Wafer thinning and film peeling machine
CN309155452SActive Publication Date: 2025-03-07江苏元夫半导体科技有限公司
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Patent Information
- Application Number
- CN202430479073.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-30
- Publication Date
- 2025-03-07
- Estimated Expiration
- 2039-07-30
Smart Images
Figure 000007_ABST
Abstract
1. The name of the product of this design: round wafer thinning and film peeling and pasting machine. 2. Purpose of the product with this design: The product with this design is used for thinning, grinding, film application and film removal of semiconductor wafers. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: Stereoscopic diagram 1.
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