A board card heat dissipation fixing structure and electronic equipment

Abstract

The application discloses a board card heat dissipation fixing structure and electronic equipment, the fixing structure comprises: a heat dissipation piece, a heat conduction piece and a fastener, the heat dissipation piece can be locked on the circuit board through the fastener, the heat conduction piece is arranged between the heat dissipation piece and the main chip of the circuit board, wherein the fastener can be compressed by a fixed torque to compress the heat conduction piece, so that the compression rate of the heat conduction piece reaches a set compression rate, the thickness of the heat conduction piece before compression is h1, the thickness after compression is h2, and the compression rate is h2 / h1*100%. The application limits the fixed torque, ensures the uniform compression amount of the heat conduction piece, avoids the compression amount from being different due to errors, and influences the heat dissipation effect, and moreover, the structure is low in cost.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation structures, and more particularly to a board heat dissipation fixing structure and electronic equipment. Background Technology

[0002] In electronic devices, the main chip needs to dissipate heat through a heat sink during operation, and a thermally conductive silicone pad is required between the main chip and the heat sink to fill the gap and ensure heat conduction. However, in actual production and assembly, the main chip, thermally conductive silicone pad, and heat sink all have dimensional or assembly errors. These errors, when combined, can lead to an unstable gap between the heat sink and the main chip: if the gap is too large, the silicone pad will not adhere properly, reducing heat dissipation efficiency; if the gap is too small, the heat sink will exert excessive pressure on the main chip and circuit board, easily causing component damage.

[0003] To compensate for the above errors, existing technologies commonly use two buffering solutions: one is to install springs in the heat sink assembly structure to absorb errors through spring deformation. However, springs have high rigidity and concentrated elastic force, which can easily cause local overvoltage on the circuit board, leading to circuit board cracking or component damage. The other is to use thick thermally conductive silicone pads to compensate for errors through greater deformation. However, thick silicone pads require more material, are more expensive, and increase thermal resistance, thus weakening the heat dissipation effect. Utility Model Content

[0004] The purpose of this utility model embodiment is to provide a board heat dissipation fixing structure and electronic device, which can solve the above-mentioned problems existing in the prior art.

[0005] To achieve the above objectives, this application adopts the following technical solution: On one hand, a heat dissipation and fixing structure for a circuit board is provided, including: a heat sink, a heat conductor, and fasteners. The heat sink is locked onto the circuit board by the fasteners. The heat conductor is disposed between the heat sink and the main chip of the circuit board. The fasteners can be compressed by applying a fixed torque to achieve a set compression ratio. By applying a fixed torque to the fasteners to achieve the set compression ratio, dimensional and assembly errors of the main chip, heat conductor, and heat sink can be effectively offset, ensuring a tight fit between the heat sink and the main chip to improve heat dissipation efficiency, while avoiding excessive compression that could damage the circuit board and the main chip.

[0006] Furthermore, a post protrudes from one side of the heat sink relative to the circuit board, and the post engages with the fastener for locking. This engagement of the post and fastener provides a precise assembly positioning reference for the fastener to ensure the relative position of the heat sink and the main chip is stable. It also converts the fixing torque of the fastener into stable axial pressure acting on the heat-conducting component, and restricts the displacement of the heat sink, thus improving the stability of the overall assembly structure.

[0007] Furthermore, the inner side of the column is provided with an internal thread, and the outer side of the fastener is provided with an external thread. The external thread and the internal thread have a minimum contact length and a maximum contact length. At the minimum contact length, the fastener and the column are locked in place. At the maximum contact length, the heat-conducting component is compressed to a set compression ratio. The minimum contact length allows for initial locking to prevent displacement of the heat sink during assembly, while the maximum contact length ensures precise compression of the heat-conducting component to a set compression ratio. This enables controllable adjustment of the heat-conducting component's compression state, improving the stability and accuracy of the structural assembly.

[0008] Furthermore, when the heat-conducting component is compressed to a set threshold, the compression rate of the heat-conducting component is 15%-25%. This quantitative compression standard can precisely control the bonding state of the heat-conducting component, ensuring that it fully fills the gap between the main chip and the heat sink to improve heat conduction efficiency, while avoiding excessive compression that could damage the circuit board and the main chip, or insufficient compression that could lead to poor bonding, thus ensuring assembly consistency and heat dissipation reliability.

[0009] Furthermore, the fixing torque applied to the fastener is 15N-25N. The fixing torque of 15N-25N applied to the fastener can accurately drive the heat-conducting component to achieve the set compression ratio, and can avoid poor adhesion of the heat-conducting component due to insufficient torque or damage to the circuit board and main chip due to excessive torque, while ensuring the consistency of torque control during batch assembly.

[0010] Furthermore, it also includes a power component, the output end of which can contact the fastener, and the power component applies a fixing torque of 20N to the fastener. The contact between the power component's output end and the fastener, applying a fixing torque of 20N, can precisely and stably drive the heat-conducting component to achieve a set compression ratio, reducing human error and improving assembly consistency and efficiency.

[0011] Furthermore, the thermal conductive component is a silicone pad with a thickness of 0.8-1.2 mm. The use of a silicone pad with a thickness of 0.8-1.2 mm as the thermal conductive component serves two purposes: firstly, the elasticity of the silicone pad allows for a controlled compression ratio to compensate for dimensional errors in the main chip and heat sink, preventing excessive compression that could damage the circuit board and main chip; secondly, the appropriate thickness controls thermal resistance, ensuring efficient heat transfer from the main chip to the heat sink.

[0012] Furthermore, the heat sink has a raised section in the middle on one side of the circuit board, forming an abutment portion. This abutment portion compresses the heat sink to adhere tightly to the main chip of the circuit board. The abutment portion formed by the raised section on one side of the heat sink relative to the circuit board concentrates pressure on the area of ​​the heat sink corresponding to the main chip, ensuring the heat sink is tightly attached to the main chip to improve heat conduction efficiency, while preventing non-core areas of the heat sink from squeezing surrounding components of the circuit board.

[0013] Furthermore, the two sides of the abutment portion are extension portions, and four pillars are provided. Each extension portion has two pillars, and the four pillars are arranged in an array with the main chip of the circuit board as the center. The extension portions on both sides of the abutment portion support the four pillars arranged in an array with the main chip as the center. This not only allows the pressure of the fastener to be evenly transmitted to the abutment portion through the extension portions to ensure uniform compression of the heat-conducting component, but also enhances the positioning stability of the heat sink to prevent displacement, and avoids the pillars interfering with the layout of surrounding components on the circuit board.

[0014] On the other hand, an electronic device is also provided, including: a circuit board and a heat dissipation and fixing structure for the board as described above.

[0015] The beneficial effects of this application are as follows: By actively quantifying and controlling the compression ratio of the thermally conductive component through the fastener fixing torque, the multi-dimensional errors of the main chip, the thermally conductive component, and the heat sink can be effectively offset, ensuring that the contact gap between the heat sink and the main chip is always within the optimal range. This completely solves the problems of inefficient heat dissipation caused by excessive gaps and component damage caused by excessive gaps in the prior art, and greatly improves the reliability of the heat dissipation system. In addition, this structure can meet the error compensation requirements without the use of thick silicone pads, which reduces the amount of thermally conductive silicone material used to control production costs. Attached Figure Description

[0016] The present application will now be described in further detail with reference to the accompanying drawings and embodiments.

[0017] Figure 1 This is a schematic diagram of the heat dissipation and fixing structure of the board described in the embodiment of this application; Figure 2 This is an exploded view of the heat dissipation and fixing structure of the board described in the embodiment of this application; Figure 3 This is a schematic diagram of the heat sink described in an embodiment of this application.

[0018] In the diagram: 1. Heat sink; 101. Abutment part; 102. Extension part; 2. Heat conduction part; 3. Fastener; 4. Circuit board; 401. Main chip; 5. Column. Detailed Implementation

[0019] To make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this application are further described in detail below. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] In the description of this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0022] In the design of electronic devices (such as servers, industrial control modules, and consumer electronics), the main chip (such as CPU, GPU, and application-specific integrated circuits) serves as the core computing unit and continuously generates a large amount of heat during operation. If this heat cannot be dissipated in time, the operating temperature of the main chip will rise rapidly, which will not only lead to a decrease in its computing performance and response delay, but may also cause chip crashes and shortened lifespan. Therefore, it is necessary to use a heat dissipation structure to force heat dissipation of the main chip to ensure the stable operation of electronic devices.

[0023] Currently, the mainstream heat dissipation solution for main chips is to mount a heat sink on the surface of the main chip and place a thermally conductive silicone pad between the main chip and the heat sink. The thermally conductive silicone pad has both elasticity and thermal conductivity. On the one hand, it can fill the tiny gap between the main chip and the heat sink to avoid the air layer affecting the heat conduction efficiency. On the other hand, it can make the heat sink and the surface of the main chip fit tightly through its own deformation, so as to efficiently transfer the heat generated by the main chip to the heat sink. Then, the heat sink dissipates the heat to the environment through convection or radiation. It is an indispensable heat conduction and buffering component in the main chip heat dissipation system.

[0024] However, in actual production and assembly processes, unavoidable dimensional or assembly errors exist in the main chip, thermal pads, and heat sinks. Firstly, the package thickness and surface flatness of the main chip are affected by the manufacturing process, leading to deviations. Secondly, the thickness and elasticity coefficient of the thermal pads are prone to batch-to-batch fluctuations during production. Thirdly, the machining precision of the heat sink's assembly surface is difficult to standardize completely. These errors, when combined, result in an unstable actual gap between the heat sink and the main chip. If the gap is too large, the thermal pad cannot fully adhere, creating a thermal blind spot and significantly reducing heat dissipation efficiency. If the gap is too small, the heat sink exerts excessive pressure on the main chip, potentially compressing the main chip or the circuit board beneath it, causing circuit board deformation, solder joint detachment, or even damage to the main chip.

[0025] To compensate for the aforementioned errors and avoid problems caused by improper gaps, existing technologies typically employ two buffer design schemes: one is to add a spring to the heatsink assembly structure, utilizing the spring's elastic deformation to absorb errors and maintain stable pressure on the main chip; however, the spring has high rigidity and its elastic force is concentrated, and if the spring compression is not properly controlled during assembly, it can easily create excessive local pressure on the circuit board, leading to circuit board cracking or component damage, especially unsuitable for thin flexible circuit boards with weak pressure resistance or high-density packaged main chips. The other scheme is to use a thicker thermally conductive silicone pad, compensating for errors through the larger elastic deformation range of the thicker silicone pad; however, the material usage of the thicker silicone pad significantly increases, directly leading to a rise in the production cost of the heat dissipation structure, and the thermal conductivity of the silicone pad is much lower than that of metal, so excessive thickness will significantly increase thermal resistance, weakening the heat dissipation effect of the heatsink and failing to meet the main chip's demand for efficient heat dissipation.

[0026] In summary, existing buffer solutions for error compensation in the heat dissipation structure design of the main chip all have obvious defects: spring buffers are prone to damaging the circuit board, and thick silicone pad buffers are expensive and affect heat dissipation efficiency. It is difficult to balance the requirements of error compensation effect, circuit board protection and cost control. Therefore, there is an urgent need for a heat dissipation buffer structure for the main chip that can avoid the above problems.

[0027] Therefore, this embodiment provides a board heat dissipation fixing structure, such as Figures 1-3 As shown, it includes: a heat sink 1, a heat conductor 2, and a fastener 3. The heat sink 1 can be locked onto the circuit board 4 by the fastener 3. The heat conductor 2 is located between the heat sink 1 and the main chip 401 of the circuit board 4. The fastener 3 can be compressed by applying a fixed torque to the heat conductor 2 so that the compression rate of the heat conductor 2 reaches a set compression rate. The thickness of the heat conductor 2 before compression is h1, and the thickness after compression is h2. The compression rate is h2 / h1*100%.

[0028] Based on the above solution, to address the dimensional and / or assembly errors of the main chip 401, heat-conducting component 2, and heat sink 1, this structure does not rely on the elastic deformation of the spring or the thickness of the thick silicone pad itself. Instead, it applies a fixed torque to the fastener 3, forcing the heat-conducting component 2 to compress to a preset compression ratio. This fixed torque, as a precisely controllable quantitative parameter, can offset the cumulative errors of each component. Regardless of the thickness deviation of the main chip 401 package, production fluctuations of the heat-conducting component 2, or differences in the processing precision of the heat sink 1, as long as the torque of the fastener 3 remains constant, the compression of the heat-conducting component 2 will stabilize at the set value, thereby ensuring that the contact gap between the heat sink 1 and the main chip 401 is neither too large nor too small.

[0029] Specifically, by directly controlling the compression ratio of the heat-conducting component 2 through the fixing torque of the fastener 3, the passive error compensation that relies on the performance of the components themselves is transformed into active quantitative control, which effectively offsets the multi-dimensional errors of the main chip 401, the heat-conducting component 2, and the heat sink 1, ensuring that the contact gap between the heat sink 1 and the main chip 401 remains stable. This completely solves the problems of reduced heat dissipation efficiency caused by excessive gaps and component damage caused by excessively small gaps in the existing technology, and improves the reliability of the heat dissipation system.

[0030] Compared to the spring buffer solution, this structure avoids the impact of local overpressure on the circuit board 4 through the uniform deformation of the heat-conducting component 2 and the pressure control of the fixed torque. It is especially suitable for scenarios with flexible circuit board 4 or high-density packaged main chip 401, reducing the risk of circuit board 4 cracking and solder joint detachment. At the same time, the elastic characteristics of the heat-conducting component 2 also have a certain vibration resistance, further improving the environmental adaptability of electronic devices.

[0031] In addition, taking the thermal conductive component 2 as a silicone pad as an example, this structure can meet the error compensation requirements without using a thick silicone pad, reducing the amount of thermal conductive silicone material used and lowering production costs; moreover, the thickness of the thermal conductive component 2 is controllable, avoiding the problem of increased thermal resistance caused by a thick silicone pad, ensuring efficient heat transfer from the main chip 401 to the heat sink 1, solving the contradiction of high cost and weak heat dissipation of existing thick silicone pads, and achieving a balance between technical performance and economy.

[0032] Meanwhile, the core functions can be achieved through the simple assembly of heat sink 1, heat conduction component 2, and fastener 3, without the need for additional complex adjustment components. This simplifies the production and assembly process, reduces assembly difficulty and labor costs, and facilitates large-scale production and application.

[0033] Furthermore, a column 5 protrudes from one side of the heat sink 1 relative to the circuit board 4, and the column 5 is locked in place with the fastener 3. During assembly, the fastener 3 passes through the preset mounting holes of the circuit board 4 in sequence and locks with the column 5. When a fixing torque is applied to the fastener 3, the column 5 converts the torque of the fastener 3 into a stable pressure along the column axis. This pressure acts directly on the heat conductor 2 between the heat sink 1 and the circuit board 4, causing the heat conductor 2 to be uniformly compressed along the axis of the column 5. At the same time, the protrusion height of the column 5 can be preset according to the original thickness of the heat conductor 2 and the set compression rate. Through the axial dimensional accuracy of the column 5, the maximum assembly distance between the heat sink 1 and the circuit board 4 is further limited, which helps to ensure that the compression rate of the heat conductor 2 accurately reaches the set value. In addition, the column 5 can also serve as a relative positioning reference between the heat sink 1 and the circuit board 4, avoiding lateral displacement of the heat sink 1 during assembly and ensuring that the heat conductor 2 always corresponds to the heat-generating area of ​​the main chip 401.

[0034] It should be noted that when the heat sink 1 and the circuit board 4 are locked, the column 5 will not come into contact with the circuit board 4, even when it is tightened.

[0035] Furthermore, the inner side of the column 5 is provided with an internal thread, and the outer side of the fastener 3 is provided with an external thread. There are minimum and maximum contact lengths between the external and internal threads. At the minimum contact length, the fastener 3 and the column 5 are locked in place; at the maximum contact length, the heat-conducting component 2 is compressed to a set compression ratio. The design of the minimum and maximum contact lengths between the internal thread on the inner side of the column 5 and the external thread on the outer side of the fastener 3 essentially establishes a precise control mechanism for the pre-fixation to final compression process of the heat-conducting component 2 through a stepped control of the thread engagement depth. The specific principle is as follows: The minimum contact length is the critical engagement length at which the thread just reaches effective locking, such as 2-3 thread engagement. At this time, the fastener 3 and the column 5 form a preliminary mechanical lock, the heat sink 1 is temporarily fixed to the preset position of the circuit board 4, and the heat conductor 2 is in an initial state of insufficient compression. This avoids the heat sink 1 from shifting or falling off during assembly and also reserves operating space for subsequent compression adjustment. The maximum contact length is the limit length of the thread when it is fully engaged, such as when the thread is fully engaged. At this time, the fastener 3 is screwed into the column 5 axially to the deepest position. The axial thrust of the thread engagement drives the heat sink 1 to move towards the circuit board 4 until the heat conductor 2 is compressed to the set compression ratio, and the fully engaged thread forms a rigid lock, which stably maintains the compressed state of the heat conductor 2.

[0036] This scheme decomposes the compression process of the heat-conducting component 2 into three stages—pre-fixation, gradual compression, and final locking—by quantifying the difference in thread contact length. It utilizes the gradual and repeatable nature of threaded transmission to ensure precise control of the compression ratio of the heat-conducting component 2.

[0037] It is worth noting that the method of controlling the compression ratio by thread is based on the ideal state, which refers to the situation without any assembly error. However, for situations with assembly or production errors, it needs to be used in conjunction with the aforementioned fixed torque.

[0038] Specifically, when the heat-conducting component 2 is compressed to a set threshold, the compression rate of the heat-conducting component 2 is 15%-20%. Based on the above formula, the preset target compression rate is 15%-25%, with a specific compression rate of 20%. This means that the compression of the heat-conducting component 2, h2, needs to be equal to 0.2h1 after the fastener 3 is engaged with the column. During assembly, the protrusion height of the column can be pre-designed based on the difference between h1 and 0.2h1, such as column height = circuit board 4 thickness + 0.2h1 + assembly allowance. When the fastener 3 is screwed to the maximum thread contact length, the axial limiting effect of the column and the torque of the fastener 3 work together to force the thickness of the heat-conducting component 2 to be compressed from h1 to 0.2h1. At the same time, the actual ratio of h2 to h1 can be directly measured with a measuring tool to verify whether the compression rate is accurately achieved. In addition, this quantitative definition can also adapt to the thickness error of the main chip 401 and the circuit board 4. If the thickness of the main chip 401 is too thick, the torque of the fastener 3 can be finely adjusted to ensure that h2 remains at 0.2h1, and vice versa, achieving precise and controllable error compensation.

[0039] More specifically, the fixing torque applied to fastener 3 is 15N-25N. The lower limit of the torque range (15N) is the minimum effective torque required for the heat conductor 2 to reach the set compression ratio. When the torque reaches 15N, the fastener 3 converts the rotational torque into linear pressure along the column axis by engaging with the internal thread of the column. This pressure is sufficient to overcome the initial elastic resistance of the heat conductor 2, causing the thickness of the heat conductor 2 to be compressed from h1 to close to the set value. At this time, the thread contact length has reached the minimum contact length, ensuring that the heat sink 1 and the circuit board 4 are initially locked. The upper limit of the torque range (25N) is the safety threshold for the heat conductor 2 to not be over-pressured and the circuit board 4 to not be damaged. That is, when the torque rises to 25N, the heat conductor 2 is just fully compressed to the set compression ratio, and the axial pressure corresponding to this torque does not exceed the pressure resistance limit of the circuit board 4 and the elastic fatigue limit of the heat conductor 2. At the same time, the 15N-25N range design can accommodate the size errors of the main chip 401 and the heat conductor 2. Even if there are slight deviations in the components, the compression ratio of the heat conductor 2 can still be kept stable within the preset range by finely adjusting the torque within this range.

[0040] As an optional specific implementation, it also includes a power component. The output end of the power component can contact the fastener 3, and the fixing torque applied to the fastener 3 by the power component is 20N. The power component can be an electric drill or a fixed torque screwdriver with torque adjustment function. First, the power component precisely engages with the head of the fastener 3 through an adapter bit to avoid slippage or torque loss during torque transmission. Its output end has a built-in torque closed-loop control module, which can stably lock the output torque at 20N, and the torque output accuracy is controlled within the error range. When the power unit starts, a 20N torque is transmitted to the fastener 3 through the bit, driving the fastener 3 to engage with the internal thread of the column. As the thread contact length extends from the minimum to the maximum, the axial pressure converted from the torque gradually acts on the heat-conducting component 2. Since 20N is the optimal torque value preset based on the elastic modulus of the heat-conducting component 2 and the specifications of the column thread, when the fastener 3 is engaged to the maximum thread contact length, the axial pressure generated by this torque just compresses the thickness of the heat-conducting component 2 from h1 to h2=0.2h1. The power unit will automatically stop outputting when it reaches the 20N torque to avoid torque deviation caused by excessive force. At the same time, the constant torque output of the power unit can offset the differences in manual operation, ensuring that the torque of each fastener 3 is consistent, thereby achieving uniformity of the compression ratio of the heat-conducting component 2 in batch assembly.

[0041] Optionally, the heat-conducting component 2 is a silicone pad with a thickness of 0.8-1.2mm, preferably 1mm. From a cushioning perspective, the thickness of the silicone pad needs to match the set compression rate. Combined with the 20% set compression rate required for the heat-conducting component 2, the initial thickness of 0.8-1.2mm corresponds to a compression amount of 0.16-0.24mm. This deformation range can directly offset common dimensional errors generated during the production and assembly of the main chip 401 and the circuit board 4, ensuring that the heat sink 1 and the main chip 401 always remain in contact, avoiding excessive or insufficient gaps. Simultaneously, the elastic properties of the silicone pad allow for stable deformation under this thickness and compression amount, preventing loss of cushioning capacity due to excessive deformation.

[0042] The silicone pad combines elasticity and thermal conductivity, with its thickness controlled within the range of 0.8-1.2mm, effectively reducing thermal resistance. Compared to thicker silicone pads, this thickness shortens the path of heat transfer from the main chip 401 to the heat sink 1, avoiding a decrease in thermal conductivity due to excessive thickness. Simultaneously, this thickness of silicone pad fully fills the tiny gaps between the main chip 401 and the heat sink 1 surface, eliminating the obstruction of heat conduction by air layers and ensuring efficient heat transfer.

[0043] The core logic behind choosing a 1mm thickness is that it represents a comprehensive balance between error compensation, thermal conductivity, and torque adaptation. This corresponds to a compression of 0.2mm at a 20% compression ratio, which can cover component dimensional errors in most scenarios. Simultaneously, this thickness achieves an optimal balance between heat conduction path length and material usage, and can stably achieve the set compression ratio under a standard fixed torque of 20N, making it the most widely adaptable benchmark specification for mass production.

[0044] In some embodiments, the heat sink 1 has a raised section in the middle on one side opposite the circuit board 4, forming an abutment portion 101. The abutment portion 101 compresses the heat conductor 2 to adhere tightly to the main chip 401 of the circuit board 4. The abutment portion 101 is a raised section in the middle on the side of the heat sink 1 facing the circuit board 4, and its raised position corresponds to the position of the main chip 401 on the circuit board 4. The raised height is slightly higher than other areas of the heat sink 1. When the heat sink 1 is locked to the post by the fastener 3, the axial pressure applied by the fastener 3 first acts on the entire heat sink 1, and then is transferred to the heat conductor 2 through the raised shape of the abutment portion 101. Since the contact area between the contact portion 101 and the heat conductor 2 is concentrated in the area corresponding to the main chip 401, the pressure is directed and concentrated in this core area, making the local compression of the heat conductor 2 above the main chip 401 more sufficient, ensuring that the heat conductor 2 is tightly attached to the surface of the main chip 401; at the same time, the protrusion height of the contact portion 101 can be adapted to the compression of the heat conductor 2, avoiding unnecessary contact or compression between the non-core area around the heat sink 1 and other components of the circuit board 4, and forming a targeted heat dissipation path only through the contact portion 101 and the area of ​​the main chip 401.

[0045] Furthermore, the two sides of the contact portion 101 are extension portions 102, and four pillars 5 are provided. The four pillars 5 are arranged in pairs on the extension portions 102, and are arranged in an array with the main chip 401 of the circuit board 4 as the center. The extension portion 102 is a planar structure that extends from the main body of the heat sink 1 to both sides of the contact portion 101. Its length and width are adapted to other areas around the main chip 401 on the circuit board 4, providing the pillars 5 with installation space away from the heat generation area of ​​the main chip 401. The four pillars 5 are arranged in an array with the extension portions 102 in pairs and the main chip 401 as the center, such as a rectangular array or a diamond array, so that the geometric center of the four pillars 5 coincides with the center of the main chip 401. When the fastener 3 locks the heat sink 1 through the pillars, the four pillars 5 convert the axial pressure applied by the fastener 3 into a symmetrical support force transmitted along the extension 102, and then converges through the extension 102 to the middle abutment 101, so that the abutment 101 applies uniform pressure to the heat sink 2, ensuring that the compression ratio of the heat sink 2 is consistent in the area of ​​the main chip 401; at the same time, the multi-point support structure formed by the four array pillars 5 can limit the lateral displacement of the heat sink 1 parallel to the surface of the circuit board 4, ensuring that the abutment 101 is always facing the center of the main chip 401, and preventing the heat sink 2 from deviating from the core heat-generating area.

[0046] On the other hand, an electronic device is also provided, including: a circuit board 4 and a heat dissipation fixing structure as described above.

[0047] In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and other orientations or positional relationships are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used merely for descriptive distinction and have no special meaning.

[0048] In the description of this specification, references to terms such as "an embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0049] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0050] The technical principles of this application have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this application and should not be construed as limiting the scope of protection of this application in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this application without inventive effort, and these embodiments will all fall within the scope of protection of this application.

Claims

1. A heat dissipation and fixing structure for a circuit board, characterized in that, include: The heat sink (1), the heat conductor (2), and the fastener (3) are provided. The heat sink (1) can be locked onto the circuit board (4) by the fastener (3). The heat conductor (2) is located between the heat sink (1) and the main chip (401) of the circuit board (4). The fastener (3) can be compressed by applying a fixed torque to the heat conductor (2) so that the compression rate of the heat conductor (2) reaches the set compression rate.

2. The board heat dissipation fixing structure according to claim 1, characterized in that, The heat sink (1) has a column (5) protruding on one side opposite to the circuit board (4), and the column (5) is locked in place with the fastener (3).

3. The board heat dissipation fixing structure according to claim 2, characterized in that, The inner side of the column (5) is provided with an internal thread, and the outer side of the fastener (3) is provided with an external thread. The external thread and the internal thread have a minimum contact length and a maximum contact length. When the contact length is at the minimum, the fastener (3) is locked and fixed to the column at the current position. When the contact length is at the maximum, the heat-conducting element (2) is compressed to a set compression ratio.

4. The board heat dissipation fixing structure according to claim 3, characterized in that, When the heat-conducting component (2) is compressed to a set threshold, the compression rate of the heat-conducting component (2) is 15%-25%.

5. The board heat dissipation fixing structure according to any one of claims 1-4, characterized in that, The fixing torque applied to the fastener (3) is 15N-25N.

6. The board heat dissipation fixing structure according to any one of claims 1-4, characterized in that, It also includes a power component, the output end of which can contact the fastener (3), and the fixing torque applied by the power component to the fastener (3) is 20N.

7. The board heat dissipation fixing structure according to any one of claims 1-4, characterized in that, The heat-conducting component (2) is a silicone pad with a thickness of 0.8-1.2 mm.

8. The board heat dissipation fixing structure according to claim 2, characterized in that, The heat sink (1) has a raised middle section on one side of the circuit board (4) to form an abutment (101), and the abutment (101) compresses the heat conductor (2) to stick to the main chip (401) of the circuit board (4).

9. The board heat dissipation fixing structure according to claim 8, characterized in that, The two sides of the abutment part (101) are extension parts (102), and four pillars (5) are provided. Each extension part (102) is provided with two pillars (5), and the four pillars are arranged in an array with the main chip (401) of the circuit board (4) as the center.

10. An electronic device, characterized in that, include: The circuit board (4) and the heat dissipation fixing structure of the board as described in any one of claims 1-9.

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