Chip unpacking high-temperature solder paste equipment

Abstract

The utility model discloses a kind of high-temperature solder paste equipment for chip subpackaging, including base, the both sides of the base are provided with support rod, the outer wall of the support rod is provided with limit sleeve, the outer wall of the limit sleeve is provided with fixing part, the inboard of the fixing part is provided with the chip support seat for supporting chip, the top of the base is equidistantly provided with chip top plate, the inside of the chip support seat is provided with the clamping assembly for the chip fixed, the top of the clamping assembly is provided with fixed assembly. Chip top plate equidistantly arranged at the top of base can lift chip, so that chip is more convenient and fast to take and place, improve work efficiency The clamping assembly in the inside of chip support seat can effectively extrude and fix chip by the cooperation of rack, turntable, clamping tooth, push rod and fixed plate.

Description

Technical Field

[0001] This utility model relates to the field of high-temperature soldering technology, specifically to a high-temperature solder paste equipment for chip packaging. Background Technology

[0002] As electronic products become increasingly miniaturized and intelligent, the requirements for chip integration are becoming higher and higher. Chip packaging not only needs to protect the chip, but also needs to complete more connections and functional integration within a limited space. High-temperature solder paste equipment can meet the needs of fine soldering and high-density connection in chip packaging, and provide technical support for achieving higher integration. For example, in multi-chip module packaging and system-in-package, high-temperature solder paste is needed to connect multiple chips and other electronic components to achieve complex circuit functions. Currently, high-temperature solder paste equipment for chip packaging requires a tray to transport the chip to the dispensing equipment, where solder paste is applied to the desired soldering position. The soldering process is then performed by heating the solder paste. However, while the current tray supports the chip, it cannot secure it properly. This causes the chip to shift when pressed by the dispensing equipment, leading to a problem where the laser heating position may shift after dispensing. Utility Model Content

[0003] The purpose of this invention is to provide a high-temperature solder paste equipment for chip packaging, so as to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a high-temperature solder paste device for chip packaging, comprising a base, support rods on both sides of the base, a limiting sleeve on the outer wall of the support rods, a fixing member on the outer wall of the limiting sleeve, a chip support seat for supporting the chip on the inner side of the fixing member, chip top plates equidistantly arranged at the top of the base, a clamping component for fixing the chip inside the chip support seat, and a fixing component at the top of the clamping component.

[0005] Preferably, the chip support base has an internal cavity for the movement of the clamping components.

[0006] Preferably, the chip support base has multiple grooves equidistantly spaced at its top end, and each groove has a through hole at its center.

[0007] Preferably, the clamping assembly includes a rack, which is movably disposed inside the chip support base. Turntables are provided on both sides of the rack, and the outer wall of the turntables is provided with teeth that can mesh with the rack. A push rod is provided on the outer wall of the turntables, and a fixing plate for pressing the chip is provided inside the chip support base.

[0008] Preferably, the front end of the fixing plate is provided with an anti-slip pad.

[0009] Preferably, a limit block is machined at the bottom end of the rack to limit the movement of the rack.

[0010] Preferably, the fixing component includes an adjusting rod, which is disposed at the top of the rack, and a fixing pin is provided on the right side of the adjusting rod to fix the adjusting rod.

[0011] Compared with the prior art, the beneficial effects of this utility model are: 1. The limiting sleeve and chip support base of the equipment work together. When the chip support base is pressed down, the limiting sleeve can slide down the outer wall of the support rod, which makes it easy to adjust the height of the chip support base to adapt to different operating needs. At the same time, the fixing parts can fix the limiting sleeve to ensure stability during operation.

[0012] 2. The chip top plates, evenly spaced at the top of the base, can lift the chips, making chip placement and removal more convenient and quick, thus improving work efficiency. The clamping components inside the chip support base, through the cooperation of rack, turntable, cleats, push rod, and fixing plate, can effectively compress and fix the chips. When the rack moves, it drives the turntable to rotate through the cleats. The turntable drives the push rod to push the fixing plate to one side, stably clamping the chips. The anti-slip pad at the front end of the fixing plate further enhances the fixing effect and prevents the chips from sliding during operation.

[0013] 3. The limiting block at the bottom of the rack can limit the movement of the rack, ensuring that the clamping force is moderate and avoiding damage to the chip. The adjusting lever in the fixing component is located at the top of the rack. After moving to the appropriate position, it can be fixed by the fixing pin. This allows the operator to flexibly adjust the clamping force and fixing position according to the size and shape of the chip, improving the versatility and applicability of the equipment. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 for Figure 1 A detailed view of the connection structure from the front; Figure 3 for Figure 1 Detailed view of the connection structure in a partial cross-section from above; Figure 4 for Figure 3 Enlarged detail of the connection structure of the clamping component; Figure 5 for Figure 3 Enlarged detail of the connection structure of the fixed component.

[0015] In the diagram: 1. Base, 2. Support rod, 3. Limiting sleeve, 4. Fixing component, 5. Chip support seat, 6. Chip top plate, 7. Rack, 8. Turntable, 9. Clamping tooth, 10. Push rod, 11. Fixing plate, 12. Adjusting rod, 13. Fixing pin. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figure 1-5 This utility model provides a technical solution: a high-temperature solder paste equipment for chip packaging, including a base 1, support rods 2 on both sides of the base 1, a limiting sleeve 3 on the outer wall of the support rod 2, the limiting sleeve 3 can slide downward on the outer wall of the support rod 2 when pressed downward by the chip support seat 5, a fixing member 4 is provided on the outer wall of the limiting sleeve 3 for fixing the limiting sleeve 3, a chip support seat 5 for supporting the chip is provided on the inner side of the fixing member 4, a chip top plate 6 is provided at equal intervals at the top of the base 1 for lifting the chip for easy picking and putting, a clamping component for fixing the chip is provided inside the chip support seat 5, a fixing component is provided at the top of the clamping component, a cavity for moving the clamping component is opened inside the chip support seat 5, a plurality of grooves are opened at equal intervals at the top of the chip support seat 5, and a through hole is opened at the center of each groove.

[0018] The clamping assembly includes a rack 7, which is movably disposed inside the chip support base 5. When the rack 7 moves, it drives the turntable 8 to rotate through the locking teeth 9. Turntables 8 are provided on both sides of the rack 7. When the turntables 8 rotate, they drive the push rod 10 to push the fixing plate 11 to one side and squeeze the chip. The outer wall of the turntable 8 is provided with locking teeth 9 that can mesh with the rack 7. The outer wall of the turntable 8 is provided with the push rod 10. The chip support base 5 is provided with a fixing plate 11 for squeezing the chip. The front end of the fixing plate 11 is provided with an anti-slip pad. The bottom end of the rack 7 is machined with a limit block to limit the movement of the rack 7.

[0019] The fixing component includes an adjusting rod 12, which is located at the top of the rack 7. After the adjusting rod 12 moves to a suitable position, it can be fixed by a fixing pin 13. A fixing pin 13 is provided on the right side of the adjusting rod 12 to fix the adjusting rod 12.

[0020] Working Principle: When starting the high-temperature solder paste equipment for chip packaging, the user first places the chip into the top groove of the chip support 5. Then, the user pushes the adjusting rod 12 forward, which moves the rack 7 forward simultaneously. The rack 7 then engages with the teeth 9 on the outer wall of the turntable 8, causing the turntable 8 to rotate. During the rotation of the turntable 8, the pushing rod 10 moves simultaneously, pushing the fixing plate 11 forward to press the chip. After the chip is pressed and fixed by the fixing plate 11, the user inserts the fixing pin 13 into the right side of the adjusting rod 12. After fixing the chip support 5, the user pushes the chip support 5 to the bottom of the solder paste machine through the base 1. The solder paste machine then applies adhesive to the chip surface and heats it for soldering. After soldering, the user removes the base 1 from the dispensing equipment. The user then pulls the fixing pin 13 out of the inside of the adjusting rod 12 and pulls the adjusting rod 12 to reset it. After the adjusting rod 12 is reset, the user removes the fixing piece 4 from the outer wall of the limiting sleeve 3, then presses the chip support 5 downward. As the chip support moves downward, the chip is lifted by the chip top plate 6. The operator then removes the soldered chip.

[0021] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-temperature solder paste equipment for chip packaging, comprising a base (1), characterized in that, Support rods (2) are provided on both sides of the base (1). A limiting sleeve (3) is provided on the outer wall of the support rod (2). A fixing member (4) is provided on the outer wall of the limiting sleeve (3). A chip support seat (5) for supporting the chip is provided on the inner side of the fixing member (4). A chip top plate (6) is provided at equal intervals on the top of the base (1). A clamping component for fixing the chip is provided inside the chip support seat (5). A fixing component is provided on the top of the clamping component.

2. The high-temperature solder paste device for chip dispensing according to claim 1, characterized in that, The chip support base (5) has a cavity inside for the movement of the clamping components.

3. The high-temperature solder paste device for chip dispensing according to claim 1, characterized in that, The chip support base (5) has multiple grooves at equal intervals at its top end, and each groove has a through hole at its center.

4. The high-temperature solder paste device for chip dispensing according to claim 1, characterized in that, The clamping assembly includes a rack (7), which is movably disposed inside the chip support base (5). Turntables (8) are provided on both sides of the rack (7). The outer wall of the turntables (8) is provided with teeth (9) that can mesh with the rack (7). A push rod (10) is provided on the outer wall of the turntables (8). A fixing plate (11) for squeezing the chip is provided inside the chip support base (5).

5. The high-temperature solder paste apparatus for die unpacking according to claim 4, wherein, The front end of the fixing plate (11) is provided with an anti-slip pad.

6. The high-temperature solder paste equipment for chip packaging according to claim 4, characterized in that, The bottom end of the rack (7) is machined with a limit block, which can limit the movement of the rack (7).

7. The high-temperature solder paste apparatus for die unpacking according to claim 6, wherein, The fixing component includes an adjusting rod (12), which is located at the top of the rack (7), and a fixing pin (13) is provided on the right side of the adjusting rod (12) to fix the adjusting rod (12).

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