LED light source for tunnels and seaside lighting and its anti-sulfurization support

Abstract

The utility model belongs to LED technical field especially relates to a tunnel and seaside illumination LED light source and its anti-sulfuration support, and the anti-sulfuration support includes fourfold anticorrosion plating, high thermal conductivity red copper layer, flip chip functional area plating, antistatic weatherproof plastic layer and bowl cup, high thermal conductivity red copper layer sets up on fourfold anticorrosion plating, flip chip functional area plating and bowl cup all set up on high thermal conductivity red copper layer, bowl cup surrounds and sets up on the outer periphery of flip chip functional area plating, and antistatic weatherproof plastic layer sets up on flip chip functional area plating and is located inside bowl cup. The LED light source for tunnel and seaside illumination has the anti-sulfuration support described above. The utility model has at least the effect that: first, the corrosion resistance is in accordance with actual demand, second, the heat dissipation adapts commonly used power, third, the reliability meets the industry standard, fourth, the environmental adaptability is strong and easy to fall to the ground.

Description

Technical Field

[0001] This utility model belongs to the field of LED technology, and in particular relates to an LED light source suitable for tunnel and seaside lighting and its anti-sulfurization bracket. Background Technology

[0002] Outdoor lighting, especially in tunnels and coastal settings, places stringent requirements on the corrosion resistance, heat dissipation, and long-term reliability of LED light source brackets. However, existing LED light source brackets suffer from at least the following drawbacks:

[0003] 1. Insufficient corrosion resistance: Most existing LED light source brackets use a "nickel-silver" double-layer plating. Under the salt spray environment of 3500ppm at the seaside (the industry's standard salt spray concentration at the seaside), the plating is prone to corrosion within 3000 hours, and the contact resistance rises to more than 80mΩ, which cannot meet the 10-year service requirement.

[0004] II. The contradiction between heat dissipation and integration: Another type of LED light source bracket uses a brass base. This type of bracket has a low thermal conductivity, typically less than [value missing]. With 6 LED chips arranged at 6W power (a common power for outdoor lighting), the junction temperature of the LED chips exceeds 85℃, and the light decay rate reaches 5% after 5000 hours, making it difficult to balance high integration and low light decay.

[0005] 3. Lack of long-term reliability: Another existing LED light source flip-chip package bracket has an unoptimized pad-plastic bonding structure. After 3000 cycles of thermal cycling from -20℃ to 60℃, the delamination rate exceeds 15%, the solder joint corrosion rate reaches 12%, and the failure rate far exceeds the requirement of ≤5% for outdoor lighting.

[0006] Clearly, existing LED light source brackets cannot simultaneously solve the three core problems of "corrosion resistance in extreme environments, high-power heat dissipation, and 10-year reliability." There is an urgent need to propose innovative technical solutions that meet the actual application scenarios of the industry and have reliable experimental data. Utility Model Content

[0007] The purpose of this invention is to overcome the shortcomings of existing LED light source brackets in environments such as tunnels and seaside areas, such as poor corrosion resistance, insufficient heat dissipation, and low reliability, and to provide an LED light source and its anti-sulfurization bracket suitable for tunnel and seaside lighting.

[0008] To achieve the above objectives, this utility model provides an anti-sulfurization support, comprising a quadruple anti-corrosion coating, a high thermal conductivity copper layer, a flip-chip functional area coating, an antistatic and weather-resistant plastic layer, and a cup. The high thermal conductivity copper layer is disposed on the quadruple anti-corrosion coating, the flip-chip functional area coating and the cup are both disposed on the high thermal conductivity copper layer, the cup surrounds the outer periphery of the flip-chip functional area coating, and the antistatic and weather-resistant plastic layer is disposed on the flip-chip functional area coating and located inside the cup.

[0009] Optionally, both the quadruple anti-corrosion coating and the flip-chip functional area coating include, from bottom to top, a copper-nickel alloy substrate, a palladium barrier layer, a nickel-phosphorus alloy barrier layer, and a silver surface layer.

[0010] Optionally, the thickness of the copper-nickel alloy substrate is 0.025-0.035 mm;

[0011] The thickness of the palladium barrier layer is 0.003-0.008 mm;

[0012] The thickness of the nickel-phosphorus alloy barrier layer is 0.008-0.012 mm;

[0013] The thickness of the silver surface layer is 0.01-0.02 mm.

[0014] Optionally, the high thermal conductivity copper layer has a purity ≥99.99%, a thickness of 0.23-0.27 mm, and a thermal conductivity of [missing information]. Oxygen-free red copper.

[0015] Optionally, the upper surface of the high thermal conductivity copper layer is provided with micro-grooves with a depth of 5-10 μm and a spacing of 12-18 μm.

[0016] Optionally, the dimensions of the antistatic and weather-resistant plastic layer are 4.6-5.0mm × 4.6-5.0mm.

[0017] Optionally, the bowl / cup has a rim size of 5.1-5.5mm × 5.1-5.5mm, a depth of 0.43-0.47mm, and an inner wall inclination angle of 8-12°.

[0018] This utility model also provides an LED light source for tunnel and seaside lighting, which includes the above-mentioned anti-sulfurization bracket. The flip chip functional area coating is provided with nine LED chip functional areas distributed in a 3×3 matrix. Each LED chip functional area is provided with one LED chip, and each LED chip is covered by the antistatic and weather-resistant plastic layer.

[0019] Optionally, each of the LED chip functional areas has a size of 1.15mm × 1.15mm, and a plastic isolation strip with a width of 0.18-0.38mm is provided between two adjacent LED chip functional areas.

[0020] Optionally, the dimensions of each LED chip satisfy: between.

[0021] The LED light source for tunnel and seaside lighting and its anti-sulfurization bracket provided in this embodiment of the utility model have at least one of the following technical effects:

[0022] First, the corrosion resistance meets actual needs. The quadruple anti-corrosion coating has stable performance under normal salt spray concentrations at the seaside. After 3,000 hours of testing, the corrosion rate is low, avoiding unreliable data caused by overly harsh experiments, while also meeting the corrosion resistance reserve of a 10-year warranty.

[0023] Secondly, the heat dissipation is adapted to common power levels. It is designed for 6W common power outdoor lighting. The red copper base has sufficient heat dissipation capacity, and the chip junction temperature and light decay rate are controlled at excellent levels in the industry, balancing performance and practicality.

[0024] Third, the reliability meets industry standards. The cold and hot cycle and dust tests are all based on the industry's conventional frequency and concentration. The test results can directly reflect the actual outdoor use effect. The failure rate is low and it is easily recognized by the market and patent examination.

[0025] Fourth, it is highly adaptable to the environment and easy to implement. Its anti-static and low dust accumulation design allows it to adapt to tunnel environments without special maintenance. The plastic formula and coating process both use mature equipment in the industry, which facilitates mass production. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 Front and back top views of the anti-sulfurization bracket provided in the embodiment of this utility model.

[0028] Figure 2 A cross-sectional view of the anti-sulfurization support provided in an embodiment of this utility model.

[0029] Figure 3 A die bonding diagram of an LED light source bracket for tunnel and seaside lighting provided in an embodiment of this utility model.

[0030] Figure 4 A circuit diagram of an LED light source for tunnel and seaside lighting provided in an embodiment of this utility model.

[0031] The following are the labeling elements in the figure:

[0032] 1—LED chip functional area; 2—Plastic functional area

[0033] 3—Top surface of the bowl / cup; 4—Marking point on the support

[0034] 5—Distance from the lateral wafer functional area to the bottom edge of the cup; 6—Distance between the lateral wafer functional areas.

[0035] 7 — Spacing between positive and negative electrode pads; 8 — Spacing from the vertical wafer functional area to the bottom edge of the cup.

[0036] 9— Spacing between the functional areas of the two wafers in the vertical direction; 10—Positive electrode pad on the back of the bracket.

[0037] 11—Plastic material on the back of the bracket 12—Wire isolation strip on the back of the bracket

[0038] 13—Negative electrode pad on the back of the bracket 14—Opening for pad on the back of the bracket

[0039] 15 — Spacing between the isolation band and the pad 16 — Pad width

[0040] 17—Length of the positive electrode pad on the back of the bracket; 18—Length of the negative electrode pad on the back of the bracket.

[0041] 19—Width of conductor isolation strip; 20—Four-layer anti-corrosion coating

[0042] 21—High thermal conductivity copper layer; 22—Flip chip functional area plating layer

[0043] 23—Antistatic and weather-resistant plastic layer; 24—Bowl / Cup

[0044] 25—Cup depth of the support cup; 26—Length and width of the cup base of the support functional area.

[0045] 27—Length and width of the cup opening in the functional area of ​​the support; 28—Length and width of the support. Detailed Implementation

[0046] The embodiments of this utility model are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The following description is based on the accompanying drawings. Figures 1-4 The described embodiments are exemplary and intended to explain embodiments of the present invention, and should not be construed as limiting the present invention.

[0047] In the description of the embodiments of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0048] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0049] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.

[0050] In one embodiment of this utility model, such as Figures 1-2 As shown, an anti-sulfurization bracket is provided, comprising a quadruple anti-corrosion coating 20, a high thermal conductivity copper layer 21, a flip-chip functional area coating 22, an antistatic and weather-resistant plastic layer 23, and a cup 24. The high thermal conductivity copper layer 21 is disposed on the quadruple anti-corrosion coating 20. The flip-chip functional area coating 22 and the cup 24 are both disposed on the high thermal conductivity copper layer 21. The cup 24 surrounds the outer periphery of the flip-chip functional area coating 22. The antistatic and weather-resistant plastic layer 23 is disposed on the flip-chip functional area coating 22 and located within the cup 24. The anti-sulfurization bracket provided by this utility model is used for LED light sources for tunnel and seaside lighting, meeting the requirements of more than 10 years of warranty, and the experimental conditions are consistent with the actual application scenarios in the industry. Specifically, it can be adapted to tunnels (high dust, -20℃~60℃ hot and cold cycles) and seaside (high salt spray, The 6060 specification bracket, designed for extreme environments (corrosion), is suitable for outdoor lighting equipment requiring a warranty of 10 years or more and represents a core component technology in semiconductor lighting.

[0051] In this embodiment, the overall dimensions of the anti-sulfurization support are preferably 6.0mm × 6.0mm × 0.7mm. For example... Figure 1 As shown, the top surface 3 of the cup of the anti-sulfurization support is provided with support marking points 4. The setting of support marking points 4 can indicate that the electrode facing the marking point is the negative electrode, preventing incorrect welding of positive and negative electrodes.

[0052] See Figure 2 It can be seen that in the anti-sulfurization support in the embodiment of this utility model, the support cup depth 25 is 0.45±0.02mm, the length and width of the cup bottom of the support functional area 26 is 4.8±0.05mm, the length and width of the cup mouth of the support functional area 27 is 5.3±0.05mm, and the length and width of the support 28 is 6.0±0.15mm.

[0053] In one embodiment of this utility model, such as Figures 1-2 As shown, both the quadruple anti-corrosion coating 20 and the flip-chip functional area coating 22 include, from bottom to top, a copper-nickel alloy substrate, a palladium barrier layer, a nickel-phosphorus alloy barrier layer, and a silver surface layer.

[0054] In one embodiment of this utility model, such as Figures 1-2 As shown, the copper-nickel alloy substrate has a Cu content of 80%-90%, a Ni content of 10%-20%, and a thickness of 0.025-0.035 mm.

[0055] Furthermore, the thickness of the palladium barrier layer is 0.003-0.008 mm.

[0056] Furthermore, the phosphorus content of the nickel-phosphorus alloy barrier layer is 6%-12%, and the thickness is 0.008-0.012 mm.

[0057] Furthermore, the thickness of the silver surface layer is 0.01-0.02 mm.

[0058] In one embodiment of this utility model, such as Figures 1-2 As shown, both the copper-nickel alloy substrate and the palladium barrier layer use a current density of And electroplating process at a temperature of 40-55℃.

[0059] Furthermore, the nickel-phosphorus alloy barrier layer is made using a chemical plating process at a temperature of 80-90℃ and a pH of 4.5-5.5.

[0060] Furthermore, the silver surface layer uses a current density of It is made by electroplating at a temperature of 20-30℃.

[0061] In one embodiment of this utility model, the high thermal conductivity copper layer 21 has a purity ≥99.99%, a thickness of 0.23-0.27 mm, and a thermal conductivity of... Oxygen-free red copper.

[0062] In one embodiment of this invention, the upper surface of the high thermal conductivity copper layer 21 is provided with micro-textures with a depth of 5-10 μm and a spacing of 12-18 μm. The surface of the micro-textures is sprayed with a silane coupling agent with a concentration of 1.5%-2.5%, and the high thermal conductivity copper layer 21 is subjected to a low-temperature annealing treatment at 360-420℃. The high thermal conductivity copper layer 21 with this structure can achieve a bonding force greater than or equal to 10 N / cm with the upper plastic material and the antistatic and weather-resistant plastic layer 23, and an internal stress less than or equal to 50 MPa.

[0063] In one embodiment of this utility model, both the antistatic and weather-resistant plastic layer 23 and the bowl / cup 24 are made of the following raw materials by weight percentage: 65%-75% EMC resin, 25%-35% glass fiber, 0.2%-0.5% carbon nanotubes, 0.1%-0.3% benzotriazole, and 0.3%-0.6% UV stabilizer. For example, it can be 69% EMC resin, 30% glass fiber, 0.3% carbon nanotubes, 0.2% benzotriazole, and 0.5% UV stabilizer; or 69.4% EMC resin, 30% glass fiber, 0.2% carbon nanotubes, 0.1% benzotriazole, and 0.3% UV stabilizer; or 73.6% EMC resin, 25% glass fiber, 0.5% carbon nanotubes, 0.3% benzotriazole, and 0.6% UV stabilizer.

[0064] Specifically, the performance indicators of the aforementioned antistatic and weather-resistant plastic layer 23 and the bowl / cup 24 include: surface resistance. After 5000 hours of UVB-313 lamp irradiation (the industry's standard UV test duration), the yellowing index is ≤1.2 and the light transmittance decreases by ≤4%.

[0065] In one embodiment of this utility model, such as Figures 1-2 As shown, the dimensions of the antistatic and weather-resistant plastic layer 23 are 4.6-5.0mm × 4.6-5.0mm, the rim size of the bowl 24 is 5.1-5.5mm × 5.1-5.5mm, the depth of the bowl 24 is 0.43-0.47mm, and the inclination angle of the inner wall of the bowl 24 is 8-12°.

[0066] This utility model embodiment also provides an LED light source for tunnel and seaside lighting, which includes the aforementioned anti-sulfurization bracket. Nine LED chip functional areas 1 arranged in a 3×3 matrix are disposed on the flip-chip functional area plating layer 22. Each LED chip functional area 1 contains one LED chip, and each LED chip is covered by the antistatic and weather-resistant plastic layer 23. Each LED chip functional area 1 has two symmetrically arranged positive and negative electrode pads, with dimensions of 1.15mm × 0.45-0.5mm and a surface roughness Ra ≤ 0.1μm.

[0067] Furthermore, such as Figure 1 As shown, plastic functional areas 2 are formed on the antistatic and weather-resistant plastic layer 23, and the plastic functional areas 2 are set corresponding to the functional areas 1 of each LED chip. The size of the LED chip functional area 1 is... The surface roughness Ra of the plastic functional area 2 is ≤0.1μm, which can increase brightness and improve light efficiency.

[0068] In this embodiment, the size of each LED chip functional area 1 is 1.15mm × 1.15mm, and a plastic isolation strip with a width of 0.18-0.38mm is provided between two adjacent LED chip functional areas 1.

[0069] The dimensions of each LED chip satisfy the following: between.

[0070] Furthermore, see Figures 3-4 As shown, in this embodiment, the nine LED chip functional areas 1 are connected using a 3-series, 3-parallel circuit, with a current density of... The dimensions of the two electrode pads are 1.3-1.5mm × 5.2mm, the width of the two conductor isolation strips is 1.10-1.30mm, and the spacing between the conductor isolation strips and between them and the electrode pads is 0.35-0.45mm.

[0071] See Figure 1 As can be seen, in this embodiment, the anti-sulfurization support has the following features: the distance 5 from the horizontal wafer functional area to the bottom edge of the cup is 0.28±0.05mm; the distance 6 between the two horizontal wafer functional areas is 0.40±0.05mm; the distance 8 from the vertical wafer functional area to the bottom edge of the cup is 0.40±0.05mm; and the distance 9 between the two vertical wafer functional areas is 0.32±0.05mm. The distance 7 between the positive and negative electrode pads is 0.2mm.

[0072] Furthermore, see Figure 1It is also known that the back of the anti-sulfurization bracket is provided with a positive electrode pad 10, a plastic material 11, a wire isolation strip 12, a negative electrode pad 13, and a pad opening 14. The wire isolation strip 12 is used to connect the circuit, and the pad opening 14 is used to prevent solder balls from being generated after the LED chip is over-reflowed.

[0073] Furthermore, see Figure 1 The spacing between the isolation strip and the pad is 15, which is 0.40±0.05mm; the pad width is 16, which is 5.2±0.05mm; the length of the positive pad on the back of the bracket is 17, which is 1.4±0.1mm; the length of the negative pad on the back of the bracket is 18, which is 1.4±0.1mm; and the width of the conductor isolation strip is 19, which is 1.2±0.1mm.

[0074] To verify the effectiveness of the technical solution of this utility model embodiment, the following experiments were conducted with reference to the "LED Bracket Reliability Test Specification" (SJ / T11559-2015) and general standards in the outdoor lighting industry (experimental samples were prepared according to the above technical solution, with a sample size of n=30 per group, and experimental conditions were tailored to actual application scenarios):

[0075] 1. Corrosion resistance test: 3500ppm salt spray (normal salt spray concentration at sea). Environment (common concentration of sulfides in outdoor air), temperature 35±2℃, humidity 90±5%, test for 3000 hours (equivalent to 3-4 years of actual outdoor use); Results: corrosion rate ≤2.5%, contact resistance change rate ≤8%, no samples showed coating peeling or sudden increase in resistance.

[0076] 2. Heat dissipation test: 6W power operation (common power for outdoor lighting LED light sources), current 1600±20mA, voltage 3.7-3.9V, ambient temperature 25±2℃, tested for 5000 hours (equivalent to 5-6 years of actual outdoor use); Results: chip junction temperature ≤75℃, light decay rate ≤22%, far below the industry failure threshold of 35%;

[0077] 3. Reliability test: 3000 cycles of hot and cold cycling from -20℃ to 60℃ (equivalent to 10 years of outdoor hot and cold cycling frequency), with a transition time of ≤5min; Results: Delamination rate ≤1.5%, solder joint corrosion rate ≤2.5%, failure rate ≤0.8%, meeting the low failure requirements for outdoor lighting;

[0078] 4. Dust resistance test: dust concentration (Tunnel dust concentration) Content 60%-70%), tested for 3000 hours (equivalent to 3-4 years of actual outdoor use); results: light transmittance decreased by ≤3.5%, and after cleaning with compressed air, light transmittance recovered to ≥92%, no disassembly or maintenance required.

[0079] More specifically, the fabrication process is exemplified by the 6060 bracket used for seaside lighting.

[0080] 1. Preparation of the quadruple anti-corrosion coating 20:

[0081] Copper-nickel alloy substrate: Cu 85%, Ni 15%, electroplating current Temperature 45℃, thickness 0.03mm;

[0082] Palladium barrier layer: electroplating current 1.0A / dm², temperature 50℃, thickness 0.005mm;

[0083] Nickel-phosphorus alloy barrier layer: P content 8.5%, electroless plating temperature 85℃, pH 5.0, thickness 0.01mm;

[0084] Silver surface layer: electroplating current 0.8A / dm², temperature 25℃, thickness 0.015mm.

[0085] 2. Preparation of high thermal conductivity copper layer 21:

[0086] Oxygen-free red copper (99.992% purity) was rolled to 0.25 mm and annealed at 390℃ for 40 min;

[0087] Laser engraving of micro-textures (8μm depth, 15μm spacing) followed by spraying with 2% KH-550 silane coupling agent.

[0088] 3. Processing of the antistatic and weather-resistant plastic layer 23 and the bowl / cup 24:

[0089] Plastic formulation: EMC resin 69.5%, glass fiber 30%, carbon nanotubes 0.3%, benzotriazole 0.2%. UV protectant 0.5%, injection molding at 280-300℃;

[0090] Bowl and cup size 24: rim 5.3mm × 5.3mm, depth 0.45mm, wall tilt 10°;

[0091] Nine 1.15mm × 1.15mm LED chip functional areas were laser-engraved, with a pad roughness Ra = 0.08μm.

[0092] The final performance test of the anti-sulfurization stent (conforming to industry standards):

[0093] Corrosion resistance: 3500ppm salt spray After 3000 hours, the corrosion rate was 2.2%, and the contact resistance change rate was 7.5%.

[0094] Heat dissipation: 6W power, 5000 hours, junction temperature 72℃, light decay rate 20.5%;

[0095] Reliability: After 3000 cycles of thermal cycling from -20℃ to 60℃, the delamination rate is 1.2%, and the solder joint corrosion rate is 2.1%.

[0096] Dust resistance: Dust, after 3000 hours, light transmittance decreased by 3.2%, and recovered to 92.5% after cleaning.

[0097] The LED light source and its anti-sulfurization bracket for tunnel and seaside lighting provided in this embodiment of the utility model have at least the following technical effects:

[0098] First, the corrosion resistance meets actual needs. The quadruple anti-corrosion coating 20 has stable performance under normal salt spray concentrations at the seaside and has a low corrosion rate after 3000 hours of testing, avoiding unreliable data due to overly harsh experiments, while also meeting the corrosion resistance reserve of a 10-year warranty.

[0099] Secondly, the heat dissipation is adapted to common power levels. It is designed for 6W common power outdoor lighting. The red copper base has sufficient heat dissipation capacity, and the chip junction temperature and light decay rate are controlled at excellent levels in the industry, balancing performance and practicality.

[0100] Third, the reliability meets industry standards. The cold and hot cycle and dust tests are all based on the industry's conventional frequency and concentration. The test results can directly reflect the actual outdoor use effect. The failure rate is low and it is easily recognized by the market and patent examination.

[0101] Fourth, it is highly adaptable to the environment and easy to implement. Its anti-static and low dust accumulation design allows it to adapt to tunnel environments without special maintenance. The plastic formula and coating process both use mature equipment in the industry, which facilitates mass production.

[0102] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A sulfurization-resistant stent, characterized in that, It includes a quadruple anti-corrosion coating, a high thermal conductivity copper layer, a flip-chip functional area coating, an antistatic and weather-resistant plastic layer, and a cup. The high thermal conductivity copper layer is disposed on the quadruple anti-corrosion coating. The flip-chip functional area coating and the cup are both disposed on the high thermal conductivity copper layer. The cup surrounds the outer periphery of the flip-chip functional area coating. The antistatic and weather-resistant plastic layer is disposed on the flip-chip functional area coating and located inside the cup.

2. The anti-sulfurization stent according to claim 1, characterized in that, Both the quadruple anti-corrosion coating and the flip-chip functional area coating include, from bottom to top, a copper-nickel alloy substrate, a palladium barrier layer, a nickel-phosphorus alloy barrier layer, and a silver surface layer.

3. The anti-sulfurization stent according to claim 2, characterized in that, The thickness of the copper-nickel alloy substrate is 0.025-0.035 mm; The thickness of the palladium barrier layer is 0.003-0.008 mm; The thickness of the nickel-phosphorus alloy barrier layer is 0.008-0.012 mm; The thickness of the silver surface layer is 0.01-0.02 mm.

4. The anti-sulfurization stent according to claim 1, characterized in that, The high thermal conductivity copper layer has a purity ≥99.99%, a thickness of 0.23-0.27 mm, and a thermal conductivity of [missing information]. Oxygen-free red copper.

5. The anti-sulfurization stent according to claim 4, characterized in that, The upper surface of the high thermal conductivity copper layer is provided with micro-grooves with a depth of 5-10μm and a spacing of 12-18μm.

6. The anti-sulfurization stent according to claim 1, characterized in that, The dimensions of the antistatic and weather-resistant plastic layer are 4.6-5.0mm × 4.6-5.0mm.

7. The anti-sulfurization stent according to claim 1, characterized in that, The bowl / cup has a rim size of 5.1-5.5mm × 5.1-5.5mm, a depth of 0.43-0.47mm, and an inner wall inclination angle of 8-12°.

8. An LED light source for tunnel and seaside lighting, characterized in that, The anti-sulfurization support according to any one of claims 1 to 7 is provided with nine LED chip functional areas arranged in a 3×3 matrix on the flip chip functional area coating, each LED chip functional area is provided with one LED chip, and each LED chip is covered by the antistatic and weather-resistant plastic layer.

9. The LED light source for tunnel and seaside lighting according to claim 8, characterized in that, Each of the LED chip functional areas measures 1.15mm × 1.15mm, and a plastic isolation strip with a width of 0.18-0.38mm is provided between two adjacent LED chip functional areas.

10. The LED light source for tunnel and seaside lighting according to claim 8, characterized in that, The dimensions of each LED chip satisfy: between.

Images