An etching experimental device dynamically simulating a production line

Abstract

The utility model relates to panel preparation technical field, specifically disclose a kind of etching experimental device of dynamic simulation production line, including spraying chamber, etching mechanism, chemical environment simulation mechanism and detection mechanism;Etching liquid is contained in spraying chamber;Etching mechanism includes the sample bearing structure for being arranged in the side wall of spraying chamber and can extend to its inside and the spraying structure for etching liquid delivery and spraying to sample surface;Chemical environment simulation mechanism is communicated with spraying chamber to adjust etching liquid chemical concentration;Detection mechanism is arranged in the side wall of spraying chamber, and detection end can extend to etching liquid to obtain chemical parameter in real time.The device is actively accurate control etching liquid chemical state by chemical environment simulation mechanism, in combination with the real-time on-line monitoring of detection mechanism, realizes the accurate control of etching process parameter and real-time data feedback, significantly improves the accuracy, efficiency and automation level of etching process research, provides reliable experimental platform for process optimization.

Description

Technical Field

[0001] This utility model relates to the field of panel manufacturing technology, specifically to an etching experimental device for dynamically simulating a production line. Background Technology

[0002] In panel and high-precision circuit board manufacturing, etching is a crucial process for forming circuit patterns. The performance of the etching solution and its dynamic changes during the process directly affect the etching rate, linewidth accuracy, and product yield. In actual continuous production, as the etching solution continuously dissolves metals such as copper and silver, the concentration of metal ions within it continuously increases, leading to a gradual decline in etching performance. Therefore, in the process research and optimization stage, accurately simulating the dynamic changes of the etching solution composition on the actual production line in a laboratory environment has become an important research direction for improving process control.

[0003] There are various etching devices in the prior art for use in laboratories or production lines; for example, Chinese utility model patent CN210444589U discloses an etching device for uniform etching of fine wire plates. This device achieves stable conveying and uniform spraying of workpieces through a conveyor belt, mounting components and an etching mechanism with fan-shaped nozzles, which effectively improves the physical uniformity of etching and reduces impact damage.

[0004] However, the aforementioned device has functional limitations. Since its overall structure is mainly designed for etching under fixed chemical conditions, the device itself lacks a physical structure for actively intervening in and sensing the chemical state of the etching solution in real time. Specifically, during the etching process, the chemical state of the etching solution, such as the concentration of metal ions, exists as an uncontrollable and passively changing parameter. This makes it impossible for the device to accurately reproduce the continuous evolution trajectory of the etching solution composition in the actual production line in a laboratory environment, and it is also difficult to obtain dynamic correlation data between the chemical state and the process results in real time. Therefore, in high-level research scenarios that require active control and precise observation of the continuous changes in the chemical parameters of the etching solution on the process, the structure of the existing device limits its ability to deeply explore the underlying mechanism of the etching process. Utility Model Content

[0005] To address the technical problems in the prior art, this utility model provides an etching test device for dynamic simulation of production lines, aiming to solve the problems that existing etching test devices cannot accurately simulate the dynamic changes in the chemical state of the etching solution in actual production lines, and lack the ability to monitor key chemical parameters in real time.

[0006] The technical solution of this utility model is implemented as follows: An etching experimental apparatus for dynamically simulating a production line includes a spray chamber, an etching mechanism, a chemical environment simulation mechanism, and a detection mechanism, wherein... The spray chamber contains etching solution; The etching mechanism includes a sample support structure and a spray structure; The sample carrying structure is located on the side wall of the spray chamber and can extend into the spray chamber to carry the sample and transport it to the spray station inside the spray chamber. The spray structure is used to transport and spray the etching solution in the spray chamber onto the sample surface located at the spray station to simulate the etching operation. The chemical environment simulation mechanism is connected to the spray chamber and is used to adjust the chemical concentration of the etching solution in the spray chamber; The detection mechanism is located on the side wall of the spray chamber, and its detection end can extend into the etching solution to obtain the chemical parameters of the etching solution in real time.

[0007] Optionally, the chemical environment simulation mechanism includes a metal powder quantitative addition structure and an etching solution replenishment structure, wherein, The metal powder quantitative addition structure is located at the top of the spray chamber and is used to precisely add metal powder to the etching solution to simulate an increase in ion concentration. The etching solution replenishment structure is connected to the inside of the spray chamber and is used to replenish fresh etching solution into the spray chamber to adjust the ion concentration. By leveraging the synergistic effect of a quantitative metal powder addition structure and an etching solution replenishment structure, the dynamic evolution of the chemical state of the etching solution in an actual production line is simulated.

[0008] Optionally, the metal powder metering addition structure includes a mass sensor, a loss-in-weight weighing hopper, and a pneumatic butterfly valve, wherein, The mass sensor is located at the top of the spray chamber; The loss-in-weight scale hopper is mounted on the mass sensor and has a discharge port at its bottom. A discharge hopper is provided at the top of the spray chamber corresponding to the discharge port. The pneumatic butterfly valve is located at the discharge port and is used to control the opening and closing of the discharge port; Both the mass sensor and the pneumatic butterfly valve are connected to an external control system. The mass sensor monitors changes in the mass of the silo, and the precise opening and closing control of the pneumatic butterfly valve together achieves the quantitative addition of metal powder.

[0009] Optionally, the etching solution replenishment structure includes an etching solution replenishment tank and a delivery pump, wherein, The etching solution replenishment tank is connected to the interior of the spray chamber via a pipe; The delivery pump is located on the pipeline and is used to pump fresh etching solution from the etching solution replenishment tank into the spray chamber.

[0010] Optionally, an etching test apparatus for a dynamic simulation production line may also include heating coils and a rotary stirrer; The heating coil is located at the bottom of the spray chamber and is immersed in the etching solution. It is connected to an external control system to receive control commands to heat the etching solution in order to simulate the process temperature conditions of the production line. The rotary stirrer is located at the bottom of the spray chamber and is driven and connected to an external drive structure to keep the etching solution uniformly mixed to simulate the etching solution flow state of the production line.

[0011] Optionally, the detection mechanism includes a mounting plate, a sliding block, and a detection probe, wherein, The mounting plate is embedded in the side wall of the spray chamber and has a longitudinally opening limit groove; The sliding block is located inside the spray chamber, and one end is slidably located in the limiting groove. The detection probe is located at the bottom of one end of the sliding block in the spray chamber and is connected to an external control system. It is used to immerse the probe in the etching solution to detect chemical parameters.

[0012] Optionally, the detection mechanism may further include a locking block and a locking screw; The locking block is located on the outside of the mounting plate; The locking screw extends through the locking block into the limiting groove and is rotatably connected to the sliding block. The locking screw is threadedly connected to the locking block.

[0013] Optionally, the sample carrying structure includes a sample replacement chamber, a pusher plate, and a carrying plate, wherein, The sample replacement chamber is located on the side wall of the spray chamber, and an inlet is provided on the side wall of the spray chamber corresponding to the sample replacement chamber. An opening for taking out and putting in the sample replacement chamber is provided on the top of the sample replacement chamber. The push plate slides laterally through the outer wall of the sample replacement chamber and extends into the sample replacement chamber; The support plate is located inside the sample replacement chamber and is fixedly connected to the end of the push plate.

[0014] Optionally, the spray structure includes spray heads, a pump, and a delivery pipe, wherein, The spray head is located at the top of the spray chamber; The pump is located outside the sprinkler room; The delivery pipe connects the spray chamber, the pump, and the spray head, and is used to pump the etching solution in the spray chamber to the spray head.

[0015] Optionally, an etching experimental device for dynamically simulating a production line may also include a liquid level observation window; The liquid level observation window is embedded in the side wall of the spray chamber and is made of transparent material. It is used to observe the liquid level of the etching solution in the spray chamber.

[0016] Compared with the prior art, the etching experimental device for dynamically simulating a production line provided by this utility model has the following advantages: (1) Through the synergistic effect of the quantitative addition structure of metal powder and the supplementation structure of etching solution, the concentration of metal ions in the etching solution in the spray chamber can be actively and accurately adjusted, and the continuous evolution trajectory of the etching solution composition from the initial stage to the final stage in the actual production line can be highly restored, providing a reliable experimental environment for process research.

[0017] (2) The integrated detection mechanism can monitor the concentration changes of specific metal ions in the etching solution online and in real time. The data is accurate and the response is fast, which makes it easy to understand the status of the etching solution in a timely manner and provide timely and accurate data support for process control.

[0018] (3) By integrating multiple execution and detection units such as quantitative addition of metal powder, replenishment of etching solution, heating, stirring and concentration detection through the control system, the centralized control, data acquisition and closed-loop feedback of key process parameters are realized, which significantly improves the automation and efficiency of the experiment.

[0019] (4) The temperature and uniformity of the etching solution can be precisely controlled by heating coils and rotating stirrers, ensuring the consistency of environmental parameters during the experiment and improving the reliability and repeatability of the experimental results.

[0020] (5) The sample support structure adopts a horizontal sliding design, which facilitates the quick loading and precise positioning of the sample; the spray structure can simulate the spray etching process; the liquid level observation window facilitates real-time monitoring of the liquid level height. The overall device is easy to operate and meets the needs of high-frequency experiments. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of an etching experimental device for a dynamic simulation production line according to this utility model. Figure 2 for Figure 1 Sectional view at point AA; Figure 3 This is a schematic diagram of the detection mechanism of an etching test device for a dynamic simulation production line according to this utility model; Figure 4 This is a schematic diagram of the sample support structure of an etching test device for a dynamic simulation production line according to this utility model.

[0022] In the diagram: 1. Spray chamber; 2. Etching mechanism; 21. Sample support structure; 211. Sample replacement chamber; 212. Push plate; 213. Support plate; 22. Spray structure; 221. Spray head; 222. Pump; 223. Delivery pipe; 3. Chemical environment simulation mechanism; 31. Metal powder quantitative addition structure; 311. Mass sensor; 312. Loss-in-weight balance hopper; 313. Pneumatic butterfly valve; 32. Etching solution replenishment structure; 321. Etching solution replenishment tank; 322. Delivery pump; 4. Detection mechanism; 401. Limiting groove; 41. Mounting plate; 42. Sliding block; 43. Detection probe; 44. Locking block; 45. Locking screw; 5. Heating coil; 6. Rotary stirrer; 11. Feed hopper; 12. Liquid level observation window. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0024] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model based on the specific circumstances.

[0025] In the description of the embodiments of this utility model, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0027] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0028] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention; however, those skilled in the art will recognize the applicability of other processes and / or the use of other materials.

[0029] Please see Figure 1-4 The present invention proposes an etching test device for dynamic simulation production line, which includes a spray chamber 1, an etching mechanism 2, a chemical environment simulation mechanism 3, and a detection mechanism 4.

[0030] like Figure 1 As shown, the spray chamber 1 contains etching solution; the etching mechanism 2 includes a sample carrying structure 21 and a spraying structure 22; the sample carrying structure 21 is located on the side wall of the spray chamber 1 and can extend into the spray chamber 1 to carry the sample and transport it to the spraying station in the spray chamber 1; the spraying structure 22 is used to transport the etching solution in the spray chamber 1 and spray it onto the sample surface located at the spraying station to simulate the etching operation; the chemical environment simulation mechanism 3 is connected to the spray chamber 1 and is used to adjust the chemical concentration of the etching solution in the spray chamber 1; the detection mechanism 4 is located on the side wall of the spray chamber 1, and its detection end can extend into the etching solution to obtain the chemical parameters of the etching solution in real time.

[0031] Specifically, a core system framework for realizing dynamic simulation was constructed; the spray chamber 1, as the core reaction vessel, carries the etching solution and provides a mounting base for various components; the extendable design of the sample carrying structure 21 enables rapid sample loading and precise positioning, improving experimental efficiency; the spray structure 22 operates by circulating the etching solution in the spray chamber 1, ensuring that the etching solution acting on the sample is consistent with the liquid receiving chemical control; the interconnected setup of the chemical environment simulation mechanism 3 allows it to directly intervene in the chemical state of the etching solution, serving as the core for active concentration control; the extendable detection end of the detection mechanism 4 provides the necessary conditions for real-time, in-situ acquisition of key chemical parameters of the etching solution; the entire architecture provides a complete physical platform for achieving accurate dynamic simulation and real-time feedback.

[0032] In some embodiments, such as Figure 1 As shown, the chemical environment simulation mechanism 3 includes a metal powder quantitative addition structure 31 and an etching solution replenishment structure 32. The metal powder quantitative addition structure 31 is located at the top of the spray chamber 1 and is used to precisely add metal powder to the etching solution to simulate an increase in ion concentration. The etching solution replenishment structure 32 is connected to the interior of the spray chamber 1 and is used to replenish fresh etching solution to the spray chamber 1 to adjust the ion concentration. Through the synergistic effect of the metal powder quantitative addition structure 31 and the etching solution replenishment structure 32, the dynamic evolution process of the chemical state of the etching solution in the actual production line is simulated.

[0033] Specifically, this embodiment clarifies the core execution components for chemical environment simulation; the metal powder quantitative addition structure 31 actively simulates the accumulation process of metal ion concentration caused by continuous etching in the production line by precisely introducing the metal source; the etching solution replenishment structure 32 is used to replenish fresh etching solution, which can dilute excessively high ion concentration or reset the system to its initial state; the synergistic work of the two realizes bidirectional and programmable control of the chemical concentration of the etching solution, enabling researchers to actively construct and study the behavior of the etching solution under different chemical states, thereby systematically exploring the process rules.

[0034] In some embodiments, such as Figure 2 As shown, the metal powder quantitative addition structure 31 includes a mass sensor 311, a loss-in-weight hopper 312, and a pneumatic butterfly valve 313. The mass sensor 311 is located at the top of the spray chamber 1; the loss-in-weight hopper 312 is located on the mass sensor 311, and a discharge port is provided at its bottom. A discharge hopper 11 is provided at the top of the spray chamber 1 corresponding to the discharge port; the pneumatic butterfly valve 313 is located at the discharge port and is used to control the opening and closing of the discharge port; both the mass sensor 311 and the pneumatic butterfly valve 313 are connected to an external control system. The mass sensor 311 monitors the mass change of the hopper, and the precise opening and closing control of the pneumatic butterfly valve 313 is combined to achieve quantitative addition of metal powder.

[0035] Specifically, this embodiment discloses a specific implementation scheme for high-precision quantitative addition; the mass sensor 311 preferably adopts a high-precision weighing sensor, which can sense the minute mass changes of the loss-in-weight scale hopper 312 in real time; by monitoring the decrease in the mass of the hopper by the mass sensor 311, the actual addition amount is calculated, realizing high-precision cumulative measurement; the fast-response pneumatic butterfly valve 313 ensures the instantaneous start and stop of powder addition; the external control system, such as a PLC, receives the mass signal and controls the pneumatic butterfly valve to form a high-precision closed-loop control circuit, thereby ensuring the accuracy and controllability of the metal powder addition amount.

[0036] In some embodiments, such as Figure 1 As shown, the etching solution replenishment structure 32 includes an etching solution replenishment tank 321 and a delivery pump 322. The etching solution replenishment tank 321 is connected to the interior of the spray chamber 1 through a pipe. The delivery pump 322 is located on the pipe and is used to pump fresh etching solution from the etching solution replenishment tank 321 into the spray chamber 1.

[0037] Specifically, this embodiment provides a key means of adjusting the concentration of etching solution; the etching solution replenishment tank 321 serves as a storage source of fresh etching solution, and the delivery pump 322 preferably adopts a high-precision metering pump or peristaltic pump. Under the command of the external control system, the fresh etching solution is pumped into the spray chamber 1 at a set flow rate to reduce the overall metal ion concentration or replenish the consumed effective components. This is an important component for realizing bidirectional regulation of the chemical environment.

[0038] In some embodiments, such as Figure 1 As shown, an etching experiment device for a dynamic simulation production line also includes a heating coil 5 and a rotary stirrer 6; the heating coil 5 is located at the bottom of the spray chamber 1 and is immersed in the etching solution, and is connected to an external control system to receive control commands to heat the etching solution in order to simulate the process temperature conditions of the production line; the rotary stirrer 6 is located at the bottom of the spray chamber 1 and is driven and connected to an external drive structure to keep the etching solution uniformly mixed to simulate the etching solution flow state of the production line.

[0039] Specifically, this embodiment improves the precise control of the physical environment of the etching solution; the heating coil 5 uses a corrosion-resistant titanium heating tube, which can accurately maintain the process temperature of the etching solution by connecting to the temperature control module of the external control system; the rotary stirrer 6 is driven by an external drive structure, which can adopt a combination of conventional stirring rod and stirring blade. The external drive structure specifically includes an explosion-proof motor and a reducer, which is connected to the inside of the spray chamber 1 through a mechanical seal to ensure that the added substances and heat are quickly and evenly dispersed, while simulating the liquid flow in the production line, which is crucial for maintaining the consistency of experimental conditions.

[0040] In some embodiments, such as Figure 3As shown, the detection mechanism 4 includes a mounting plate 41, a sliding block 42, and a detection probe 43. The mounting plate 41 is embedded in the side wall of the spray chamber 1 and has a limiting groove 401 longitudinally formed. The sliding block 42 is located inside the spray chamber 1, and one end is slidably located in the limiting groove 401. The detection probe 43 is located at the bottom of one end of the sliding block 42 inside the spray chamber 1 and is connected to an external control system for immersing in the etching solution to detect chemical parameters.

[0041] Specifically, this embodiment provides a specific structure for real-time, in-situ monitoring; the lifting mechanism consisting of the mounting plate 41 and the sliding block 42 allows the detection probe 43 to flexibly adjust the immersion depth according to the liquid level; the detection probe 43 preferably adopts an ion-selective electrode, specifically including a copper ion-selective electrode and a silver ion-selective electrode, which transmits the specific ion concentration signal in the etching solution to the external control system in real time, realizing instantaneous capture and continuous monitoring of the chemical state.

[0042] In some embodiments, such as Figure 3 As shown, the detection mechanism 4 also includes a locking block 44 and a locking screw 45; the locking block 44 is located on the outside of the mounting plate 41; the locking screw 45 passes through the locking block 44 and extends into the limiting slide groove 401, and is rotatably connected to the sliding block 42, and the locking screw 45 is threadedly connected to the locking block 44.

[0043] Specifically, this embodiment ensures the stability of the monitoring process; by rotating the locking screw 45, the locking block 44 is driven by the threaded pair to press the mounting plate 41, thereby increasing the friction between the sliding block 42 and the inner wall of the limiting slide groove 401, and reliably locking the detection probe 43 in the required position, preventing probe drift during equipment operation.

[0044] In some embodiments, such as Figure 4 As shown, the sample carrying structure 21 includes a sample replacement chamber 211, a push plate 212, and a carrying plate 213. The sample replacement chamber 211 is located on the side wall of the spray chamber 1, and an inlet is provided on the side wall of the spray chamber 1 corresponding to the sample replacement chamber 211. A pick-up and drop-off port is provided on the top of the sample replacement chamber 211. The push plate 212 slides laterally through the outer wall of the sample replacement chamber 211 and extends into the sample replacement chamber 211. The carrying plate 213 is located inside the sample replacement chamber 211 and is fixedly connected to the end of the push plate 212.

[0045] Specifically, this embodiment describes a preferred solution for convenient sample handling; the sample replacement chamber 211 forms a transition cavity; by pushing and pulling the push plate 212, the support plate 213 and the sample on it can be driven to smoothly enter and exit the spray station, realizing the rapid and convenient replacement of samples and greatly improving the convenience of experimental operation.

[0046] In some embodiments, such as Figure 1As shown, the spray structure 22 includes a spray head 221, a pump 222 and a delivery pipe 223. The spray head 221 is located at the top inside the spray chamber 1; the pump 222 is located outside the spray chamber 1; the delivery pipe 223 connects the spray chamber 1, the pump 222 and the spray head 221, and is used to pump the etching solution in the spray chamber 1 to the spray head 221.

[0047] Specifically, this embodiment clarifies the execution details of the etching function; the pump 222 adopts a corrosion-resistant magnetic drive pump to provide power to pump the etching solution through the delivery pipe 223 to the spray head 221 and spray it evenly onto the sample surface; as a preferred embodiment, a regulating valve and a spray pressure gauge are also provided on the delivery pipe 223 before the spray head 221. The spray pressure and flow rate can be precisely controlled by adjusting the valve, and the spray pressure gauge is used to display the pressure value in real time, thereby accurately simulating different production line spray conditions.

[0048] In some embodiments, such as Figure 1 As shown, an etching experiment device for a dynamic simulation production line also includes a liquid level observation window 12; the liquid level observation window 12 is embedded in the side wall of the spray chamber 1 and is made of transparent material, and is used to observe the liquid level height of the etching liquid in the spray chamber 1.

[0049] Specifically, this embodiment provides an intuitive liquid level management method; the liquid level observation window 12 is made of tempered glass and has scale markings, which makes it easy for experimental personnel to directly monitor liquid level changes visually, and plays an important role in maintaining the stable operation of the experimental system and judging the timing of liquid replenishment.

[0050] It is worth noting that the external control system involved in this utility model preferably adopts an industrial PLC controller, equipped with an analog input module for receiving signals from the mass sensor 311, detection probe 43, temperature sensor, etc., and a digital output module for controlling the pneumatic butterfly valve 313, delivery pump 322, heating coil 5, and other actuators. It is also equipped with a human-machine interface for parameter setting and data display. The external drive structure specifically includes an explosion-proof motor and a reducer, which are connected to the rotary stirrer 6 through a mechanical seal to ensure long-term stable operation in corrosive environments.

[0051] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An etching experimental apparatus for dynamically simulating a production line, characterized in that, It includes a spray chamber (1), an etching mechanism (2), a chemical environment simulation mechanism (3), and a testing mechanism (4), among which, The spray chamber (1) contains etching solution; The etching mechanism (2) includes a sample support structure (21) and a spray structure (22). The sample carrying structure (21) is located on the side wall of the spray chamber (1) and can extend into the spray chamber (1) to carry the sample and transport it to the spray station in the spray chamber (1); The spray structure (22) is used to transport and spray the etching solution in the spray chamber (1) onto the sample surface located at the spray station to simulate the etching operation. The chemical environment simulation mechanism (3) is connected to the spray chamber (1) and is used to adjust the chemical concentration of the etching solution in the spray chamber (1); The detection mechanism (4) is located on the side wall of the spray chamber (1), and its detection end can extend into the etching solution to obtain the chemical parameters of the etching solution in real time.

2. The etching experimental apparatus for a dynamic simulation production line according to claim 1, characterized in that, The chemical environment simulation mechanism (3) includes a metal powder quantitative addition structure (31) and an etching solution replenishment structure (32), wherein, The metal powder quantitative addition structure (31) is located at the top of the spray chamber (1) and is used to precisely add metal powder to the etching solution to simulate an increase in ion concentration. The etching solution replenishment structure (32) is connected to the interior of the spray chamber (1) and is used to replenish fresh etching solution into the spray chamber (1) to adjust the ion concentration; The dynamic evolution of the chemical state of the etching solution in the actual production line is simulated by the synergistic effect of the metal powder quantitative addition structure (31) and the etching solution replenishment structure (32).

3. The etching experimental apparatus for a dynamic simulation production line according to claim 2, characterized in that, The metal powder quantitative addition structure (31) includes a mass sensor (311), a loss-in-weight weighing hopper (312), and a pneumatic butterfly valve (313), wherein, The mass sensor (311) is located at the top of the spray chamber (1); The loss-in-weight weighing hopper (312) is mounted on the mass sensor (311), and a discharge port is provided at its bottom. A discharge hopper (11) is provided at the top of the spray chamber (1) corresponding to the discharge port. The pneumatic butterfly valve (313) is located at the discharge port and is used to control the opening and closing of the discharge port; The mass sensor (311) and the pneumatic butterfly valve (313) are both connected to an external control system. The mass sensor (311) monitors the changes in the mass of the silo, and the pneumatic butterfly valve (313) controls the precise opening and closing of the silo to achieve the quantitative addition of metal powder.

4. The etching experimental apparatus for dynamically simulating a production line according to claim 2, characterized in that, The etching solution replenishment structure (32) includes an etching solution replenishment tank (321) and a delivery pump (322), wherein, The etching solution replenishment tank (321) is connected to the interior of the spray chamber (1) via a pipe; The delivery pump (322) is located on the pipeline and is used to pump fresh etching solution from the etching solution replenishment tank (321) into the spray chamber (1).

5. An etching experimental apparatus for dynamically simulating a production line according to any one of claims 2-4, characterized in that, It also includes a heating coil (5) and a rotary stirrer (6); The heating coil (5) is located at the bottom of the spray chamber (1) and immersed in the etching solution. It is connected to an external control system to receive control commands to heat the etching solution in order to simulate the process temperature conditions of the production line. The rotary stirrer (6) is located at the bottom of the spray chamber (1) and is connected to the external drive structure to keep the etching solution uniformly mixed to simulate the etching solution flow state of the production line.

6. The etching experimental apparatus for a dynamic simulation production line according to claim 1, characterized in that, The detection mechanism (4) includes a mounting plate (41), a sliding block (42), and a detection probe (43), wherein, The mounting plate (41) is embedded in the side wall of the spray chamber (1) and has a limiting groove (401) longitudinally provided. The sliding block (42) is located inside the spray chamber (1), and one end is slidably located in the limiting groove (401); The detection probe (43) is located at the bottom of one end of the sliding block (42) inside the spray chamber (1) and is connected to the external control system for immersing in the etching solution to detect chemical parameters.

7. The etching experimental apparatus for a dynamic simulation production line according to claim 6, characterized in that, The detection mechanism (4) also includes a locking block (44) and a locking screw (45). The locking block (44) is located on the outside of the mounting plate (41); The locking screw (45) passes through the locking block (44) and extends into the limiting slide groove (401), and is rotatably connected to the sliding block (42). The locking screw (45) is threadedly connected to the locking block (44).

8. The etching experimental apparatus for a dynamic simulation production line according to claim 1, characterized in that, The sample carrying structure (21) includes a sample replacement chamber (211), a push plate (212), and a carrying plate (213), wherein, The sample replacement chamber (211) is located on the side wall of the spray chamber (1). An inlet is provided on the side wall of the spray chamber (1) corresponding to the sample replacement chamber (211). A pick-up and put-out port is provided on the top of the sample replacement chamber (211). The push plate (212) slides laterally through the outer wall of the sample replacement chamber (211) and extends into the sample replacement chamber (211); The support plate (213) is located inside the sample replacement chamber (211) and is fixedly connected to the end of the push plate (212).

9. The etching experimental apparatus for a dynamic simulation production line according to claim 8, characterized in that, The spray structure (22) includes a spray head (221), a pump (222), and a delivery pipe (223), wherein, The spray head (221) is located at the top of the spray chamber (1); The pump (222) is located outside the spray chamber (1); The delivery pipe (223) connects the spray chamber (1), the pump (222) and the spray head (221) to pump the etching solution in the spray chamber (1) to the spray head (221).

10. The etching experimental apparatus for a dynamic simulation production line according to claim 1, characterized in that, It also includes a liquid level observation window (12); The liquid level observation window (12) is embedded in the side wall of the spray chamber (1) and is made of transparent material. It is used to observe the liquid level height of the etching solution in the spray chamber (1).

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