Camera semiconductor heat sink (lever type)
CN309569665SActive Publication Date: 2025-10-28曾银平
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Patent Information
- Application Number
- CN202530138792.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-20
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2040-03-20
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product in this design: Camera Semiconductor Heatsink (Lever Type). 2. Purpose of this design: A heat dissipation product used to cool down a camera. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.
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