Flexible printed circuit board anti-suction electric testing fixture

Abstract

The utility model relates to flexible printed circuit board test fixture technical field, especially in kind of flexible printed circuit board anti -adsorption electric measuring fixture, through installing retractable anti -adsorption subassembly on the upper die mechanism, when the upper die mechanism rises at the end of test, anti -adsorption subassembly can always keep the slight pressure to the flexible printed circuit board with the retractable characteristic, and the flexible printed circuit board is stably pressed on the lower die mechanism, can effectively prevent the flexible printed circuit board from being adsorbed by the upper die mechanism, to avoid the position of flexible printed circuit board from deviating, thereby improved test accuracy, and the flexible printed circuit board in traditional fixture can also avoid the equipment alarm shutdown caused by displacement with the upper die mechanism, significantly improve equipment utilization, reduce the production interruption loss caused by shutdown, also avoid the product scrappage caused by wrinkle, warping when separating after being adsorbed.

Description

Technical Field

[0001] This utility model relates to the field of flexible printed circuit board testing fixtures, and in particular to a flexible printed circuit board anti-adsorption electrical testing fixture. Background Technology

[0002] Flexible printed circuit boards (PCBs) are widely used in consumer electronics, automotive electronics and other fields due to their thinness and flexibility. Electrical testing is a key process in the production of flexible PCBs to ensure their electrical performance is up to standard. This process is completed using a special testing fixture. The lower mold of the fixture carries the flexible PCB, and the upper mold descends to fit with the lower mold to perform the test. After the test is completed, the upper mold rises to reset.

[0003] Because flexible printed circuit boards are typically only 0.1mm-0.3mm thick and lightweight, and are easily affected by factors such as static electricity and air pressure differences during testing, when the upper mold rises, the flexible printed circuit board is easily attracted by the upper mold and lifted up with it, causing the position of the flexible printed circuit board to shift, which in turn affects the positioning accuracy of subsequent processes. Although there are currently improved solutions such as adding air blowing devices or plasma antistatic devices, the anti-adsorption effect is limited, and it is also easy to cause secondary displacement of the flexible printed circuit board and increase equipment costs. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a flexible printed circuit board anti-adsorption electrical testing fixture, which can effectively prevent the flexible printed circuit board from being adsorbed by the upper mold mechanism when the upper mold mechanism rises, so as to avoid the position of the flexible printed circuit board from shifting, thereby improving the testing accuracy.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: A flexible printed circuit board anti-adsorption electrical testing fixture includes an upper mold mechanism and a lower mold mechanism that cooperate with each other. The lower mold mechanism is used to support the flexible printed circuit board, and the flexible printed circuit board is located between the upper mold mechanism and the lower mold mechanism. A retractable anti-adsorption component is installed on the upper mold mechanism. The anti-adsorption component is used to maintain pressure on the flexible printed circuit board as the upper mold mechanism rises until it separates from the upper mold mechanism.

[0006] Furthermore, the anti-adsorption component includes a pressure rod, a spring, and a sleeve, one end of which passes through the pressing end of the upper mold mechanism and is fixedly connected to the pressing end of the upper mold mechanism. The spring is sleeved outside the pressure rod, the sleeve is sleeved outside the spring, one end of the pressure rod passes through the sleeve and extends to the outside of one end of the sleeve, and the pressure rod and the sleeve are slidably connected.

[0007] Furthermore, an elastic head is installed at one end of the pressure rod.

[0008] Furthermore, the elastic head is made of polyetheretherketone (PEEK), and the pressure rod is made of stainless steel.

[0009] Furthermore, the anti-adsorption component also includes a buckle, with one end of the pressure rod extending to the outside of the opposite end of one end of the sleeve, and the outer wall of the opposite end of the pressure rod having multiple slots that cooperate with the buckle.

[0010] Furthermore, there are multiple anti-adsorption components, and these multiple anti-adsorption components are distributed along the edge of the flexible printed circuit board.

[0011] Furthermore, there are multiple anti-adsorption components, and these multiple anti-adsorption components are distributed along the non-electrical testing area of ​​the flexible printed circuit board.

[0012] Furthermore, the upper mold mechanism includes an upper mold base, a first support column, and an upper mold panel. The first support column is located between the upper mold base and the upper mold panel and is connected to both the upper mold base and the upper mold panel. The anti-adsorption component is installed on the upper mold panel.

[0013] Furthermore, the lower mold mechanism includes a lower mold base, a second support column, and a lower mold pin plate. The second support column is located between the lower mold base and the lower mold pin plate and is connected to the lower mold base and the lower mold pin plate respectively. The lower mold pin plate is used to support the flexible printed circuit board.

[0014] Furthermore, the lower die pin plate is provided with a plurality of positioning pins, which are used to pre-position the flexible printed circuit board and support the flexible printed circuit board.

[0015] The beneficial effects of this utility model are as follows: This solution utilizes a retractable anti-adsorption component installed on the upper mold mechanism. At the end of the test, as the upper mold mechanism rises, the anti-adsorption component, due to its retractable nature, maintains a slight pressure on the flexible printed circuit board (PCB) to stably press it onto the lower mold mechanism. This effectively prevents the PCB from being adsorbed by the upper mold mechanism, thus avoiding displacement of the PCB and improving test accuracy. Furthermore, this solution avoids equipment alarms and shutdowns caused by the PCB shifting with the upper mold mechanism in traditional fixtures, significantly improving equipment uptime and reducing production interruptions. It also avoids product scrap caused by wrinkles and warping due to pulling when the PCB separates after adsorption, physically protecting the structural integrity of the PCB, reducing the risk of scrap due to material adsorption, and indirectly reducing production costs. The flexible printed circuit board anti-adsorption electrical testing fixture designed in this solution does not rely on complex air blowing devices or plasma static elimination devices. It only requires the addition of a retractable anti-adsorption component to the upper mold mechanism. It does not require significant modifications to the original power system and test circuit of the fixture, resulting in low modification costs. The component structure is also simple. Subsequent maintenance does not require professional personnel to debug complex devices, reducing maintenance difficulty and costs. It also avoids the problem of secondary displacement of the flexible printed circuit board that may be caused by additional devices. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the flexible printed circuit board anti-adsorption electrical testing fixture of this utility model; Figure 2 This is a schematic diagram of the anti-adsorption component of the flexible printed circuit board anti-adsorption electrical testing fixture of this utility model. Figure 3 This is a cross-sectional view of the anti-adsorption component of the flexible printed circuit board anti-adsorption electrical testing fixture of this utility model. Figure 4 This is a schematic diagram of the pressure bar of the flexible printed circuit board anti-adsorption electrical testing fixture of this utility model. Figure 5 This is a top view of the lower mold mechanism, flexible printed circuit board, and anti-adsorption component of the flexible printed circuit board anti-adsorption electrical testing fixture of this utility model. Label Explanation: 1. Upper mold mechanism; 11. Upper mold base; 12. First support column; 13. Upper mold panel; 2. Lower mold mechanism; 21. Lower mold base; 22. Second support column; 23. Lower mold pin plate; 24. Positioning pin; 3. Flexible printed circuit boards; 4. Anti-adsorption component; 41. Pressure rod; 411. Slot; 42. Spring; 43. Sleeve; 44. Elastic head; 45. Buckle. Detailed Implementation

[0017] To explain in detail the technical content, objectives, and effects of this utility model, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0018] Please refer to Figure 1 A flexible printed circuit board anti-adsorption electrical testing fixture includes an upper mold mechanism 1 and a lower mold mechanism 2 that cooperate with each other. The lower mold mechanism 2 is used to support the flexible printed circuit board 3. The flexible printed circuit board 3 is located between the upper mold mechanism 1 and the lower mold mechanism 2. A retractable anti-adsorption component 4 is installed on the upper mold mechanism 1. The anti-adsorption component 4 is used to maintain pressure on the flexible printed circuit board 3 when the upper mold mechanism 1 rises until it separates from the upper mold mechanism 1.

[0019] As can be seen from the above description, the beneficial effects of this utility model are as follows: This solution installs a retractable anti-adsorption component 4 on the upper mold mechanism 1. When the upper mold mechanism 1 rises after testing, the anti-adsorption component 4, due to its retractable nature, maintains a slight pressure on the flexible printed circuit board 3, stably pressing the flexible printed circuit board 3 onto the lower mold mechanism 2. This effectively prevents the flexible printed circuit board 3 from being adsorbed by the upper mold mechanism 1, thus avoiding positional displacement and improving testing accuracy. Furthermore, this solution avoids equipment alarms and shutdowns caused by the flexible printed circuit board 3 shifting with the upper mold mechanism 1 in traditional fixtures, significantly improving equipment uptime and reducing production interruption losses. It also avoids product scrap caused by wrinkles and warping due to pulling when the flexible printed circuit board 3 separates after adsorption, physically protecting the structural integrity of the flexible printed circuit board 3, reducing the risk of scrap due to material adsorption, and indirectly reducing production costs. The flexible printed circuit board 3 anti-adsorption electrical testing fixture designed in this scheme does not rely on complex air blowing devices or plasma static elimination devices. It only requires the addition of a retractable anti-adsorption component 4 to the upper mold mechanism 1. It does not require significant modifications to the original power system and test circuit of the fixture, resulting in low modification costs and a simple component structure. Subsequent maintenance does not require professional personnel to debug complex devices, reducing maintenance difficulty and costs. It also avoids the problem of secondary displacement of the flexible printed circuit board 3 that may be caused by additional devices.

[0020] For further details, please refer to Figures 2 to 4 The anti-adsorption component 4 includes a pressure rod 41, a spring 42 and a sleeve 43. One end of the sleeve 43 passes through the pressing end of the upper mold mechanism 1 and is fixedly connected to the pressing end of the upper mold mechanism 1. The spring 42 is sleeved outside the pressure rod 41, and the sleeve 43 is sleeved outside the spring 42. One end of the pressure rod 41 passes through the sleeve 43 and extends to the outside of one end of the sleeve 43, and the pressure rod 41 and the sleeve 43 are slidably connected.

[0021] As can be seen from the above description, the anti-adsorption component 4 is composed of a pressure rod 41, a spring 42, and a sleeve 43. It has a simple structure and is easy to assemble. The spring 42 provides automatic extension and retraction power, and the sleeve 43 protects and guides the spring 42 and the pressure rod 41, ensuring the stable operation of the anti-adsorption component 4, reducing the probability of failure, and ensuring continuous operation of the equipment.

[0022] For further details, please refer to Figures 2 to 4 One end of the pressure rod 41 is equipped with an elastic head 44.

[0023] As can be seen from the above description, installing an elastic head 44 at one end of the pressure rod 41 can buffer the pressure of the pressure rod 41 on the flexible printed circuit board 3, avoid damaging the surface of the flexible printed circuit board 3, reduce the risk of product scrap, and at the same time enhance the contact and adhesion between the pressure rod 41 and the flexible printed circuit board 3, further optimize the anti-adsorption effect, and indirectly reduce the possibility of equipment downtime.

[0024] For further details, please refer to Figure 4 The elastic head 44 is made of polyetheretherketone, and the pressure rod 41 is made of stainless steel.

[0025] As can be seen from the above description, the elastic head 44 is made of polyetheretherketone (PEEK), which is insulating and wear-resistant. It can prevent scratching the surface of the flexible printed circuit board 3 or interfering with electrical testing, thus ensuring the accuracy of testing and product quality. The pressure rod 41 is made of stainless steel, which is high in strength and rust-resistant. It can extend the service life of the anti-adsorption component 4 and reduce maintenance downtime.

[0026] For further details, please refer to Figure 2 and Figure 3 The anti-adsorption component 4 also includes a buckle 45. One end of the pressure rod 41 extends to the outside of the other end of the sleeve 43. The outer wall of the other end of the pressure rod 41 is provided with a plurality of slots 411 that cooperate with the buckle 45.

[0027] As can be seen from the above description, by cooperating with the buckle 45 and the multiple slots 411 on the pressure rod 41, the length of the pressure rod 41 extending out of the sleeve 43 can be flexibly adjusted, the overall height of the anti-adsorption component 4 can be changed, and it can be adapted to flexible printed circuit boards 3 of different thicknesses (such as 0.1mm, 0.2mm, 0.3mm and other conventional thicknesses). It eliminates the need for frequent fixture changes, reduces equipment downtime caused by fixture switching, and improves production continuity.

[0028] For further details, please refer to Figure 5 The number of anti-adsorption components 4 is multiple, and the multiple anti-adsorption components 4 are distributed along the edge of the flexible printed circuit board 3.

[0029] As can be seen from the above description, multiple anti-adsorption components 4 are distributed along the edge of the flexible printed circuit board 3, which can be uniformly pressed from multiple points on the edge of the flexible printed circuit board 3, avoiding the flexible printed circuit board 3 from being lifted and adsorbed by the upper mold mechanism 1 due to insufficient local force on the edge, further reducing the risk of equipment downtime, ensuring the stability of the anti-adsorption effect, and is especially suitable for testing scenarios of large-size flexible printed circuit boards 3.

[0030] Furthermore, there are multiple anti-adsorption components 4, and the multiple anti-adsorption components 4 are distributed along the non-electrical testing area of ​​the flexible printed circuit board 3.

[0031] As can be seen from the above description, multiple anti-adsorption components 4 are distributed along the non-electrical testing area of ​​the flexible printed circuit board 3. While achieving the anti-adsorption function, they completely avoid the probe contact area of ​​the flexible printed circuit board 3, avoid abnormal test signals caused by component obstruction or interference, ensure test accuracy, reduce rework and downtime caused by test errors, and ensure the accuracy of test results.

[0032] For further details, please refer to Figure 1 The upper mold mechanism 1 includes an upper mold base 11, a first support column 12 and an upper mold panel 13. The first support column 12 is located between the upper mold base 11 and the upper mold panel 13 and is connected to the upper mold base 11 and the upper mold panel 13 respectively. The anti-adsorption component 4 is installed on the upper mold panel 13.

[0033] As can be seen from the above description, the upper mold mechanism 1 adopts a combination structure of upper mold base 11, first support column 12 and upper mold panel 13, which provides stable and firm support and can provide a stable installation foundation for the anti-adsorption component 4, avoiding component alignment deviation caused by the shaking of the upper mold mechanism 1 during the test; the anti-adsorption component 4 is installed on the upper mold panel 13, which makes it easy to adjust the position of the component according to the size of the flexible printed circuit board 3, and at the same time facilitates the installation, disassembly and maintenance of the component, shortens maintenance time and reduces equipment downtime.

[0034] For further details, please refer to Figure 1 The lower mold mechanism 2 includes a lower mold base 21, a second support column 22 and a lower mold pin plate 23. The second support column 22 is located between the lower mold base 21 and the lower mold pin plate 23 and is connected to the lower mold base 21 and the lower mold pin plate 23 respectively. The lower mold pin plate 23 is used to support the flexible printed circuit board 3.

[0035] As can be seen from the above description, the lower mold mechanism 2 consists of a lower mold base 21, a second support column 22, and a lower mold pin plate 23. It can stably support the flexible printed circuit board 3 and provide a reliable support foundation for the pressing effect of the anti-adsorption component 4. The lower mold pin plate 23 can be designed to fit the size and shape of the flexible printed circuit board 3 (such as opening clearance grooves and adjusting the bearing area), which can improve the placement stability of the flexible printed circuit board 3 and reduce adsorption shutdown problems caused by unstable placement of the flexible printed circuit board 3.

[0036] For further details, please refer to Figure 1 The lower die plate 23 is provided with a plurality of positioning pins 24, which are used to pre-position the flexible printed circuit board 3 and support the flexible printed circuit board 3.

[0037] As can be seen from the above description, the positioning pins 24 on the lower mold pin plate 23 can pre-position the flexible printed circuit board 3 to ensure that the flexible printed circuit board 3 is in the accurate position before testing, and avoid the deviation of the pressing point of the anti-adsorption component 4 due to the initial position offset of the flexible printed circuit board 3; at the same time, the positioning pins 24 assist in supporting the flexible printed circuit board 3, further enhancing the fit between the flexible printed circuit board 3 and the lower mold, reducing the probability of the flexible printed circuit board 3 being adsorbed by the upper mold mechanism 1, reducing equipment downtime, and ensuring production efficiency.

[0038] Please refer to Figures 1 to 5 As shown, Embodiment 1 of this utility model is as follows: Please refer to Figure 1 A flexible printed circuit board anti-adsorption electrical testing fixture includes an upper mold mechanism 1 and a lower mold mechanism 2 that cooperate with each other. The lower mold mechanism 2 is used to support the flexible printed circuit board 3. The flexible printed circuit board 3 is located between the upper mold mechanism 1 and the lower mold mechanism 2. A retractable anti-adsorption component 4 is installed on the upper mold mechanism 1. The anti-adsorption component 4 is used to maintain pressure on the flexible printed circuit board 3 when the upper mold mechanism 1 rises until it separates from the upper mold mechanism 1.

[0039] The flexible printed circuit board anti-adsorption electrical testing fixture designed in this scheme is used in conjunction with a testing machine, and the upper mold mechanism 1 is raised and lowered by the cylinder of the testing machine.

[0040] Please refer to Figures 2 to 4 The anti-adsorption component 4 includes a pressure rod 41, a spring 42 and a sleeve 43. One end of the sleeve 43 passes through the pressing end of the upper mold mechanism 1 and is fixedly connected to the pressing end of the upper mold mechanism 1. The spring 42 is sleeved outside the pressure rod 41, and the sleeve 43 is sleeved outside the spring 42. One end of the pressure rod 41 passes through the sleeve 43 and extends to the outside of one end of the sleeve 43, and the pressure rod 41 and the sleeve 43 are slidably connected.

[0041] The diameter of the pressure rod 41 is 3.2mm-6mm, and it protrudes 3mm-5mm from the surface of the fixture (the side facing the lower mold mechanism 2).

[0042] Please refer to Figures 2 to 4 One end of the pressure rod 41 is equipped with an elastic head 44.

[0043] Please refer to Figure 4 The elastic head 44 is made of polyetheretherketone, and the pressure rod 41 is made of stainless steel.

[0044] Please refer to Figure 2 and Figure 3 The anti-adsorption component 4 also includes a buckle 45. One end of the pressure rod 41 extends to the outside of the other end of the sleeve 43. The outer wall of the other end of the pressure rod 41 is provided with a plurality of slots 411 that cooperate with the buckle 45.

[0045] Please refer to Figure 5 The number of anti-adsorption components 4 is multiple, and the multiple anti-adsorption components 4 are distributed along the edge of the flexible printed circuit board 3.

[0046] The number of anti-adsorption components 4 is multiple, and the multiple anti-adsorption components 4 are distributed along the non-electrical test area of ​​the flexible printed circuit board 3.

[0047] Please refer to Figure 1 The upper mold mechanism 1 includes an upper mold base 11, a first support column 12 and an upper mold panel 13. The first support column 12 is located between the upper mold base 11 and the upper mold panel 13 and is connected to the upper mold base 11 and the upper mold panel 13 respectively. The anti-adsorption component 4 is installed on the upper mold panel 13.

[0048] The lower mold mechanism 2 includes a lower mold base 21, a second support column 22 and a lower mold pin plate 23. The second support column 22 is located between the lower mold base 21 and the lower mold pin plate 23 and is connected to the lower mold base 21 and the lower mold pin plate 23 respectively. The lower mold pin plate 23 is used to support the flexible printed circuit board 3.

[0049] The lower die needle plate 23 is provided with a plurality of positioning pins 24, which are used to pre-position the flexible printed circuit board 3 and support the flexible printed circuit board 3.

[0050] The working principle of the aforementioned flexible printed circuit board anti-adsorption electrical testing fixture is as follows: Before testing, the flexible printed circuit board 3 is placed on the lower mold pin plate 23 of the lower mold mechanism 2. The positioning pins 24 on the lower mold pin plate 23 pre-position and support the flexible printed circuit board 3 to ensure that the initial position of the flexible printed circuit board 3 is accurate, laying the foundation for subsequent anti-adsorption and testing, and reducing the risk of adsorption caused by the position deviation of the flexible printed circuit board 3.

[0051] During the testing phase, the upper mold panel 13 of the upper mold mechanism 1 drives the anti-adsorption component 4 to descend synchronously. When the upper mold mechanism 1 descends to the test position and fits with the lower mold mechanism 2, the pressure rod 41 of the anti-adsorption component 4 contacts the surface of the flexible printed circuit board 3. As the upper mold mechanism 1 continues to press down, the pressure rod 41 is retracted into the sleeve 43 by the reaction force of the flexible printed circuit board 3, and the spring 42 is compressed. At this time, the upper mold mechanism 1 and the lower mold mechanism 2 fit together, and the probe contacts the flexible printed circuit board 3, completing the electrical performance test of the flexible printed circuit board 3.

[0052] After the test, the upper mold mechanism 1 begins to rise, and the compressed spring 42 releases its elastic force to push the pressure rod 41 to gradually return to its original position, so that the upper mold mechanism 1 separates from the flexible printed circuit board 3 before the anti-adsorption component 4. During the separation process, the pressure rod 41 always maintains a slight pressure on the flexible printed circuit board 3, firmly pressing the flexible printed circuit board 3 onto the lower mold pin plate 23, effectively preventing the flexible printed circuit board 3 from being adsorbed and lifted by the upper mold mechanism 1, and preventing the position of the flexible printed circuit board 3 from shifting. This not only improves the test accuracy, but also fundamentally reduces equipment downtime.

[0053] When the upper mold mechanism 1 rises to the preset height, the pressure rod 41 is fully reset, the anti-adsorption component 4 is completely separated from the flexible printed circuit board 3, and the flexible printed circuit board 3 remains stably on the lower mold pin plate 23 without any deviation or wrinkles. It can directly enter the next flexible printed circuit board 3 testing process, ensuring continuous production and improving production efficiency.

[0054] In summary, the flexible printed circuit board (PCB) anti-adsorption electrical testing fixture provided by this utility model, by installing a retractable anti-adsorption component on the upper mold mechanism, maintains a slight pressure on the PCB due to its retractable nature when the upper mold mechanism rises after testing. This stably presses the PCB onto the lower mold mechanism, effectively preventing the PCB from being adsorbed by the upper mold mechanism and thus avoiding displacement of the PCB, thereby improving testing accuracy. Furthermore, this also avoids equipment alarms and shutdowns caused by the PCB shifting with the upper mold mechanism in traditional fixtures, significantly improving equipment uptime and reducing production interruption losses. It also avoids product scrap caused by wrinkles and warping due to pulling when the PCB separates after adsorption, physically protecting the structural integrity of the PCB, reducing the risk of scrap due to material adsorption, and indirectly reducing production costs. The flexible printed circuit board anti-adsorption electrical testing fixture designed in this solution does not rely on complex air blowing devices or plasma static elimination devices. It only requires the addition of a retractable anti-adsorption component to the upper mold mechanism. It does not require significant modifications to the original power system and test circuit of the fixture, resulting in low modification costs. The component structure is also simple. Subsequent maintenance does not require professional personnel to debug complex devices, reducing maintenance difficulty and costs. It also avoids the problem of secondary displacement of the flexible printed circuit board that may be caused by additional devices.

[0055] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent modifications made based on the content of this utility model specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A flexible printed circuit board anti-adsorption electrical testing fixture, characterized in that, It includes an upper mold mechanism and a lower mold mechanism that cooperate with each other. The lower mold mechanism is used to support a flexible printed circuit board. The flexible printed circuit board is located between the upper mold mechanism and the lower mold mechanism. A retractable anti-adhesion component is installed on the upper mold mechanism. The anti-adsorption component is used to maintain pressure on the flexible printed circuit board as the upper mold mechanism rises until it separates from the upper mold mechanism.

2. The flexible printed circuit board anti-adsorption electrical testing fixture according to claim 1, characterized in that, The anti-adsorption component includes a pressure rod, a spring, and a sleeve. One end of the sleeve passes through the pressing end of the upper mold mechanism and is fixedly connected to the pressing end of the upper mold mechanism. The spring is sleeved outside the pressure rod, the sleeve is sleeved outside the spring, one end of the pressure rod passes through the sleeve and extends to the outside of one end of the sleeve, and the pressure rod and the sleeve are slidably connected.

3. The flexible printed circuit board anti-adsorption electrical testing fixture according to claim 2, characterized in that, One end of the pressure rod is equipped with an elastic head.

4. The flexible printed circuit board anti-adsorption electrical testing fixture according to claim 3, characterized in that, The elastic head is made of polyetheretherketone (PEEK), and the pressure rod is made of stainless steel.

5. The flexible printed circuit board anti-adsorption electrical testing fixture according to claim 2, characterized in that, The anti-adsorption component also includes a buckle, with one end of the pressure rod extending to the outside of the opposite end of one end of the sleeve, and the outer wall of the opposite end of the pressure rod having multiple slots that cooperate with the buckle.

6. The flexible printed circuit board anti-adsorption electrical testing fixture according to claim 1, characterized in that, The number of anti-adsorption components is multiple, and the multiple anti-adsorption components are distributed along the edge of the flexible printed circuit board.

7. The flexible printed circuit board anti-adsorption electrical testing fixture according to claim 1, characterized in that, The number of anti-adsorption components is multiple, and the multiple anti-adsorption components are distributed along the non-electrical testing area of ​​the flexible printed circuit board.

8. The flexible printed circuit board anti-adsorption electrical testing fixture according to claim 1, characterized in that, The upper mold mechanism includes an upper mold base, a first support column, and an upper mold panel. The first support column is located between the upper mold base and the upper mold panel and is connected to both the upper mold base and the upper mold panel. The anti-adsorption component is installed on the upper mold panel.

9. The flexible printed circuit board anti-adsorption electrical testing fixture according to claim 1, characterized in that, The lower mold mechanism includes a lower mold base, a second support column, and a lower mold pin plate. The second support column is located between the lower mold base and the lower mold pin plate and is connected to the lower mold base and the lower mold pin plate respectively. The lower mold pin plate is used to support the flexible printed circuit board.

10. The flexible printed circuit board anti-adsorption electrical testing fixture according to claim 9, characterized in that, The lower die plate is provided with multiple positioning pins, which are used to pre-position the flexible printed circuit board and support the flexible printed circuit board.

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