An apparatus for transferring a chip

Abstract

The utility model discloses a device for transferring chip, including the loading platform, be provided with chip positioning hole on the loading platform, chip positioning hole sets up in the central position of loading platform, penetrates loading platform, top positioning chip, and the both sides of loading platform are provided with positioning assembly, and the locking of loading platform is pasted on the component of chip mounter, is provided with vacuum assembly in the inside loading platform, and vacuum assembly sets up in the inside loading platform, and the vacuum pump in vacuum assembly is connected with chip positioning hole, and the device provides negative pressure to chip positioning hole through the vacuum pump, and completes the adsorption to the chip that places on chip positioning hole, prevents the displacement of chip in the process of transferring, and simultaneously avoids the displacement in the process of transferring, and avoids the mutual collision between chips, therefore improves the overall transfer volume through the setting of multiple chip positioning holes, and improves the transfer efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip manufacturing, and in particular to a device for transferring chips. Background Technology

[0002] In traditional packaging and wafer-level packaging back-end mounting processes, chip transfer is required during wafer mounting, regardless of whether face-up or face-down mode is used. When using traditional transfer devices, chip rotation and loss may occur during the transport from the wafer to the carrier. Figure 1 The transfer device shown uses a snap-fit ​​mechanism to position itself on the pick-and-place machine component. During the transfer process, the snap-fit ​​mechanism is prone to loosening, which can lead to a high probability of chip displacement or other abnormalities on the transfer device. In order to prevent the chips from colliding with each other, only one chip can be transported at a time. To address this issue, this application proposes a solution. Summary of the Invention

[0003] Purpose of the utility model: The purpose of this utility model is to provide a device for transporting chips, which can improve the efficiency of chip transport while ensuring that the chips are not displaced during the transport process.

[0004] Technical solution: The present invention discloses a device for transferring chips, comprising a carrier stage, wherein a chip positioning hole is provided on the carrier stage, the chip positioning hole is located at the center of the carrier stage, penetrates the carrier stage, and positions the chip at the top; positioning components are arranged on both sides of the carrier stage to lock the carrier stage onto a pick-and-place machine component; a vacuum component is provided inside the carrier stage, the vacuum component is located inside the carrier stage, and the vacuum pump in the vacuum component is connected to the chip positioning hole.

[0005] This device uses a vacuum pump to apply negative pressure to the chip positioning holes, thereby adsorbing the chips placed on the positioning holes and preventing the chips from shifting during transport.

[0006] Preferably, the positioning component includes a pin and a positioning hole, the positioning hole penetrating the stage and facing the locking hole on the pick-and-place machine component, the pin extending into the positioning hole and locking with the locking hole on the pick-and-place machine component.

[0007] Using pins and positioning holes, the stage is further locked onto the pick-and-place machine components, ensuring that the stage as a whole will not shift relative to the pick-and-place machine components during movement.

[0008] Preferably, the carrier is provided with a plurality of chip positioning holes, which are evenly distributed on the carrier.

[0009] The use of multiple positioning holes can increase the amount of chips transferred by the stage each time, thereby improving transfer efficiency.

[0010] Preferably, the size of the chip positioning hole is no more than 80% of the chip size.

[0011] The size of the chip positioning hole is smaller than the chip size to ensure that the chip completely covers the chip positioning hole, preventing unstable adsorption caused by vacuum leakage.

[0012] Preferably, the vacuum assembly further includes a vacuum hole that penetrates the stage, with one end face located on the top surface of the stage and the other end face located on the bottom surface of the stage.

[0013] Preferably, the vacuum hole is located at the outlet on the top of the stage and is not covered by the chip when the chip is adsorbed onto the stage.

[0014] The design of leaving the top outlet of the vacuum hole uncovered facilitates the subsequent breaking of the vacuum state of the chip positioning hole.

[0015] Preferably, a vacuum groove is provided on the bottom surface of the stage, and a vacuum hole and the bottom outlet of the chip positioning hole are provided in the vacuum groove.

[0016] By connecting the chip positioning hole and the vacuum hole through the vacuum groove, when the vacuum pump stops working, the chip positioning hole can be connected to the outside through the vacuum hole, restoring the pressure difference between the chip positioning hole and the outside, so that the chip is no longer attracted to the chip positioning hole and can be easily removed.

[0017] Preferably, the end of the stage is provided with a positioning buckle for positioning on the pick-and-place machine component. The positioning buckle has a groove structure that matches the protrusion on the pick-and-place machine component.

[0018] The positioning clips are used to initially position the stage on the pick-and-place machine components.

[0019] Beneficial effects: Compared with the prior art, this utility model has the following advantages:

[0020] This device uses a vacuum pump and chip positioning holes to adsorb the chips, preventing them from shifting during transport. By avoiding displacement during transport, collisions between chips are also prevented. Therefore, by setting multiple chip positioning holes, the overall transport capacity is increased, thus improving transport efficiency. Attached Figure Description

[0021] Figure 1 This is a side view of a traditional transfer device.

[0022] Figure 2 This is a top view of the present invention.

[0023] Figure 3 This is a side view of the present invention.

[0024] Figure 4 This is a bottom view of the present invention.

[0025] Figure 5 This is a side view of the present invention placed on a component of a pick-and-place machine. Detailed Implementation

[0026] The technical solution of this utility model will be further described below with reference to the accompanying drawings.

[0027] See appendix Figures 1-5 Figure 1 shows a device for transferring chips according to this utility model. It includes a stage 1 with a chip positioning hole 2 located at the center of the stage 1, penetrating the stage 1 and positioning a chip 3 at the top. Positioning components are arranged on both sides of the stage 1 to lock the stage 1 onto a pick-and-place machine component 4. A vacuum assembly is provided inside the stage 1. The vacuum assembly has a vacuum pump connected to the chip positioning hole 2. This device continuously provides negative pressure to the chip positioning hole 2 through the vacuum pump to adsorb the chip 3 placed on the chip positioning hole 2 and prevent the chip 3 from shifting during the transfer process.

[0028] In this embodiment, the positioning component includes a pin 5 and a positioning hole 6. The positioning hole 6 penetrates the stage 1 and is directly opposite the locking hole on the pick and place machine component 4. The pin 5 extends into the positioning hole 6 and locks with the locking hole on the pick and place machine component 4. By using the pin 5 and the positioning hole 6, the stage 1 is further locked on the pick and place machine component 4, ensuring that the stage 1 as a whole will not be displaced relative to the pick and place machine component 4 during the movement.

[0029] In this embodiment, the stage 1 is provided with multiple chip positioning holes 2. The multiple chip positioning holes 2 are evenly distributed on the stage 1, which can increase the amount of chips 3 transferred by the stage 1 each time and improve the transfer efficiency.

[0030] In this embodiment, the size of the chip positioning hole 2 is no more than 80% of the size of the chip 3. This setting can ensure that the chip 3 completely covers the chip positioning hole 2, preventing unstable adsorption caused by vacuum leakage.

[0031] In this embodiment, the vacuum assembly also includes a vacuum hole 7, which penetrates the stage 1. One end face of the vacuum hole 7 is located on the top surface of the stage 1, and the other end face is located on the bottom surface of the stage 1. At the same time, the outlet of the vacuum hole 7 located on the top of the stage 1 is not covered by the chip 3 when the chip 3 is adsorbed on the stage 1. This setting can facilitate the subsequent breaking of the vacuum state of the chip positioning hole 2.

[0032] In this embodiment, a vacuum groove 8 is provided on the bottom surface of the stage 1. A vacuum hole 7 and the bottom outlet of the chip positioning hole 2 are provided in the vacuum groove 8. The chip positioning hole 2 and the vacuum hole 8 are connected through the vacuum groove 8, so that when the vacuum pump stops working, the chip positioning hole 2 can be connected to the outside through the vacuum hole 7, restoring the pressure difference between the inside of the chip positioning hole 2 and the outside, so that the chip 3 is no longer adsorbed on the chip positioning hole 2 and can be easily removed.

[0033] In this embodiment, the end of the stage 1 is provided with a positioning buckle 9 for positioning on the pick and place machine component 4. The positioning buckle 9 has a groove structure that matches the protrusion on the pick and place machine component 4. The positioning buckle 9 is provided for the stage 1 to be initially positioned on the pick and place machine component 4.

Claims

1. An apparatus for transferring chips, comprising a stage (1), characterized in that: The stage (1) is provided with a chip positioning hole (2), which is located at the center of the stage (1), penetrates the stage (1), and positions the chip (3) at the top. Positioning components are placed on both sides of the stage (1) to lock the stage (1) onto the pick-and-place machine component (4). A vacuum component is provided inside the stage (1), and the vacuum pump in the vacuum component is connected to the chip positioning hole (2).

2. The device for transferring chips according to claim 1, characterized in that: The positioning component includes a pin (5) and a positioning hole (6). The positioning hole (6) passes through the stage (1) and is directly opposite the locking hole on the pick and place machine component (4). The pin (5) extends into the positioning hole (6) and locks with the locking hole on the pick and place machine component (4).

3. The device for transferring chips according to claim 1, characterized in that: The stage (1) is provided with a plurality of chip positioning holes (2), which are evenly distributed on the stage (1).

4. The device for transferring chips according to claim 1, characterized in that: The size of the chip positioning hole (2) is no greater than 80% of the size of the chip (3).

5. The device for transferring chips according to claim 1, characterized in that: The vacuum assembly also includes a vacuum hole (7) that penetrates the stage (1), with one end face located on the top surface of the stage (1) and the other end face located on the bottom surface of the stage (1).

6. The apparatus for transferring chips according to claim 5, characterized in that: The vacuum hole (7) located on the top surface of the stage (1) is not covered by the chip (3) when the chip (3) is adsorbed onto the stage (1).

7. The device for transferring chips according to claim 5, characterized in that: A vacuum groove (8) is provided on the bottom surface of the stage (1), and a vacuum hole (7) and the bottom outlet of the chip positioning hole (2) are provided in the vacuum groove (8).

8. The device for transferring chips according to claim 1, characterized in that: The end of the platform (1) is provided with a positioning buckle (9) for positioning on the pick and place machine component (4). The positioning buckle (9) has a groove structure that matches the protrusion on the pick and place machine component (4).

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