Printed circuit board and electronic vehicle

Abstract

The application provides a printed circuit board and an electronic vehicle, and the printed circuit board comprises: a first substrate, at least one chip packaging unit is embedded in the first substrate, and the chip packaging unit comprises a power chip; a second substrate arranged on an upper layer of the first substrate, an upper surface of the second substrate at least comprising a driving circuit; and a transmission channel penetrating through the first substrate and the second substrate, the transmission channel being configured to transmit a driving signal of the driving circuit to a power device on the power chip to drive the power device to turn on or turn off. Through the above scheme, the dynamic characteristics of the power device can be effectively improved, and the lightweight and compact design of the vehicle are facilitated.

Description

Technical Field

[0001] This application relates to the field of electronic vehicles, and more particularly to a printed circuit board and an electronic vehicle. Background Technology

[0002] In the development of modern electric vehicles, the design of printed circuit boards (PCBs) is a key factor in improving vehicle performance and efficiency.

[0003] Currently, electronic components in electric vehicles, such as inverters, do not include drive circuitry in their power PCB designs. Drive circuitry requires an additional PCB to house these components, increasing system complexity. Specifically, the interconnection of two PCBs via wiring harnesses or connectors lengthens the signal transmission path. This extended path introduces additional inductance and resistance, easily causing signal delays and distortions. Especially at high-frequency operation, this can severely degrade the dynamic characteristics of power semiconductors, thereby affecting the overall performance and efficiency of the inverter.

[0004] Furthermore, the wiring harness and connectors themselves require additional physical space to accommodate and connect two separate PCBs. This additional space requirement increases the overall system size without directly increasing the system's power handling capacity, resulting in a lower inverter volumetric power density and hindering the vehicle's lightweight and compact design. Utility Model Content

[0005] This application provides a printed circuit board and an electronic vehicle to at least solve one of the above-mentioned technical problems.

[0006] According to one aspect of this application, a printed circuit board is provided, comprising:

[0007] A first substrate, wherein at least one chip packaging unit is embedded in the first substrate, and the chip packaging unit includes a power chip;

[0008] A second substrate disposed on the upper layer of the first substrate, wherein the upper surface of the second substrate includes at least a driving circuit;

[0009] A transmission channel runs through the first substrate and the second substrate, the transmission channel being configured to transmit the drive signal of the drive circuit to the power device on the power chip to drive the power device to turn on or off.

[0010] In one embodiment, the printed circuit board further includes:

[0011] A shielding layer is disposed between the first substrate and the second substrate, the shielding layer being configured to block electromagnetic interference from the chip packaging unit to electronic components on the second substrate.

[0012] In one embodiment, an insulating layer region for filling with insulating material is included between the first substrate and the second substrate, and the shielding layer is disposed within the insulating layer region.

[0013] In one embodiment, the chip packaging unit further includes a metal support block for supporting the power chip; the chip packaging unit is configured to be embedded in the first substrate via the metal support block. For example, the first substrate has a recess for embedding the chip packaging unit; the chip packaging unit further includes a metal support block for supporting the power chip; the chip packaging unit is configured to be embedded in the recess via the metal support block.

[0014] In one embodiment, a welding material is provided between the metal support block and the power chip, so that the power chip is securely mounted on the metal support block.

[0015] In one embodiment, the metal support block includes a concave copper block, and the power chip is disposed within the concave space of the copper block.

[0016] In one embodiment, the power device includes an upper bridge power device and a lower bridge power device; the driving circuit includes a first driving circuit for driving the upper bridge power device and a second driving circuit for driving the lower bridge power device; the transmission channel includes a first transmission channel and a second transmission channel, the first transmission channel being connected to a first control electrode of the upper bridge power device and the second transmission channel being connected to a second control electrode of the lower bridge power device.

[0017] The first control electrode is led out to the upper surface of the second substrate through the first transmission channel, so that the first control electrode is connected to the first driving circuit to receive the driving signal transmitted by the first driving circuit.

[0018] The second control electrode is led out to the upper surface of the second substrate through the second transmission channel, so that the second control electrode is connected to the second driving circuit to receive the driving signal transmitted by the second driving circuit.

[0019] In one embodiment, the transmission channel further includes a third transmission channel connected to the first electrode of the upper bridge power device, a fourth transmission channel connected to the second electrode of the upper bridge power device, a fifth transmission channel connected to the first electrode of the lower bridge power device, and a sixth transmission channel connected to the second electrode of the lower bridge power device.

[0020] The first electrode of the upper bridge power device is led out to the surface of the printed circuit board through the third transmission channel, so that the first electrode of the upper bridge power device is connected to the positive terminal of the external power supply.

[0021] The second electrode of the upper bridge power device is connected to the first electrode of the lower bridge power device through the fourth transmission channel inside the printed circuit board through the fifth transmission channel, so that the second electrode of the upper bridge power device is connected to the first electrode of the lower bridge power device.

[0022] The second electrode of the lower bridge power device is led out to the surface of the printed circuit board through the sixth transmission channel, so that the second electrode of the lower bridge power device is connected to the negative terminal of the external DC power supply.

[0023] In one embodiment, the transmission channel is a micropore with a metal coating on the inside, and the number of micropores is determined based on a predefined current carrying requirement.

[0024] In one embodiment, the outer surface of the second substrate further includes a driving power supply connected to the driving circuit, the driving power supply being configured to provide a power supply voltage to the driving circuit.

[0025] In one embodiment, the second substrate is located on the upper surface layer of the printed circuit board.

[0026] In one implementation, it further includes:

[0027] A thermally conductive layer disposed on the lower surface of the first substrate is configured to conduct heat from electronic components on the printed circuit board to the heat sink when the printed circuit board is mounted on a heat sink.

[0028] In one embodiment, the thermally conductive layer is a thermally conductive interface material with electrical insulation properties.

[0029] In a second aspect, this application provides an electronic vehicle including a printed circuit board as provided in any of the first aspects above.

[0030] The printed circuit board and electric vehicle provided in this application integrate drive circuits and power devices by using embedded chips and substrate stacks in a printed circuit board and transmitting drive signals through a transmission channel that penetrates the substrate. This significantly reduces the physical space and shortens the signal transmission path between the drive circuit and the power devices, thereby improving the power characteristics of power semiconductors and enhancing the overall stability and weight reduction of the system. Attached Figure Description

[0031] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0032] Figure 1 This is a schematic diagram of the structure of a printed circuit board provided in an embodiment of this application;

[0033] Figure 2 This is a schematic diagram of another printed circuit board structure provided in an embodiment of this application;

[0034] Figure 3 A top view of a printed circuit board provided in an embodiment of this application;

[0035] Figure 4 This is a block diagram of an electronic vehicle provided in an embodiment of this application.

[0036] Reference numerals: 100-Printed circuit board; 110-First substrate; 111-Chip packaging unit; 1111-Power chip; 1112-Metal support block; 120-Second substrate; 121-Drive circuit; 122-Drive power supply; 130-Transmission channel; 131-First transmission channel; 132-Second transmission channel; 133-Third transmission channel; 134-Fourth transmission channel; 135-Fourth transmission channel; 136-Fifth transmission channel; 140-Shielding layer; 150-Insulating layer area; 160-Heat-conducting layer; 1000-Electric vehicle.

[0037] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0038] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0039] The accompanying drawings are merely illustrative of this application and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore, repeated descriptions of them will be omitted. The processes shown in the drawings are merely exemplary and do not necessarily include all steps. For example, some steps can be broken down, some steps can be combined or partially combined, and the actual order of execution may change depending on the actual situation.

[0040] The terms "upper" and "lower," etc., indicating orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, in the description of this application, when it is said that a device is "connected" to another device, this includes not only direct connection but also indirect connection through other elements.

[0041] It should be noted that, unless otherwise specified, the embodiments of this application and the features in different embodiments can be combined with each other.

[0042] Please refer to Figures 1-3 , Figure 1 A schematic diagram of the structure of a printed circuit 100 provided in an embodiment of this application is shown below. Figure 1 As shown, the printed circuit board 100 includes:

[0043] A first substrate 110, wherein at least one chip packaging unit 111 is embedded in the first substrate 110, and the chip packaging unit 111 includes a power chip 1111.

[0044] A second substrate 120 is disposed on the upper layer of the first substrate 110, and the upper surface of the second substrate 120 includes at least a driving circuit 121.

[0045] A transmission channel 130 runs through the first substrate 110 and the second substrate 120. The transmission channel 130 is configured to transmit the drive signal of the drive circuit 121 to the power device on the power chip 1111 to drive the power device to turn on or off.

[0046] In related technologies, two PCBs, a power PCB and a driver PCB, are deployed and connected by wire harnesses or connectors. In wire harness connections, appropriate wire materials and specifications must be selected, and connector terminals must be installed at both ends of the wires. During wire harness assembly, multiple wires are typically bundled together and secured with cable ties or sheaths before connecting both ends of the harness to connectors on their respective PCBs. This results in an extended signal transmission path. This connection method leads to a larger physical distance between the PCBs, and the extended signal transmission path introduces additional inductance and resistance, easily causing signal delay and distortion. Especially under high-frequency operation, this can severely degrade the dynamic characteristics of power semiconductors, thereby affecting the overall performance and efficiency of the inverter.

[0047] In direct connector connections, the pins (i.e., connector leads) are typically inserted directly into the connector. This means that pins on one PCB are inserted into corresponding holes on another PCB to achieve signal and power transmission between the two PCBs. This method is prone to unstable connections and increases the risk of poor contact. This is especially true during the operation of electric vehicles, where vibrations or mechanical stresses are significant. This not only results in a larger overall physical space for electronic components but also affects stability.

[0048] In this embodiment, by integrating the drive circuit and power devices within a single PCB board using an embedded chip and substrate stack and transmitting drive signals through a transmission channel penetrating the substrate, the physical space is significantly reduced. Simultaneously, the signal transmission path between the drive circuit and power devices is shortened, thereby improving the power characteristics of the power semiconductor and enhancing the overall system stability and weight reduction. Specifically:

[0049] A chip packaging unit containing a power chip is embedded in a first substrate. This chip packaging unit can employ Chip on Board (CoB) technology, meaning it is directly embedded in the first substrate to reduce the overall system size and weight, while improving thermal conductivity and electrical performance. The power chip can be a structure containing only power devices, or it can include circuitry other than power devices, such as interface circuitry. Through this embedded chip packaging unit design, the chip is surrounded by the substrate material, providing better mechanical support and protection. This allows the chip to better resist external mechanical stress and vibration, thereby reducing the risk of damage caused by physical impact or vibration. Furthermore, the embedded design allows for close contact between the chip and the substrate, enabling more efficient heat transfer from the chip to the substrate, where it is diffused and dissipated through the substrate material.

[0050] By vertically mounting the second substrate on the first substrate, a more compact design is achieved. Simultaneously, the drive circuit is positioned on the upper surface of the second substrate, effectively shortening the signal transmission path between the drive circuit and the power devices while achieving physical and electrical isolation from the power devices in the first substrate. This reduces electromagnetic interference (EMI) caused by the high voltage or current generated by the power devices, protecting the sensitive drive circuit from potential electrical noise and overvoltage in PCB integrated designs. Furthermore, power devices typically generate significant heat; placing the drive circuit on the upper surface of the second substrate reduces direct heat conduction into the drive circuit, preventing performance degradation or damage due to overheating.

[0051] As can be seen, compared with the method of separately deploying the driver board and power board and connecting them through connectors in related technologies, the integrated PCB board provided in this embodiment, by utilizing the substrate stack-up design, the design method of the driver circuit and power device (chip embedding and driver circuit upper surface layout), and the transmission channel method that runs through the substrate, reduces physical space, shortens the signal transmission path between the driver circuit and power device, effectively enhances the mechanical strength and thermal management capability of the system, and reduces electromagnetic interference between the power device and the driver circuit to a certain extent, thereby improving the overall stability and reliability of the system.

[0052] Figure 2 This is a schematic diagram of another printed circuit board 100 provided in the embodiments of this application, compared to Figure 1 The corresponding structure is illustrated in this embodiment using the upper and lower bridge power devices as examples to illustrate the printed circuit board 100. Specifically, in this embodiment, the printed circuit board 100 further includes:

[0053] A shielding layer 140 is disposed between the first substrate 110 and the second substrate 120. The shielding layer 140 is configured to block electromagnetic interference from the chip packaging unit 111 (including two chip packaging units, which are respectively used to package the power chips corresponding to the upper bridge power device and the lower bridge power device) to the electronic components on the second substrate 120.

[0054] In related technologies, since the drive circuit and power devices use two PCBs, signals need to be transmitted between the two boards. The long transmission path can lead to signal attenuation and reflection, increasing the risk of EMI. To address this issue, shielding material is typically added between the two PCBs that respectively host the drive circuit and power devices to reduce the impact of electromagnetic interference on circuit performance. However, adding shielding material between the two PCBs increases the complexity of the manufacturing process: precise alignment and installation are required to ensure shielding effectiveness and mechanical stability, and the shielding material occupies additional space, leading to a larger overall device size and hindering miniaturization design. Clearly, the above approach not only increases material and manufacturing costs but may also result in poor shielding effectiveness, failing to adequately suppress high-frequency interference.

[0055] In this embodiment, by integrating the drive circuit and power devices onto the same PCB board and using the first and second substrates respectively, this design effectively shortens the signal transmission path and significantly reduces signal delay and distortion. Simultaneously, by placing a shielding layer between the first and second substrates, this EMI shielding layer integrated on the same PCB board can more tightly isolate electromagnetic interference. Based on the original stack-up, by adding a shielding layer in the space region within the stack-up, the EMI shielding effect can be achieved, while simultaneously reducing manufacturing costs and complexity.

[0056] Furthermore, an insulating layer region 150 for filling with insulating material is included between the first substrate 110 and the second substrate 120, and a shielding layer 140 is disposed within the insulating layer region 150.

[0057] Optionally, the insulating material can be a prepreg. The prepreg filling between the first substrate and the second substrate effectively achieves electrical isolation between the electronic devices on the first substrate and the second substrate.

[0058] With the above technical solution, the shielding layer is located in the insulating layer area, which can effectively block or absorb electromagnetic interference from power devices and drive circuits, preventing it from propagating between the two substrates. At the same time, by placing the shielding layer in the insulating layer area, the vertical space of the PCB board is fully utilized, eliminating the need for additional layers or components, thereby maintaining the compactness and efficiency of the entire PCB board.

[0059] In some embodiments, the shielding layer may not be disposed in the area of ​​the insulating layer. For example, the shielding layer may be disposed above or below the insulating layer, located between the first substrate and the second substrate, to achieve the shielding effect between the power device and the driving circuit.

[0060] Optionally, the chip packaging unit 111 further includes a metal support block for supporting the power chip; the chip packaging unit 111 is configured to be embedded in the first substrate via the metal support block 1112. Exemplarily, the first substrate 110 may have a groove for embedding the chip packaging unit 111; the chip packaging unit 111 is configured to be embedded in the groove via the metal support block 1112.

[0061] In this embodiment, the metal support block provides a robust platform for supporting and securing the power chip. The chip's stability is improved by embedding the metal support block within the groove.

[0062] In addition, the metal support block has good thermal conductivity. By using the metal support block to embed the chip, the heat generated by the power device can be conducted through the metal support block, which helps to transfer the heat generated by the power chip to other parts of the PCB board or heat dissipation devices, prevents the chip from overheating, and improves the thermal stability and reliability of the system.

[0063] In one embodiment, a welding or burning material 113 is provided between the metal support block 112 and the power chip 1111, so that the power chip is stably mounted on the metal support block 1112.

[0064] In this embodiment, to ensure that the chip can be firmly attached to the metal support block, a layer of welding or bonding material (or other materials that can firmly attach the chip to the metal support block in some embodiments) is placed between the two. This welding or bonding material not only provides the necessary adhesion to ensure that the chip does not move or fall off during operation, but also absorbs mechanical stress to a certain extent, reducing the risk of damage due to thermal expansion or vibration.

[0065] In one embodiment, the metal support block 1112 includes a concave copper block, and the power chip 1111 is disposed within the concave space of the copper block.

[0066] In this embodiment, the metal support block adopts a concave copper block structure, with the power chip embedded in this concave space. This provides a physical boundary for the chip, preventing it from moving or falling out. Simultaneously, the excellent thermal conductivity of copper enables efficient thermal management, rapidly conducting and dissipating the heat generated by the chip. Furthermore, the copper block can serve as part of the electrical connection, enhancing current carrying capacity and reducing resistance.

[0067] This design significantly improves the reliability and efficiency of chips and circuit systems by providing mechanical stability, thermal management, and optimized electrical performance.

[0068] In one embodiment, the power device includes an upper-bridge power device and a lower-bridge power device (e.g., Figure 2 The left-hand power chip 1111 includes an upper-bridge power device, and the right-hand power chip 1111 includes a lower-bridge power device; the driving circuit 121 includes a first driving circuit (as shown on the left) for driving the upper-bridge power device and a second driving circuit (as shown on the right) for driving the lower-bridge power device; the transmission channel includes a first transmission channel 131 and a second transmission channel 132, the first transmission channel 131 being connected to the first control electrode of the upper-bridge power device, and the second transmission channel 132 being connected to the second control electrode 132 of the lower-bridge power device;

[0069] The first control electrode is led out to the upper surface of the second substrate through the first transmission channel 131, so that the first control electrode is connected to the first driving circuit to receive the driving signal transmitted by the first driving circuit.

[0070] The second control electrode is led out to the upper surface of the second substrate through the second transmission channel 132, so that the second control electrode is connected to the second driving circuit to receive the driving signal transmitted by the second driving circuit.

[0071] For example, taking an upper-bridge power device as an example, the upper-bridge power device includes a control electrode, a first electrode, and a second electrode (not shown). A main current path is formed between the first electrode and the second electrode. The control electrode is used to control the switching of the main current path to drive the upper-bridge power device to turn on or off. A first transmission channel 131 is connected to the control electrode. The control electrode is led out to the upper surface of the second substrate through the first transmission channel 131, so that the control electrode is connected to the drive circuit 121 to receive the drive signal transmitted by the drive circuit 121.

[0072] Optionally, the power device can be an insulated gate bipolar transistor (IGBT) or a silicon carbide metal-oxide-semiconductor field-effect transistor (SiC MOSFET). In some embodiments, it can also be a giant transistor (GTR), a bipolar junction transistor (BJT), etc.

[0073] Taking a SiC MOSFET as an example, the power device includes three electrodes: the gate (corresponding to the control electrode, which forms an electric field by applying voltage to control the conduction state between the source and drain), the source (corresponding to the second electrode, the current input terminal as the low potential terminal of the circuit), and the drain (corresponding to the first electrode, the current output terminal as the high potential terminal of the circuit). In some embodiments, the source may correspond to the second electrode and the drain to the first electrode; this embodiment does not impose any particular limitation on this.

[0074] In this embodiment, the gate is led out to the upper surface of the second substrate using a first transmission channel, enabling it to connect to the driving circuit. This allows the driving circuit to transmit control signals to the gate of the power device via the transmission channel, thereby efficiently turning the power device on or off. Thus, the SiC MOSFET can effectively control current flow, providing efficient power conversion and management. Simultaneously, the reliable connection to the driving circuit via the first transmission channel shortens the transmission distance and further improves power dynamic characteristics. Optionally, the second substrate is located on the upper surface of the printed circuit board. By placing the second substrate on the upper surface, the driving circuit is more easily exposed to the external environment, facilitating effective heat dissipation. Furthermore, the driving circuit contains more electronic components, allowing for more efficient use of PCB space and increasing the overall circuit integration. This high-integration design helps reduce the circuit board size, adapting to the needs of more compact device designs.

[0075] In some embodiments, the driving circuit is disposed on the upper surface of the second substrate. This can be achieved by laying an insulating material on the upper surface of the second substrate to isolate electrical components and applying green oil to the insulating layer to protect the circuit board before designing the driving circuit.

[0076] In one embodiment, the transmission channel 130 further includes a third transmission channel 133 connected to the first electrode of the upper bridge power device, a fourth transmission channel 134 connected to the second electrode of the upper bridge power device, a fifth transmission channel 135 connected to the first electrode of the lower bridge power device, and a sixth transmission channel 136 connected to the second electrode of the lower bridge power device.

[0077] The first electrode of the upper bridge power device is led out to the surface of the printed circuit board through the third transmission channel 133, so that the first electrode of the upper bridge power device is connected to the positive terminal of the external power supply.

[0078] The second electrode of the upper bridge power device is connected to the first electrode of the lower bridge power device through the fifth transmission channel 135 inside the printed circuit board via the fourth transmission channel 134, so that the second electrode of the upper bridge power device is connected to the first electrode of the lower bridge power device.

[0079] The second electrode of the lower bridge power device is led out to the surface of the printed circuit board through the sixth transmission channel 136, so that the second electrode of the lower bridge power device is connected to the negative terminal of the external DC power supply.

[0080] In this embodiment, the second substrate is disposed on the surface structure of the PCB board. The corresponding electrode in the power device can be led out to the upper surface of the second substrate, for example, it can be located at the side of the upper surface of the second substrate.

[0081] Optionally, the corresponding electrodes of the power device can be located on the front and back sides of the chip, respectively. In this embodiment, the chip is embedded in the first substrate via a metal support block. Since the metal support block is conductive, the electrodes on the back side of the chip can be led out without requiring a back-side design; the electrodes can be led out directly through the metal support block. Specifically, taking a downbridge power device as an example, the second electrode of the power device is led out from the metal support block to the surface layer of the PCB, such as the side of the upper surface of the second substrate, through the connection between the sixth transmission channel and the metal support block. This side position can be provided with pads for connection to an external power source (such as a battery). For example, the second electrode of the downbridge power device is connected to the negative terminal of the external power source. In some embodiments, the transmission channel can be designed based on the front side of the chip (e.g., front-side hole drilling, i.e., drilling holes upwards on the second substrate), and the first electrode on the front side can be led out through the transmission channel. Similarly, the transmission channel can be designed based on the back side of the chip (e.g., back-side hole drilling, i.e., drilling holes downwards on the second substrate), and the second electrode on the back side can be led out through the transmission channel. This embodiment does not impose any particular limitations on this approach.

[0082] In the above scheme, the flexible transmission channel design and the application of metal support blocks achieve efficient lead-out and reliable connection of power device electrodes, improving the flexibility of PCB design and manufacturing efficiency. Optionally, the transmission channel adopts microvias with a metal plating on the inside, and the number of microvias is determined based on predefined current carrying requirements.

[0083] In this embodiment, the transmission channel is designed as copper-plated microvias (a low-impedance path for current within the transmission channel, thereby reducing power loss and signal attenuation). The number and diameter of the microvias can be determined based on predefined current-carrying requirements. These predefined current-carrying requirements can be calculated based on the specific current requirements of the device mounting the printed circuit board, allowing for the selection of an appropriate number and size of microvias. This ensures that the transmission channel can carry the required current without generating excessive heat or loss. In some embodiments, the number of microvias can be flexibly adjusted according to the actual number of layers, thereby providing stable and efficient electrical connections in complex multilayer PCBs, adapting to different circuit design requirements, and improving the overall circuit performance and reliability.

[0084] It should be understood that the transmission channel layout in the accompanying drawings of this application embodiments is merely a possible example to facilitate understanding of the embodiments of this application, and is not intended to limit the embodiments of this application. For example, the internal traces of the PCB board are not described in the drawings. The transmission channel may extend to the side of the PCB board in a parallel direction, thereby enabling the electrodes of the power device to be led out and soldered to the outer surface of the PCB board. In addition, the transmission channel may not have traces in the vertical direction. The traces in the vertical direction shown in the drawings may be used by the transmission channel for connection between other components.

[0085] In one embodiment, the outer surface of the second substrate 120 further includes a driving power supply 122 connected to the driving circuit 121, the driving power supply 122 being configured to provide a power supply voltage to the driving circuit 121.

[0086] In this embodiment, by integrating a drive power supply connected to the drive circuit on the second substrate, the drive power supply directly delivers the required electrical energy to the drive circuit, reducing the impact of voltage fluctuations and power supply noise on circuit performance. A significant advantage of this integration method is that it simplifies the circuit board layout design. By placing the drive power supply directly on the outer surface of the second substrate, the complexity of external connections and potential connection failure points are reduced.

[0087] In some embodiments, auxiliary circuits such as protection circuits and measurement functions can also be provided on the second substrate. The protection circuits may include multiple functions such as overvoltage protection, overcurrent protection, and short-circuit protection. These protection mechanisms can respond rapidly under abnormal electrical conditions to prevent damage to circuit components; while the integration of measurement functions enables the system to monitor the circuit's operating status in real time. By installing sensors for current, voltage, temperature, etc., on the second substrate, the system can acquire key operating parameters. This data can not only be used for real-time monitoring and adjustment but can also be transmitted to external devices for further analysis via a data interface. Integrating these auxiliary circuits on the second substrate further simplifies the overall layout of the circuit board, reduces the complexity of external connections, and improves the system's integration and performance stability.

[0088] In one implementation, it further includes:

[0089] A thermally conductive layer 160 is disposed on the lower surface of the first substrate 110. The thermally conductive layer 160 is configured to conduct heat from the electronic components on the printed circuit board 100 to the heat sink 200 when the printed circuit board 100 is mounted on the heat sink 200.

[0090] Optionally, the thermally conductive layer is a thermally conductive interface material with electrical insulation properties.

[0091] Thermal interface material (TIM) is a material specifically designed to improve heat transfer efficiency, typically possessing high thermal conductivity and good flexibility. By applying TIM materials, the thermal resistance between electronic components and heat sinks can be significantly reduced, thereby improving heat transfer efficiency. This embodiment uses a thermal interface material with electrical insulation properties as the thermally conductive material to transfer heat to the heat sink, while simultaneously achieving electrical insulation between the material and the metal heat sink.

[0092] In conjunction with the design of the heat dissipation layer, in this embodiment, the second substrate is disposed on the first substrate, which can be in an "up" or "down" direction with the heat dissipation layer as the reference. For example, if the heat dissipation layer is disposed on the back of the first substrate, the front is the top of the first substrate; if the heat dissipation layer is disposed on the front of the first substrate, the back is the top of the first substrate.

[0093] Figure 4 This is a schematic diagram of the structure of an electronic vehicle provided in an embodiment of this application, such as... Figure 4 As shown, the electronic vehicle 1000 includes, as Figures 1-3 The printed circuit board 100 provided in the corresponding embodiment.

[0094] In this embodiment, the printed circuit board 100 can serve as a core control module in the electric vehicle 300, responsible for managing and coordinating the operation of various electronic systems. The integrated drive circuits and power chips on it can efficiently control the operation of the motor, achieving precise control of the vehicle's power system.

[0095] It should be noted that the electronic vehicle provided in this embodiment includes the structure of the printed circuit board described above, which can realize all the solutions implemented in the printed circuit board embodiment and achieve the same technical effect. Therefore, the parts that are the same as those in the printed circuit board embodiment and the beneficial effects will not be described in detail here.

[0096] In this application, "at least one" means one or more, and "more than one" means two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates an "or" relationship between the preceding and following related objects; in formulas, the character " / " indicates a "division" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0097] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application. In the embodiments of this application, the order of the above-mentioned process numbers does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0098] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0099] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A printed circuit board, characterized in that, include: A first substrate, wherein at least one chip packaging unit is embedded in the first substrate, and the chip packaging unit includes a power chip; A second substrate disposed on the upper layer of the first substrate, wherein the upper surface of the second substrate includes at least a driving circuit; A transmission channel runs through the first substrate and the second substrate, the transmission channel being configured to transmit the drive signal of the drive circuit to the power device on the power chip to drive the power device to turn on or off.

2. The printed circuit board according to claim 1, characterized in that, Also includes: A shielding layer is disposed between the first substrate and the second substrate, the shielding layer being configured to block electromagnetic interference from the chip packaging unit to electronic components on the second substrate.

3. The printed circuit board according to claim 2, characterized in that, An insulating layer region for filling with insulating material is included between the first substrate and the second substrate, and the shielding layer is disposed within the insulating layer region.

4. The printed circuit board according to claim 1, characterized in that, The chip packaging unit also includes a metal support block for supporting the power chip; The chip packaging unit is configured to be embedded in the first substrate via the metal support block.

5. The printed circuit board according to claim 4, characterized in that, A welding or soldering material is provided between the metal support block and the power chip, so that the power chip is securely mounted on the metal support block.

6. The printed circuit board according to claim 4, characterized in that, The metal support block includes a concave copper block, and the power chip is disposed within the concave space of the copper block.

7. The printed circuit board according to claim 1, characterized in that, The power device includes an upper bridge power device and a lower bridge power device; the driving circuit includes a first driving circuit for driving the upper bridge power device and a second driving circuit for driving the lower bridge power device. The transmission channel includes a first transmission channel and a second transmission channel, the first transmission channel being connected to the first control electrode of the upper bridge power device, and the second transmission channel being connected to the second control electrode of the lower bridge power device; The first control electrode is led out to the upper surface of the second substrate through the first transmission channel, so that the first control electrode is connected to the first driving circuit to receive the driving signal transmitted by the first driving circuit. The second control electrode is led out to the upper surface of the second substrate through the second transmission channel, so that the second control electrode is connected to the second driving circuit to receive the driving signal transmitted by the second driving circuit.

8. The printed circuit board according to claim 7, characterized in that, The transmission channel further includes a third transmission channel connected to the first electrode of the upper bridge power device, a fourth transmission channel connected to the second electrode of the upper bridge power device, a fifth transmission channel connected to the first electrode of the lower bridge power device, and a sixth transmission channel connected to the second electrode of the lower bridge power device. The first electrode of the upper bridge power device is led out to the surface of the printed circuit board through the third transmission channel, so that the first electrode of the upper bridge power device is connected to the positive terminal of the external power supply. The second electrode of the upper bridge power device is connected to the first electrode of the lower bridge power device through the fourth transmission channel inside the printed circuit board through the fifth transmission channel, so that the second electrode of the upper bridge power device is connected to the first electrode of the lower bridge power device. The second electrode of the lower bridge power device is led out to the surface of the printed circuit board through the sixth transmission channel, so that the second electrode of the lower bridge power device is connected to the negative terminal of the external DC power supply.

9. The printed circuit board according to any one of claims 1-8, characterized in that, The transmission channel is a micropore with a metal coating on the inside, and the number of micropores is determined based on a predefined current carrying requirement.

10. The printed circuit board according to any one of claims 1-8, characterized in that, The outer surface of the second substrate also includes a driving power supply connected to the driving circuit, the driving power supply being configured to provide a power supply voltage to the driving circuit.

11. The printed circuit board according to any one of claims 1-8, characterized in that, The second substrate is located on the upper surface layer of the printed circuit board.

12. The printed circuit board according to any one of claims 1-8, characterized in that, Also includes: A thermally conductive layer disposed on the lower surface of the first substrate is configured to conduct heat from electronic components on the printed circuit board to the heat sink when the printed circuit board is mounted on a heat sink.

13. The printed circuit board according to claim 12, characterized in that, The thermally conductive layer is a thermally conductive interface material with electrical insulation properties.

14. An electronic vehicle, characterized in that, Including the printed circuit board as described in any one of claims 1-13.

Images