An optical device substrate and PCB assembly jig and assembly system of an optical module

Abstract

The utility model discloses a kind of optical device substrate and PCB assembly fixture of optical module, including base, first push mechanism for clamping PCB, upper cover and second push mechanism for clamping optical device substrate;The fixed groove that is adapted with the PCB appearance is opened in the base, the first push mechanism is correspondingly arranged in one side of the fixed groove;The upper cover can be covered in the upper portion of the base, and it is connected with the base by the elastic locking mechanism of two ends setting;The second push mechanism is fixed in the lower portion of the upper cover, and the position of the second push mechanism is adapted with the optical device substrate placed on the PCB preset assembly site.This utility model further discloses a kind of optical module assembly system.The utility model has the beneficial effect that: using elastic locking mechanism connects upper cover and base, the quick assembly and disassembly of fixture can be realized, and assembly efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of optical module manufacturing technology, specifically to an optical device substrate and PCB assembly fixture and assembly system for an optical module. Background Technology

[0002] The optical component substrate of an optical module is used to mount optical components such as COC (Ceramic Components), FA (Fiber Optic Array), and Lens (Optical Lens). Currently, in the production of 800G OSFP optical modules, the PCB (Printed Circuit Board) and the optical component substrate of the optical module are... Figure 1 As shown in the attached figure (8 is the PCB and 9 is the optical device substrate), the assembly process of the two relies on manual operation for positioning, which has the following technical defects: 1. The clamping between the upper and lower covers of the fixture is done by screw locking. After the PCB and the optical device substrate are installed separately, quick clamping and disassembly cannot be achieved, resulting in poor operation convenience and low assembly efficiency; 2. The positioning of the optical device substrate and the PCB depends on the employee to manually move and align the edges, resulting in low positioning accuracy and poor product consistency.

[0003] Therefore, it is necessary to improve existing technologies. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing an optical module optical device substrate and PCB assembly fixture and assembly system, aiming to solve the problem of low assembly efficiency in existing technologies.

[0005] The technical solution adopted by this utility model is: an optical module optical device substrate and PCB assembly fixture, including a base, a first pushing mechanism for clamping the PCB, a top cover and a second pushing mechanism for clamping the optical device substrate; The base has a fixing groove that matches the shape of the PCB. The first pushing mechanism is located on one side of the fixed groove; The upper cover can be fitted onto the upper part of the base and is connected to the base through elastic locking mechanisms provided at both ends; The second pushing mechanism is fixedly mounted on the lower part of the upper cover, and the position of the second pushing mechanism is adapted to the optical device substrate placed on the preset assembly position of the PCB.

[0006] According to the above scheme, mounting grooves are respectively opened at both ends of the top cover, and the elastic locking mechanism is correspondingly arranged in the mounting groove; the elastic locking mechanism includes an L-shaped buckle and a locking spring; the two ends of the middle part of the vertical section of the buckle are rotatably connected to the top cover through a rotating shaft, and the upper part of the vertical section of the buckle is also elastically connected to the groove wall of the mounting groove through a locking spring; the horizontal section of the buckle is adapted to the buckle grooves opened at both ends of the base.

[0007] According to the above scheme, the second pushing mechanism includes a second push block and a second pushing spring; The top of the second push block is connected to the second cover plate fixed to the upper cover via the second push spring, and the lower outer side of the second push block is a working surface that contacts the corner of the optical device substrate.

[0008] According to the above scheme, the working surface of the second pusher is an inclined surface.

[0009] According to the above scheme, the lower part of the second cover plate is connected to a third push block by a third push spring. The third push block is located above the optical device substrate placed on the PCB assembly position, and the lower surface of the third push block is the working surface that contacts the optical device substrate.

[0010] According to the above scheme, the upper cover is provided with a first guide groove for guiding the second push block and a second guide groove for guiding the third push block. The second cover plate covers the first guide groove and the second guide groove, and the second cover plate is connected to the upper cover. The second push spring and the second push block are located in the first guide groove. The third push spring and the third push block are located in the second guide groove.

[0011] According to the above scheme, a slot for installing the first pushing mechanism is provided on the base on one side of the fixed slot; the first pushing mechanism includes a first pushing spring and a first pushing block; one side of the first pushing block is connected to the inner wall of the slot through the first pushing spring, and the other side of the first pushing block is a working surface that can contact the optical device substrate.

[0012] According to the above scheme, the slot is covered with a first cover plate, and the first cover plate is connected and fixed to the base; the top of the first push block is connected to a movable block, and the first cover plate is provided with a movable opening that is adapted to the movable block.

[0013] According to the above scheme, the upper cover is also provided with an operating hole corresponding to the position of the first pushing mechanism.

[0014] This utility model also employs an optical module assembly system, including the optical device substrate and PCB assembly fixture of the optical module as described above.

[0015] The beneficial effects of this utility model are as follows: 1. In this utility model, elastic locking mechanisms are designed at both ends of the upper cover. The upper cover and the base are connected by elastic locking mechanisms. Compared with the screw / bolt connection method in the prior art, this utility model can realize the quick loading and unloading of the clamp and improve the assembly efficiency.

[0016] 2. In this utility model, the elastic locking mechanism is also equipped with a locking spring. The return force of the locking spring limits the buckle, which can realize the quick locking of the top cover and the base, and improve the stability of the entire clamp.

[0017] 3. In this utility model, a second pusher and a third pusher are designed. The working surface of the second pusher is designed as an inclined surface. During the pressing down of the upper cover, the inclined surface can be used to push the corner of the light device substrate, thereby realizing automatic edge positioning and improving positioning accuracy. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the assembly of the PCB and the optical device substrate in the optical module.

[0019] Figure 2 This is a schematic diagram of the overall structure of Example 1.

[0020] Figure 3 This is an exploded view of Example 1.

[0021] Figure 4 for Figure 3 Enlarged diagram of point A in the diagram.

[0022] Figure 5 This is a schematic diagram of the second pusher block in Example 1.

[0023] Figure 6 This is a schematic diagram of the first pushing mechanism in Example 1.

[0024] Figure 7 This is a schematic diagram of the working state of the first and second pushing mechanisms in Example 1.

[0025] Figure 8 This is a schematic diagram of the elastic locking mechanism in Embodiment 1.

[0026] Figure 9 This is a schematic diagram of the base structure in Example 1.

[0027] The components include: 1. Base; 1.1 Fixing groove; 1.2 Snap-fit ​​groove; 2. Top cover; 2.1 First guide groove; 2.2 Mounting screw hole; 2.3 Second guide groove; 2.4 Operating hole; 3. Elastic locking mechanism; 3.1 Snap-fit; 3.2 Rotating shaft; 3.3 Locking screw; 3.4 Locking spring; 4. First cover plate; 4.1 Second push block; 4.1.1 Working surface of the second push block; 4.2 Third push block; 4.3 Second push spring; 4.4 Third push spring; 4.5 Second cover plate; 5. Positioning pin; 6. First push block; 6.1 Movable block; 7. First push spring; 8. PCB; 9. Optical component substrate. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0029] In the description of the embodiments of this application, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0030] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0031] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0032] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples, without contradiction. Additionally, the term "a plurality of" indicates two or more.

[0033] like Figures 2-3 The optical module optical device substrate and PCB assembly fixture shown includes a base 1, a first pushing mechanism for clamping PCB 8, an upper cover 2, and a second pushing mechanism for clamping optical device substrate 9. The base 1 has a fixing groove 1.1 that matches the shape of the PCB8 (for positioning and placing the PCB8). The first pushing mechanism is located on one side of the fixing groove 1.1 to push and clamp the PCB8 in the fixing groove 1.1 laterally. The upper cover 2 can be placed on the upper part of the base 1 and is detachably connected to the base 1 through the elastic locking mechanism 3 provided at both ends; The second pushing mechanism is fixedly mounted on the lower part of the upper cover 2, and the position of the second pushing mechanism is adapted to the optical device substrate 9 placed on the preset assembly position of the PCB8, for laterally pushing and clamping the optical device substrate 9 after the upper cover 2 is closed.

[0034] In this utility model, the fixing groove 1.1 is adapted to the shape of the PCB8 of the optical module. First, the PCB8 of the optical module is placed into the fixing groove 1.1 of the base 1, and the first pushing mechanism on the side completes the positioning and clamping of the PCB8. Then, the optical device substrate 9 of the optical module is placed on the preset assembly position of the PCB8. Subsequently, the upper cover 2 is fastened to the base 1, and the upper cover 2 and the base 1 are quickly locked by the elastic locking mechanism 3 at both ends. At this time, the second pushing mechanism at the lower part of the upper cover 2 simultaneously forms a lateral pushing and clamping fixation of the optical device substrate 9, and finally the assembly and positioning of the PCB8 and the optical device substrate 9 are completed.

[0035] Preferably, the upper cover 2 has mounting grooves at both ends, and the elastic locking mechanism 3 is correspondingly disposed in each mounting groove; like Figure 8 As shown, the elastic locking mechanism 3 includes an L-shaped buckle 3.1 and a locking spring 3.4; The two ends of the vertical section of the buckle 3.1 are rotatably connected to the upper cover 2 via a pivot 3.2, and the upper part of the vertical section is also elastically connected to the groove wall of the mounting groove via a locking spring 3.4; the horizontal section of the buckle 3.1 is adapted to the buckle grooves 1.2 opened at both ends of the base 1.

[0036] In this invention, two symmetrical latches 3.1 are provided on both sides of the upper cover 2, and a corresponding latch groove 1.2 is provided on the base 1. During assembly, the latches 3.1 are limited by the return force of the locking spring 3.4 (the locking spring 3.4 is in a compressed state, and when it returns, it pushes the upper end of the vertical section of the latch 3.1 outward, thereby pressing the lower end of the latch 3.1 inward with the latch groove 1.2 of the base 1), thus achieving quick locking of the upper cover 2 and the base 1. The end of the rotating shaft 3.2 is locked by a locking set screw 3.3.

[0037] Preferably, the base 1 on one side of the fixing groove 1.1 has a slot for installing the first pushing mechanism; like Figure 6 , 7 As shown in Figures 9 and 1, the first pushing mechanism includes a first pushing spring 7 and a first pushing block 6; One side of the first push block 6 is connected to the inner wall of the slot through the first push spring 7, and the other side of the first push block 6 is the working surface, which can contact the side of the PCB8 placed in the fixed slot 1.1.

[0038] Preferably, the working surface of the first pusher 6 is an inclined surface, and it is inclined downward in the direction away from PCB8.

[0039] Preferably, the slot is covered by a first cover plate 4, which is fixedly connected to the base 1 by bolts; the top of the first push block 6 is fixedly connected to a movable block 6.1 that moves with the first push block 6, and the first cover plate 4 is provided with a movable opening that matches the movable block 6.1.

[0040] In this utility model, the first push block 6 of the first push mechanism pushes and clamps the PCB8 placed in the fixing groove 1.1 to fix it; the first push spring 7 provides clamping force to adapt to the size deviation of the PCB8.

[0041] Preferably, such as Figure 4 , 5 As shown in Figures 7 and 8, the second pushing mechanism includes a second push block 4.1 and a second push spring 4.3; The top of the second push block 4.1 is connected to the second cover plate 4.5 fixed to the upper cover 2 via the second push spring 4.3. The lower outer side of the second push block 4.1 is the working surface 4.1.1 that contacts the corner of the optical device substrate 9. The working surface 4.1.1 of the second push block 4.1 is an inclined surface.

[0042] Preferably, such as Figure 4 and Figure 7 As shown, the lower part of the second cover plate 4.5 is connected to a third push block 4.2 via a third push spring 4.4. The third push block 4.2 is located above the optical device substrate 9 placed on the PCB8 assembly position, and the lower surface of the third push block 4.2 is the working surface that contacts the optical device substrate 9.

[0043] In this invention, when the upper cover 2 is fastened onto the base 1, the lower surface of the third push block 4.2, which is connected to the third push spring 4.4, first contacts and pre-presses the optical device substrate 9. Then, the inclined working surface 4.1.1 of the second push block 4.1, which is connected to the second push spring 4.3 on its side, pushes the corner of the optical device substrate 9 to achieve edge positioning. The position of the working surface 4.1.1 of the second push block 4.1 is determined according to the assembly position of the optical device substrate 9. When the upper cover 2 is fully fastened onto the base 1, the working surface 4.1.1 of the second push block 4.1 pushes the optical device substrate 9 to the set assembly position.

[0044] In this utility model, the upper cover 2 has a first guide groove 2.1 for guiding the second push block 4.1 and a second guide groove 2.3 for guiding the third push block 4.2. The second cover plate 4.5 covers the first guide groove 2.1 and the second guide groove 2.3, and the second cover plate 4.5 is connected to the upper cover 2 by bolts (the upper cover 2 has corresponding mounting screw holes 2.2). The second push spring 4.3 and the second push block 4.1 are located in the first guide groove 2.1 and can move vertically within the first guide groove 2.1. The third push spring 4.4 and the third push block 4.2 are located in the second guide groove 2.3 and can move vertically within the second guide groove 2.3.

[0045] Preferably, the upper cover 2 is also provided with an operation hole 2.4 corresponding to the position of the first pushing mechanism, so as to facilitate the operation of the first pushing block 6 through the movable block 6.1.

[0046] Preferably, such as Figure 9 As shown, the base 1 is provided with a positioning pin 5, and the upper cover 2 is provided with a positioning hole that matches the positioning pin 5.

[0047] In this utility model, there are no fewer than two positioning pins 5 on the base 1; the positioning pins 5 are adapted to the positioning holes, which facilitates the fastening and positioning of the upper cover 2 and the base 1.

[0048] In this invention, the optical device substrate 9 can be made of tungsten copper material or iron-nickel alloy material.

[0049] Example 1 An optical module optical device substrate and PCB assembly fixture is provided on its base 1, which has only one fixing slot 1.1 for placing the optical module PCB8. The fixing slot 1.1 is equipped with a first pushing mechanism and a second pushing mechanism, which can assemble a set of optical module PCB8 and optical device substrate 9.

[0050] Example 2 The difference between this embodiment and Embodiment 2 is as follows: Figure 1 As shown, the base 1 is provided with 5 fixing slots 1.1 for placing optical module PCB8. Each positioning slot is equipped with a first pushing mechanism and a second pushing mechanism, which can simultaneously assemble 5 sets of optical module PCB8 and optical device substrate 9.

[0051] The working process of Example 2 is as follows: 1. Place PCB8 into base 1: Push the first push block 6 away from the fixing groove 1.1 (at this time, the first push spring 7 is compressed) to place each PCB8 into the fixing groove 1.1 of base 1 respectively, and use the first push spring 7 to reset and drive the first push block 6 to push the side of the PCB8 to achieve clamping and fixing; 2. PCB8 dispensing: Place the base 1 containing PCB8 into the dispensing equipment and complete the dispensing operation on PCB8; 3. Assembly of optical device substrate 9 and PCB8: Place the optical device substrate 9 on the corresponding assembly position of the PCB8 that has been glued; 4. Assembly of the upper cover 2 and the base 1: The upper cover 2 is assembled and locked onto the base 1 by the elastic locking mechanism 3 at both ends. At the same time, the third push block 4.2 pre-tightens the optical device substrate 9, and the working surface 4.1.1 of the second push block 4.1 pushes the corner of the optical device substrate 9, so that the optical device substrate 9 moves to the set assembly position and completes the positioning. 5. Oven baking and curing: Place the assembled base 1 and top cover 2 into the oven to cure the adhesive between PCB8 and optical device substrate 9; 6. Unloading: Open the buckle 3.1 of the elastic locking mechanism 3, remove the top cover 2 and disassemble the clamp, and take out the cured finished product.

[0052] Example 3 An optical module assembly system includes an optical device substrate and a PCB assembly fixture for the optical module as described above.

[0053] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0054] Finally, it should be noted that the above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An optical device substrate and PCB assembly jig for an optical module, characterized by, It includes a base, a first pushing mechanism for clamping the PCB, a top cover, and a second pushing mechanism for clamping the optical device substrate; The base has a fixing groove that matches the shape of the PCB; The first pushing mechanism is located on one side of the fixed groove; The upper cover fits onto the upper part of the base and is connected to the base by elastic locking mechanisms at both ends; The second pushing mechanism is fixedly mounted on the lower part of the upper cover, and the position of the second pushing mechanism is adapted to the optical device substrate placed on the preset assembly position of the PCB.

2. The optical device substrate and PCB assembly jig for optical modules of claim 1, wherein, The top cover has mounting grooves at both ends, and the elastic locking mechanism is correspondingly located in the mounting grooves. The elastic locking mechanism includes an L-shaped buckle and a locking spring. The two ends of the vertical section of the buckle are rotatably connected to the top cover via a pivot, and the upper part of the vertical section of the buckle is also elastically connected to the groove wall of the mounting groove via a locking spring. The horizontal section of the buckle is adapted to the buckle grooves at both ends of the base.

3. The optical device substrate and PCB assembly jig for optical modules of claim 1, wherein, The second pushing mechanism includes a second push block and a second push spring; The top of the second push block is connected to the second cover plate fixed to the upper cover via the second push spring, and the lower outer side of the second push block is a working surface that contacts the corner of the optical device substrate.

4. The optical device substrate and PCB assembly jig for optical modules of claim 3, wherein, The working surface of the second pusher is an inclined surface.

5. The optical device substrate and PCB assembly jig for optical modules of claim 3, wherein, The lower part of the second cover plate is connected to a third push block via a third push spring. The third push block is located above the optical device substrate placed on the PCB assembly position, and the lower surface of the third push block is the working surface that contacts the optical device substrate.

6. The optical device substrate and PCB assembly jig for optical modules of claim 5, wherein, The upper cover has a first guide groove for guiding the second push block and a second guide groove for guiding the third push block. The second cover plate covers the first guide groove and the second guide groove, and the second cover plate is connected to the upper cover. The second push spring and the second push block are located in the first guide groove. The third push spring and the third push block are located in the second guide groove.

7. The optical device substrate and PCB assembly jig for optical modules of claim 1, wherein, A slot for mounting the first pushing mechanism is provided on the base on one side of the fixed slot; the first pushing mechanism includes a first pushing spring and a first pushing block; One side of the first pusher is connected to the inner wall of the slot through the first push spring, and the other side of the first pusher is the working surface that contacts the optical device substrate.

8. The optical device substrate and PCB assembly jig for optical modules of claim 7, wherein, The slot is covered by a first cover plate, which is fixedly connected to the base; the top of the first push block is connected to a movable block, and the first cover plate is provided with a movable opening that is adapted to the movable block.

9. The optical device substrate and PCB assembly jig for optical modules of claim 7, wherein, The upper cover also has an operating hole corresponding to the position of the first pushing mechanism.

10. An optical module assembly system characterized by comprising: Includes the optical device substrate and PCB assembly fixture of the optical module as described in any one of claims 1 to 9.

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