Thermal patching device housing
CN309246773SActive Publication Date: 2025-04-18XIAN ZHANDONG NEW MATERIALS CO LTD
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Patent Information
- Application Number
- CN202430546864.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-28
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2039-08-28
Smart Images
Figure 000006_ABST
Abstract
1. The name of this design product: thermal patching instrument housing. 2. The purpose of this design product: to protect the internal circuits and components of the thermal patching instrument, etc. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture. 5. The bottom surface of this design product is a part that is not easily visible or cannot be seen when in use, so the top view is omitted.
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