PCBA surface-mounted wire harness tin wire laser welding jig

CN224927147UActive Publication Date: 2026-11-03CRRC CHANGCHUN RAILWAY VEHICLES CO LTD
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Patent Information

Application Number
CN202522396889.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-12
Publication Date
2026-11-03
Estimated Expiration
2035-11-12

AI Technical Summary

Technical Problem

Existing technologies for welding cables to integrated circuit boards suffer from problems such as insufficient welding strength, inconsistent solder joints, and low efficiency. While robotic welding improves uniformity, it also results in a high defect rate.

Method used

Design a laser soldering fixture for PCBA surface mount wire harnesses, including a fixture body, a vision positioning mechanism, a fixing device and a limiting post, to achieve precise bonding and soldering of the wire harness and the pad through vision positioning and parameter adjustment.

Benefits of technology

It improves the stability and uniformity of welding, reduces the defect rate, shortens the welding time, and improves welding efficiency and safety.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a kind of PCBA surface mount wire harness tin wire laser welding jigs, involve intelligent manufacturing technical field.The jig includes: jig body;The top of jig body is equipped with cover plate;Visual positioning mechanism is equipped below cover plate;Fixed device is equipped below cover plate, it is used to lock and fix integrated circuit board on the lower surface of cover plate;One end of cover plate is connected with strip-shaped pressing block, recess is equipped below strip-shaped pressing block;Wire harness is arranged in recess;Strip-shaped pressing block is used to fix wire harness tightly in recess, to guarantee that wire harness and integrated circuit board surface mount pad are completely laminated.Application of the PCBA surface mount wire harness tin wire laser welding jig of the utility model, wire harness welding is carried out by tin wire laser welding machine, can guarantee the stability, uniformity and welding quality of wire harness welding;It can shorten the required beat of welding, improve process safety.
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Description

Technical Field

[0001] This utility model relates to the field of intelligent manufacturing technology, and in particular to a laser welding fixture for surface-mount wire harnesses in PCBA. Background Technology

[0002] In the production process of multiple scenarios, the cables used need to have their outer sheath stripped off at one end before being soldered to the integrated circuit board. However, most of the current wire harness soldering process is done manually. Manual soldering often results in problems such as insufficient strength after soldering, poor uniformity of solder joint appearance, inconsistent solder joint size, and low soldering efficiency.

[0003] With the continuous advancement of mechanical automation technology, many manufacturers have begun to use robotic welding to replace manual welding. Although the uniformity of welding has been improved, the welding efficiency has not been significantly improved, and the welding defect rate is still relatively high. Utility Model Content

[0004] This invention aims to solve the technical problems of high welding efficiency and high welding defect rate in the prior art by providing a laser welding fixture for PCBA surface-mount wire harnesses.

[0005] To solve the above-mentioned technical problems, the specific technical solution of this utility model is as follows:

[0006] A PCBA surface mount wire harness solder wire laser welding fixture includes: a fixture body;

[0007] The fixture body has a cover plate on top; a visual positioning mechanism is located below the cover plate.

[0008] A fixing device is also provided below the cover plate, which is used to lock and fix the integrated circuit board to the lower surface of the cover plate;

[0009] One end of the cover plate is connected to a strip-shaped pressure block, and a groove is provided below the strip-shaped pressure block; the wire harness is placed in the groove; the strip-shaped pressure block is used to press the wire harness tightly in the groove for fixation, so as to ensure that the wire harness is completely attached to the surface mount pads of the integrated circuit board.

[0010] In the above technical solution, the cover plate has a quick-release structure to enable rapid product assembly.

[0011] In the above technical solution, multiple limiting posts of different sizes are provided below the cover plate. These limiting posts are used to prevent incorrect installation of the wire harness.

[0012] In the above technical solution, the cover plate is also used to achieve rapid welding of wire harnesses on both sides of the integrated circuit board by flipping it.

[0013] This utility model has the following beneficial effects:

[0014] This utility model relates to a PCBA surface mount wire harness solder wire laser welding fixture, which fixes the integrated circuit board and wire harness and adjusts parameters such as the wire feeding length, wire feeding speed, welding time, and welding power to achieve wire harness welding on surface mount pads.

[0015] The PCBA surface mount wire harness solder wire laser welding fixture of this invention can be used to weld wire harnesses using a solder wire laser welding machine, which can ensure the stability, uniformity and welding quality of wire harness welding; it can also shorten the welding cycle time and improve process safety. Attached Figure Description

[0016] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0017] Figure 1 This is a schematic diagram of the structure of the PCBA surface mount wire harness solder wire laser welding fixture of this utility model.

[0018] The reference numerals in the figure are:

[0019] 1- Fixture body; 2- Integrated circuit board; 3- Wire harness; 4- Groove; 5- Strip pressure block; 6- Cover plate. Detailed Implementation

[0020] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0021] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0022] Example 1

[0023] like Figure 1As shown, the PCBA surface mount wire harness solder wire laser soldering fixture of this utility model includes: a fixture body 1; a cover plate 6 is provided on the top of the fixture body 1; a visual positioning mechanism is provided below the cover plate 6; a fixing device is also provided below the cover plate 6, which is used to lock and fix the integrated circuit board 2 on the lower surface of the cover plate 6; a strip-shaped pressure block 5 is connected to one end of the cover plate 6, and a groove 4 is provided below the strip-shaped pressure block 5; the wire harness 3 is placed in the groove 4; the strip-shaped pressure block 5 is used to press the wire harness 3 into the groove 4 for fixation, so as to ensure that the wire harness 3 is completely attached to the surface mount pad of the integrated circuit board 2.

[0024] Specifically, the fixing device is a circuit board locking strip; the cover plate 6 has a quick-release structure to enable rapid product assembly; multiple limiting posts of various sizes are provided under the cover plate 6 to prevent incorrect installation of the wire harness 3; the cover plate 6 can also be flipped to enable rapid soldering of the wire harness 3 on both sides of the integrated circuit board 2. The pad position markings are pre-set on the integrated circuit board 2, and rapid positioning can be achieved by identifying the pad position markings on the integrated circuit board 2 through a visual positioning mechanism. This visual positioning mechanism determines the pad position markings through image analysis.

[0025] The method for welding surface-mount wire harnesses on integrated circuit boards using the PCBA surface-mount wire harness laser welding fixture of this utility model specifically includes the following steps:

[0026] Step 1: Use the above-mentioned fixture to fix the integrated circuit board 2 and the wire harness 3;

[0027] Step 2: Adjust the wire feeding parameters; these parameters include: wire feeding length, wire feeding speed, wire take-up length, and wire take-up speed.

[0028] Step 3: Visually locate the pre-set pad position marks on the integrated circuit board 2 using a visual positioning mechanism;

[0029] Step 4: Perform welding operation. After welding is completed, use a vision positioning mechanism to visually inspect the welding effect of integrated circuit board 2, detect welding defects, and automatically identify, mark and record welding defects.

[0030] In step 2, the solder wire feeding parameters can be flexibly adjusted according to the size of the product pads to make the solder joints full and teardrop-shaped after soldering. In this embodiment, the solder wire feeding parameters are as follows: wire feeding length 10mm, wire feeding speed 7mm / s, wire take-up length 5mm, and wire take-up speed 18mm / s.

[0031] In step 4, when visually inspecting the soldering effect of integrated circuit board 2 using a visual positioning mechanism, the detected defect types include: missing solder, solder bridging, insufficient solder, solder spikes, solder balls, and bridging.

[0032] Using the fixture of this invention for welding can significantly improve the problems of insufficient solder and tombstoning that occur during the welding process of label wire harnesses, and the welding effect is significantly improved.

[0033] After determining the program parameters, the cycle time of the welding process is calculated. The cycle time is 40 seconds per piece, starting from when the first integrated circuit board 2 is placed in the fixture until the welding is completed and the board is removed from the equipment. Compared with the cycle time of 5 minutes per piece for manual welding, the welding efficiency is greatly improved by applying the method of this utility model, and the appearance consistency of the solder joints is guaranteed.

[0034] Example 2

[0035] The difference between this embodiment and Embodiment 1 is that:

[0036] In step 2, when soldering the product, the specific parameters for feeding the solder wire are: wire feeding length of 8mm, wire feeding speed of 8mm / s, wire take-up length of 6mm, and wire take-up speed of 20mm / s.

[0037] After determining the program parameters, the cycle time of the welding process is calculated. The cycle time is 42 seconds per piece, starting from when the first integrated circuit board 2 is placed in the fixture until the welding is completed and the board leaves the equipment.

[0038] Example 3

[0039] The difference between this embodiment and Embodiment 1 is that:

[0040] In step 2, when soldering the product, the specific parameters for feeding the solder wire are: wire feeding length of 6mm, wire feeding speed of 6mm / s, wire take-up length of 4mm, and wire take-up speed of 10mm / s.

[0041] After determining the program parameters, the cycle time of the welding process is calculated. The cycle time is 45 seconds per piece, starting from when the first integrated circuit board 2 is placed in the fixture until the welding is completed and the board is removed from the equipment.

[0042] This utility model relates to a PCBA surface mount wire harness solder wire laser welding fixture, which fixes the integrated circuit board and wire harness and adjusts parameters such as the wire feeding length, wire feeding speed, welding time, and welding power to achieve wire harness welding on surface mount pads.

[0043] The PCBA surface mount wire harness solder wire laser welding fixture of this invention can be used to weld wire harnesses using a solder wire laser welding machine, which can ensure the stability, uniformity and welding quality of wire harness welding; it can also shorten the welding cycle time and improve process safety.

[0044] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A laser soldering fixture for surface mount wire harnesses in PCBA, characterized in that, include: Fixture body (1); The top of the fixture body (1) is provided with a cover plate (6); a visual positioning mechanism is provided below the cover plate (6); A fixing device is also provided below the cover plate (6) to lock the integrated circuit board (2) onto the lower surface of the cover plate (6); One end of the cover plate (6) is connected to a strip-shaped pressure block (5), and a groove (4) is provided below the strip-shaped pressure block (5); the wire harness (3) is placed in the groove (4); the strip-shaped pressure block (5) is used to press the wire harness (3) into the groove (4) for fixation, so as to ensure that the wire harness (3) is completely attached to the surface mount pad of the integrated circuit board (2).

2. The PCBA surface mount wire harness solder wire laser welding fixture according to claim 1, characterized in that, The cover plate (6) is a quick-release structure to enable rapid product assembly.

3. The PCBA surface mount wire harness solder wire laser welding fixture according to claim 1, characterized in that, Multiple sized limit posts are provided below the cover plate (6) to prevent incorrect installation of the wire harness (3).

4. The PCBA surface mount wire harness solder wire laser welding fixture according to claim 1, characterized in that, The cover plate (6) is also used to enable rapid soldering of the wire harnesses (3) on both sides of the integrated circuit board (2) by flipping.