A ceramic package

Abstract

The utility model discloses a kind of ceramic packaging, specifically related to electronic packaging technical field, including ceramic plate, lid, functional piece;Metal pad and glue blocking ring are equipped on ceramic plate, metal pad is coated on ceramic plate, glue blocking ring is fixedly connected with ceramic plate, functional piece is fixed with metal pad by glue, and glue blocking ring encloses metal pad and functional piece, lid is connected by glue and ceramic plate to form encapsulation, lid is sleeved in glue blocking ring outside.The utility model can avoid glue liquid to the electrical performance of metal pad and functional piece interference, improve product pass rate, reduce resource waste.

Description

Technical Field

[0001] This utility model relates to the field of electronic packaging technology, and in particular to a ceramic package. Background Technology

[0002] When sealing the ceramic plate and the cap, the cap is coated with sealing adhesive and fixed to the ceramic plate. However, the flow direction of the adhesive before curing is difficult to control precisely, often resulting in excessive adhesive overflow onto the surface of the functional component or the metal pad below it. Furthermore, the large amount of organic matter volatilized during the curing process can re-condense and adhere to the functional component. Both of these situations severely interfere with the electrical connection and conductivity between the functional component and the metal pad, ultimately leading to product failure, reduced production yield, and resource waste. Utility Model Content

[0003] The purpose of this invention is to provide a ceramic encapsulation body to solve the problems existing in the prior art, thereby avoiding the conductive interference of adhesive on functional components and metal pads, improving product qualification rate, and reducing resource waste.

[0004] To achieve the above objectives, this utility model provides the following solution: This utility model provides a ceramic encapsulation body, including a ceramic plate, a cover, and functional components; a retaining ring and a metal pad are provided on the ceramic plate, the metal pad is coated on the ceramic plate, the retaining ring is fixedly connected to the ceramic plate, the functional components are fixed to the metal pad by adhesive, and the retaining ring can surround the metal pad and the functional components; the cover is sleeved on the retaining ring, and the cover is sealed to the ceramic plate by adhesive.

[0005] Preferably, the adhesive retaining ring is printed on the ceramic plate with a high film thickness.

[0006] Preferably, the rubber retaining ring is made of glass, ceramic or metal.

[0007] Preferably, the shape of the rubber-blocking ring is circular, rectangular, or polygonal.

[0008] Preferably, a limiting line is provided circumferentially on the outer side wall of the lid, the limiting line being used to limit the height of the adhesive being applied.

[0009] Preferably, the height of the retaining ring is greater than the height of the limiting line.

[0010] The present invention achieves the following technical advantages over the prior art: This invention provides a ceramic encapsulation body. By setting a retaining ring around the metal pad and functional components, it can prevent the flowing adhesive from crossing the retaining ring and contaminating the internal functional components and metal pad. This solves the problem of decreased conductivity and product failure caused by contamination, improves product qualification rate, and reduces resource waste. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is a schematic diagram of the structure of a ceramic encapsulation plate; Figure 2 A partial cross-sectional view of the ceramic package; Figure 3 This is a schematic diagram of the lid.

[0013] In the diagram: 1. Ceramic plate; 2. Cover; 3. Sealing ring; 4. Functional component; 5. Metal pad; 6. Limit line. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] The purpose of this invention is to provide a ceramic encapsulation body to solve the problems existing in the prior art, thereby avoiding the conductive interference of adhesive on functional components and metal pads, improving product qualification rate, and reducing resource waste.

[0016] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0017] This utility model provides a ceramic encapsulation body, such as Figures 1-2As shown, the device includes a ceramic plate 1, a cover 2, and a functional component 4. A retaining ring 3 and a metal pad 5 are mounted on the ceramic plate 1. The metal pad 5 is coated onto the ceramic plate 1. The functional component 4 is fixed to the metal pad 5 with adhesive. The retaining ring 3 is fixedly connected to the ceramic plate 1 and surrounds the metal pad 5 and the functional component 4. The cover 2 is sealed to the ceramic plate 1 with adhesive and is fitted over the retaining ring 3. The retaining ring 3 is fixed to the ceramic plate 1 and surrounds the metal pad 5 and the functional component 4, while the cover 2 is fitted over its outer side, forming a physical barrier around the functional component 4 and the metal pad 5. When the cover 2 and the ceramic plate 1 are sealed with adhesive, the adhesive is confined to the sealing area outside the retaining ring 3, preventing it from crossing the retaining ring 3 to contact the inner functional component 4 and the metal pad 5. This fundamentally eliminates conductive interference caused by adhesive turbulence, thereby improving product yield and reducing resource waste. The functional component 4 is a chip.

[0018] In a further preferred embodiment of this utility model, the adhesive retaining ring 3 is printed on the ceramic plate 1 with a high film thickness. Screen printing is low in cost, high in efficiency, and has strong adhesion.

[0019] In a further preferred embodiment of this utility model, the material of the retaining ring 3 is glass, ceramic or metal, or other materials with thermal properties similar to those of the green body.

[0020] In a further preferred embodiment of this utility model, the shape of the adhesive-blocking ring 3 is circular, rectangular, or polygonal.

[0021] A further preferred embodiment of this utility model is, as follows: Figure 3 As shown, a limiting line 6 is provided circumferentially on the outer side wall of the cover 2. The limiting line 6 is used to limit the height of the adhesive being dipped. The limiting line 6 can accurately control the amount of adhesive dipped, avoiding encapsulation problems caused by too much or too little adhesive from the source, and improving the overall product encapsulation quality stability.

[0022] In a further preferred embodiment of this invention, the height of the adhesive-retaining ring 3 is greater than the height of the limiting line 6. The height of the limiting line 6 determines the maximum amount of adhesive that the cap 2 can absorb, while the height of the adhesive-retaining ring 3, being higher than the limiting line 6, means that the physical isolation height of the adhesive-retaining ring 3 is always higher than the actual filling height of the adhesive. Even if the adhesive slightly overflows due to the bonding pressure, it will be blocked by the higher adhesive-retaining ring 3, preventing it from flowing over the adhesive-retaining ring 3 to the inner functional components and metal pad 5, thus eliminating the possibility of adhesive seepage.

[0023] The manufacturing process for ceramic packages is as follows: Step S1: Substrate preparation; First, the ceramic raw materials are made into unfired semi-finished blanks, and then through the molding process, the preliminary shape of the ceramic plate is finally obtained. Step S2: Printing; Print the adhesive retaining ring on the ceramic plate using a high film thickness printing process; Step S3: Sintering; The raw sheet from step S2 is sintered into a substrate by controlling the debinding sintering temperature; Step S4: Functional component encapsulation; The functional component is sealed onto the metal pad by dispensing adhesive, and the adhesive is dried to cure, forming a ceramic plate after encapsulating the functional component; Step S5: Apply adhesive; Dip the cap into the encapsulation adhesive. To avoid excessive adhesive during subsequent encapsulation and causing adhesive overflow, the direction of dipping the cap into the adhesive should be vertical, and the contact depth between the cap and the adhesive should be less than 1 / 2 of the height of the adhesive retaining ring. Step S6: Cap sealing; Attach the cap from step S5 to the outer edge of the sealant ring 3, assemble it with the ceramic plate, and dry it to cure the adhesive, forming a ceramic package with qualified airtightness and good electrical performance.

[0024] This utility model uses specific examples to illustrate its principles and implementation methods. The above description of the embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the idea of ​​this utility model. In summary, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A ceramic encapsulation body, characterized in that: The device includes a ceramic plate, a cover, and functional components. A retaining ring and a metal pad are provided on the ceramic plate. The metal pad is coated on the ceramic plate, and the retaining ring is fixedly connected to the ceramic plate. The functional components are fixed to the metal pad with adhesive, and the retaining ring can surround the metal pad and the functional components. The cover is sleeved on the retaining ring and is sealed to the ceramic plate with adhesive.

2. The ceramic encapsulation body according to claim 1, characterized in that: The rubber retaining ring is printed on the ceramic plate with a high film thickness.

3. The ceramic encapsulation body according to claim 1, characterized in that: The retaining ring is made of glass, ceramic or metal.

4. The ceramic encapsulation body according to claim 1, characterized in that: The shape of the rubber-blocking ring is circular, rectangular, or polygonal.

5. The ceramic package according to claim 1, characterized in that: The outer side wall of the lid is provided with a limiting line around its perimeter, which is used to limit the height at which glue is applied.

6. The ceramic package according to claim 5, characterized in that: The height of the retaining ring is greater than the height of the limiting line.

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