Aging test apparatus for integrated circuits

Abstract

This utility model relates to the field of integrated circuit testing technology, specifically disclosing an aging test device for integrated circuits. The device includes: a support base serving as the overall support structure; an integrated control cabinet and a test support platform are respectively installed on the top of the support base, with the test support platform supporting the integrated circuits; and the integrated control cabinet serving as a control and monitoring unit for monitoring the integrated circuits. In this aging test device, the docking plate on the side wall of the integrated control cabinet serves as a centralized connection hub, allowing for the orderly integration of cables for components such as temperature and humidity sensors. The cable limiting bracket within the side heating frame further organizes the cables, reducing connection interference caused by cable clutter. The engaging connection between the test chamber shell and the support base, along with the rectangular limiting structure formed by the positioning mounting bracket and the slide rail, enhances the overall structural stability of the device, reduces the risk of loosening caused by thermal expansion and contraction of components under high-temperature conditions, and ensures the stability of signal transmission and power connection.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit testing technology, specifically to an aging test device for integrated circuits. Background Technology

[0002] In the integrated circuit manufacturing process, aging testing is a crucial step in ensuring product quality and reliability. Aging test equipment simulates harsh working environments such as high temperature and high voltage, causing potential early failure defects inside the integrated circuit to be exposed in advance, thereby screening out qualified products and effectively reducing the risk of failure in later use. Currently, existing equipment can meet the testing needs of most conventional integrated circuits, but in the long-term use, its structural design has revealed a series of problems.

[0003] Because traditional testing equipment uses a fixed fixture structure, it is difficult to quickly accommodate chips of various specifications. Each time the test object is changed, time is required to adjust or replace the fixture, which reduces testing efficiency. In addition, in the high-temperature environment of testing, some connecting parts are prone to loosening due to thermal expansion and contraction, resulting in unstable signal transmission and poor power contact. Utility Model Content

[0004] The purpose of this invention is to provide an aging test device for integrated circuits to solve the problems mentioned in the background art. Traditional test devices use a fixed fixture structure, which makes it difficult to quickly accommodate chips of various specifications. Each time the test object is changed, time is required to adjust or replace the fixture. Furthermore, in the high-temperature environment of the test, some connecting parts are prone to loosening due to thermal expansion and contraction, resulting in unstable signal transmission and poor power contact.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an aging test device for integrated circuits, comprising a support base as the overall support structure of the device, an integrated control cabinet and a test support platform respectively installed on the top of the support base, wherein the test support platform is used to support integrated circuits, and the integrated control cabinet is a control and monitoring unit for monitoring integrated circuits;

[0006] The integrated control cabinet is equipped with an operation display panel on its surface and a docking plate on its side wall. The docking plate is connected to a temperature sensor and a humidity sensor via cables, and the temperature sensor and humidity sensor are installed on the upper part of the test chamber shell.

[0007] The test support platform is symmetrically provided with slide rails at its upper end, and sliding clamp one and sliding clamp two are slidably connected in the slide rails of the test support platform. The sliding clamp one is equipped with a telescopic column, and the output end of the telescopic column is connected to the flexible clamp plate. The sliding clamp two is a sheet-shaped sliding frame, and a side heating frame is nested and engaged on the surface of the sliding clamp two. Cable limiting frames are provided at equal intervals in the side heating frame.

[0008] By adopting the above technical solution, through the sliding cooperation between the slide rail and sliding fixture one and sliding fixture two, as well as the structure of the telescopic column and flexible clamp, it is possible to quickly adapt to chips of different specifications and shorten the time for changing test objects.

[0009] Preferably, the upper surface of the support base is provided with a groove that engages with the outer shell of the test chamber, and the upper surface of the outer shell of the test chamber is provided with an observation window.

[0010] By adopting the above technical solution, the snap-fit ​​connection between the support base and the test chamber shell enhances structural stability, and the observation window facilitates real-time observation of the test status, improving operational convenience.

[0011] Preferably, two positioning mounting brackets are installed on the upper part of the test support platform, and the positioning mounting brackets and the slide rail of the test support platform together form a rectangle surrounding the test support platform.

[0012] Using the above technical solution, the positioning mounting bracket and slide rail form a rectangular structure, which limits the movement range of the fixture, ensures the stability of the chip position, and improves the accuracy of testing.

[0013] Preferably, the telescopic column is a multi-segment sliding hydraulic telescopic structure, and the flexible clamp connected to the output end of the telescopic column is an arc-shaped rubber plate, and the inner wall of the flexible clamp is pasted with a conductive silicone layer.

[0014] The above technical solution, with its multi-segment hydraulic telescopic column and arc-shaped rubber flexible clamp, can not only firmly hold the chip but also avoid physical damage. The conductive silicone layer ensures electrical contact and improves test reliability.

[0015] Preferably, the side heating frame includes a ceramic frame and a spiral heating wire, with the spiral heating wire evenly wound inside the ceramic frame. The spiral heating wire is connected to an external power source through a temperature control module, and the temperature control module interacts with the control system in the integrated control cabinet.

[0016] By adopting the above technical solution, the interaction between the side heating rack structure, the temperature control module, and the control system enables precise temperature regulation, meets the requirements of high-temperature testing, and ensures a stable testing environment.

[0017] Preferably, the bottom end of the test chamber shell is engaged with the upper end face of the support base. The test chamber shell and the support base together form a test chamber.

[0018] By adopting the above technical solution, the test chamber shell and the supporting base form a closed test chamber, which reduces external interference, ensures the consistency of the test environment, and improves the reliability of the test results.

[0019] Preferably, the temperature sensor and humidity sensor are electrically connected to the internal circuitry of the integrated control cabinet, and the temperature sensor and humidity sensor are electrically connected to the internal circuitry of the integrated control cabinet via a mating plate.

[0020] By adopting the above technical solution, the connection method between the temperature sensor, humidity sensor and integrated control cabinet is clarified, ensuring stable environmental data transmission, providing support for precise control and improving test accuracy.

[0021] Compared with the prior art, the beneficial effects of this utility model are: the aging test device for integrated circuits:

[0022] 1. This device achieves rapid adaptation and stable clamping of integrated circuits of different sizes by sliding the slide rail on the upper part of the test support platform with sliding clamp one and sliding clamp two, combined with the telescopic column of the multi-segment hydraulic telescopic structure inside sliding clamp one and the flexible clamp plate made of arc-shaped rubber plate. During use, the operator does not need to change the clamps, but only adjusts the position of the clamps and the telescopic column to fix chips of different specifications, shortening the adjustment time when changing test objects. At the same time, the conductive silicone layer on the inner wall of the flexible clamp plate ensures the stability of electrical contact and avoids physical damage to the chip, further optimizing the reliability of the test process.

[0023] 2. The docking plate on the side wall of the integrated control cabinet serves as a centralized connection hub, which organizes the cables of components such as temperature and humidity sensors in an orderly manner. Together with the cable limiter in the side heating rack, the cables are kept in order, reducing connection interference caused by messy cables. The snap-fit ​​connection between the test chamber shell and the support base, as well as the rectangular limit structure formed by the positioning mounting bracket and the slide rail, enhance the overall structural stability of the device, reduce the risk of loosening caused by thermal expansion and contraction of components under high temperature environment, and ensure the stability of signal transmission and power connection.

[0024] 3. The closed test chamber, consisting of the test chamber shell and the support base, combined with the side heating frame using a combination structure of ceramic frame and spiral heating wire, along with the signal interaction between the temperature control module and the control system in the integrated control cabinet, as well as the real-time monitoring and feedback from temperature and humidity sensors, achieves precise control of temperature and humidity within the test chamber, ensuring the consistency of the test environment and helping to more accurately evaluate the aging performance of the chip. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall external three-dimensional structure of this utility model;

[0026] Figure 2 This is a three-dimensional structural diagram showing the installation positions of the integrated control cabinet and test support platform of this utility model.

[0027] Figure 3This is a three-dimensional structural diagram of the flexible clamping plate and side heating frame of this utility model.

[0028] Figure 4 This is a schematic diagram of the overall internal side section of the present invention.

[0029] Figure 5 This is a three-dimensional structural diagram of the test support platform, sliding clamp one, and sliding clamp two of this utility model.

[0030] Figure 6 This is a three-dimensional structural diagram of the sliding clamp, side heating frame, and cable limiting frame of this utility model.

[0031] In the diagram: 1. Support base; 2. Integrated control cabinet; 3. Operation display panel; 4. Connecting plate; 5. Test support platform; 6. Sliding clamp one; 7. Telescopic column; 8. Flexible clamp; 9. Sliding clamp two; 10. Side heating frame; 11. Cable limiting frame; 12. Positioning mounting frame; 13. Test chamber shell; 14. Temperature sensor; 15. Humidity sensor. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] Please see Figures 1-6 This utility model provides a technical solution: an aging test device for integrated circuits, including a support base 1, an integrated control cabinet 2, an operation display panel 3, a docking plate 4, a test support platform 5, a sliding clamp 1 6, a telescopic column 7, a flexible clamp 8, a sliding clamp 2 9, a side heating frame 10, a cable limiting frame 11, a positioning mounting frame 12, a test chamber shell 13, a temperature sensor 14, and a humidity sensor 15;

[0034] Among them, the support base 1 is the overall support structure of the device. The top of the support base 1 is respectively installed with the integrated control cabinet 2 and the test support platform 5. The test support platform 5 is used to support the integrated circuit, and the integrated control cabinet 2 is the control and monitoring unit for monitoring the integrated circuit.

[0035] The upper surface of the support base 1 is provided with a groove that engages with the test chamber shell 13, and the upper surface of the test chamber shell 13 is provided with an observation window. The surface of the integrated control cabinet 2 is embedded with an operation display panel 3, and the side wall of the integrated control cabinet 2 is embedded with a docking plate 4. The docking plate 4 is connected to the temperature sensor 14 and the humidity sensor 15 respectively through cables, and the temperature sensor 14 and the humidity sensor 15 are installed on the upper end of the test chamber shell 13.

[0036] Referring to the attached diagrams in the instruction manual Figures 1-6 As shown, the support base 1 is placed on a horizontal working surface, and the integrated control cabinet 2 and the test support platform 5 are installed on its top. The operation display panel 3 is embedded in the surface of the integrated control cabinet 2, the docking plate 4 is embedded in the side wall, and the internal circuit connection is completed. The slide rails are symmetrically opened on the upper end of the test support platform 5, and the sliding clamp 1 6 and the sliding clamp 2 9 are slidably installed in the slide rails. The telescopic column 7 is installed in the sliding clamp 1 6, and the output end of the telescopic column 7 is docked with the flexible clamp 8.

[0037] The side heating frame 10 is installed on the surface of the sliding fixture 9 using a nested locking structure, ensuring that the cable limiting frame 11 inside the side heating frame 10 is in a regular position. Two positioning mounting frames 12 are installed on the upper end of the test support platform 5, so that they, together with the slide rail, form a rectangular structure surrounding the perimeter of the test support platform 5. Figures 2-3 As shown, the temperature sensor 14 and humidity sensor 15 are installed on the upper end of the test chamber housing 13 and connected to the docking plate 4 via cables. The bottom end of the test chamber housing 13 is then snapped into the groove on the upper surface of the support base 1 to form a closed test chamber.

[0038] The test support platform 5 has symmetrically arranged slide rails on its upper end, and sliding clamps 6 and 9 are slidably connected within the slide rails. Two positioning mounting brackets 12 are installed on the upper end of the test support platform 5, and the positioning mounting brackets 12 and the slide rails of the test support platform 5 together form a rectangle surrounding the test support platform 5. A telescopic column 7 is installed inside the sliding clamp 6, and the output end of the telescopic column 7 is connected to a flexible clamp 8. The telescopic column 7 is a multi-segment sliding hydraulic telescopic structure, and the flexible clamp 8 connected to the output end of the telescopic column 7 is an arc-shaped rubber plate, and a conductive silicone layer is pasted on the inner wall of the flexible clamp 8. The sliding clamp 9 is a sheet-like sliding frame, and the surface of the sliding clamp 9 is nested. A side heating frame 10 is snapped together, and cable limiting frames 11 are equidistantly provided inside the side heating frame 10. The side heating frame 10 includes a ceramic frame and a spiral heating wire, and the spiral heating wire is evenly wound inside the ceramic frame. The spiral heating wire is connected to an external power supply through a temperature control module. The temperature control module interacts with the control system signal in the integrated control cabinet 2. The bottom end of the test chamber shell 13 is snapped together with the upper end face of the support base 1. The test chamber shell 13 and the support base 1 form a test chamber. The temperature sensor 14 and the humidity sensor 15 are electrically connected to the internal circuit of the integrated control cabinet 2, and the temperature sensor 14 and the humidity sensor 15 are electrically connected to the internal circuit of the integrated control cabinet 2 through a docking plate 4.

[0039] Referring to the attached diagrams in the instruction manual Figures 1-6 As shown, the starting device and the support base 1 provide stable support for the whole. The operator sets parameters such as temperature, humidity and test duration through the operation display panel 3 of the integrated control cabinet 2.

[0040] Open the test chamber shell 13, place the integrated circuit to be tested on the test support platform 5, slide along the slide rail to adjust the position of sliding clamp 1 6 and sliding clamp 2 9, drive the flexible clamp 8 to hold the chip through the telescopic column 7, and the sliding clamp 2 9 restricts the position of the chip;

[0041] When the test chamber housing 13 is closed, the device enters the test state. Temperature sensor 14 and humidity sensor 15 collect environmental data inside the test chamber in real time, which is transmitted to the integrated control cabinet 2 via the docking plate 4 and displayed on the operation display panel 3. The spiral heating wire of the side heating rack 10 adjusts its power according to the data from the temperature sensor 14 through the temperature control module to maintain the set temperature. The cable limit rack 11 straightens the cable, while the positioning mounting rack 12 restricts the movement range of the fixture. The operator monitors the chip status through the observation window of the test chamber housing 13, and the integrated control cabinet 2 adjusts the parameters in real time until the test is completed and the aging performance of the integrated circuit is evaluated.

[0042] Working principle: When using this integrated circuit aging test device, the support base 1 supports the integrated control cabinet 2 and the test support platform 5. The operator sets parameters such as temperature, humidity and test duration through the operation display panel 3 on the surface of the integrated control cabinet 2.

[0043] Before testing, the integrated circuit is placed on the test support platform 5, and the sliding clamp 1 6 and sliding clamp 2 9 are slidably adjusted along the upper slide rail. The telescopic column 7 inside the sliding clamp 1 6 drives the flexible clamp 8 to hold the chip. The arc-shaped rubber plate and the conductive silicone layer ensure fixation and conductivity. The sliding clamp 2 9 slides to limit the position of the chip's side wall, and at the same time, the side heating frame 10 on the surface of the sliding clamp 2 9 contacts the chip.

[0044] During testing, the test chamber shell 13 engages with the support base 1 to form a closed test chamber. Temperature sensor 14 and humidity sensor 15 at the upper end transmit data to the integrated control cabinet 2 via cables through the docking plate 4, and the data is displayed on the operation display panel 3. The side heating rack 10 is fixed by sliding clamp 9, and its spiral heating wire adjusts its power according to the data from temperature sensor 14 via the temperature control module. Cable limiting bracket 11 straightens the cables, and positioning mounting bracket 12 and slide rail restrict the movement of the clamps. The operator monitors the process through the observation window of the test chamber shell 13, and the integrated control cabinet 2 adjusts parameters in real time to complete the aging test, increasing overall practicality.

[0045] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An aging test apparatus for integrated circuits, comprising: The support base (1) is the overall support structure of the device. The top of the support base (1) is respectively equipped with an integrated control cabinet (2) and a test support platform (5). The test support platform (5) is used to support the integrated circuit. The integrated control cabinet (2) is a control and monitoring unit for monitoring the integrated circuit. The feature is that: the surface of the integrated control cabinet (2) is fitted with an operation display panel (3), and the side wall of the integrated control cabinet (2) is fitted with a docking plate (4). The docking plate (4) is connected to the temperature sensor (14) and the humidity sensor (15) respectively through cables, and the temperature sensor (14) and the humidity sensor (15) are installed on the upper end of the test chamber shell (13). The test support platform (5) is symmetrically provided with slide rails at its upper end, and sliding clamp one (6) and sliding clamp two (9) are slidably connected in the slide rails of the test support platform (5). The sliding clamp one (6) is equipped with a telescopic column (7), and the output end of the telescopic column (7) is connected to the flexible clamp (8). The sliding clamp two (9) is a sheet-shaped sliding frame, and a side heating frame (10) is nested and engaged on the surface of the sliding clamp two (9). Cable limiting frames (11) are provided at equal intervals in the side heating frame (10).

2. The burn-in apparatus of claim 1, wherein: The upper surface of the support base (1) is provided with a groove that engages with the test chamber shell (13), and the upper surface of the test chamber shell (13) is provided with an observation window.

3. The integrated circuit burn-in apparatus of claim 1, wherein: Two positioning mounting brackets (12) are installed on the upper end of the test support platform (5), and the positioning mounting brackets (12) and the slide rail of the test support platform (5) together form a rectangle surrounding the test support platform (5).

4. The integrated circuit burn-in apparatus of claim 1, wherein: The telescopic column (7) is a multi-segment sliding hydraulic telescopic structure, and the flexible clamp (8) connected to the output end of the telescopic column (7) is an arc-shaped rubber plate, and the inner wall of the flexible clamp (8) is pasted with a conductive silicone layer.

5. The integrated circuit burn-in apparatus of claim 1, wherein: The side heating frame (10) includes a ceramic frame and a spiral heating wire, and the spiral heating wire is evenly wound around the inner side of the ceramic frame. The spiral heating wire is connected to an external power supply through a temperature control module, and the temperature control module interacts with the control system signal in the integrated control cabinet (2).

6. The integrated circuit burn-in apparatus of claim 1, wherein: The bottom end of the test chamber shell (13) is engaged and connected to the upper end face of the support base (1). The test chamber shell (13) and the support base (1) constitute a test chamber.

7. The integrated circuit burn-in apparatus of claim 1, wherein: The temperature sensor (14) and humidity sensor (15) are electrically connected to the internal circuit of the integrated control cabinet (2), and the temperature sensor (14) and humidity sensor (15) are electrically connected to the internal circuit of the integrated control cabinet (2) through the docking plate (4).

Images