Physical vapor deposition equipment (thin film deposition vacuum pretreatment chamber)
CN309468812SActive Publication Date: 2025-08-29UNIV OF SCI & TECH BEIJING
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Patent Information
- Application Number
- CN202430713321.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-12
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2039-11-12
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product of this design: Physical vapor deposition device (thin film deposition vacuum pretreatment chamber). 2. Purpose of this design product: The design product is used for physical vapor deposition of semiconductor, superconducting and magnetoelectric thin films. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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