An integrated circuit chip packaging structure facilitating heat dissipation

Abstract

This utility model discloses an integrated circuit chip packaging structure that facilitates heat dissipation, relating to the field of semiconductor packaging heat dissipation technology, and solves the problem of performance degradation caused by insufficient heat dissipation in high-power chips. The structure includes a chip core, a composite packaging shell, a gradient heat dissipation assembly, and composite heat dissipation pillars. The packaging shell consists of an inner heat-conducting shell, an outer heat dissipation shell, and an annular vacuum insulation cavity. An annular heat pipe is embedded in the cavity, with the evaporation section attached to the inner shell and the condensation section connected to fins. A copper-based heat sink, a graphene film, and an indium foil flexible layer are sequentially stacked on top of the chip, and filled with columnar heat conductors and phase-change thermal paste. Copper-aluminum composite heat dissipation pillars are inserted into the honeycomb holes at the bottom of the support platform, and corrugated heat sinks are connected externally. This solution achieves rapid heat dissipation and uniform heat dissipation from the chip through multi-stage heat conduction, phase-change heat storage, vacuum insulation, and constant pressure from elastic plates, significantly reducing the operating temperature and improving chip performance, reliability, and lifespan.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip packaging technology, and more specifically to an integrated circuit chip packaging structure that facilitates heat dissipation. Background Technology

[0002] Currently, integrated circuit chip packaging generally adopts a structure with a single metal or plastic shell and a heat sink mounted on the surface. This results in a short heat dissipation path and a small heat conduction area, making it difficult to meet the instantaneous high heat flux density requirements of high-power chips such as 5G and AI. While some high-end solutions incorporate heat pipes or vapor chambers, the piping and packaging are layered, leading to high interface thermal resistance, bulky size, and a lack of simultaneous heat dissipation methods for the back and edges of the chip. In existing technologies, the heat sink and chip are only filled with thermal grease. After long-term thermal cycling, the grease dries and cracks, and the interface contact deteriorates, causing a sharp increase in thermal resistance. Simultaneously, traditional packaging lacks thermal insulation structures, allowing heat to easily flow back to the PCB, affecting the reliability of surrounding components. To address the aforementioned shortcomings, this invention proposes an overall technical solution of "composite cavity + gradient heat dissipation component + honeycomb composite heat dissipation column": an annular vacuum insulation cavity is set between the inner heat-conducting shell and the outer heat dissipation shell to block reverse heat transfer; the annular heat pipe and radial fins are integrated and welded together to achieve efficient end heat dissipation; the copper-based heat dissipation plate, graphene film, indium foil flexible layer and phase change thermal paste on the top of the chip form a gradient heat storage-conducting path; the elastic pressure plate provides a constant pressure of 5-8N to maintain a tight interface over a long period of time; the copper-aluminum composite heat dissipation column in the honeycomb holes at the bottom of the support platform directly connects to the recess on the back of the chip to form a third heat dissipation channel that penetrates the package, thereby solving the problems of low heat dissipation efficiency, interface aging, heat reflow and excessive size of traditional packaging. Utility Model Content

[0003] The purpose of this invention is to address the problems of single heat dissipation path, high interface thermal resistance, and heat reflow in existing packaging. This invention achieves low thermal resistance and long lifespan heat dissipation for high-power chips through a collaborative design of "composite cavity - gradient heat dissipation - honeycomb back cooling": A ring-shaped vacuum insulation cavity is set between the inner heat-conducting shell and the outer heat dissipation shell to block heat reflow to the PCB; the evaporation section of the ring-shaped heat pipe is closely attached to the inner shell, and the condensation section is welded to the radial fins to form a highly efficient end heat dissipation without interface thermal resistance; the gradient heat dissipation component on the top of the chip is composed of a copper-based heat sink, a graphene film, and an indium foil flexible layer, which absorbs heat transiently with phase change thermal paste, and a beryllium copper elastic pressure sheet provides a constant pressure of 5-8N to maintain a tight thermal interface over a long period of time; the composite heat dissipation pillar in the honeycomb heat dissipation holes uses a central copper pillar to cooperate with the concave ball-and-socket structure on the back of the chip, and conducts heat to the aluminum heat sink and corrugated heat sink through the thermally conductive silicone layer, constructing a third heat dissipation channel that runs through the package. This solves the drawbacks of low heat dissipation efficiency, interface aging, heat reflow, and bulky size of traditional packaging, significantly reduces chip temperature rise, and improves system reliability and lifespan.

[0004] To achieve the above-mentioned technical effects, the present invention adopts the following technical solution:

[0005] An integrated circuit chip packaging structure for easy heat dissipation includes a chip core, a packaging shell encapsulating the chip, and metal leads connecting the chip. The chip core is fixed to a carrier platform of the packaging shell using thermally conductive adhesive. One end of the metal lead is bonded to the chip, and the other end extends to the outside of the packaging shell. The packaging shell is a composite cavity structure, including an inner thermally conductive shell and an outer heat dissipation shell. The surface of the inner thermally conductive shell is densely covered with conical heat dissipation bumps, forming radial air channels between the bumps. An annular vacuum insulation cavity is provided between the inner and outer layers. An annular heat pipe is embedded in the inner sidewall of the cavity. The evaporation section of the heat pipe is attached to the inner thermally conductive shell, and the condensation section is connected to... The outer surface of the outer heat sink has fins; the top of the chip core is covered with a gradient heat dissipation assembly, which consists of an upper copper-based heat sink, a middle graphene film, and a lower indium foil flexible layer. The bottom of the copper-based heat sink has columnar heat conductors corresponding to the chip's heat-generating area, and phase-change thermal paste is filled between the columnar bodies. The edge of the copper-based heat sink is connected to the packaging shell through an elastic pressure sheet; the bottom of the support platform has honeycomb-shaped heat dissipation holes, and composite heat dissipation columns are inserted into the holes. The heat dissipation column consists of a central copper column and an outer aluminum heat dissipation sleeve. The surface of the aluminum heat dissipation sleeve has spiral heat dissipation grooves, and the bottom extends out of the packaging shell and is connected to a corrugated heat dissipation fin.

[0006] The annular heat pipe has a flat tube structure, with a copper wire mesh wick inside. The working fluid is an acetone-nanodiamond mixture, and the curved section of the heat pipe adopts a corrugated pipe structure.

[0007] The gradient heat dissipation component has a serrated interlocking surface between the copper-based heat sink and the graphene film. The interlocking surface is fitted with silver thermally conductive rivets, which penetrate both layers and have their ends in contact with the copper-based heat sink and the indium foil flexible layer, respectively.

[0008] The phase change thermal paste is a composite paraffin-based material containing a carbon fiber thermal conductive mesh. Its phase change temperature range is 50-60℃, and its solidification point is below 40℃.

[0009] The elastic pressure plate is made of beryllium copper and is distributed in a ring around the edge of the gradient heat dissipation component. One end of the pressure plate is fixed to the packaging shell by rivets, and the other end is provided with an arc-shaped pressure head to abut against the copper-based heat dissipation plate. The pre-tightening force of the pressure plate in its natural state is 5-8N.

[0010] The composite heat sink has a hemispherical contact head at the top of the central copper pillar, which is adapted to the recess on the back of the chip core. An annular thermally conductive silicone layer is provided between the copper pillar and the aluminum heat sink sleeve.

[0011] The outer surface of the outer heat dissipation shell has radially arranged fins, with triangular baffles at the ends of the fins. The spacing between adjacent fins is 2-3 mm, and the roots of the fins are welded to the condensation section of the annular heat pipe.

[0012] The positive and beneficial technical effects of this utility model are as follows:

[0013] This invention employs an integrated solution of "composite cavity—gradient heat dissipation—honeycomb back cooling," simultaneously addressing the problems of short heat dissipation paths, small thermal conductivity, high interfacial thermal resistance, heat reflow, and bulky size inherent in traditional packaging. The composite cavity incorporates a vacuum insulation chamber to block heat reflow to the PCB; the annular heat pipe is directly welded to the radial fins, achieving near-zero thermal resistance at the ends and instantaneously dissipating high heat flux. The gradient heat dissipation component on the chip top utilizes a three-stage thermal conductivity system: a copper-based heat sink, a graphene film, and an indium foil flexible layer. Combined with 50-60℃ phase-change thermal paste and a 5-8N constant-pressure elastic pressure plate, it maintains low thermal resistance contact over the long term, preventing thermal grease from drying out. The copper-aluminum composite heat sink columns and recesses within the honeycomb holes adhere to the chip's back recesses, forming a third heat dissipation channel that penetrates the package, significantly improving heat dissipation efficiency. The overall solution reduces chip temperature rise by over 20%, decreases volume by 15%, and significantly improves system reliability and lifespan. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0015] Figure 1 This is an overall structural diagram of an integrated circuit chip packaging structure that facilitates heat dissipation according to this utility model;

[0016] Figure 2 This is a structural diagram of the package shell of an integrated circuit chip that facilitates heat dissipation, according to the present invention.

[0017] Figure 3 This is a structural diagram of a gradient heat dissipation component for an integrated circuit chip packaging structure that facilitates heat dissipation, according to the present invention.

[0018] Figure 4 This is a diagram of an elastic compression structure for an integrated circuit chip packaging structure that facilitates heat dissipation, according to the present invention.

[0019] Figure 5 This is a diagram of the heat dissipation structure at the bottom of the support platform for an integrated circuit chip packaging structure that facilitates heat dissipation, according to this utility model.

[0020] Figure 6 This utility model presents a ring-shaped heat pipe structure for an integrated circuit chip packaging structure that facilitates heat dissipation.

[0021] Figure 7 This is a diagram of the recessed structure of an integrated circuit chip packaging structure that facilitates heat dissipation, according to the present invention.

[0022] In the diagram: 1. Chip core; 2. Package shell; 3. Metal pins; 4. Gradient heat dissipation assembly; 11. Recess; 21. Support platform; 211. Honeycomb heat dissipation holes; 22. Inner heat-conducting shell; 221. Heat dissipation bumps; 222. Radial air channels; 23. Outer heat dissipation shell; 231. Outer surface fins; 232. Triangular baffles; 24. Vacuum insulation cavity; 25. Annular heat pipe; 251. Heat pipe evaporation section; 252. Condensation section; 253. Wire mesh wick; 254. Acetone-nanodiamond mixture. 4. Heat pipe bending section 255, upper copper-based heat sink 41, middle graphene film 42, lower indium foil flexible layer 43, columnar heat conductor 44, phase change heat dissipation paste 45, carbon fiber heat conduction mesh 451, elastic pressure plate 46, rivet 461, arc-shaped pressure head 462, serrated interlocking surface 47, thermally conductive rivet 48, central copper pillar 51, hemispherical contact head 511, heat dissipation sleeve 52, spiral heat dissipation groove 521, corrugated heat dissipation fin 53, annular thermally conductive silicone layer 54. Detailed Implementation

[0023] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0024] like Figures 1-7 As shown, the integrated circuit chip packaging structure of this utility model includes key components such as a chip core 1, a packaging shell 2, and metal leads 3. The chip core 1 is fixed to the carrier platform 21 of the packaging shell 2 by thermally conductive adhesive. One end of the metal leads 3 is bonded to the chip, and the other end extends to the outside of the shell. The packaging shell 2 adopts a composite cavity structure, consisting of an inner thermally conductive shell 22 and an outer heat dissipation shell 23. The surface of the inner thermally conductive shell 22 is densely covered with conical heat dissipation bumps 221, forming radial air channels 222 between the bumps to enhance the local heat exchange effect. An annular vacuum insulation cavity 24 is provided between the inner and outer layers. An annular heat pipe 25 is embedded in the inner sidewall of the cavity. The evaporation section 251 of the heat pipe is attached to the inner thermally conductive shell 22, and the condensation section 252 is connected to the outer surface fins 231 of the outer heat dissipation shell 23, realizing efficient heat transfer and dissipation. The top of the chip core 1 is covered by a gradient heat dissipation assembly 4, which consists of an upper copper-based heat sink 41, a middle graphene film 42, and a lower indium foil flexible layer 43. The bottom of the copper-based heat sink 41 has columnar heat conductors 44 corresponding to the chip's heat-generating area, with phase-change thermal paste 45 filling the spaces between the columns. The edges of the copper-based heat sink 41 are connected to the package shell 2 via elastic clamps 46. The bottom of the support platform 21 has honeycomb-shaped heat dissipation holes 211, into which composite heat dissipation columns 5 are inserted. Each heat dissipation column 5 consists of a central copper column 51 and an outer aluminum heat dissipation sleeve 52. The surface of the aluminum heat dissipation sleeve 52 has spiral heat dissipation grooves 521, and its bottom extends out of the package shell 2 and connects to corrugated heat sink 53. This design not only improves heat dissipation efficiency but also enhances the stability and reliability of the structure.

[0025] In the above embodiments, the "composite cavity + gradient heat dissipation component + honeycomb composite heat dissipation column" technical solution of this utility model, through multi-dimensional structural innovation and thermal management design, specifically solves the four core problems of traditional packaging. The specific solution path is as follows:

[0026] Addressing the issue of "low heat dissipation efficiency and inability to handle high heat flux density": Traditional packaging, due to its single heat dissipation path and small heat conduction area, cannot adapt to the instantaneous high heat flux density (typically >50W / cm²) of 5G and AI chips. This solution constructs a multi-path, high-efficiency heat conduction system through a "three-dimensional heat dissipation network":

[0027] The gradient heat dissipation component 4 consists of a copper-based heat sink 41 (high thermal conductivity 401 W / m·K), a graphene film 42 (in-plane thermal conductivity > 1500 W / m·K), an indium foil flexible layer 43 (good ductility, adaptable to thermal expansion), and a phase change thermal paste 45 (phase change temperature 60-70℃, latent heat > 200 J / g).

[0028] The columnar heat conductor 44 at the bottom of the copper-based heat sink is precisely aligned with the chip's heat-generating area (error ≤ 0.1mm), directly absorbing the high heat flow from the core.

[0029] Graphene films rapidly diffuse localized heat laterally, preventing hotspots from accumulating.

[0030] Phase change thermal paste absorbs and stores heat through phase change during instantaneous high temperatures, buffering temperature peaks (which can reduce instantaneous temperature differences by 15-20℃).

[0031] The indium foil flexible layer fills the microscopic gap between the chip and the heat sink, reducing the interface thermal resistance to <0.5℃·cm² / W (60% lower than traditional silicone grease).

[0032] In the above embodiment, the conical heat dissipation bumps 221 (height 0.5-1mm, density 50 bumps / cm²) on the surface of the inner heat-conducting shell 22 increase the contact area with air by 30%, and the radial air channels 222 between the bumps form directional airflow channels to accelerate the transfer of heat to the annular heat pipe 25.

[0033] The evaporation section 251 of the ring heat pipe 25 is integrally welded to the inner heat-conducting shell 22 (interface thermal resistance < 0.1℃·cm² / W), and the condensation section 252 is directly connected to the radial fins 231 of the outer heat dissipation shell 23 (fin thickness 0.3mm, spacing 1mm, total heat dissipation area increased by 200% compared with the traditional design), realizing "zero resistance" heat transfer from the chip edge to the external environment, and improving the end heat dissipation efficiency to 150W / ℃.

[0034] In the above embodiment, copper-aluminum composite heat dissipation pillars 5 are inserted into the honeycomb heat dissipation holes 211 (hole diameter 3-5mm, porosity 60%) at the bottom of the support platform 21: the central copper pillar 51 (thermal conductivity 398W / m·K) directly connects to the recess on the back of the chip (contact area ≥90%), quickly dissipating heat from the back; the spiral heat dissipation grooves 521 (pitch 0.8mm) on the surface of the outer aluminum heat dissipation sleeve 52 increase the convective heat exchange area with the air, and the bottom corrugated heat dissipation fins 53 (thickness 0.2mm, corrugation height 1mm) further expand the heat dissipation end, forming a "third heat dissipation channel" that penetrates the package, which can independently handle 30% of the total heat dissipation.

[0035] Traditional packaging solutions address the issue of high and persistently deteriorating interfacial thermal resistance by relying on thermal grease to fill the interface. However, long-term thermal cycling leads to grease drying and cracking, resulting in a dramatic increase in thermal resistance (typically >5℃·cm² / W). This solution achieves long-term stable contact through a "constant-pressure interface + flexible fit" design.

[0036] The elastic pressure plate 46 of the gradient heat dissipation component provides a constant pressure of 5-8N (error ±0.5N) to ensure that the copper-based heat sink 41 is always in close contact with the chip surface, and the interface contact rate remains >95% even after 1000 thermal cycles (-40℃ to 125℃).

[0037] The indium foil flexible layer 43 has excellent plasticity (elongation > 40%) and can adapt to the thermal expansion difference between the chip and the heat sink (typical value 5-10 μm) to avoid gaps caused by rigid contact.

[0038] Phase change thermal paste 45 is liquid at high temperatures, filling microscopic gaps, and solidifies at low temperatures to maintain its shape. It does not crack after long-term use (lifespan > 10,000 hours) and improves the stability of interface thermal resistance by 80%.

[0039] When addressing the issue of heat flowing back to the PCB and affecting surrounding components, traditional packaging without thermal insulation design results in 30%-50% of the heat being conducted back to the PCB, causing the temperature of surrounding components to rise (typically >10℃). This solution blocks reverse heat transfer through "vacuum insulation + directional heat conduction": the annular vacuum insulation cavity 24 (vacuum degree <1Pa) between the inner heat-conducting shell 22 and the outer heat dissipation shell 23 utilizes the low thermal conductivity of the vacuum environment (<0.001W / m·K) to reduce the amount of reverse heat conduction to the PCB to <5%; the unidirectional heat conduction characteristics of the annular heat pipe 25 (thermal conductivity >1000W / m·K, reverse thermal conduction <10W / m·K) further guide heat to diffuse towards the outer fins, preventing backflow to the inner PCB; the carrier platform 21 uses a low thermal conductivity ceramic material (Al2O3, thermal conductivity <20W / m·K) to reduce the conduction of chip heat to the PCB substrate, controlling the temperature rise of surrounding components to <3℃.

[0040] When addressing the issues of "bulky size and low integration," traditional high-end solutions increase size by 30%-50% due to the layered arrangement of heat pipes and packaging. This solution reduces size through an "integrated design":

[0041] The annular heat pipe 25 is embedded in the annular cavity between the inner and outer shells, and is integrated with the shell structure without any additional protrusions;

[0042] The gradient heat dissipation component 4 adopts a thin design (total thickness < 3mm), and the copper-based heat sink 41 is flush with the edge of the encapsulation shell 2;

[0043] The corrugated heat sink 53 of the bottom composite heat sink 5 is flush with the bottom of the package shell 2, reducing the overall height by 40% compared to the traditional solution and reducing the volume to 60% of the solution with the same heat dissipation capacity, thus meeting the requirements of high-density integration.

[0044] In summary, this solution addresses the challenge of high heat flux density heat dissipation through a three-dimensional heat dissipation network, resolves long-term thermal resistance deterioration through a constant-pressure flexible interface, blocks heat recirculation through a vacuum insulation cavity, and controls volume through an integrated design. It comprehensively breaks through the technical bottlenecks of traditional packaging and can meet the heat dissipation requirements of high-power chips such as 5G base stations and AI servers (total heat dissipation capacity reaches 300W, and chip junction temperature is controlled at <85℃).

[0045] This invention includes a chip core 1, a package shell 2 encapsulating the chip, and metal pins 3 connecting the chip. The chip core 1 is fixed to a support platform 21 of the package shell 2 using thermally conductive adhesive. One end of the metal pin 3 is bonded to the chip, and the other end extends to the outside of the shell. The package shell 2 is a composite cavity structure, including an inner thermally conductive shell 22 and an outer heat dissipation shell 23. The surface of the inner thermally conductive shell 22 is densely covered with conical heat dissipation bumps 221, forming radial air channels 222 between the bumps. An annular vacuum insulation cavity 24 is provided between the inner and outer layers. An annular heat pipe 25 is embedded in the inner sidewall of the cavity. The evaporation section 251 of the heat pipe is attached to the inner thermally conductive shell 22, and the condensation section 252 is connected to the outer surface of the outer heat dissipation shell 23. The chip core 1 is covered with a gradient heat dissipation assembly 4, which consists of an upper copper-based heat sink 41, a middle graphene film 42, and a lower indium foil flexible layer 43. The bottom of the copper-based heat sink 41 is provided with columnar heat conductors 44 corresponding to the heat-generating area of ​​the chip. The columnar bodies are filled with phase change thermal paste 45. The edge of the copper-based heat sink 41 is connected to the package shell 2 through an elastic pressure sheet 46. The bottom of the support platform 21 is provided with honeycomb heat dissipation holes 211. Composite heat dissipation columns 5 are inserted into the holes. The heat dissipation column 5 consists of a central copper column 51 and an outer aluminum heat dissipation sleeve 52. The surface of the aluminum heat dissipation sleeve 52 is provided with spiral heat dissipation grooves 521. The bottom extends out of the package shell 2 and is connected to a corrugated heat dissipation fin 53.

[0046] In the above specific embodiments, this utility model achieves synergistic heat dissipation through "inner and outer double shells + multi-level heat conduction": the heat generated by the chip operation is first absorbed by the gradient heat dissipation components, the copper-based heat sink utilizes its high thermal conductivity to quickly achieve lateral heat equalization, the graphene film further diffuses in-plane, and the indium foil flexible layer fills the micro-gaps to reduce contact thermal resistance; the columnar heat conductor and phase change thermal paste form a vertical and efficient heat conduction channel in the heat-generating area, and the heat is quickly directed to the packaging shell. The conical bumps and radial air channels on the surface of the inner heat-conducting shell increase the heat exchange area and guide airflow, the vacuum insulation cavity blocks the heat from returning to the PCB, the evaporation section of the annular heat pipe adheres closely to the inner shell to absorb heat, the acetone-nanodiamond working fluid rapidly vaporizes, and in the condensation section, the heat is transferred to the fins of the outer heat dissipation shell and dissipated outward. At the same time, the composite heat dissipation column in the honeycomb holes of the support platform directly adheres to the recess on the back of the chip with the central copper column, and the heat is conducted to the aluminum heat sink through the copper column and the thermally conductive silicone layer, and the spiral heat dissipation groove and corrugated heat sink expand the heat dissipation area, forming a continuous heat dissipation path from bottom to top. The elastic pressure plate provides a constant pressure of 5-8N to ensure long-term close contact between all thermal interfaces, enabling high-power chips to achieve low thermal resistance, rapid and stable heat dissipation.

[0047] The annular heat pipe 25 has a flat tube structure, with a copper wire mesh liquid absorber 253 inside the tube, and the working fluid is an acetone-nanodiamond mixture 254. The bent section 255 of the heat pipe adopts a corrugated pipe structure.

[0048] In the above specific embodiments, the annular heat pipe adopts a flat tube structure to maximize the contact surface with the inner heat-conducting shell and the outer fins, reducing interfacial thermal resistance. A copper wire mesh wick is sintered on the inner wall of the pipe, forming a capillary network that provides a continuous reflux channel for the liquid working fluid. The filled acetone-nanodiamond mixture has a low boiling point and high latent heat of vaporization. The nanodiamond particles significantly improve the thermal conductivity and inhibit bubble aggregation, ensuring rapid start-up and stable heat transfer. When the chip's heat is transferred to the evaporation section through the inner heat-conducting shell, the working fluid absorbs heat and vaporizes. The vapor rapidly diffuses along the flat tube to the condensation section, where it releases heat and condenses at the fins. The condensate flows back along the pipe wall under the capillary force of the wire mesh, forming a closed-loop circulation with zero power consumption. The curved section of the corrugated pipe structure can freely expand and contract under thermal expansion and contraction and mechanical stress, preventing fatigue cracking while maintaining unobstructed vapor channels, achieving efficient, reliable, and long-life heat transfer.

[0049] The gradient heat dissipation component 4 has a sawtooth interlocking surface 47 between the copper-based heat sink 41 and the graphene film 42. The interlocking surface is fitted with silver thermally conductive rivets 48, which penetrate both layers and are in contact with the copper-based heat sink 41 and the indium foil flexible layer 43 at both ends, respectively.

[0050] In the above specific embodiment, a "mechanical-thermal dual coupling" method is used to integrate the copper-based heat sink, graphene film, and indium foil flexible layer into a continuous surface-to-surface and layer-to-layer high thermal conductivity gradient path. The serrated interlocking surface microscopically multiplies the copper-graphene contact area while forming a mechanical lock to prevent slippage due to thermal expansion differences. Silver thermally conductive rivets penetrate the three layers, with a thermal conductivity as high as 429 W·m⁻¹·K⁻¹, which is equivalent to implanting a "thermal bridge" between layers, rapidly guiding the laterally diffused graphene heat vertically into the copper plate, and then transferring it downwards to the chip's heat-generating area. When the chip heats up instantaneously, the heat is first uniformly absorbed by the indium foil flexible layer and fills the micro-gaps, and then quickly rises to the graphene film through the silver rivets, completing secondary heat equalization within the surface. The serrated interlocking surface simultaneously suppresses the increase in interface thermal resistance, ensuring that heat enters the copper-based heat sink without hindrance and is finally carried away by the external heat dissipation system, achieving millisecond-level response, low thermal resistance, and high reliability three-dimensional gradient heat dissipation.

[0051] The phase change thermal paste 45 is a composite paraffin-based material containing a carbon fiber thermal conductive mesh 451, with a phase change temperature range of 50-60℃ and a freezing point below 40℃.

[0052] In the specific embodiments described above, the phase change thermal paste uses paraffin as a base, with an internal three-dimensional interwoven carbon fiber thermal mesh forming a continuous, highly thermally conductive framework. The paraffin and carbon fiber work synergistically, utilizing both the latent heat absorption capacity of paraffin and the high thermal conductivity and mechanical support of carbon fiber to form a dual-functional composite system of "heat storage and heat conduction." When the chip temperature is below 40°C, the thermal paste remains solid, and the carbon fiber mesh provides a low thermal resistance channel, allowing heat to diffuse rapidly laterally along the mesh. When the temperature rises to the 50-60°C range, the paraffin melts, absorbing a large amount of latent heat, and its volume expands to fill the micro-gaps, reducing interfacial thermal resistance. Simultaneously, the carbon fiber mesh inhibits the flow of liquid paraffin, maintaining shape stability. After the temperature drops, the paraffin solidifies and releases heat; the solidification point is below 40°C, ensuring that it can return to a solid state within the lower limit of normal chip operation, making the cycle reversible. This phase change mechanism buffers temperature rise during instantaneous high chip loads and provides continuous and efficient heat conduction in steady state, achieving adaptive, low thermal resistance, and long-life thermal interface management.

[0053] The elastic pressure plate 46 is made of beryllium copper and is distributed in a ring around the edge of the gradient heat dissipation component 4. One end of the pressure plate is fixed to the encapsulation shell 2 by a rivet 461, and the other end is provided with an arc-shaped pressure head 462 to abut against the copper-based heat dissipation plate 41. The pre-tightening force of the pressure plate in its natural state is 5-8N.

[0054] In the above specific embodiment, the elastic pressure plate is made of beryllium copper alloy, which utilizes its high elastic modulus and fatigue resistance to form a ring-shaped constant force mechanism at the edge of the gradient heat dissipation component. One end of the pressure plate is rigidly connected to the package shell by a rivet, while the other end, with an arc-shaped pressure head, forms a point-to-surface contact with the copper-based heat sink, applying a constant preload of 5-8N vertically to the thermally conductive stack. This ensures a tight fit between the copper-based heat sink-graphene film-indium foil flexible layer and the chip surface, while preventing overpressure that could damage the chip or pads. When the chip expands or contracts due to power fluctuations, the beryllium copper pressure plate undergoes slight elastic deformation, and the arc-shaped pressure head moves accordingly, compensating for thickness changes in real time, keeping the interface thermal resistance at a minimum. Simultaneously, the ring-shaped multi-point layout ensures uniform pressure, preventing local warping or gaps, and achieving a long-term, stable, and low-thermal-resistance thermally conductive connection.

[0055] The composite heat sink 5 has a hemispherical contact head 511 at the top of the central copper pillar 51, which is adapted to the recess 11 on the back of the chip core 1. An annular thermally conductive silicone layer 54 is provided between the copper pillar and the aluminum heat sink 52.

[0056] In the above specific embodiment, the central copper pillar is made of high thermal conductivity oxygen-free copper. The top hemispherical contact head forms a ball-and-socket precision fit with the recess on the back of the chip, achieving point-to-surface contact. This increases the effective heat transfer area and automatically aligns and absorbs assembly tolerances. The aluminum heat sink uses lightweight, high thermal conductivity aluminum material to diffuse heat externally. An annular thermally conductive silicone layer is filled between the two, utilizing the flexibility and high filling capacity of the silicone to eliminate gaps caused by the thermal expansion difference between copper and aluminum, reducing interface thermal resistance. The heat generated by the chip is rapidly transferred from the recess to the copper pillar through the hemispherical contact head, resulting in a high axial heat flux density. After reaching the copper pillar, a portion of the heat is radially transferred to the aluminum heat sink through the thermally conductive silicone layer. The spiral heat sink grooves and external corrugated heat sink quickly diffuse the heat to the environment. The silicone layer maintains elasticity during temperature cycling, continuously filling microscopic gaps and preventing thermal resistance from increasing with aging, thus achieving a low thermal resistance, high reliability, and long lifespan back heat dissipation path.

[0057] The outer surface fins 231 of the outer heat dissipation shell 23 are arranged radially, and triangular baffles 232 are provided at the ends of the fins. The spacing between adjacent fins is 2-3 mm, and the root of the fins is welded to the condensation section 252 of the annular heat pipe 25.

[0058] In the above specific embodiment, the outer heat dissipation shell adopts a radial fin array to uniformly disperse the concentrated heat from the annular heat pipe condensation section radially. The root of each fin is directly welded to the condensation section, forming a low thermal resistance metal passage, allowing heat to enter the fin instantly. The 2-3mm narrow spacing design ensures sufficient heat dissipation area while maintaining a thin airflow boundary layer. The triangular baffles stamped at the fin ends break laminar flow, inducing turbulence and significantly improving the convective heat transfer coefficient. Heat pipe vapor liquefies and releases heat in the condensation section, and the heat is quickly introduced into the fins through the weld. The external airflow is cut and rotated by the baffles in the radial channels, forming strong turbulence and carrying away heat from the fin surface. The radial layout allows heat to diffuse evenly in all directions, avoiding local hot spots and achieving efficient, uniform, and low-resistance end heat dissipation.

[0059] While specific embodiments of this utility model have been described above, those skilled in the art should understand that these specific embodiments are merely illustrative. Those skilled in the art can omit, substitute, and modify the details of the above methods and systems in various ways without departing from the principles and essence of this utility model. For example, combining the above method steps to perform substantially the same function and achieve substantially the same result according to substantially the same method falls within the scope of this utility model. Therefore, the scope of this utility model is defined only by the appended claims.

Claims

1. An integrated circuit chip packaging structure for easy heat dissipation, comprising a chip core (1), a packaging shell (2) enclosing the chip, and metal pins (3) connecting the chip, wherein the chip core (1) is fixed to a support platform (21) of the packaging shell (2) by thermally conductive adhesive, and one end of the metal pin (3) is bonded to the chip, and the other end extends to the outside of the shell; characterized in that: The encapsulation shell (2) is a composite cavity structure, including an inner heat-conducting shell (22) and an outer heat-dissipating shell (23). The surface of the inner heat-conducting shell (22) is densely covered with conical heat dissipation protrusions (221), and radial air channels (222) are formed between the protrusions. An annular vacuum heat insulation cavity (24) is provided between the inner and outer layers. An annular heat pipe (25) is embedded in the inner sidewall of the cavity. The evaporation section (251) of the heat pipe is attached to the inner heat-conducting shell (22), and the condensation section (252) is connected to the outer surface fins (231) of the outer heat-dissipating shell (23). The top of the chip core (1) is covered with a gradient heat dissipation component (4), which consists of an upper copper-based heat dissipation plate (41), a middle graphene film (42) and a lower indium foil flexible layer (43). The bottom of the copper-based heat dissipation plate (41) is provided with columnar heat conductors (44) corresponding to the heat dissipation area of ​​the chip. The columnar bodies are filled with phase change heat dissipation paste (45). The edge of the copper-based heat dissipation plate (41) is connected to the packaging shell (2) through an elastic pressure sheet (46). The bottom of the support platform (21) is provided with honeycomb heat dissipation holes (211), and composite heat dissipation columns (5) are inserted into the holes. The heat dissipation column (5) consists of a central copper column (51) and an outer aluminum heat dissipation sleeve (52). The surface of the aluminum heat dissipation sleeve (52) is provided with spiral heat dissipation grooves (521), and the bottom extends out of the encapsulation shell (2) and is connected to a corrugated heat dissipation sheet (53).

2. The structure according to claim 1, characterized in that, The annular heat pipe (25) has a flat tube structure, with a copper wire mesh liquid absorber (253) inside the tube. The working fluid is an acetone-nanodiamond mixture (254), and the bent section (255) of the heat pipe adopts a corrugated pipe structure.

3. The structure according to claim 1, characterized in that, The gradient heat dissipation component (4) has a sawtooth interlocking surface (47) between the copper-based heat dissipation plate (41) and the graphene film (42). The interlocking surface is fitted with silver thermally conductive rivets (48). The rivets penetrate the two layers and their two ends are in contact with the copper-based heat dissipation plate (41) and the indium foil flexible layer (43) respectively.

4. The structure according to claim 1, characterized in that, The phase change heat dissipation paste (45) is a composite paraffin-based material containing a carbon fiber heat-conducting mesh (451), with a phase change temperature range of 50-60℃ and a solidification point below 40℃.

5. The structure of claim 1, wherein The elastic pressure plate (46) is made of beryllium copper and is distributed in a ring around the edge of the gradient heat dissipation component (4). One end of the pressure plate is fixed to the encapsulation shell (2) by a rivet (461), and the other end is provided with an arc-shaped pressure head (462) to abut against the copper-based heat dissipation plate (41). The pre-tightening force of the pressure plate in its natural state is 5-8N.

6. The structure of claim 1, wherein The composite heat sink (5) has a hemispherical contact head (511) at the top of the central copper pillar (51), which is adapted to the recess (11) on the back of the chip core (1). An annular thermally conductive silicone layer (54) is provided between the copper pillar and the aluminum heat sink sleeve (52).

7. The structure according to claim 1, characterized in that, The outer surface fins (231) of the outer heat dissipation shell (23) are arranged radially, and triangular baffles (232) are provided at the ends of the fins. The spacing between adjacent fins is 2-3 mm, and the root of the fins is welded to the condensation section (252) of the annular heat pipe (25).

Images