Simple and effective module power supply aging fixture

Abstract

The utility model discloses a simple and effective module power supply aging fixture belongs to module power supply test technical field, including PCB circuit board, test module, heat conduction gasket, aluminium profile heat dissipation fin, support and cooling fan. PCB circuit board is equipped with four module installation sites, and four corners are equipped with installation positioning hole, test module is the module power supply of aging, heat conduction gasket is silica gel material, and the thickness is 3.0mm+0.2mm, and the heat conductivity coefficient is greater than or equal to 3.0W / m K, and is pasted on the surface of heat dissipation fin, and heat dissipation fin is fin structure, and one is placed on every two test module top, support is acrylic and is bent into U type, and is equipped with two openings and a plurality of screw holes, and cooling fan is locked in support through screw. This fixture can improve aging test heat dissipation efficiency (module surface temperature uniformity is less than or equal to 5 DEG C) and operation convenience (module replacement time consumption shortens 60%), guarantees the consistency of multiple module test, and can be widely applied in communication, industry, consumer electronics and other fields.

Description

Technical Field

[0001] This invention relates to the field of power supply reliability testing technology, specifically to a simple and effective power supply aging fixture, which is particularly suitable for aging tests of power supply modules in consumer electronics, industrial control, new energy vehicles and other fields. Background Technology

[0002] As the "heart" of electronic devices, the reliability of power supplies directly determines the lifespan and safety of end products. Industry data shows that early power supply failures (within the first 1000 hours of use) account for over 60% of all failures, and aging tests are a key method for screening products with early failures. By simulating the long-term operating conditions of products under high temperature and high load (typically 4-168 hours), potential defects (such as loose solder joints, capacitor electrolyte evaporation, and thermal fatigue of semiconductor devices) can be stimulated, thereby improving the stability of products leaving the factory. Existing power supply aging fixtures suffer from the following technical drawbacks: cumbersome operation, poor heat dissipation, high energy consumption, and high testing costs. Summary of the Invention

[0003] The technical problem this invention aims to solve is to provide a simple and effective modular power supply aging fixture design, which addresses the issues of cumbersome operation, poor heat dissipation, high energy consumption, and high testing costs associated with traditional aging designs. It offers superior heat dissipation, ease of operation, outstanding durability, and significant cost advantages, thereby improving the efficiency of modular power supply aging production.

[0004] The technical problem to be solved by this utility model is achieved by the following technical solution:

[0005] A simple and effective power supply aging fixture design is characterized by the following: it includes a PCB circuit board, test modules, thermal pads, aluminum profile heat sinks, a bracket, and a cooling fan; the PCB circuit board has four module mounting positions on its surface and mounting positioning holes at the four corners; the test modules are the modular power supply products to be aged; the thermal pads are made of silicone thermally conductive material with a thickness of 3.0mm±0.2mm and a thermal conductivity ≥3.0W / m·K, and are attached to the surface of the profile heat sink; the aluminum profile heat sink has a finned structure, with one profile heat sink placed on top of the thermal pads corresponding to every two test modules; the bracket is made of acrylic bent into a U-shape, with two large openings and several threaded holes on its surface; the cooling fan is secured to the bracket with screws.

[0006] In practical applications, push the acrylic bracket inward to expose the operating space of the test module, insert the four test modules into the PCB circuit board, place the heat sink on top, and ensure that the thermal pad is in close contact with the upper surface of the module; pull the acrylic bracket back to start the aging test and build a thermal management closed loop of "module → thermal pad → heat sink → fan"; if a module needs to be replaced, repeat the push and pull operation to easily complete the module removal and installation.

[0007] As a preferred example, the PCB circuit board surface is provided with four module mounting positions and mounting positioning holes at the four corners;

[0008] By adopting the above technical solution, four modules can be tested simultaneously, thus improving the efficiency of aging tests.

[0009] As a preferred example, the thermal pad is made of silicone thermally conductive material with a thickness of 3.0mm ± 0.2mm and a thermal conductivity ≥ 3.0W / m·K, and is attached to the surface of the heat sink of the profile;

[0010] By adopting the above technical solutions, the product's heat dissipation capacity is improved and its operation is simple and efficient.

[0011] As a preferred example, the bracket is made of acrylic bent into a U-shape, with two large openings and several threaded holes on its surface; the cooling fan is fastened to the bracket with screws.

[0012] By adopting the above technical solutions, we can ensure that the stent is simple to manufacture, low in cost, and easy to mass-produce.

[0013] As a preferred example, the aluminum profile heat sink has a finned structure;

[0014] By adopting the above technical solutions, the product's heat dissipation capacity can be further improved;

[0015] As a preferred example, in practical application, push the acrylic bracket inward to expose the operating space of the test module, insert the four test modules into the PCB circuit board, place the heat sink on top, and ensure that the thermal pad is in close contact with the upper surface of the module; pull the acrylic bracket back to start the aging test and build a thermal management closed loop of "module → thermal pad → heat sink → fan"; repeat the push and pull operation to easily complete the module removal and installation.

[0016] By adopting the above technical solution, the entire aging process becomes simple and efficient to operate;

[0017] The beneficial effects of this utility model are: by using standardized profiles and common components such as U-shaped brackets, thermal pads, heat sinks, and fans, a simple and efficient heat dissipation structure is formed, which has low manufacturing cost and is convenient for maintenance and replacement, improving the operational efficiency of the product aging process; and the cooling efficiency is increased by 25% compared with similar products. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the heat dissipation pad and the heat sink of the profile in this utility model;

[0020] Figure 3This is a schematic diagram of the support structure in this utility model;

[0021] In the diagram: 1. Aging cabinet shelf, 11. Copper stud, 2. Bracket, 21. Fan mounting hole, 22. Fan, 3. Screw, 4. PCB circuit board, 5. Test module, 6. Thermal pad, 7. Profile heat sink, 8. Aging cabinet back panel, 9. Wiring terminal block. Detailed Implementation

[0022] To facilitate a clear understanding of the technical means, creative features, objectives, and effects of this utility model, the following description, in conjunction with specific illustrations, further elaborates on this utility model.

[0023] like Figure 1 , Figure 2 , Figure 3 As shown, a modular power supply aging fixture structure includes an aging cabinet shelf 1, a bracket 2, a fan 3, screws 4, a PCB circuit board 5, a test module 6, a thermal pad 7, a profile heat sink 8, and an aging cabinet back panel 9.

[0024] Several copper studs 11 are set on the aging cabinet shelf 1. The PCB circuit board 5 is fixed on the copper studs 11. The power supply is connected to the PCB circuit board 5 through the terminal 91. The thermal pad 7 is attached to the heat sink 8 of the profile. The fan 3 is locked on the bracket 2 by the screw 4 and the fixing hole 21 on the bracket 2. The fan 3 is aligned with the fan hole 22. The power supply of the fan comes from the 12V controllable power supply of the aging cabinet back panel.

[0025] In practical applications, test module 6 is installed on PCB circuit board 5, heat sink 8 is placed above test module 6, and thermal pad 7 is pressed on test module 6. Bracket 2 is placed above PCB circuit board 5, and fan 3 is used to align with heat sink 8. After aging, bracket 2 is pushed inward, heat sink 8 is removed, test module 6 is removed, a new test module 6 is replaced, heat sink 8 is placed, bracket 2 is moved back to its original position, and aging is repeated. The whole process is simple and efficient, improving production aging efficiency.

[0026] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments, and various changes and modifications can be made without departing from the spirit and scope of this utility model. All such changes and modifications fall within the scope of protection claimed by this utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A simple and effective module power supply aging fixture, characterized in that: It includes a PCB circuit board, test modules, thermal pads, aluminum heat sinks, a bracket, and a cooling fan. The PCB circuit board has four module mounting positions and mounting holes at the four corners. The test modules are the power supplies to be aged. The thermal pads are made of silicone thermally conductive material, 3.0mm ± 0.2mm thick, with a thermal conductivity ≥ 3.0W / m・K, and are attached to the surface of the heat sink. The aluminum heat sink has a finned structure, with one heat sink placed above the thermal pads corresponding to every two test modules. The bracket is made of U-shaped acrylic with two large openings and several threaded holes on its surface. The cooling fan is screwed onto the bracket. In practical application, the acrylic bracket is pushed inward to expose the operating space for the test modules. The four test modules are inserted into the PCB circuit board, and the heat sink is placed on top, ensuring the thermal pads are tightly fitted to the upper surface of the modules. The acrylic bracket is then pulled back to start the aging test, constructing the sequence "module → thermal pad → heat sink → fan". A closed-loop thermal management system; if a module needs to be replaced, simply repeat the push-pull operation to easily remove and install the module.

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