A packaging apparatus for semiconductor discrete device manufacturing

Abstract

The utility model discloses a kind of packaging devices for semiconductor discrete device manufacturing, the utility model relates to packaging technical field, including bottom plate, the upper end surface of bottom plate is provided with transmission assembly and packaging assembly, transmission assembly includes carousel, jaw, limit board and pivot, the inner wall of carousel is connected with the surface of pivot, the side of jaw is rotatably connected with the side of carousel, the inner wall of jaw is slidably connected with the side of limit board, the side of bottom plate is connected with servo motor, the utility model has the advantages that: through servo motor drive pivot drives carousel rotation, jaw rotates synchronously on carousel, can be sequentially transported to packaging, drying and other stations to be packaged device, realize the continuous operation from feeding, packaging to discharging, reduce manual intervention, improve production rhythm, electric telescopic link drives moulding box accurate closure by connecting frame and connecting rod, replace traditional manual moulding, shorten packaging operation time, adapt to batch production demand.

Description

Technical Field

[0001] This utility model relates to the field of packaging technology, specifically to a packaging device for manufacturing semiconductor discrete devices. Background Technology

[0002] Semiconductor discrete devices generally refer to semiconductor crystal diodes, semiconductor transistors (abbreviated as transistors), transistors, and special semiconductor devices. Since the manufacturing of semiconductor discrete devices usually requires packaging, packaging equipment becomes very important.

[0003] Existing technologies may rely heavily on manual operations, such as manual feeding, manual mold closing and packaging, and manual transfer to drying equipment. The lack of continuity between processes leads to a slow production pace and makes it difficult to meet the needs of mass production. To address this, we propose a packaging device for manufacturing semiconductor discrete devices. Utility Model Content

[0004] The purpose of this invention is to provide a packaging device for manufacturing discrete semiconductor devices.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a packaging device for manufacturing semiconductor discrete devices, comprising a base plate, wherein a transmission assembly and a packaging assembly are disposed on the upper end surface of the base plate;

[0006] The transmission assembly includes a turntable, grippers, a limiting plate, and a rotating shaft. The inner wall of the turntable is connected to the surface of the rotating shaft, the side of the grippers is rotatably connected to the side of the turntable, and the inner wall of the grippers is slidably connected to the side of the limiting plate.

[0007] The encapsulation assembly includes a fixed plate, an electric telescopic rod, a connecting rod, a connecting frame, and a mold box. The telescopic end of the electric telescopic rod is connected to the side of the connecting frame. One end of the connecting rod is rotatably connected to the side of the fixed plate, and the other end of the connecting rod is rotatably connected to the side of the mold box. The side of the mold box is rotatably connected to the inner wall of the connecting frame.

[0008] As a further embodiment of this utility model: a servo motor is connected to the side of the base plate, and the output end of the servo motor passes through the inner wall of the base plate and is connected to one end of the rotating shaft.

[0009] As a further embodiment of this utility model: the rotating shaft is rotatably connected to the inner wall of the base plate, and a first spring is connected between every two opposing grippers.

[0010] As a further embodiment of this utility model: the lower end face of the limiting plate is connected to the upper end face of the base plate, and a storage box is connected to the side of the limiting plate.

[0011] As a further embodiment of this utility model: a placement frame is connected to the upper end face of the base plate, a baffle is rotatably connected to the upper end face of the base plate, and a second spring is connected to the side of the base plate, with one end of the second spring connected to the side of the baffle.

[0012] As a further embodiment of this utility model: the lower end face of the fixing plate is connected to the upper end face of the base plate, and one end of the electric telescopic rod is connected to the side of the fixing plate.

[0013] As a further embodiment of this utility model: a drying box is connected to the side of the base plate, and the side of the turntable is disposed inside the drying box.

[0014] Compared with the prior art, the beneficial effects of this utility model by adopting the above technical solution are as follows:

[0015] 1. This utility model uses a servo motor to drive the rotating shaft to rotate the turntable, and the grippers rotate synchronously on the turntable. It can sequentially transport the devices to be packaged to the packaging, drying and other workstations, realize continuous operation from feeding, packaging to unloading, reduce manual intervention, improve production speed, and the electric telescopic rod drives the mold box to close precisely through the connecting frame and connecting rod, replacing the traditional manual mold closing, shortening the packaging operation time, and adapting to the needs of mass production.

[0016] 2. The gripper of this utility model maintains the initial clamping state through the first spring, and with the guiding effect of the limiting plate, it automatically opens when picking up the material and automatically clamps after picking up the material, ensuring that the device is not easy to fall off during the transportation process and reducing the impact of positional deviation on the packaging accuracy.

[0017] Other advantages, objectives and features of this invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination or study, or may be taught from the practice of this invention. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall embodiment of the present utility model;

[0019] Figure 2 This is a schematic diagram of the rotating shaft in an embodiment of the present utility model;

[0020] Figure 3 This is a schematic diagram of the turntable in an embodiment of the present utility model;

[0021] Figure 4 This is a schematic diagram of the drying box in an embodiment of the present invention;

[0022] Figure 5 This is a schematic diagram of the connecting rod in an embodiment of the present invention.

[0023] In the diagram: 1. Base plate; 2. Transmission assembly; 21. Turntable; 22. Gripper; 23. First spring; 24. Storage box; 25. Limiting plate; 26. Placement rack; 27. Servo motor; 28. Rotating shaft; 29. ​​Baffle; 210. Second spring; 3. Drying oven; 4. Packaging assembly; 41. Fixing plate; 42. Electric telescopic rod; 43. Connecting rod; 44. Connecting frame; 45. Mold box. Detailed Implementation

[0024] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings. It should be noted that the description of these embodiments is for the purpose of helping to understand this utility model, but does not constitute a limitation on this utility model.

[0025] Furthermore, the technical features involved in the various embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0026] Please see the appendix Figure 1 -Appendix Figure 5 The present invention provides a packaging device for manufacturing semiconductor discrete devices, including a base plate 1, wherein a transmission assembly 2 and a packaging assembly 4 are disposed on the upper end surface of the base plate 1.

[0027] In embodiment 1, the transmission assembly 2 includes a turntable 21, grippers 22, a limiting plate 25, and a rotating shaft 28. The inner wall of the turntable 21 is connected to the surface of the rotating shaft 28. The side of the grippers 22 is rotatably connected to the side of the turntable 21. The inner wall of the grippers 22 is slidably connected to the side of the limiting plate 25. A servo motor 27 is connected to the side of the base plate 1. The output end of the servo motor 27 passes through the inner wall of the base plate 1 and is connected to one end of the rotating shaft 28. The rotating shaft 28 is rotatably connected to the inner wall of the base plate 1. A first spring 23 is connected between every two opposing grippers 22. The lower end face of the limiting plate 25 is connected to the upper end face of the base plate 1. A storage box 24 is connected to the side of the limiting plate 25. A placement rack 26 is connected to the upper end face of the base plate 1. A baffle 29 is rotatably connected to the upper end face of the base plate 1. A second spring 210 is connected to the side of the base plate 1. One end of the second spring 210 is connected to the side of the baffle 29.

[0028] Specifically, the first spring 23 connecting each pair of opposing grippers 22 provides an inward elastic force when the grippers 22 are not in contact with the limiting plate 25, keeping the grippers 22 in a clamped state. When the grippers 22 rotate with the turntable 21 to the vicinity of the placement rack 26, the inner wall of the grippers 22 slides into contact with the side of the limiting plate 25. The side of the limiting plate 25 is designed with an inclined or arc-shaped structure, forcing the grippers 22 to overcome the elastic force of the first spring 23 and open outward, thus successfully clamping the device to be packaged on the placement rack 26. When the grippers 22 leave the area of ​​the limiting plate 25, the elastic force of the first spring 23 will... The gripper 22 clamps again to ensure that the device is stable and does not fall off during the transport process. The storage box 24 connected to the side of the limiting plate 25 is used to collect the packaged device. When the gripper 22 carries the packaged device and rotates to the top of the storage box 24, the gripper 22 contacts the limiting plate 25 again and opens. The device falls into the storage box 24 under the action of gravity. The baffle 29 rotatably connected to the bottom plate 1 is kept in a state of abutting against the side of the turntable 21 under the elastic force of the second spring 210, which can prevent the device from accidentally falling off the edge of the turntable 21 during the transport process, and play a protective and limiting role.

[0029] In embodiment 2, the packaging component 4 includes a fixed plate 41, an electric telescopic rod 42, a connecting rod 43, a connecting frame 44, and a mold box 45. The telescopic end of the electric telescopic rod 42 is connected to the side of the connecting frame 44. One end of the connecting rod 43 is rotatably connected to the side of the fixed plate 41, and the other end of the connecting rod 43 is rotatably connected to the side of the mold box 45. The side of the mold box 45 is rotatably connected to the inner wall of the connecting frame 44. The lower end face of the fixed plate 41 is connected to the upper end face of the base plate 1. One end of the electric telescopic rod 42 is connected to the side of the fixed plate 41. The side of the base plate 1 is connected to the drying box 3, and the side of the turntable 21 is located inside the drying box 3.

[0030] Specifically, in the encapsulation assembly 4, when the telescopic end of the electric telescopic rod 42 pushes the connecting frame 44 to move, since one end of the connecting rod 43 is rotatably connected to the fixed plate 41 and the other end is rotatably connected to the mold box 45, and the mold box 45 is rotatably connected to the inner wall of the connecting frame 44, the movement of the connecting frame 44 will drive the mold box 45 to rotate around the connection point between the connecting rod 43 and the fixed plate 41 as the fulcrum, realizing the opening and closing action of the mold box 45. This multi-link structure design can make the movement of the mold box 45 more stable and precise, ensure the alignment of the upper and lower molds, and improve the encapsulation quality. The drying box is connected to the side of the base plate 1. The internal structure of the drying chamber 3 is equipped with a heating element. When the packaged device rotates with the turntable 21 into the drying chamber 3, the drying chamber 3 can heat and dry the packaging material (such as packaging glue) on the surface of the device, accelerate the curing of the packaging material, enhance the packaging effect, and eliminate the need for a separate drying process, thereby improving production efficiency. The lower end face of the fixing plate 41 is connected to the base plate 1, providing a stable support point for the electric telescopic rod 42 and the connecting rod 43, ensuring that the electric telescopic rod 42 will not shake during operation, and the rotation of the connecting rod 43 can also be kept stable based on this reference, thereby ensuring the movement accuracy of the mold box 45.

[0031] Working principle:

[0032] First, the discrete semiconductor device to be packaged is placed on the placement rack 26 and fed to the gripper 22 on the edge of the turntable 21 by manual or automatic feeding. The gripper 22 is initially held in place by the elastic force of the first spring 23. When the device enters the inside of the gripper 22, the turntable 21 rotates and drives the gripper 22 to move. The side of the limiting plate 25 slides in contact with the inner wall of the gripper 22. The gripper 22 gradually opens due to the guiding action of the limiting plate 25. The servo motor 27 starts and its output drives the rotating shaft 28 to rotate, which in turn causes the turntable 21 fixed on the rotating shaft 28 to rotate synchronously. When the gripper 22 separates from the limiting plate 25, the gripper 22 can clamp the device placed on the placement rack 26. The device clamped by the gripper 22 rotates with the turntable 21 and passes through the packaging station, drying station, etc. in sequence to achieve continuous conveying.

[0033] When the device is conveyed to the bottom of the packaging assembly 4, the electric telescopic rod 42 is activated, and its telescopic end pushes the connecting frame 44 to move. The connecting frame 44 drives the mold box 45 to move. At the same time, the connecting rod 43 rotates around the fixed plate 41 as the fulcrum, assisting the mold box 45 to close accurately and perform the packaging operation on the internal device. After the packaging is completed, the electric telescopic rod 42 retracts, the mold box 45 opens and resets, and the packaged device continues to rotate with the turntable 21 and enters the drying oven 3. The heating function of the drying oven 3 cures the packaging material (such as resin) to ensure a firm packaging. After drying, the device moves with the turntable 21 to the vicinity of the storage box 24. At this time, the gripper 22 contacts the limiting plate 25 again. Under the restriction of the limiting plate 25, the gripper 22 releases the device, and the device falls into the storage box 24 under the action of gravity to complete the collection and unloading. At this point, the entire workflow is completed.

[0034] The terms "front," "back," "left," "right," "top," and "bottom" all refer to the figures in the accompanying drawings. Figure 1 Based on.

[0035] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of this utility model.

[0036] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments.

[0037] For those skilled in the art, various changes, modifications, substitutions, and alterations to these embodiments without departing from the principles and spirit of this utility model will still fall within the protection scope of this utility model.

Claims

1. A packaging apparatus for manufacturing semiconductor discrete devices, comprising a base plate (1), characterized in that: The upper surface of the base plate (1) is provided with a transmission assembly (2) and an encapsulation assembly (4); The transmission assembly (2) includes a turntable (21), a gripper (22), a limiting plate (25), and a rotating shaft (28). The inner wall of the turntable (21) is connected to the surface of the rotating shaft (28), the side of the gripper (22) is rotatably connected to the side of the turntable (21), and the inner wall of the gripper (22) is slidably connected to the side of the limiting plate (25). The encapsulation assembly (4) includes a fixed plate (41), an electric telescopic rod (42), a connecting rod (43), a connecting frame (44), and a mold box (45). The telescopic end of the electric telescopic rod (42) is connected to the side of the connecting frame (44). One end of the connecting rod (43) is rotatably connected to the side of the fixed plate (41), and the other end of the connecting rod (43) is rotatably connected to the side of the mold box (45). The side of the mold box (45) is rotatably connected to the inner wall of the connecting frame (44).

2. The packaging apparatus for a semiconductor discrete device manufacturing according to claim 1, wherein: A servo motor (27) is connected to the side of the base plate (1), and the output end of the servo motor (27) passes through the inner wall of the base plate (1) and is connected to one end of the rotating shaft (28).

3. The packaging apparatus for a semiconductor discrete device manufacturing according to claim 1, wherein: The rotating shaft (28) is rotatably connected to the inner wall of the base plate (1), and a first spring (23) is connected between every two opposing grippers (22).

4. The packaging apparatus for a semiconductor discrete device manufacturing according to claim 1, wherein: The lower end face of the limiting plate (25) is connected to the upper end face of the base plate (1), and a storage box (24) is connected to the side of the limiting plate (25).

5. The packaging apparatus for a semiconductor discrete device manufacturing according to claim 1, wherein: The upper end face of the base plate (1) is connected to a placement rack (26), and the upper end face of the base plate (1) is rotatably connected to a baffle (29). The side face of the base plate (1) is connected to a second spring (210), and one end of the second spring (210) is connected to the side face of the baffle (29).

6. The packaging apparatus for a semiconductor discrete device manufacturing according to claim 1, wherein: The lower end face of the fixed plate (41) is connected to the upper end face of the base plate (1), and one end of the electric telescopic rod (42) is connected to the side of the fixed plate (41).

7. The packaging apparatus for semiconductor discrete device manufacturing according to claim 1, wherein: The side of the base plate (1) is connected to the drying box (3), and the side of the turntable (21) is located inside the drying box (3).

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