R1; pin 4 of linear charging management chip IC1 is connected to pin 2 of connection terminal CN1, pin 8 of linear charging management chip IC1, one end of capacitor C1, the positive terminal of LED D4, the positive terminal of LED D3, the positive terminal of LED D2, and the positive terminal of LED D1 respectively; the other end of capacitor C1 is connected to pin 1 of connection terminal CN1, the negative terminal of battery BT2, the negative terminal of battery BT1, the negative terminal of LED D5, one end of resistor R9, the source of transistor Q2, one end of resistor R6, and the source of transistor Q1 and grounded; the positive terminal of battery BT2 is connected to the positive terminal of diode D7; the negative terminal of diode D7 is connected to the positive terminal of battery BT1, one end of switch S2, and switch S1 respectively. One end of the circuit is connected to pin 5 of the linear charging management chip IC1, the negative terminal of diode D6, one end of fan FA1, one end of fan FAN2, and one end of connector TE. Pin 6 of the linear charging management chip IC1 is connected to one end of resistor R3. Pin 7 of the linear charging management chip IC1 is connected to one end of resistor R2. The negative terminal of LED D1 is connected to the negative terminal of LED D2 and the other end of resistor R3. The other end of resistor R9 is connected to one end of resistor R5 and the gate of transistor Q2. The other end of resistor R5 is connected to the other end of switch S1. The drain of transistor Q2 is connected to one end of resistor R7. The other end of resistor R6 is connected to one end of resistor R4 and the gate of transistor Q1. The other end of resistor R4 is connected to the other end of switch S1. The drain of transistor Q1 is connected to the positive terminal of diode D6, the other end of fan FA1, the other end of fan FAN2, the other end of resistor R7, and the other end of connector TE.

[0006] Preferably, the space between the semiconductor cooling chip and the heat sink is filled with a thermally conductive material.

[0007] Preferably, the surface of the heat sink is provided with a fin structure.

[0008] Preferably, the partition is filled with a phase change material.

[0009] Preferably, a heat pipe is provided between the heat sink and the semiconductor cooling chip, one end of the heat pipe is connected to the heating surface of the semiconductor cooling chip, and the other end of the heat pipe is connected to the heat sink.

[0010] Preferably, an active cooling fan is provided on the outside of the heat sink.

[0011] Preferably, the interior of the housing is provided with multiple layers of heat insulation material.

[0012] Preferably, the air inlet is provided with a waterproof and dustproof structure.

[0013] Preferably, the air outlet is provided with a waterproof and dustproof structure.

[0014] The semiconductor cooling helmet of this invention has the following beneficial effects:

[0015] In terms of cooling effect, the semiconductor cooling chip uses the thermoelectric effect to achieve efficient cooling. One side of it is connected to the inside of the helmet, which can quickly reduce the temperature inside the helmet and create a cool and comfortable environment for the wearer. It is especially suitable for high-temperature work or outdoor activities in hot weather.

[0016] With excellent heat dissipation performance, the hot end of the semiconductor cooling chip is connected to the heat sink outside the helmet through heat conduction. The heat sink can effectively dissipate heat, ensuring that the cooling chip works continuously and stably, and avoiding the cooling effect being affected by overheating.

[0017] The helmet's internal air circulation system is well-designed, with a fan located in the center of the helmet. It draws in outside air through the air inlet and circulates the air inside the helmet. The air outlets are distributed on both sides of the air duct, which can accurately blow the cooled air to the wearer's head, further enhancing the cooling experience.

[0018] The partition design is very thoughtful. It can effectively isolate the cooling area from the non-cooling area, prevent cold air from leaking out, improve cooling efficiency, and make more rational use of the internal space of the helmet. Moreover, the components are connected by electrical connections and fasteners, making the structure stable and easy to install and maintain.

[0019] While improving wearing comfort, it also provides strong protection for working in special environments. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort. The utility model will be further described below in conjunction with the drawings and embodiments. In the drawings:

[0021] Figure 1 This is a circuit diagram of the control module in the semiconductor cooling helmet of this utility model;

[0022] Figure 2 This is a schematic diagram showing the semiconductor arrangement in the semiconductor cooling chip of the semiconductor cooling helmet of this utility model;

[0023] Figure 3This is a schematic diagram illustrating the working principle of the semiconductor cooling chip in the semiconductor cooling helmet of this utility model.

[0024] In the diagram, 1 represents the first metal wire, and 2 represents the second metal wire. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0027] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0028] The semiconductor-cooled helmet provided in the first embodiment of this utility model includes at least a shell, a semiconductor cooling chip, a heat sink, a control module, a fan, an air inlet, a partition, an air duct, and an air outlet. The semiconductor cooling chip is located at the upper part of the helmet near the back of the head and achieves cooling by utilizing the thermoelectric effect of semiconductor materials. One side of the cooling chip is connected to the inside of the helmet, and the other side is connected to the heat sink through heat conduction. The heat sink is located on the outside of the helmet and is connected to the hot end of the semiconductor cooling chip. The control module is located inside or outside the helmet and is used to regulate the working state of the semiconductor cooling chip. The fan is located in the center of the helmet and is used to draw outside air into the helmet through the air inlet and drive the air to circulate inside the helmet. The air inlet is located at the top of the helmet and is used to introduce outside air. The air outlets are distributed on both sides of the air duct inside the helmet and are used to blow the cooled air toward the wearer's head. The partition is located inside the helmet and is used to isolate the cooled area from the non-cooled area. The semiconductor cooling chip, heat sink, control module, and fan are electrically connected, and the shell and heat sink are connected by fasteners.

[0029] The helmet shell is the main structure of the entire device, made of lightweight, high-strength composite materials. This ensures the helmet's durability while reducing overall weight for easy wear. The helmet shell's design must conform to ergonomics to ensure comfortable and secure wear.

[0030] Semiconductor coolers utilize the thermoelectric effect of semiconductor materials to achieve cooling. It should be noted that the selection of a semiconductor cooler requires consideration of factors such as its cooling efficiency, power consumption, and thermal stability.

[0031] The heat sink is located on the outside of the helmet and is connected to the hot end of the thermoelectric cooler to dissipate the heat generated during the cooling process into the air. The heat sink needs to be designed with a large heat dissipation area and good thermal conductivity to improve heat dissipation efficiency.

[0032] Figure 1 This is a circuit diagram of the control module in the semiconductor cooling helmet of this utility model. Figure 1As shown, the control module includes: pin 1 of linear charging management chip IC1 is connected to one end of resistor R1 and pin 3 of linear charging management chip IC1 respectively; pin 2 of linear charging management chip IC1 is connected to one end of resistor R1; pin 4 of linear charging management chip IC1 is connected to pin 2 of connection terminal CN1, pin 8 of linear charging management chip IC1, one end of capacitor C1, the positive terminal of LED D4, the positive terminal of LED D3, the positive terminal of LED D2, and the positive terminal of LED D1 respectively; the other end of capacitor C1 is connected to pin 1 of connection terminal CN1, the negative terminal of battery BT2, the negative terminal of battery BT1, the negative terminal of LED D5, one end of resistor R9, the source of transistor Q2, one end of resistor R6, and the source of transistor Q1 and grounded; the positive terminal of battery BT2 is connected to the positive terminal of diode D7; the negative terminal of diode D7 is connected to the positive terminal of battery BT1, one end of switch S2, and the negative terminal of switch S1 respectively. One end of the linear charging management chip IC1 is connected to pin 5, the negative terminal of diode D6, one end of fan FA1, one end of fan FAN2, and one end of connector TE. Pin 6 of the linear charging management chip IC1 is connected to one end of resistor R3. Pin 7 of the linear charging management chip IC1 is connected to one end of resistor R2. The negative terminal of LED D1 is connected to the negative terminal of LED D2 and the other end of resistor R3. The other end of resistor R9 is connected to one end of resistor R5 and the gate of transistor Q2. The other end of resistor R5 is connected to the other end of switch S1. The drain of transistor Q2 is connected to one end of resistor R7. The other end of resistor R6 is connected to one end of resistor R4 and the gate of transistor Q1. The other end of resistor R4 is connected to the other end of switch S1. The drain of transistor Q1 is connected to the positive terminal of diode D6, the other end of fan FA1, the other end of fan FAN2, the other end of resistor R7, and the other end of connector TE.

[0033] When charging, LED red lights D1, D2, D3 and D4 light up; when fully charged, LED blue lights D1, D2, D3 and D4 light up.

[0034] Press the left switch S2, and the 10mm through-hole LEDs D1, D2, D3 and D4 will light up. Press it again and the LEDs D1, D2, D3 and D4 will turn off.

[0035] Pressing switch S1 at the back activates fans FAN1 and FAN2 at half speed, with the thermoelectric cooler fully on. Pressing it again activates fans FAN1 and FAN2 at full speed, with the thermoelectric cooler partially on. Pressing it again deactivates the thermoelectric cooler completely. Switch S2 on the left controls the F8 LED's on / off state. Switch S1 on the right controls both the motor and the thermoelectric cooler's slow / fast and off states. A red light indicates charging, and a blue light indicates a full charge. The charging current is approximately 1A. The first socket on the left is for an external power source, such as the battery compartment; the second socket is empty. The third socket connects to the lithium battery, and the fourth and fifth sockets connect to the fan motor.

[0036] The control module is located inside or outside the helmet in an easily accessible position. It is responsible for regulating the working status of the thermoelectric cooler, including cooling power and working time.

[0037] It should be noted that the design of the air inlet and outlet must take into account the smoothness and uniformity of airflow to ensure that the cooling effect inside the helmet is evenly distributed.

[0038] The selection of a fan needs to consider factors such as airflow, air speed, and noise level to ensure sufficient cooling while maintaining a low noise level. The fan drive is controlled by a control module that can automatically adjust the speed according to the internal temperature of the helmet.

[0039] Thermally conductive material is used to fill the space between the semiconductor cooling chip and the heat sink.

[0040] Heat sinks are used to dissipate heat generated during the cooling process into the air. In practice, the surface of the heat sink can be designed with fins to increase the heat dissipation area and accelerate air convection. It should be noted that the heat sink design needs to have a large heat dissipation area and good thermal conductivity to improve heat dissipation efficiency.

[0041] The partition is used to separate refrigerated and non-refrigerated areas to prevent heat loss. It should be noted that the partition design must ensure unimpeded airflow while minimizing heat leakage.

[0042] In practice, the partition is filled with phase change materials such as paraffin wax and hydrated salts. The latent heat absorption properties of these materials are utilized to improve the helmet's internal heat capacity and cooling effect. When the internal temperature of the helmet rises, the phase change material absorbs heat and undergoes a phase change, thus slowing down the rate of temperature increase; when the internal temperature of the helmet decreases, the phase change material releases heat and returns to a solid state, preparing for the next cooling process.

[0043] A heat pipe is installed between the heat sink and the thermoelectric cooler. One end of the heat pipe is connected to the heating surface of the thermoelectric cooler, and the other end is connected to the heat sink. The phase change heat transfer characteristics of the working fluid inside the heat pipe are utilized to improve heat conduction efficiency. When the thermoelectric cooler generates heat, the heat is rapidly transferred to the heat sink through the heat pipe and dissipated into the air. The heat pipe has advantages such as high thermal conductivity, low thermal resistance, and good temperature uniformity, which can significantly improve the heat dissipation efficiency of the thermoelectric cooler helmet.

[0044] An active cooling fan is installed on the outside of the heatsink to improve its heat dissipation efficiency. The active cooling fan increases airflow speed, accelerating the convective heat transfer process on the heatsink surface, thereby reducing the heatsink temperature. The speed of the active cooling fan can be automatically adjusted according to the heatsink temperature to achieve energy-saving effects.

[0045] The interior of the casing incorporates multiple layers of insulation material to minimize cold air leakage and heat transfer. The selection of insulation materials must consider factors such as their thermal conductivity, density, and thickness to ensure maximum insulation effectiveness. The design of the multi-layer insulation material must allow for smooth airflow while minimizing cold air leakage and heat transfer.

[0046] The air inlet features a waterproof and dustproof structure to prevent moisture and dust from entering the helmet and affecting cooling efficiency and electrical safety. It should be noted that the waterproof and dustproof design must consider factors such as the helmet's operating environment and ease of maintenance to ensure long-term stable operation.

[0047] The air vent is equipped with a waterproof and dustproof structure to prevent moisture and dust from entering the helmet and affecting its cooling effect and electrical safety. The waterproof and dustproof design takes into account factors such as the helmet's operating environment and ease of maintenance to ensure the helmet's long-term stable operation.

[0048] In practical implementation, the ergonomic design can be optimized to improve the wearing comfort and stability of the semiconductor-cooled helmet. By adjusting parameters such as the helmet's shape, size, and weight, the helmet can better conform to the curves of the human head; adding accessories such as headbands and earmuffs can improve the helmet's wearing stability and comfort. Optimized ergonomic design can improve the wearer's work efficiency and user experience.

[0049] In practical implementation, a modular design approach can be adopted, breaking down this novel semiconductor cooling helmet into multiple independent modules, such as a cooling module, a heat dissipation module, and a control module, to facilitate maintenance and upgrades. Modular design can reduce production and maintenance costs, and improve the product's maintainability and scalability.

[0050] Figure 2 This is a schematic diagram showing the semiconductor arrangement in the semiconductor cooling chip of the semiconductor cooling helmet of this utility model. For example... Figure 2As shown, the thermoelectric cooler is composed of alternating N-type and P-type semiconductors. When a DC power supply is turned on, the direction of the current is determined. Under the influence of the current, free electrons in the N-type semiconductor and holes in the P-type semiconductor undergo directional movement.

[0051] At one end of the cooling element, the movement of electrons and holes absorbs heat; this end is the cold end, used to lower the internal temperature of the helmet and provide a cool experience for the user. At the other end, the movement of electrons and holes releases heat; this end is the hot end, requiring a heat dissipation device to dissipate the heat and ensure the cooling effect.

[0052] The ceramic sheet serves as both insulation and thermal conductivity, ensuring circuit safety while effectively transferring heat. The metal conductor connects the N-type and P-type semiconductors and the DC power supply, ensuring smooth current flow.

[0053] Through this ingenious semiconductor arrangement and current control, the semiconductor cooling helmet achieves a cooling function, providing a comfortable temperature environment for the user's head in hot conditions, and has the advantages of high efficiency, environmental protection, and no noise.

[0054] Figure 3 This is a schematic diagram illustrating the working principle of the semiconductor cooling chip in the semiconductor cooling helmet of this utility model. (See diagram for example.) Figure 3 As shown, in a closed circuit composed of two different metal wires, the first metal wire 1 and the second metal wire 2, after the power is turned on, the heat at point A is moved to point B, causing the temperature at point A to decrease and the temperature at point B to increase.

[0055] In practical implementation, the air supply process of this semiconductor cooling helmet can be achieved by setting up a dedicated channel that is directly connected to the semiconductor cooling chip through the air outlet. The fan blows air, and the cooled air is then distributed through the air duct surrounding the helmet, which results in a smaller space and better cooling effect.

[0056] The working principle of this novel semiconductor cooling helmet is as follows:

[0057] Based on the thermoelectric effect of semiconductor materials, when an electric current passes through a semiconductor cooling chip, one side of the chip absorbs heat and cools down, while the other side releases heat and heats up. The cooling side is connected to the inside of the helmet, transferring the cooling energy to the air inside the helmet; the heating side dissipates the heat into the air through heat sinks.

[0058] A fan draws outside air into the helmet through the inlet. As the air flows through the helmet, it is cooled by the thermoelectric cooler, creating cool air. This cool air is then distributed to other parts of the helmet's interior via air ducts on either side of the cooler, achieving localized cooling. The control module adjusts the power output of the thermoelectric cooler and the fan speed based on real-time temperature signals monitored by a temperature sensor to maintain a constant temperature inside the helmet.

[0059] The beneficial effects of this utility model, through the design of the above embodiments, are as follows:

[0060] In terms of cooling effect, the semiconductor cooling chip uses the thermoelectric effect to achieve efficient cooling. One side of it is connected to the inside of the helmet, which can quickly reduce the temperature inside the helmet and create a cool and comfortable environment for the wearer. It is especially suitable for high-temperature work or outdoor activities in hot weather.

[0061] With excellent heat dissipation performance, the hot end of the semiconductor cooling chip is connected to the heat sink outside the helmet through heat conduction. The heat sink can effectively dissipate heat, ensuring that the cooling chip works continuously and stably, and avoiding the cooling effect being affected by overheating.

[0062] The helmet's internal air circulation system is well-designed, with a fan located in the center of the helmet. It draws in outside air through the air inlet and circulates the air inside the helmet. The air outlets are distributed on both sides of the air duct, which can accurately blow the cooled air to the wearer's head, further enhancing the cooling experience.

[0063] The partition design is very thoughtful. It can effectively isolate the cooling area from the non-cooling area, prevent cold air from leaking out, improve cooling efficiency, and make more rational use of the internal space of the helmet. Moreover, the components are connected by electrical connections and fasteners, making the structure stable and easy to install and maintain.

[0064] While improving wearing comfort, it also provides strong protection for working in special environments.

[0065] This utility model has been described based on specific embodiments, but those skilled in the art will understand that various changes and equivalent substitutions can be made without departing from the scope of this utility model. Furthermore, to adapt to specific applications of this utility model, numerous modifications can be made without departing from its protection scope. Therefore, this utility model is not limited to the specific embodiments disclosed herein, but includes all embodiments falling within the protection scope of the claims.

Claims

1. A semiconductor cooling helmet, characterized in that, include: The helmet comprises a shell, a thermoelectric cooler, a heat sink, a control module, a fan, an air inlet, a partition, an air duct, and an air outlet. The thermoelectric cooler is located at the top of the helmet near the back of the head and utilizes the thermoelectric effect of semiconductor materials to achieve cooling. One side of the cooler is connected to the interior of the helmet, and the other side is connected to the heat sink via heat conduction. The heat sink is located on the exterior of the helmet and connected to the hot end of the thermoelectric cooler. The control module is located inside or outside the helmet and is used to regulate the working state of the thermoelectric cooler. The fan is located in the center of the helmet and is used to draw outside air into the helmet through the air inlet and circulate the air inside the helmet. The air inlet is located at the top of the helmet and is used to introduce outside air. The air outlets are distributed on both sides of the air duct inside the helmet and are used to blow the cooled air towards the wearer's head. The partition is located inside the helmet and is used to isolate the cooled area from the non-cooled area. The thermoelectric cooler, the heat sink, the control module, and the fan are electrically connected, and the shell and the heat sink are connected by fasteners.

2. The semiconductor cooling helmet according to claim 1, characterized in that, The control module includes: pin 1 of linear charging management chip IC1 is connected to one end of resistor R1 and pin 3 of linear charging management chip IC1 respectively; pin 2 of linear charging management chip IC1 is connected to one end of resistor R1; pin 4 of linear charging management chip IC1 is connected to pin 2 of connection terminal CN1, pin 8 of linear charging management chip IC1, one end of capacitor C1, the positive terminal of LED D4, the positive terminal of LED D3, the positive terminal of LED D2, and the positive terminal of LED D1 respectively; the other end of capacitor C1 is connected to pin 1 of connection terminal CN1, the negative terminal of battery BT2, the negative terminal of battery BT1, the negative terminal of LED D5, one end of resistor R9, the source of transistor Q2, one end of resistor R6, and the source of transistor Q1 and grounded; the positive terminal of battery BT2 is connected to the positive terminal of diode D7; the negative terminal of diode D7 is connected to the positive terminal of battery BT1, one end of switch S2, and one end of switch S1 respectively. The following connections are made: pin 5 of linear charging management chip IC1, the negative terminal of diode D6, one end of fan FA1, one end of fan FAN2, and one end of connector TE; pin 6 of linear charging management chip IC1 is connected to one end of resistor R3; pin 7 of linear charging management chip IC1 is connected to one end of resistor R2; the negative terminal of LED D1 is connected to the negative terminal of LED D2 and the other end of resistor R3; the other end of resistor R9 is connected to one end of resistor R5 and the gate of transistor Q2; the other end of resistor R5 is connected to the other end of switch S1; the drain of transistor Q2 is connected to one end of resistor R7; the other end of resistor R6 is connected to one end of resistor R4 and the gate of transistor Q1; the other end of resistor R4 is connected to the other end of switch S1; and the drain of transistor Q1 is connected to the positive terminal of diode D6, the other end of fan FA1, the other end of fan FAN2, the other end of resistor R7, and the other end of connector TE.

3. The semiconductor cooling helmet according to claim 1, characterized in that, The space between the semiconductor cooling chip and the heat sink is filled with a thermally conductive material.

4. The semiconductor cooling helmet according to claim 1, characterized in that, The surface of the heat sink is designed with a fin structure.

5. The semiconductor cooling helmet according to claim 1, characterized in that, The partition is filled with a phase change material.

6. The semiconductor cooling helmet according to claim 1, characterized in that, A heat pipe is provided between the heat sink and the semiconductor cooling chip. One end of the heat pipe is connected to the heating surface of the semiconductor cooling chip, and the other end of the heat pipe is connected to the heat sink.

7. The semiconductor cooling helmet according to claim 1, characterized in that, An active cooling fan is provided on the outside of the heat sink.

8. The semiconductor cooling helmet according to claim 1, characterized in that, The shell is equipped with multiple layers of heat insulation material.

9. The semiconductor cooling helmet according to any one of claims 1 to 8, characterized in that, The air inlet is equipped with a waterproof and dustproof structure.

10. The semiconductor cooling helmet according to claim 9, characterized in that, The air outlet is equipped with a waterproof and dustproof structure.

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