Rapid thermal processing apparatus
CN309668059SActive Publication Date: 2025-12-12ETA-SEMITECH (ANHUI) CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202430412949.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-03
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2039-07-03
Smart Images
Figure 000001_ABST
Abstract
1. The name of the design product: rapid thermal processing equipment. 2. The use of the design product: equipment for rapid thermal processing of semiconductor wafers. 3. The design points of the design product: in shape. 4. The picture or photo that best shows the design points: perspective view. 5. The bottom surface of the product is not commonly used when in use, so the bottom view is omitted; the top surface of the product has been shown in the perspective view, so the top view is omitted.
Need to check novelty before this filing date? Find Prior Art