An ultra-thin uniform temperature plate cover plate with positioning slots

Abstract

The utility model belongs to the technical field of temperature equalizing plate, concretely relates to a super -thin temperature equalizing plate cover plate with positioning groove, including upper cover, the lower end of upper cover is contacted with lower cover, the surface of lower cover is equipped with positioning hole, the lower end fixedly connected with positioning rod of upper cover, positioning rod and positioning hole slide connection. The utility model discloses through the cooperation of positioning hole and positioning rod, can be positioned between upper cover and lower cover fast, the subsequent vacuum welding of upper cover and lower cover, sealing operation are convenient, and under the action of positioning groove no.

Description

Technical Field

[0001] This utility model relates to the field of temperature equalization plate technology, specifically to an ultra-thin temperature equalization plate cover with a positioning groove. Background Technology

[0002] As is well known, an ultrathin vapor chamber is a passive heat dissipation device that utilizes the principle of phase change heat transfer (evaporation and condensation cycle) for two-dimensional efficient heat conduction. Its core objective is to rapidly and evenly diffuse the heat from point / area heat sources across the entire plate surface, thereby reducing the temperature of local hot spots and creating conditions for subsequent heat exchange through heat pipes, fins, or the outer shell.

[0003] A utility model patent with patent authorization announcement number CN219454785U discloses an ultrathin heat spreader. This ultrathin heat spreader includes a first cover plate, a second cover plate, a capillary layer, and support columns. The first and second cover plates are interlocked to form a sealed chamber. The capillary layer is attached to the inner end face of the first cover plate and includes an air passage and a copper mesh. Multiple support columns are provided; some support columns are positioned between the second cover plate and the copper mesh, while others are supported at one end by the second cover plate and at the other end through the air passage and supported by the first cover plate. Within the space enclosed by the capillary layer and the second cover plate, a steam channel is formed between adjacent support columns. Within the space enclosed by the air passage and the first cover plate, an auxiliary air passage is formed between adjacent support columns. This is the ultrathin heat spreader.

[0004] However, existing ultra-thin heat spreaders also have certain drawbacks. Although most existing ultra-thin heat spreaders are assembled by vacuum welding of upper and lower cover plates, the surface of the upper cover plate is relatively smooth and the overall structure is relatively simple, which makes it difficult to connect and assemble with subsequent equipment components. Utility Model Content

[0005] The purpose of this utility model is to provide an ultra-thin heat exchanger cover with a positioning groove, which solves the problem that although existing ultra-thin heat exchangers mostly use upper and lower cover plates for vacuum welding assembly, the surface of the upper cover plate is relatively smooth and the overall structure is relatively simple, which makes it difficult to connect and assemble with subsequent equipment parts.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an ultra-thin temperature-equalizing plate cover with positioning grooves, comprising an upper cover plate, the lower end of which contacts a lower cover plate, a positioning hole on the surface of the lower cover plate, a positioning rod fixedly connected to the lower end of the upper cover plate, the positioning rod being slidably connected to the positioning hole, a positioning groove one being formed in the middle of the upper end of the upper cover plate, a positioning groove two being formed at the upper end of the upper cover plate, a metal wire mesh fixedly connected to the upper end of the lower cover plate, a heat-conducting sheet fixedly connected to the inner wall of the upper cover plate, a heat-conducting rod fixedly connected to the lower end of the heat-conducting sheet, a sintered copper ball fixedly connected to the lower end of the heat-conducting rod, the sintered copper ball being in contact with the metal wire mesh, a capillary groove one being formed at the top inner side of the upper cover plate, and capillary groove two being formed at the top inner side of the upper cover plate on both sides of the capillary groove one.

[0007] Preferably, four positioning holes are provided, which are evenly distributed on the lower cover plate. The positioning holes facilitate subsequent positioning and locking with positioning rods to connect the upper and lower cover plates.

[0008] Preferably, the diameter of the positioning rod is the same as the diameter of the positioning hole, and the positioning rod is made of copper. By using copper, the positioning rod can have good thermal conductivity and structural rigidity.

[0009] Preferably, four positioning slots are provided, and the four positioning slots are evenly distributed on the upper cover plate. The positioning slots facilitate the engagement and assembly of the temperature equalization plate and the equipment parts.

[0010] Preferably, the heat-conducting rod is a thermally conductive silicone rod, and the heat-conducting sheet is a thermally conductive pad. By setting the thermally conductive silicone rod and the thermally conductive pad, the heat-conducting rod and the thermally conductive sheet can have good thermal conductivity.

[0011] Preferably, there are two capillary grooves, which are symmetrically distributed on the upper cover plate. The capillary grooves can be used to conduct heat quickly.

[0012] Preferably, four capillary grooves are provided, and the four capillary grooves are evenly distributed on the upper cover plate. Through the arrangement of the capillary grooves, heat can be quickly conducted.

[0013] Preferably, four metal wire meshes are provided, which are symmetrically distributed on the lower cover plate. The metal wire meshes are woven from copper wires, and the copper wires provide good thermal conductivity.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] 1. This utility model, through the combined use of positioning holes and positioning rods, can quickly position the upper and lower cover plates, facilitating subsequent vacuum welding and sealing operations between the upper and lower cover plates. Furthermore, with the assistance of positioning slot one and positioning slot two, it can engage with positioning posts or pins on the main board of the equipment and snap-fit ​​fasteners on the bracket, avoiding problems such as poor contact and poor heat dissipation caused by misalignment. The positioning slots also facilitate gripping and placement by robotic arms or fixtures, enabling rapid and accurate pre-installation and improving production efficiency.

[0016] 2. This utility model ensures the thermal conductivity of the lower cover plate by setting the metal wire mesh. With the action of the heat-conducting sheet, heat-conducting rod and sintered copper ball, the upper cover plate can be guaranteed to have good thermal conductivity. In addition, with the action of capillary groove one and capillary groove two, the upper cover plate can be guaranteed to have high heat conduction, thereby ensuring the heat conduction effect of the heat spreader. Attached Figure Description

[0017] Figure 1 This is a three-dimensional view of the overall structure of this utility model;

[0018] Figure 2 For the present utility model Figure 1 A bottom view;

[0019] Figure 3 For the present utility model Figure 1 A schematic diagram of the internal structure of the top cover plate;

[0020] Figure 4 For the present utility model Figure 2 A schematic diagram showing the removal of the cover plate;

[0021] Figure 5 For the present utility model Figure 1 A schematic diagram excluding the top cover.

[0022] In the diagram: 1. Upper cover plate; 2. Lower cover plate; 3. Positioning hole; 4. Positioning rod; 5. Positioning groove one; 6. Positioning groove two; 7. Metal wire mesh; 8. Heat-conducting plate; 9. Heat-conducting rod; 10. Sintered copper ball; 11. Capillary groove one; 12. Capillary groove two. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 An ultra-thin temperature equalization plate cover with positioning grooves includes an upper cover plate 1, a lower cover plate 2 in contact with the lower end of the upper cover plate 1, positioning holes 3 on the surface of the lower cover plate 2, a positioning rod 4 fixedly connected to the lower end of the upper cover plate 1, the positioning rod 4 being slidably connected to the positioning hole 3, a positioning groove 5 in the middle of the upper end of the upper cover plate 1, a positioning groove 6 in the upper end of the upper cover plate 1, a metal wire mesh 7 fixedly connected to the upper end of the lower cover plate 2, a heat-conducting sheet 8 fixedly connected to the inner wall of the upper cover plate 1, a heat-conducting rod 9 fixedly connected to the lower end of the heat-conducting sheet 8, a sintered copper ball 10 fixedly connected to the lower end of the heat-conducting rod 9, the sintered copper ball 10 being in contact with the metal wire mesh 7, a capillary groove 11 in the top inner side of the upper cover plate 1, and a capillary groove 12 in the top inner side of the upper cover plate 1 on both sides of the capillary groove 11.

[0025] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 There are four positioning holes 3, which are evenly distributed on the lower cover plate 2. The positioning holes 3 facilitate the subsequent positioning and snapping with the positioning rod 4 to connect the upper cover plate 1 and the lower cover plate 2. The diameter of the positioning rod 4 is the same as the diameter of the positioning hole 3. The positioning rod 4 is made of copper. The copper material gives the positioning rod 4 good thermal conductivity and structural rigidity.

[0026] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 There are four positioning slots 26, which are evenly distributed on the upper cover plate 1. The positioning slots 26 facilitate the engagement and assembly of the temperature equalization plate and the equipment parts.

[0027] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 The heat-conducting rod 9 is a heat-conducting silicone rod, and the heat-conducting plate 8 is a heat-conducting pad. By setting the heat-conducting silicone rod and the heat-conducting pad, the heat-conducting rod 9 and the heat-conducting plate 8 can have good thermal conductivity.

[0028] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5There are two capillary grooves 11, which are symmetrically distributed on the upper cover plate 1. Through the setting of capillary grooves 11, heat can be conducted quickly. There are four capillary grooves 2 12, which are evenly distributed on the upper cover plate 1. Through the setting of capillary grooves 2 12, heat can be conducted quickly.

[0029] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 There are four metal wire meshes 7, which are symmetrically distributed on the lower cover plate 2. The metal wire meshes 7 are woven from copper wires. The copper wires enable the metal wire meshes 7 to have good thermal conductivity.

[0030] The specific implementation process of this utility model is as follows: In use, the positioning hole 3 and the positioning rod 4 are used together to quickly position the upper cover plate 1 and the lower cover plate 2, which facilitates the subsequent vacuum welding and sealing operations of the upper cover plate 1 and the lower cover plate 2. Under the action of positioning groove 1 5 and positioning groove 2 6, they can be engaged with the positioning column or pin on the main board of the equipment and the buckle on the bracket to avoid the problems of poor contact and poor heat dissipation efficiency caused by misalignment. In addition, the setting of positioning groove 1 5 and positioning groove 2 6 can also facilitate the gripping and placement of the robotic arm or fixture, realize the rapid and accurate pre-installation, and improve production efficiency.

[0031] The metal mesh 7 ensures the heat conduction of the lower cover plate 2, and the copper wire material gives the metal mesh 7 good thermal conductivity. With the help of the heat-conducting plate 8, heat-conducting rod 9, and sintered copper ball 10, the upper cover plate 1 has good heat conduction efficiency. The heat-conducting silicone rod and heat-conducting pad give the heat-conducting rod 9 and heat-conducting plate 8 good thermal conductivity. In conjunction with the capillary groove 11 and capillary groove 2 12, the upper cover plate 1 has high heat conduction, thereby ensuring the heat conduction effect of the heat spreader.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An ultra-thin temperature equalization plate cover with a positioning groove, comprising an upper cover plate (1), characterized in that: The lower end of the upper cover plate (1) contacts the lower cover plate (2). A positioning hole (3) is provided on the surface of the lower cover plate (2). A positioning rod (4) is fixedly connected to the lower end of the upper cover plate (1). The positioning rod (4) is slidably connected to the positioning hole (3). A positioning groove (5) is provided in the middle of the upper end of the upper cover plate (1). A positioning groove (6) is provided at the upper end of the upper cover plate (1). A metal wire mesh (7) is fixedly connected to the upper end of the lower cover plate (2). A heat-conducting plate (8) is fixedly connected to the inner wall of the upper cover plate (1). A heat-conducting rod (9) is fixedly connected to the lower end of the heat-conducting plate (8). A sintered copper ball (10) is fixedly connected to the lower end of the heat-conducting rod (9). The sintered copper ball (10) is in contact with the metal wire mesh (7). A first capillary groove (11) is opened on the top inner side of the upper cover plate (1). A second capillary groove (12) is opened on the top inner side of the upper cover plate (1) and on both sides of the first capillary groove (11).

2. The ultra-thin temperature equalization plate cover with positioning groove according to claim 1, characterized in that: The positioning holes (3) are provided in four parts, and the four positioning holes (3) are evenly distributed on the lower cover plate (2).

3. The ultra-thin temperature equalization plate cover with positioning groove according to claim 1, characterized in that: The diameter of the positioning rod (4) is the same as the diameter of the positioning hole (3), and the positioning rod (4) is made of copper.

4. The ultra-thin temperature equalization plate cover with positioning groove according to claim 1, characterized in that: The second positioning groove (6) is provided in four parts, and the four second positioning grooves (6) are evenly distributed on the upper cover plate (1).

5. The ultra-thin temperature equalization plate cover with positioning groove according to claim 1, characterized in that: The heat-conducting rod (9) is a heat-conducting silicone rod, and the heat-conducting sheet (8) is a heat-conducting pad.

6. The ultra-thin temperature equalization plate cover with positioning groove according to claim 1, characterized in that: There are two capillary grooves (11), which are symmetrically distributed on the upper cover plate (1).

7. The ultra-thin temperature equalization plate cover with positioning groove according to claim 1, characterized in that: Four capillary grooves (12) are provided, and the four capillary grooves (12) are evenly distributed on the upper cover plate (1).

8. The ultra-thin temperature equalization plate cover with positioning groove according to claim 1, characterized in that: Four metal wire meshes (7) are provided, and the four metal wire meshes (7) are symmetrically distributed on the lower cover plate (2). The metal wire meshes (7) are woven from copper wire.

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