Square semiconductor package chip
CN309093396SInactive Publication Date: 2025-01-28SHENZHEN DEXIN MICROELECTRONICS CO LTD
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Patent Information
- Application Number
- CN202430514608.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-14
- Publication Date
- 2025-01-28
- Estimated Expiration
- Not applicable · inactive patent
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Figure 000007_ABST
Abstract
1. The name of the product of this design: square semiconductor package chip. 2. The purpose of this design product: to protect internal semiconductor devices, provide electrical connections and optimize heat dissipation performance. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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