Laser cutting apparatus

Abstract

This utility model discloses a laser cutting device, relating to the field of automated processing technology. The laser cutting device includes a working platform, a feeding device, multiple transport devices, a transfer device, and a cutting device. The feeding device is located on the working platform and forms a feeding channel with a transport tray. Multiple transport devices are all located on the working platform and arranged sequentially along a first direction. Each transport device forms a transport channel extending along a second direction, and the transport device is used to carry the tray along the transport channel. The transfer device is located on the working platform and is used to transfer the tray from the feeding channel to another transport channel and to retrieve a tray from another transport channel. The cutting device is located on the working platform and is used to cut the material in the tray of any transport channel. The first direction and the second direction are arranged at an angle. The technical solution provided by this utility model aims to reduce waiting time during the cutting process to improve production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of automated processing technology, and in particular to a laser cutting device. Background Technology

[0002] Laser cutting technology is commonly used in the manufacturing of circuit boards. A laser beam is focused onto the surface of the circuit board and cuts along a pre-defined path to create a predetermined shape. Laser cutting technology not only offers high precision but also avoids mechanical damage.

[0003] In existing laser cutting equipment, multiple circuit boards are neatly loaded onto a tray. The tray is transported to the loading area by a feeding device, and then the transfer device transfers the tray to the cutting area. The cutting device cuts the circuit boards in the tray. After the cutting is completed, the transfer device transfers the tray from the cutting area to the inspection area. The inspection device performs visual inspection on the circuit boards to ensure the accuracy of the cut edges.

[0004] However, when the circuit board in the current tray is being cut, the subsequent tray can only wait in the loading area. The tray in the loading area can only enter the cutting area after the current tray has left the cutting area. During the process of the tray in the loading area entering the cutting area, the cutting device is idle, which increases the waiting time in the cutting process and reduces production efficiency. Utility Model Content

[0005] The main purpose of this invention is to provide a laser cutting device that aims to reduce waiting time during the cutting process and improve production efficiency.

[0006] To achieve the above objectives, this utility model proposes a laser cutting device, which includes:

[0007] Work platform;

[0008] A feeding device is provided on the working platform and forms a feeding channel with a transport tray;

[0009] Multiple transport devices are provided on the working platform and arranged sequentially along a first direction. Each transport device forms a transport channel extending along a second direction. The transport device is used to carry the material tray and move it along the transport channel.

[0010] A transfer device, disposed on the working platform, is used to transfer the material tray from the feeding channel to a transport channel and to retrieve the material tray from the transport channel; and

[0011] A cutting device, which is located on the working platform, is used to cut the material in the tray of any of the transport channels;

[0012] The first direction and the second direction are set at an angle.

[0013] In one embodiment, the laser cutting equipment further includes a detection device disposed on the working platform for detecting the material in the tray of any of the transport channels.

[0014] In one embodiment, the cutting device, the transfer device, and the detection device are arranged sequentially along the second direction, and the cutting device, the transfer device, and the detection device are all capable of moving along the first direction to process the tray in any of the transport channels.

[0015] In one embodiment, each of the transport devices includes:

[0016] A linear motor is disposed on the working platform along the second direction, and the transport channel is formed on the surface of the linear motor;

[0017] A cutting base, wherein the cutting base is disposed on the linear motor, and the cutting base has a cutting plane for supporting the material tray; and

[0018] A detection base is provided on the linear motor and spaced apart from the cutting base. The detection base has a detection plane that supports the material tray.

[0019] The linear motor drives the cutting base and the detection base to move along the transport channel. The cutting device processes the material tray on the cutting plane, the detection device processes the material tray on the detection plane, and the transfer device places the material tray into the cutting plane and the detection plane, and retrieves the material tray from the cutting plane.

[0020] In one embodiment, the cutting base includes:

[0021] A cutting base is mounted on the linear motor. The upper surface of the cutting base forms the cutting plane. A collection cavity is formed around the cutting base, and the upper surface of the cutting base has a collection hole and multiple limiting protrusions. The collection hole communicates with the collection cavity for collecting cutting debris. The multiple limiting protrusions are spaced apart from the collection hole.

[0022] A holding component is disposed on the upper surface of the cutting base and is used to drive at least two adjacent sides of the material tray to abut against the limiting protrusion.

[0023] In one embodiment, the detection base includes:

[0024] The detection base includes two first frames disposed on the linear motor. The two first frames are arranged sequentially along the first direction, and the detection plane is formed on the upper surface of the two first frames.

[0025] A light-emitting element, disposed between the two first frames, for illuminating the bottom of the tray; and

[0026] A push rod, which is movably mounted on the upper surface of the two first frames, is used to push the tray along the second direction.

[0027] In one embodiment, the cutting device includes:

[0028] A first support base is disposed on the working platform and is arranged along the first direction;

[0029] A laser mechanism, which is slidably mounted on the first support base, is used to emit a cutting laser.

[0030] A detection mechanism is slidably mounted on the first support base and spaced apart from the laser mechanism. The detection mechanism forms a detection optical path for detecting the cutting position, and the detection optical path is angled to the cutting laser emitted by the laser mechanism.

[0031] A beam combiner is disposed on the first support base and located at the intersection of the detection optical path and the cutting laser. The beam combiner is used to reflect the cutting laser and allow the detection optical path to pass through, so that the reflected cutting laser and the detection optical path are coaxially arranged.

[0032] In one embodiment, the feeding device includes:

[0033] Two second frames are disposed opposite each other on the work platform and extend along the second direction. One second frame can move relative to the other second frame to adjust the width between the two second frames.

[0034] Two feeding belts are respectively located on opposite sides of the two second frames, and the surfaces of the feeding belts form the feeding channels;

[0035] Two feeding drive units are respectively disposed on the two frames and connected to the feeding belt, for driving the feeding belt to rotate; and

[0036] A lifting assembly is disposed on the working platform and located between the two second frames;

[0037] The lifting assembly is capable of moving in a direction perpendicular to the plane of the working platform to disengage the material tray from the transport channel, and the transfer device retrieves the material tray from the lifting assembly.

[0038] In one embodiment, the lifting assembly includes:

[0039] A lifting drive unit is disposed on the working platform and located between the two second frames;

[0040] A lifting base is connected to the output end of the lifting drive component. The upper surface of the lifting base is provided with positioning posts that can be inserted into the positioning slots of the material tray.

[0041] A limiting post is provided, which is spaced apart from the lifting drive member along the second direction, and the limiting post protrudes from the plane where the transport channel is located. The limiting post is used to position the material tray.

[0042] The lifting drive unit drives the lifting base to move in a direction perpendicular to the plane of the working platform.

[0043] In one embodiment, the laser cutting equipment further includes a barcode scanning device, which is located on the working platform and has its scanning end corresponding to the feeding channel. The barcode scanning device is used to acquire information about the material tray.

[0044] The technical solution of this utility model involves a feeding device conveying a material tray to a feeding channel, a transfer device transferring the material tray from the feeding channel to multiple transport channels arranged sequentially along a first direction, a cutting device cutting the material in the material tray on the transport channel, and after cutting, the transfer device transferring the material tray in the transport channel to other mechanisms. When the cutting device is cutting a material tray in a certain transport channel, subsequent material trays can enter other unoccupied transport channels from the feeding channel under the action of the transfer device to wait. After completing the cutting operation of the material in the current material tray, the cutting device can directly switch to the transport channel of the next material tray for cutting, thus reducing waiting time and improving production efficiency. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0046] Figure 1 A schematic diagram of the structure of an embodiment of the laser cutting equipment provided by this utility model;

[0047] Figure 2 A schematic diagram of the structure of a laser cutting equipment from another perspective;

[0048] Figure 3 This is a schematic diagram of the barcode scanning device and the feeding device in a laser cutting equipment.

[0049] Figure 4 This is a schematic diagram of the transport device, transfer device, and detection device in a laser cutting equipment.

[0050] Figure 5 This is a schematic diagram of the transfer device in a laser cutting equipment.

[0051] Figure 6 This is a schematic diagram of the transport device in a laser cutting equipment.

[0052] Figure 7 This is a schematic diagram of the cutting device in a laser cutting machine;

[0053] Figure 8 This is a schematic diagram of the cutting device in a laser cutting equipment from another perspective.

[0054] Figure 9 This is a structural schematic diagram of the cutting device in a laser cutting machine from another perspective.

[0055] Explanation of icon numbers:

[0056] 100. Laser cutting equipment; 1. Working platform; 2. Feeding device; 21. Second frame; 22. Feeding belt; 221. Feeding channel; 23. Feeding drive component; 24. Lifting assembly; 241. Lifting drive component; 242. Lifting base; 2421. Positioning post; 243. Limiting post; 3. Transport device; 31. Linear motor; 311. Transport channel; 32. Cutting base; 321. Cutting base; 3211. Cutting plane; 3212. Collection hole; 3213. Limiting protrusion; 322. Supporting assembly; 33. Detection base; 331. Detection base; 3311. First frame; 3312. Detection plane; 332. Light-emitting component; 333. 4. Push rod; 5. Transfer device; 6. Second support base; 7. Fixed base; 8. Vertical drive component; 9. Material handling assembly; 10. Cutting device; 11. First support base; 12. Translation drive component; 13. Laser mechanism; 14. Mounting base; 15. First reflector; 26. Galvanometer field lens module; 27. Lifting drive component; 28. Adapter plate; 29. ​​Pipe; 20. Detection mechanism; 21. Beam combiner; 22. Laser emitting mechanism; 23. Fourth support base; 34. Laser; 55. Second reflector; 65. Beam expander; 76. Dust removal assembly; 87. Detection device; 98. Third support base; 10. Detection camera; 11. Barcode scanning device.

[0057] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0058] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0059] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0060] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0061] Laser cutting technology is commonly used in the manufacturing of circuit boards. A laser beam is focused onto the surface of the circuit board and cuts along a pre-defined path to create a predetermined shape. Laser cutting technology not only offers high precision but also avoids mechanical damage.

[0062] In existing laser cutting equipment, multiple circuit boards are neatly loaded onto a tray. The tray is transported to the loading area by a feeding device, and then the transfer device transfers the tray to the cutting area. The cutting device cuts the circuit boards in the tray. After the cutting is completed, the transfer device transfers the tray from the cutting area to the inspection area. The inspection device performs visual inspection on the circuit boards to ensure the accuracy of the cut edges.

[0063] However, when the circuit board in the current tray is being cut, the subsequent tray can only wait in the loading area. The tray in the loading area can only enter the cutting area after the current tray has left the cutting area. During the process of the tray in the loading area entering the cutting area, the cutting device is idle, which increases the waiting time in the cutting process and reduces production efficiency.

[0064] The main purpose of this invention is to provide a laser cutting device 100, which aims to reduce the waiting time during the cutting process and improve production efficiency.

[0065] Please see Figures 1 to 9In one embodiment of this utility model, the laser cutting equipment 100 includes a working platform 1, a feeding device 2, multiple transport devices 3, a transfer device 4, and a cutting device 5. The feeding device 2 is located on the working platform 1 and forms a feeding channel 221 with a transport tray. Multiple transport devices 3 are all located on the working platform 1 and are arranged sequentially along a first direction. Each transport device 3 forms a transport channel 311 extending along a second direction. The transport device 3 is used to carry the tray and move it along the transport channel 311. The transfer device 4 is located on the working platform 1 and is used to transfer the tray from the feeding channel 221 to a transport channel 311 and to retrieve the tray from a transport channel 311. The cutting device 5 is located on the working platform 1 and is used to cut the material in the tray of any transport channel 311. The first direction and the second direction are arranged at an angle.

[0066] First, for ease of understanding, please refer to Figure 2 Let a1-a2 be the first direction and b1-b2 be the second direction. In this embodiment, the first direction is perpendicular to the second direction, thereby allowing the laser cutting equipment 100 to operate on the rectangular work platform 1. Depending on actual needs, the first and second directions can also be set to other angles.

[0067] In this embodiment, the work platform 1 serves as the structural foundation, supporting other devices. The feeding device 2 has a feeding channel 221 formed on the work platform 1 for transporting trays from other equipment. Multiple transport devices 3 are arranged along a first direction, and each transport device 3 has a transport channel 311 extending along a second direction for carrying the trays as they move in the second direction. The transfer device 4 is used to transfer the trays between the feeding channel 221 and the transport channel 311, while the cutting device 5 performs laser cutting on the material in the tray within the transport channel 311.

[0068] Understandably, when the cutting device 5 is cutting a tray in a certain transport channel 311, subsequent trays can be moved from the loading channel 221 to other unoccupied transport channels 311 to wait for their turn, thanks to the transfer device 4. After completing the cutting operation of the material in the current tray, the cutting device 5 can directly switch to the transport channel 311 of the next tray for cutting, thus reducing waiting time and improving production efficiency.

[0069] Optionally, the number and spacing of the transport devices 3 can be adjusted according to the production scale and the size of the trays. For example, in large-scale production, the number of transport devices 3 can be increased to improve parallel processing capabilities, while the distance between the transport devices 3 can be appropriately reduced to improve space utilization. Furthermore, the number of cutting devices 5 can be increased, allowing multiple cutting devices 5 to be arranged along a first direction, each capable of moving along the first direction, thus enabling one cutting device 5 to cut materials in trays on multiple transport devices 3. In this embodiment, since only one cutting device 5 is provided, and the time required for the transfer device 4 and transport device 3 to transport the trays is far less than the cutting time of the cutting device 5, only two transport devices 3 are needed to ensure that the cutting device 5 is always in a cutting state, thereby reducing the cutting time of the cutting device 5.

[0070] In one implementation, please refer to Figure 1 , Figure 2 and Figure 4 The laser cutting equipment 100 also includes a detection device 6, which is located on the working platform 1 and is used to detect the material in the tray of any transport channel 311.

[0071] In this embodiment, the detection device 6 includes a third support base 61 and a detection camera 62. The third support base 61 is disposed on the working platform 1 and extends along a first direction. The detection camera 62 is slidably disposed on the third support base 61 and can move along the first direction to detect the material in the tray of each transport channel 311. As for the specific structure of the detection camera 62, it is quite common in the prior art and will not be described in detail here.

[0072] Understandably, after capturing an image of the cut material, the detection device 6 uses image analysis software to check the quality, dimensional accuracy, and presence of defects at the cut edges, allowing subsequent screening equipment to filter out unqualified cut products. The third support 61 can also be equipped with a drive unit to move the detection camera 62 along the first direction, facilitating automatic detection of materials in different transport channels 311. The drive unit can be driven by a linear motor 31 or a servo motor combined with a lead screw; these two structures are common in existing technology and will not be elaborated upon here.

[0073] In one implementation, please refer to Figure 1 and Figure 2 The cutting device 5, the transfer device 4, and the detection device 6 are arranged sequentially along the second direction, and all three devices are capable of moving along the first direction to process the trays in any transport channel 311.

[0074] In this embodiment, the cutting device 5, the transfer device 4, and the detection device 6 are arranged sequentially along the second direction, with the cutting device 5 and the detection device 6 located on either side of the transfer device 4. It is understood that with this arrangement, by changing the transport direction of the transport channel 311, the material tray on the transport channel 311 can flow towards the cutting device 5 or the detection device 6.

[0075] In one implementation, please refer to Figure 2 and Figure 4 Each transport device 3 includes a linear motor 31, a cutting base 32, and a detection base 33. The linear motor 31 is disposed on the working platform 1 along a second direction, and a transport channel 311 is formed on the surface of the linear motor 31. The cutting base 32 is disposed on the linear motor 31 and has a cutting plane 3211 for carrying the material tray. The detection base 33 is disposed on the linear motor 31 and spaced apart from the cutting base 32, and has a detection plane 3312 for carrying the material tray. The linear motor 31 can drive the cutting base 32 and the detection base 33 to move along the transport channel 311. The cutting device 5 is used to process the material tray on the cutting plane 3211, the detection device 6 is used to process the material tray on the detection plane 3312, and the transfer device 4 is used to place the material tray into the cutting plane 3211 and the detection plane 3312, and to retrieve the material tray from the cutting plane 3211.

[0076] In this embodiment, a linear motor 31 is mounted on the work platform 1 along a second direction, and a transport channel 311 for transporting the material tray is formed on the surface of the linear motor 31. Both the cutting base 32 and the detection base 33 are mounted on the linear motor 31. The cutting base 32 has a cutting plane 3211 that supports the material tray during cutting operations, and the detection base 33 has a detection plane 3312 that supports the material tray during detection operations. The linear motor 31 can drive the detection base 33 and the cutting base 32 to move along the transport channel 311, respectively.

[0077] Understandably, after the transfer device 4 retrieves the tray from the feeding channel 221, it moves along a first direction to align the tray with a transport channel 311. Then, the cutting base 32 moves along a second direction to align with the transfer device 4, and the transfer device 4 places the tray onto the cutting plane 3211. The cutting base 32 then moves along the second direction to the cutting device 5. After the cutting device 5 cuts the material in the tray on the cutting plane 3211, the cutting base 32 moves along the second direction to align with the transfer device 4, and the transfer device 4 retrieves the tray from the cutting plane 3211. Subsequently, the cutting base 32 and the detection base 33 move along the second direction to align with the tray in the transfer device 4, and the transfer device 4 places the tray onto the detection plane 3312. The detection base 33 moves along the second direction to the detection device 6. After the detection device 6 detects the material in the tray on the detection plane 3312, the tray is transported to other equipment.

[0078] Optionally, a slide rail extending along the second direction can be provided on the work platform 1. The cutting base 32 and the detection base 33 are slidably mounted on the slide rail. At this time, a transport channel 311 is formed on the surface of the slide rail. Two drive motors are also provided on the slide rail, and the output ends of the two drive motors are respectively connected to the cutting base 32 and the detection base 33, so that the cutting base 32 and the detection base 33 can slide independently on the slide rail. With this configuration, the linear motor 31 is not required.

[0079] In one implementation, please refer to Figure 4 and Figure 6 The cutting base 32 includes a cutting base 321 and a holding component 322. The cutting base 321 is mounted on the linear motor 31. The upper surface of the cutting base 321 forms a cutting plane 3211. The cutting base 321 surrounds a collection cavity. The upper surface of the cutting base 321 is provided with a collection hole 3212 and a plurality of limiting protrusions 3213. The collection hole 3212 communicates with the collection cavity and is used to collect the debris generated during cutting. The plurality of limiting protrusions 3213 are spaced apart from the collection hole 3212. The holding component 322 is mounted on the upper surface of the cutting base 321 and is used to drive at least two adjacent sides of the material tray to limit and abut against the limiting protrusions 3213.

[0080] In this embodiment, the cutting base 321 is mounted on the linear motor 31, which directly drives the cutting base 321 to move along the second direction. The upper surface of the cutting base 321 is the cutting plane 3211, used to support the material tray. Simultaneously, the collecting cavity cooperates with the collecting hole 3212 so that debris generated during the cutting process can fall directly into the collecting cavity through the collecting hole 3212, preventing debris from spreading to other parts of the laser cutting equipment 100 and reducing cleaning workload. The abutment component 322 can abut against one corner and two adjacent sides of the material tray, and can drive the material tray to move relative to the limiting protrusion 3213, so that the remaining two sides of the material tray are respectively abutted against the two limiting protrusions 3213, thereby ensuring the stability of the material tray during the cutting process while accommodating material trays of different sizes.

[0081] Alternatively, a drawer structure can be provided on the cutting base 321 so that the debris entering the collection chamber falls into the drawer. By pulling the drawer out of the collection chamber, the debris in the collection chamber can be cleaned up.

[0082] Alternatively, the supporting component 322 can be driven by a cylinder, a lead screw, or an electric push rod 333.

[0083] In one implementation, please refer to Figure 4 and Figure 6 The detection base 33 includes a detection base 331, a light-emitting element 332, and a push rod 333. The detection base 331 includes two first frames 3311 disposed on the linear motor 31. The two first frames 3311 are arranged sequentially along a first direction. A detection plane 3312 is formed on the upper surface of the two first frames 3311. The light-emitting element 332 is disposed between the two first frames 3311 and is used to illuminate the bottom of the material tray. The push rod 333 is movably disposed on the upper surface of the two first frames 3311 and is used to push the material tray along a second direction.

[0084] In this embodiment, two first frames 3311 of the detection base 331 are mounted on the linear motor 31 along a first direction. A detection plane 3312 for supporting the tray during detection is formed on the upper surface of the two first frames 3311. The two first frames 3311 can move relative to each other to accommodate trays of different widths. A light-emitting element 332 is installed between the two first frames 3311 to illuminate the bottom of the tray during detection, thereby improving the imaging quality of the detection camera 62. A push rod 333 is movably disposed on the upper surface of the two first frames 3311, and can push the tray along a second direction to align the tray with the position of the light-emitting element 332, and can push the tray into the next device.

[0085] Alternatively, the push rod 333 can be driven by a motor, a pneumatic cylinder, or a hydraulic cylinder.

[0086] Optionally, the light-emitting element 332 can be a structure such as an LED light strip, fiber optic lighting, or a halogen lamp.

[0087] In one implementation, please refer to Figure 7 , Figure 8 and Figure 9 The cutting device 5 includes a first support base 51, a laser mechanism 52, a detection mechanism 53, and a beam combiner 54. The first support base 51 is disposed on the working platform 1 and is arranged along a first direction. The laser mechanism 52 is slidably disposed on the first support base 51 and is used to emit a cutting laser. The detection mechanism 53 is slidably disposed on the first support base 51 and is spaced apart from the laser mechanism 52. The detection mechanism 53 is used to form a detection optical path for detecting the cutting position. The detection optical path is arranged at an angle to the cutting laser emitted by the laser mechanism 52. The beam combiner 54 is disposed on the first support base 51 and is located at the intersection of the detection optical path and the cutting laser. The beam combiner 54 is used to reflect the cutting laser and allow the detection optical path to pass through, so that the reflected cutting laser and the detection optical path are coaxially arranged.

[0088] In this embodiment, the first support base 51 is arranged along the first direction, providing a sliding track for the laser mechanism 52 and the detection mechanism 53, thereby enabling the cutting operation to be performed along the first direction. The laser mechanism 52 is used to emit a cutting laser, while the detection mechanism 53 is used to form a detection optical path for real-time monitoring of the cutting position. The cutting laser and the detection optical path are arranged at an angle, and at the intersection, the beam combiner 54 is used to make the reflected cutting laser and the detection optical path coaxial.

[0089] Understandably, through the optical function of the beam combiner 54, the detection optical path and the cutting laser are coaxially aligned, enabling the detection mechanism 53 to monitor the cutting position information in real time and accurately. This provides precise feedback information to the laser mechanism 52, ensuring that the cutting operation is performed in the correct position and improving the processing quality of the product. Specifically, the beam combiner 54 can reflect or transmit specific light beams according to the wavelength of light, thus combining optical paths of different wavelengths. In this embodiment, the beam combiner 54 can transmit visible light and reflect 355nm light.

[0090] In one implementation, please refer to Figure 7 and Figure 9 The cutting device 5 also includes a laser emitting mechanism 55, which is located on the working platform 1. The feeding device 2, multiple transport devices 3 and the laser emitting mechanism 55 are arranged in sequence along the first direction. The laser emitting mechanism 55 can emit a cutting laser along the first direction so that it can be received by the laser mechanism 52.

[0091] It should be noted that since the material is cut on the cutting plane 3211, the detection optical path extends perpendicular to the working platform 1 and passes directly through the mirror surface of the beam combiner 54, thus enabling the detection of the material's cutting position. The cutting laser emitted by the laser mechanism 52 is emitted along the first direction, forming a certain angle with the mirror surface of the beam combiner 54. The beam combiner 54 reflects the cutting laser, changing the transmission direction of the cutting laser to be perpendicular to the working platform 1 and completely coaxial with the detection optical path. This allows the detection optical path to monitor the cutting position in real time, while the cutting laser processes the material coaxially, ensuring precise monitoring of each cutting action and thus improving processing quality.

[0092] In this embodiment, the laser emitting mechanism 55 can be independently installed in a safe area to avoid potential hazards to operators from high-power lasers. Simultaneously, this arrangement ensures that the laser mechanism 52 can always receive the cutting laser emitted by the laser emitting mechanism 55 as it moves along the first direction.

[0093] Optionally, the angle between the cutting laser and the beam combiner 54 can be adjusted according to actual processing requirements. In this embodiment, since the first direction is perpendicular to the extension direction of the detection optical path, the angle between the cutting laser and the beam combiner 54 is set to 45°. In other embodiments, when the extension direction of the cutting laser emitted by the laser mechanism 52 is not perpendicular to the extension direction of the detection optical path, the corresponding angle can be calculated based on the mathematical relationship that the incident angle equals the reflection angle during mirror reflection, thereby ensuring that the reflected cutting laser and the detection optical path are coaxially aligned.

[0094] Optionally, an optical fiber can be installed between the laser emitting mechanism 55 and the laser mechanism 52 to ensure stable transmission of the cutting laser and reduce energy loss during transmission, thus adapting to long-distance transmission. Of course, if the distance between the laser emitting mechanism 55 and the laser mechanism 52 is short, an optical fiber can be omitted, and the cutting laser can be transmitted directly to the laser mechanism 52.

[0095] In one implementation, please refer to Figure 7 and Figure 8The laser mechanism 52 includes a mounting base 521, a first reflector 522, a lifting drive 524, a converter plate 525, and a galvanometer and field lens module 523. The mounting base 521 is slidably mounted on a first support base 51, and the detection mechanism 53 is mounted on the mounting base 521. The first reflector 522 is mounted on the mounting base 521 and is used to reflect the cutting laser generated by the laser emitting mechanism 55. The galvanometer and field lens module 523 is mounted on the mounting base 521 and is used to receive the cutting laser reflected by the first reflector 522 and direct the cutting laser toward the beam combiner 54. The lifting drive 524 is mounted on the mounting base 521 and spaced apart from the first reflector 522. The converter plate 525 is connected to the output end of the lifting drive 524. The galvanometer and field lens module 523, the detection mechanism 53, and the beam combiner 54 are all mounted on the converter plate 525. Among them, the lifting drive component 524 drives the adapter plate 525, which in turn drives the galvanometer field lens module 523, the detection mechanism 53 and the beam combiner 54 to move in a direction perpendicular to the plane of the working platform 1.

[0096] In this embodiment, the laser mechanism 52 includes a mounting base 521, a first reflecting mirror 522, and a galvanometer and field mirror module 523. The mounting base 521 is slidably mounted on the first support base 51, providing a base for the laser mechanism 52 to move. The first reflecting mirror 522 is mounted on the mounting base 521 and is used to receive the cutting laser from the laser emitting mechanism 55 and change the transmission direction of the cutting laser. The galvanometer and field mirror module 523 is also mounted on the mounting base 521 and is used to further process the cutting laser reflected from the first reflecting mirror 522, accurately guiding the cutting laser to the beam combiner 54 through the internal galvanometer and field mirror system. The lifting drive 524 is mounted on the mounting base 521 and maintains a certain distance from the first reflecting mirror 522. The adapter plate 525 is connected to the output end of the lifting drive 524, and the galvanometer and field mirror module 523, the detection mechanism 53, and the beam combiner 54 are all mounted on the adapter plate 525. Driven by the lifting drive 524, the adapter plate 525 can move these components up and down in a direction perpendicular to the working platform 1, thereby adjusting the height position of the cutting laser and the detection optical path to accommodate circuit boards of different thicknesses.

[0097] Understandably, the galvanometer and field lens module 523 includes a galvanometer and a field lens arranged sequentially along the first direction. The galvanometer has rapid deflection capability and high repeatability, enabling it to direct the cutting laser reflected from the first reflecting mirror 522 towards the field lens. The field lens is used to correct the cutting laser to ensure that it is focused on the beam combiner 54. Furthermore, by adjusting the lifting drive 524, it is possible to ensure that the cutting laser is always focused on the surface of the circuit board, thereby improving the cutting quality.

[0098] Optionally, please refer to Figure 7 and Figure 9To further ensure that the cutting laser reflected by the first reflector 522 can be fully received by the galvanometer and field lens module 523, a sealed conduit 526 can be installed between the first reflector 522 and the galvanometer and field lens module 523 to ensure stable transmission of the cutting laser. The conduit 526 uses a high-reflectivity inner wall material, such as a silver-plated or aluminum-plated metal surface, to reduce the loss of cutting laser energy during transmission. Simultaneously, both ends of the conduit 526 are tightly connected to the first reflector 522 and the galvanometer and field lens module 523 to ensure the airtightness of the optical path and prevent dust, gas, or other impurities from entering the optical path and affecting laser focusing and cutting effect.

[0099] Optionally, the lifting drive component 524 can be a structure such as a cylinder, motor, or hydraulic cylinder.

[0100] In one implementation, please refer to Figure 7 and Figure 8 The laser emitting mechanism 55 includes a fourth support base 551, a laser 552, and a plurality of second reflectors 553. The fourth support base 551 is disposed on the working platform 1 and is spaced apart from the first support base 51. The laser 552 is disposed on the fourth support base 551 and is used to generate a cutting laser. The plurality of second reflectors 553 are spaced apart on the fourth support base 551 and are used to reflect the cutting laser so that the cutting laser is received by the first reflector 522.

[0101] In this embodiment, the fourth support 551 is mounted on the working platform 1, maintaining a certain distance from the first support 51, and is used to support the laser 552 and multiple second reflectors 553. The multiple second reflectors 553 are spaced apart along the support and cooperate with each other to reflect the cutting laser emitted by the laser 552 to the first reflector 522 of the laser mechanism 52. For easier understanding, please refer to... Figure 8 and Figure 9 The cutting laser is transmitted along the direction of the arrow in the figure, so that the cutting laser generated by the laser 552 can be emitted onto the cutting plane 3211.

[0102] Optionally, the number and layout of the second reflectors 553 can be adjusted according to the optical path design. In this embodiment, three second reflectors 553 are set, and the angle between the cutting laser and each second reflector 553 is 45°, so that the cutting laser emitted by the laser 552 along the second direction can eventually capture the image of the first reflector 522 along the first direction.

[0103] Optionally, a beam expander 554 can be provided between two adjacent second reflectors 553 to convert the laser beam emitted by the laser 552 into a parallel beam, and then the galvanometer field mirror module 523 can be used to obtain a fine, high-power-density cutting laser.

[0104] In one implementation, please refer to Figure 7 The first support base 51 is provided with a translation drive 511, and the mounting base 521 is located at the output end of the translation drive 511. The translation drive 511 drives the mounting base 521 to move along a first direction.

[0105] In this embodiment, the mounting base 521 can move stably in a straight line along the first direction by being driven by the translation drive 511, thereby completing the laser cutting operation.

[0106] In one implementation, please refer to Figure 7 The cutting device 5 also includes a dust removal component 56, which is located on the adapter plate 525 and spaced apart from the beam combiner 54. The dust removal component 56 is used to clean the dust generated during cutting.

[0107] In this embodiment, the dust removal component 56 is mounted on the adapter plate 525 and can move along the first direction with the adapter plate 525, thereby enabling the dust removal component 56 to promptly clean up the dust generated during laser cutting. It is understood that if the dust generated during laser cutting is not cleaned in time, it may contaminate optical components such as the beam combiner 54 and the first reflecting mirror 522, reducing beam quality and thus affecting the accuracy and efficiency of laser cutting. The dust removal component 56, through dust collection and filtration, ensures that the optical components are always in good working condition, extending the service life of the cutting device 5 and reducing operating costs.

[0108] Optionally, the dust removal component 56 generally includes a suction nozzle and a suction fan, which are connected. The suction nozzle is installed at the adapter plate 525, and the suction port of the suction nozzle faces the work platform 1. The suction fan is used to generate negative pressure to suck away dust through the suction nozzle. The specific structure of the dust removal component is quite common in the prior art and will not be described in detail here.

[0109] In one implementation, please refer to Figure 4 and Figure 5 The transfer device 4 includes a second support base 41, a fixed base 42, a vertical drive component 43, and a material picking component 44. The second support base 41 is disposed on the working platform 1 and extends along a first direction. The fixed base 42 is slidably disposed on the second support base 41, can move along the first direction, and corresponds to multiple transport channels 311 and feeding channels 221. The vertical drive component 43 is disposed on the fixed base 42, and the material picking component 44 is connected to the output end of the vertical drive component 43 for picking up the material tray.

[0110] In this embodiment, the second support base 41 is mounted on the working platform 1 along the first direction, providing a moving track for the fixed base 42. The fixed base 42 can move along the first direction on the second support base 41 to correspond to the two transport channels 311 and the feeding channel 221. Similarly, the fixed base 42 can also be driven by a drive component to move automatically on the second support base 41. This structure is the same as the structure of the fixed base 42 in the detection device 6. A vertical drive component 43 is mounted on the fixed base 42. The output end of the vertical drive component 43 is connected to the material picking assembly 44, which can drive the material picking assembly 44 to move vertically up and down, thereby realizing the gripping and release of the material tray.

[0111] Optionally, the material handling component 44 can be a gripper mechanism that grips the opposite sides of the material tray. An elastic element can be provided on the gripper mechanism; when the material tray approaches the gripper mechanism, the elastic element is compressed, allowing the gripper mechanism to adapt to material trays of different thicknesses. The elastic element can be a spring or elastic rubber. Alternatively, the material handling component 44 can also be a suction cup mechanism, using four suction cups to adhere to the four corners of the material tray, thereby completing the gripping and release of the material tray.

[0112] Optionally, the material handling component 44 can also be equipped with corresponding sensors to monitor the material handling process in real time and determine whether the material tray has been firmly adsorbed or securely clamped. Once a deviation in the position of the material tray is detected, the system will immediately issue an alarm and suspend subsequent actions.

[0113] In one implementation, please refer to Figure 2 and Figure 3 The feeding device 2 includes two second frames 21, two feeding belts 22, two feeding drive components 23, and a lifting assembly 24. The two second frames 21 are arranged opposite to each other on the working platform 1 and extend along a second direction. One second frame 21 can move relative to the other second frame 21 to adjust the width between the two second frames 21. The two feeding belts 22 are respectively arranged on opposite sides of the two second frames 21, and the surface of the feeding belts 22 forms a feeding channel 221. The two feeding drive components 23 are respectively arranged on the two frames and connected to the feeding belts 22 for driving the feeding belts 22 to rotate. The lifting assembly 24 is arranged on the working platform 1 and located between the two second frames 21. The lifting assembly 24 can move in a direction perpendicular to the plane of the working platform 1 to disengage the material tray from the transport channel 311, and the transfer device 4 obtains the material tray from the lifting assembly 24.

[0114] In this embodiment, two second frames 21 are arranged opposite each other on the working platform 1 and extend along a second direction. One of the second frames 21 can move relative to the other second frame 21 to adjust the distance between them to accommodate different sizes of material trays. At the same time, the lifting component 24 located between the two second frames 21 can lift the material tray, causing it to detach from the feeding belt 22, thereby facilitating the material picking component 44 to pick up the material tray.

[0115] In one implementation, please refer to Figure 2 and Figure 3 The lifting assembly 24 includes a lifting drive 241, a lifting base 242, and a limiting post 243. The lifting drive 241 is located on the working platform 1 between the two second frames 21. The lifting base 242 is connected to the output end of the lifting drive 241. The upper surface of the lifting base 242 is provided with a positioning post 2421, which can be inserted into the positioning groove of the material tray. The limiting post 243 is spaced apart from the lifting drive 241 along a second direction, and the limiting post 243 protrudes from the plane of the transport channel 311. The limiting post 243 is used to position the material tray. The lifting drive 241 drives the lifting base 242 to move in a direction perpendicular to the plane of the working platform 1.

[0116] In this embodiment, the lifting drive component 241 is mounted on the working platform 1 and located between the two second frames 21, providing lifting power to the lifting base 242. The lifting base 242 is connected to the output end of the lifting drive component 241, and a positioning post 2421 is provided on the upper surface of the lifting base 242. When the lifting base 242 is lifted, the positioning post 2421 can cooperate with the positioning groove of the material tray, thereby ensuring that the material tray can be stably placed on the lifting base 242. The limiting post 243 can prevent the material tray from moving along the feeding channel 221, making it convenient for the lifting assembly 24 to lift the material tray.

[0117] In one implementation, please refer to Figure 1 and Figure 3 The laser cutting equipment 100 also includes a barcode scanning device 7, which is located on the working platform 1 and the scanning end of the barcode scanning device 7 is set to correspond to the feeding channel 221. The barcode scanning device 7 is used to obtain information about the material tray.

[0118] In this embodiment, the barcode scanning device 7 and the feeding device 2 are arranged at intervals, and can obtain information on the material tray, such as the tray number, material type, cutting program, etc.

[0119] Understandably, by acquiring information from the material tray, the laser cutting equipment 100 can automatically call up the corresponding cutting parameters and programs to ensure the accuracy of the cutting operation. Simultaneously, the barcode scanning record can also be used for production traceability, facilitating product quality tracking and management in subsequent processes.

[0120] Optionally, the scanning device 7 can be a one-dimensional barcode scanner, a two-dimensional matrix scanner, or a QR code scanner, etc.

[0121] The working process of the laser cutting equipment 100 is as follows:

[0122] During the material transfer process of the material tray in the feeding channel 221 of the feeding device 2, the material tray passes through the scanning device 7, which acquires information from the material tray, such as the tray number, material type, and cutting program. This information will be transmitted to the control system of the laser cutting equipment 100 for subsequent cutting operations.

[0123] The material is fed in, and the material tray continues to be conveyed along the feeding channel 221. The limiting post 243 blocks the movement of the material tray along the feeding channel 221 so that the material tray corresponds to the lifting component 24. The lifting drive component 241 of the lifting component 24 drives the lifting base 242 to rise, so that the material tray is removed from the feeding channel 221.

[0124] The material tray is transferred to the cutting base 32. The vertical drive 43 of the transfer device 4 drives the material picking assembly 44 to descend and grab the tray. Then, the vertical drive 43 drives the material picking assembly 44 to rise and remove the tray from the lifting assembly 24. Subsequently, the fixed base 42 moves along the second support base 41 to transfer the tray to the cutting base 32 of the transport device 3.

[0125] Cutting: The cutting base 32 moves along the linear motor 31, aligning the cutting plane 3211 with the cutting device 5. The laser mechanism 52 of the cutting device 5 receives the cutting laser generated by the laser emitting mechanism 55, which is reflected by the first reflecting mirror 522, processed by the galvanometer field mirror module 523, and then directed towards the beam combiner 54. The beam combiner 54 reflects the cutting laser to a position coaxial with the detection optical path, cutting the material in the tray. Simultaneously, the detection mechanism 53 monitors the cutting position in real time through the detection optical path, providing precise feedback to the laser mechanism 52 to ensure the accuracy of the cutting operation. Dust generated during the cutting process is cleaned by the dust removal component 56.

[0126] After the material is transferred to the detection base 33 and cut, the cutting base 32 moves along the linear motor 31 to align the material tray with the transfer device 4. The material picking component 44 of the transfer device 4 then removes the material tray from the cutting plane 3211. Simultaneously, the detection base 33 and the cutting base 32 move along the linear motor 31 to align the material picking component 44 with the detection base 33. The material picking component 44 then places the material tray into the detection plane 3312.

[0127] The detection base 33 moves along the linear motor 31 to align the detection plane 3312 with the detection device 6. The detection camera 62 of the detection device 6 moves along the third support 61 to perform visual inspection on the material in the tray.

[0128] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A laser cutting apparatus, characterized by, The laser cutting equipment includes: Work platform; A feeding device is provided on the working platform and forms a feeding channel with a transport tray; Multiple transport devices are provided on the working platform and arranged sequentially along a first direction. Each transport device forms a transport channel extending along a second direction. The transport device is used to carry the material tray and move it along the transport channel. A transfer device, disposed on the working platform, is used to transfer the material tray from the feeding channel to a transport channel and to retrieve the material tray from the transport channel; and A cutting device, which is located on the working platform, is used to cut the material in the tray of any of the transport channels; The first direction and the second direction are set at an angle.

2. The laser cutting equipment as described in claim 1, characterized in that, The laser cutting equipment also includes a detection device, which is located on the working platform and is used to detect the material in the tray of any of the transport channels.

3. The laser cutting equipment as described in claim 2, characterized in that, The cutting device, the transfer device, and the detection device are arranged sequentially along the second direction, and all three devices are capable of moving along the first direction to process the tray in any of the transport channels.

4. The laser cutting equipment as described in claim 3, characterized in that, Each of the aforementioned transport devices includes: A linear motor is disposed on the working platform along the second direction, and the transport channel is formed on the surface of the linear motor; A cutting base, wherein the cutting base is disposed on the linear motor, and the cutting base has a cutting plane for supporting the material tray; and A detection base is provided on the linear motor and spaced apart from the cutting base. The detection base has a detection plane that supports the material tray. The linear motor drives the cutting base and the detection base to move along the transport channel. The cutting device is used to cut the material tray on the cutting plane. The detection device is used to detect the material tray on the detection plane. The transfer device is used to place the material tray into the cutting plane and the detection plane, and to retrieve the material tray from the cutting plane.

5. The laser cutting equipment as described in claim 4, characterized in that, The cutting base includes: A cutting base is mounted on the linear motor. The upper surface of the cutting base forms the cutting plane. A collection cavity is formed around the cutting base, and the upper surface of the cutting base has a collection hole and multiple limiting protrusions. The collection hole communicates with the collection cavity for collecting cutting debris. The multiple limiting protrusions are spaced apart from the collection hole. A holding component is disposed on the upper surface of the cutting base and is used to drive at least two adjacent sides of the material tray to abut against the limiting protrusion.

6. The laser cutting equipment as described in claim 4, characterized in that, The detection base includes: The detection base includes two first frames disposed on the linear motor. The two first frames are arranged sequentially along the first direction, and the detection plane is formed on the upper surface of the two first frames. A light-emitting element, disposed between the two first frames, for illuminating the bottom of the tray; and A push rod, which is movably mounted on the upper surface of the two first frames, is used to push the tray along the second direction.

7. The laser cutting equipment according to any one of claims 1 to 6, characterized in that, The cutting device includes: A first support base is disposed on the working platform and is arranged along the first direction; A laser mechanism, which is slidably mounted on the first support base, is used to emit a cutting laser; A detection mechanism is slidably mounted on the first support base and spaced apart from the laser mechanism. The detection mechanism forms a detection optical path for detecting the cutting position, and the detection optical path is angled to the cutting laser emitted by the laser mechanism. A beam combiner is disposed on the first support base and located at the intersection of the detection optical path and the cutting laser. The beam combiner is used to reflect the cutting laser and allow the detection optical path to pass through, so that the reflected cutting laser and the detection optical path are coaxially arranged.

8. The laser cutting equipment as described in any one of claims 1 to 6, characterized in that, The feeding device includes: Two second frames are disposed opposite each other on the work platform and extend along the second direction. One second frame can move relative to the other second frame to adjust the width between the two second frames. Two feeding belts are respectively located on opposite sides of the two second frames, and the surfaces of the feeding belts form the feeding channels; Two feeding drive units are respectively disposed on the two frames and connected to the feeding belt, for driving the feeding belt to rotate; and A lifting assembly is disposed on the working platform and located between the two second frames; The lifting assembly is capable of moving in a direction perpendicular to the plane of the working platform to disengage the material tray from the transport channel, and the transfer device retrieves the material tray from the lifting assembly.

9. The laser cutting equipment as described in claim 8, characterized in that, The lifting assembly includes: A lifting drive unit is disposed on the working platform and located between the two second frames; A lifting base, connected to the output end of the lifting drive component, wherein the upper surface of the lifting base is provided with positioning posts that can be inserted into the positioning slots of the material tray; and A limiting post is provided, which is spaced apart from the lifting drive member along the second direction, and the limiting post protrudes from the plane where the transport channel is located. The limiting post is used to position the material tray. The lifting drive unit drives the lifting base to move in a direction perpendicular to the plane of the working platform.

10. The laser cutting equipment as described in claim 9, characterized in that, The laser cutting equipment also includes a barcode scanning device, which is located on the working platform and the scanning end of the barcode scanning device is set corresponding to the feeding channel. The barcode scanning device is used to obtain information about the material tray.

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