Electronic arrangement

Abstract

Electronic arrangement (1) with: - a carrier (2), - at least one connecting surface (6) on the support (2), - at least one optoelectronic component (3a) which is attached at least to the connecting surface (6) by means of a contact material (4), - a cover surface (5) that surrounds the connecting surface (6) on the support (2), and - at least one covered area (15, 16, 17, 18, 19) which is covered by a covering material (10), wherein - the cover surface (5) is highly reflective with a reflectivity greater than 70%, and exposed areas on the connecting surface (6) and on the contact material (4) are covered with the cover material (10), wherein the cover material (10) is colored by titanium dioxide (TiO2) particles such that the titanium dioxide particles in the cover material (10) are provided at a proportion of 25% to 70% by weight, so that the cover material (10) is highly reflective with a reflectivity greater than 70%, thereby minimizing optical contrast between the cover surface (5) and the covered area (15, 16, 17, 18, 19), wherein the difference in reflectivity between the cover surface (5) and the cover material (10) is less than 20%, - that at least one optoelectronic component (3a) is a radiation-emitting component that is encapsulated with a potting material (13) in which scattering centers (12) are introduced, and - the area covered by the covering material (15, 16, 17, 18, 19) comprises side surfaces (7) of the optoelectronic component (3a).

Description

[0001] The present invention relates to an electronic arrangement.

[0002] Electronic devices exhibit an inhomogeneous optical appearance when switched off. They can contain optoelectronic and non-optoelectronic components whose contact materials and surfaces convey different color and brightness impressions.

[0003] Publication JP 2008-258 296 A describes a light-emitting component on a substrate, wherein a p-side connection surface and an n-side connection surface are formed on the substrate, and the component is attached to one of the connection surfaces by means of a bonding layer. The substrate has a mounting area, wherein the mounting area, viewed from above, encompasses portions of the connection surfaces and is enclosed by a cover layer made of a white covering material. The mounting area may also be covered with a further layer of a white material.

[0004] Publication US 2009 / 0 087 775 A1 and Publication JP 2009- 194 026 A describe titanium dioxide particles and their use as well as a light-emitting component with a potting material on a substrate.

[0005] The object of the invention is to provide an electronic arrangement which has a homogeneous optical appearance when switched off.

[0006] This problem is solved by an electronic arrangement according to independent claim 1 or according to independent claim 14.

[0007] Further developments and advantageous configurations of the electronic arrangement are specified in the dependent claims. EXAMPLE EXECUTION FORMS

[0008] Various embodiments feature an electronic arrangement with optoelectronic and non-optoelectronic components. In the off state, the optical appearance is homogenized. In the on state of the optoelectronic component, absorption losses are minimized.

[0009] The electronic arrangement comprises a substrate with at least one connection surface. At least one electronic component, which is a radiation-emitting optoelectronic component, is attached to the connection surface by means of a contact material. A cover surface is arranged on the substrate and surrounds the connection surface. The electronic arrangement has at least one covered area, which is covered by a cover material. The cover material is designed such that the optical contrast between the cover surface and the covered area is minimized.

[0010] In a preferred embodiment, the connecting surface is an electrical, preferably metallic, contact surface.

[0011] Alternatively or additionally, the bonding surface can be an adhesive surface, particularly a non-metallic one. This can be used for optoelectronic components grown on sapphire.

[0012] Optical contrast refers to color contrast. Alternatively or additionally, optical contrast also refers to brightness contrast. Optical contrast is minimized, firstly, by ensuring that the surface and the covering material have a similar, preferably identical, reflectivity. Secondly, optical contrast is minimized by ensuring that the surface and the covering material have a similar, preferably identical, color.

[0013] Color differences, and thus color contrast, can be represented by the color difference ΔE. The term "same color valence" is synonymous with "same color." Color differences ΔE < 2 are barely perceptible to the human eye. In contrast, color differences of ΔE > 5–10 are perceived as different colors. The color of the surface and the color of the covering material preferably have a color difference of ΔE < 5, and particularly preferably ΔE < 3.

[0014] The similarity of the perceived brightness of the masking material to the bonding surface can be expressed in terms of reflectance differences. Before masking, for example, the gold-coated bond pad has a reflectance of approximately 55%. The bonding surface material can have a reflectance of about 95%. The resulting 40% difference can be defined as the problematic initial state. The difference in reflectivity between the bonding surface and the masking material is less than 20%, and preferably less than 10%. Any reduction in the difference in reflectivity between the bonding surface and the masking material produces a more homogeneous perceived brightness.

[0015] In addition to minimizing contrast, partially or completely covering electronic components with covering material provides corrosion protection for the electronic components.

[0016] The use of covering material is advantageous compared to the use of lenses made of diffuse plastic or roughening of lens surfaces or coating the lens surface with diffuse resin.

[0017] In a preferred embodiment, the contact material comprises solder or adhesive. This is advantageous because it allows the electronic component to be mechanically and / or electrically connected to the contact surface.

[0018] In one embodiment, the electronic component is an optoelectronic component, in particular an LED. The optoelectronic component can be grown on a III-V compound semiconductor material, in particular a nitride compound semiconductor material such as gallium nitride (GaN). The optoelectronic component has at least one active region that emits electromagnetic radiation. The active regions can be pn junctions, double heterostructures, multiple quantum well (MQW) structures, or single quantum well (SQW) structures. Quantum well structure means: quantum wells (3-dimensional), quantum wires (2-dimensional), and quantum dots (1-dimensional).

[0019] In one embodiment, the arrangement also includes an electronic component, which is a non-optoelectronic component. An ESD semiconductor chip and / or a microchip, for example a memory chip or a controller, can be used as the non-optoelectronic component. Alternatively or additionally, a passive component, in particular a resistor, an inductor, or a capacitor, can be used as the non-optoelectronic component.

[0020] In a preferred embodiment, the optoelectronic component is a wire-contacted semiconductor chip. Alternatively or additionally, the optoelectronic component can be designed as a flip chip. The embodiment with an optoelectronic component in the form of a flip chip is advantageous because the shading caused by the bond wire is eliminated and no active area is lost to the bond pad on the optoelectronic component.

[0021] In one embodiment, the area covered by the covering material comprises the surface of the non-optoelectronic component facing away from the support.

[0022] The covered area includes the side surfaces of the electronic component.

[0023] In a preferred embodiment, the covered area includes the areas of the connection surface not covered by the electrical component.

[0024] In a preferred embodiment, the covered area includes the areas of the contact material not covered by the electrical component.

[0025] In a preferred embodiment, the bond wires can be covered by the covering material.

[0026] In a preferred embodiment, fastening units, in particular screws, can be covered by the covering material.

[0027] In a preferred embodiment, the non-optoelectronic components can be completely covered by a covering material. Complete coverage of the non-optoelectronic components is particularly advantageous because it minimizes, and preferably eliminates, the contrast between the covered component and the covering surface.

[0028] The covered areas are advantageous because covering them homogenizes the optical appearance of the electronic arrangement when it is switched off. Furthermore, it is beneficial that light absorption on poorly reflective surfaces of the electronic arrangement is reduced.

[0029] In a preferred embodiment, the top surface comprises a ceramic, preferably white, material. Alternatively or additionally, the top surface comprises a laminated epoxy resin. Alternatively or additionally, the top surface comprises solder resist.

[0030] In a preferred embodiment, the covering material comprises a colored silicone. Alternatively or additionally, the covering material comprises a colored epoxy resin, in particular solder resist. Alternatively or additionally, the covering material comprises a thermoplastic.

[0031] The covering material is colored by pigments, namely by titanium dioxide (TiO2) particles.

[0032] Titanium dioxide particles are provided in the covering material with a proportion of up to 70 percent by weight, and at least 25 percent by weight.

[0033] The top surface is highly reflective with a reflectivity greater than 70%. Additionally, the covering material is also highly reflective with a reflectivity greater than 70%.

[0034] Various embodiments include a method for manufacturing an electronic arrangement. In a preferred embodiment, a cover surface is applied to a substrate in a flat and structured manner. At least one connection surface is recessed. Subsequently, at least one electronic component is mounted on the connection surface. Finally, at least partially exposed areas on the connection surface are covered.

[0035] Alternatively or additionally, in the case of a non-optoelectronic component, the surface of the electronic component facing away from the substrate is covered with a covering material.

[0036] In a preferred embodiment, covering with a covering material is carried out by dispensing or dosing.

[0037] In a preferred embodiment, covering with a covering material is carried out by jetting. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Various embodiments of the electronic arrangement are explained in more detail below with reference to the drawings. Fig. Figure 1 shows a section view of an electronic arrangement with an optoelectronic component; Fig. 2a and Fig. 2b shows top views of a section of an electronic arrangement with an optoelectronic component with wire contacts; Fig. 3a and Fig. Figure 3b shows top views of a section of an electronic arrangement with an optoelectronic component with flip-chip contacting; Fig. Figure 4 shows a section view of an electronic arrangement with a non-optoelectronic component; Fig. Figure 5 shows a section view of an electronic arrangement with an optoelectronic and a non-optoelectronic component; Fig. Figure 6a shows a section view of an electronic arrangement with a non-optoelectronic component, in particular a passive component; Fig. 6b and Fig. Figure 6c shows a top view of a section of an electronic arrangement with a non-optoelectronic component, in particular a passive component; Fig. Figure 7a shows a section view of an electronic arrangement with a non-optoelectronic component, in particular a passive component; Fig. 7b and Fig. Figure 7c shows a top view of a section of an electronic arrangement with a non-optoelectronic component, in particular a passive component. All figures refer only to partial aspects of independent claims 1 and 14. EXAMPLES OF EXECUTION

[0039] Identical, similar, or similarly effective elements in the figures are marked with the same reference symbols. The figures and the relative sizes of the elements depicted within them are not to be considered to scale. Rather, individual elements may be exaggerated for clarity and comprehension.

[0040] Fig. Figure 1 shows a cross-section of an electronic arrangement 1. A connection surface 6 is arranged on a carrier 2. An optoelectronic component 3a is attached to the connection surface 6 by means of a contact material 4. A cover surface 5 surrounds the connection surface 6 on the carrier 2. A covered area 15 is covered by a cover material 10. The cover material 10 is designed such that the optical contrast between the cover surface 5 and the covered area 15 is minimized.

[0041] The connecting surface 6 can be an electrical contact surface. Alternatively, the connecting surface 6 can also be an adhesive surface, particularly a non-metallic one.

[0042] Optical contrast is a color contrast and / or a brightness contrast.

[0043] The contact material 4 can be solder or adhesive. The optoelectronic component 3a can be an LED.

[0044] The covered area 15 comprises the side surfaces 7 of the optoelectronic component 3a, the areas of the connecting surface 6 not covered by the optoelectronic component 3a, and the areas of the contact material 4 not covered by the optoelectronic component 3a. The surface 8 of the optoelectronic component 3a facing away from the support 2 has no covering material 10. The electromagnetic radiation 21 generated in the active zone is preferably emitted through the surface 8 facing away from the support 2.

[0045] The top surface 5 can be a ceramic material, preferably white. Alternatively or additionally, the top surface 5 can be a laminated epoxy resin. Alternatively or additionally, the top surface 5 can have a solder mask or a thermoplastic (premold package).

[0046] The covering material 10 can be a colored silicone. Alternatively or additionally, the covering material 10 can be a colored epoxy resin, in particular solder resist. Alternatively or additionally, the covering material 10 can be a thermoplastic.

[0047] The covering material 10 is colored by titanium dioxide (TiO2) particles. The titanium dioxide particles are present in the covering material up to a proportion of approximately 70% by weight, and at least approximately 25% by weight.

[0048] The surface 5 and / or the covering material 10 are highly reflective. Their respective reflectivities are greater than 70%.

[0049] Fig. Figure 2a shows a top view of an electronic arrangement before the application of cover material 10. An optoelectronic component 3a is attached to the connection surface 6 by means of a contact material 4. The optoelectronic component 3a is implemented as a wire-contacted semiconductor chip. The contact is made via a bond pad 20 on the optoelectronic component 3a by means of a bond wire 14.

[0050] To the observer, contact material 4 is visible on all sides of the optoelectronic component 3a. Contact material 4 is also visible on the bond pad 20 of the optoelectronic component 3a. The connection surface 6 is directly visible between the areas with exposed contact material 4 and the cover surface 5. The contact material 4 and the connection surface 6 are dark in color compared to the cover surface 5 and stand out clearly from it in terms of color and brightness. This dark coloration is aesthetically displeasing to the observer of an electronic arrangement 1 with an optoelectronic component 3a in the switched-off state. In addition, the dark areas of the electronic arrangement 1 with an optoelectronic component 3a lead to undesirable absorption losses in the switched-on state. To solve both problems, or rather,To reduce the area 15 with exposed connecting surface 6 and exposed contact material 4, a covering material 10 is applied. The result is shown in . Fig. 2b can be seen.

[0051] Fig. Figure 2b shows a top view of an electronic arrangement after the application of covering material 10. Area 15 is completely covered with covering material 10. The pigments 11 in the covering material 10 and the covering material 10 itself cause the contrast between the covered area 15 and the surface 5 to disappear. Therefore, the boundary between the covered area 15 and the surface 5 is shown as a dashed line. The surface 8 of the optoelectronic component 3a facing away from the support 2 has no covering material 10.

[0052] In an embodiment not shown, the bond wire 14 is also covered with covering material 10.

[0053] Fig. Figure 3a shows an electronic arrangement in which the optoelectronic component is designed as a flip chip. The arrangement is identical to the arrangement in Figure 3a. Fig. 2a, except that in Fig. 3a the bond pad 20 and the bond wire 14 from Fig. 2a is omitted. This is made possible by the fact that the contacting of the optoelectronic component 3a takes place entirely via the back side of the optoelectronic component 3a.

[0054] Fig. Figure 3b shows an electronic arrangement in which the optoelectronic component 3a is designed as a flip chip and the exposed area between the optoelectronic component 3a and the cover surface 5 is covered. The covered area 16 is covered by the cover material 10 in such a way that an area between the luminescent semiconductor chip 3a and the cover surface 5 is created which has minimal contrast to the cover surface 5.

[0055] Fig. Figure 4 shows an electronic arrangement wherein the electronic component is a non-optoelectronic component 3b, in particular an ESD semiconductor chip and / or a microchip, for example a memory or a controller. Since the non-optoelectronic component 3b does not emit or sens any electromagnetic radiation, the entire surface 8 of the non-optoelectronic component 3b facing away from the support 2 can be covered with covering material 10. As already shown in Fig. As shown in Figure 1, even in the case of a non-optoelectronic component 3b, the side surfaces 7 and the areas with exposed contact material 4 and exposed connecting surface 6 can be covered with covering material 10. The covered area 17, when the non-optoelectronic component 3b is completely covered, results in a homogeneous color appearance and minimizes absorption losses on the side surfaces 7 and on the surface 8 of the non-optoelectronic component 3b facing away from the support 2.

[0056] Fig. Figure 5 shows an electronic arrangement in which an optoelectronic component 3a and a non-optoelectronic component 3b are arranged in close proximity to each other on a support 2. The covered area 15 of the optoelectronic component 3a and the covered area 17 when the non-optoelectronic component 3b is completely covered are identical to those in Figure 5. Fig. 1 and Fig. 4. The electronic components 3a and 3b are encapsulated with a potting material 13. Scattering centers 12 are incorporated into the potting material 13. The complete covering 17 of the non-optoelectronic component 3b and the covered area 15 of the optoelectronic component 3a reduces unwanted absorption losses. The electromagnetic radiation 21 emanating from the optoelectronic component 3a is scattered, and in particular reflected, by the scattering centers. The reflected radiation largely strikes the covered areas 15 and 17 and the cover surface 5. The covering material 10 and the cover surface 5 are designed to be highly reflective. To a greater extent, the reflected electromagnetic radiation is absorbed only by the surface 8 of the optoelectronic component 3a facing away from the support 2.

[0057] Fig. Figure 6a shows a section of an electronic arrangement in a sectional view, where the electronic component is a non-optoelectronic component 3c. In particular, the non-optoelectronic component 3c can be a passive component. A resistor, a capacitor, or an inductor can be used as a passive component. In this case, the component has an SMD package. The area 18 covered by the cover material 10 includes the areas of the connection surface 6 and the areas of the contact material 4 not covered by the passive component 3c. The contact material 4 provides the electrical and mechanical connection between the SMD solder pads 22 of the passive component 3c and the connection surfaces 6. As in the previous figures, the cover surface 5 surrounds the connection surfaces 6.The surface 8a of the passive component 3c facing away from the support 2 remains uncovered.

[0058] Fig. Figure 6b shows a top view of the section of the electronic arrangement. Fig. 6a before covering exposed areas with a covering material 10. By attaching the passive component 3c to the two connecting surfaces 6, contact material 4 is distributed beyond the boundaries of the solder pads 22. The visual appearance is very inhomogeneous.

[0059] Fig. 6c shows the arrangement from Fig. 6b, wherein in Fig. 6c the exposed areas on the connecting surface 6 and on the contact material 4 are covered with covering material 10. This results in a covered area 18. As already described in the preceding embodiments, the partial covering of exposed areas also reduces the optical contrast of passive components 3c. In the embodiment of Fig. 6c uncovered by covering material.

[0060] Fig. Figure 7a shows a section view of an electronic arrangement, with the electronic component as already shown in Fig. 6a is a passive component 3c. The contact material 4, which directly adjoins the solder pads 22, establishes an electrical and mechanical contact between the passive component 3c and the connection surfaces 6. Preferably, solder is used as the contact material 4 for this function. In addition, the contact material 4 provides a purely mechanical contact between the surface 8b of the passive component 3c facing the carrier 2 and the carrier. Preferably, an adhesive is used as the contact material 4 for this function. The covering material 10 covers the entire passive component 3c, the areas of the connection surfaces 6 covered by the contact material 4, and the exposed areas of the connection surface 6. The covering material 10 is flush with the cover surface 5. This results in a covered area 19 when the passive component 3c is completely covered.

[0061] Fig. Figure 7b shows a top view of the section of the electronic arrangement. Fig. 7a before covering exposed areas with a covering material 10. By attaching the passive component 3c to the two connecting surfaces 6, contact material 4 is distributed beyond the boundary of the solder pads 22. Between the two solder pads 22, there is a gap between the carrier 2 and the surface 8b facing the carrier 2 (see [reference]). Fig. 7a; not in Fig. (7b visible) of the passive component 3c, additional contact material 4 is provided. This additional contact material 4 protrudes laterally from under the passive component 3c. Due to the exposed areas of the connecting surfaces 6 and the contact material 4, the optical appearance is very inhomogeneous, and absorption losses occur when combined with optoelectronic components.

[0062] Fig. Figure 7c shows a top view of the section of the electronic arrangement. Fig. 7a, i.e., after covering exposed areas with a covering material 10. This results in a covered area 19 when the passive component 3c is completely covered. The contrast between the covering surface 5 and the covered area 19 is minimized; preferably, no contrast is discernible. The visual impression is very homogeneous. To indicate this, the structures of the passive component 3c lying beneath the covered area 19 are shown as dashed lines.

[0063] The electronic arrangement was described using several examples to illustrate the underlying concept. Reference symbol list 1 electronic arrangement 2 carriers 3a, 3b, 3c electronic component 3a optoelectronic component 3b, 3c non-optoelectronic component 4 Contact material 5 Cover area 6 Connection surface 7 Side surface of the electronic component 3a, 3b 8 Surface of the electronic component 3a, 3b facing away from the support 2 8a Surface of the non-optoelectronic component facing away from the support 2 3c 8b surface of the non-optoelectronic component facing the support 2 3c 10 Covering material 11 Pigment 12 Scattering center in the potting material 13 13 Potting compound 14 Bond wire 15 Covered area of ​​optoelectronic component 3a, wire-contacted 16 Covered area in optoelectronic component 3a, flip chip 17 Covered area when the non-optoelectronic component is completely covered 3b 18 Covered area when the non-optoelectronic component is partially covered 3c 19 Covered area when the non-optoelectronic component is completely covered 3c 20 Bond pad on the optoelectronic component 3a 21 Electromagnetic radiation emitted by optoelectronic component 3a 22 Solder pad (SMD contact) of the non-optoelectronic component 3c

Claims

[1] Electronic arrangement (1) with: - a carrier (2), - at least one connecting surface (6) on the support (2), - at least one optoelectronic component (3a) which is attached at least to the connecting surface (6) by means of a contact material (4), - a cover surface (5) that surrounds the connecting surface (6) on the support (2), and - at least one covered area (15, 16, 17, 18, 19) which is covered by a covering material (10), wherein - the cover surface (5) is highly reflective with a reflectivity greater than 70%, and exposed areas on the connecting surface (6) and on the contact material (4) are covered with the cover material (10), wherein the cover material (10) is colored by titanium dioxide (TiO2) particles such that the titanium dioxide particles in the cover material (10) are provided at a proportion of 25% to 70% by weight, so that the cover material (10) is highly reflective with a reflectivity greater than 70%, thereby minimizing optical contrast between the cover surface (5) and the covered area (15, 16, 17, 18, 19), wherein the difference in reflectivity between the cover surface (5) and the cover material (10) is less than 20%, - that at least one optoelectronic component (3a) is a radiation-emitting component that is encapsulated with a potting material (13) in which scattering centers (12) are introduced, and - the area covered by the covering material (15, 16, 17, 18, 19) comprises side surfaces (7) of the optoelectronic component (3a). [2] Electronic arrangement according to claim 1, wherein the connecting surface (6) comprises an electrical contact surface and / or an adhesive surface. [3] Electronic arrangement according to one of claims 1 or 2, wherein the optical contrast is a color contrast and / or a brightness contrast. [4] Electronic arrangement according to any of the preceding claims, wherein the contact material (4) comprises solder and / or an adhesive. [5] Electronic arrangement according to one of the preceding claims, wherein the optoelectronic component (3a) comprises an LED. [6] Electronic arrangement according to one of the preceding claims, which further comprises at least one non-optoelectronic component (3b, 3c), in particular an ESD semiconductor chip and / or a passive component. [7] Electronic arrangement according to claim 6, wherein the covered area (17, 19) comprises a surface (8, 8a) of the non-optoelectronic component (3b, 3c) facing away from the support (2). [8] Electronic arrangement according to one of the preceding claims, wherein the covered area (15, 16, 17, 18, 19) comprises the areas of the connecting surface (6) not covered by the optoelectronic component (3a). [9] Electronic arrangement according to one of the preceding claims, wherein the covered area (15, 16, 17, 18, 19) comprises the areas of the contact material (4) not covered by the optoelectronic component (3a). [10] Electronic arrangement according to one of the preceding claims, wherein the cover surface (5) comprises a ceramic, preferably white material and / or a laminated epoxy resin and / or solder mask. [11] Electronic arrangement according to one of the preceding claims, wherein the cover material (10) comprises a colored silicone and / or at least a colored epoxy resin, in particular solder resist, and / or thermoplastic. [12] Electronic arrangement (1) according to claim 1, wherein - the optoelectronic component (3a) is configured such that electromagnetic radiation can be emitted through a surface of the optoelectronic component (3a) facing away from the support (2), and - the surface of the optoelectronic component (3a) facing away from the support (2) has no covering material (10). [13] Electronic arrangement (1) according to claim 1, wherein - the connecting surface (6) and the contact material (4) are colored dark compared to the covering surface (5), and have areas that are not covered by the optoelectronic component (3a), and - the covered area (15) includes the areas of the contact material (4) not covered by the optoelectronic component (3a). [14] Electronic arrangement (1) with: - a carrier (2), - at least one connecting surface (6) on the support (2), - at least one optoelectronic component (3a) and at least one non-optoelectronic component (3b, 3c) which are attached at least on the connecting surface (6) by means of a contact material (4), - a cover surface (5) that surrounds the connecting surface (6) on the support (2), and - at least one covered area (15, 16, 17, 18, 19) which is covered by a covering material (10), wherein - the cover surface (5) is highly reflective with a reflectivity greater than 70%, and exposed areas on the connecting surface (6) and on the contact material (4) are covered with the cover material (10), wherein the cover material (10) is colored by titanium dioxide (TiO2) particles such that the titanium dioxide particles in the cover material (10) are provided at a proportion of 25% to 70% by weight, so that the cover material (10) is highly reflective with a reflectivity greater than 70%, thereby minimizing optical contrast between the cover surface (5) and the covered area (15, 16, 17, 18, 19), wherein the difference in reflectivity between the cover surface (5) and the cover material (10) is less than 20%, - the covered area (15, 16, 17, 18, 19) includes a surface (8, 8a) facing away from the support (2) and the side surfaces (7) of the non-optoelectronic component (3b, 3c), - the non-optoelectronic component (3b, 3c) is completely covered by the covering material (10), - that at least one optoelectronic component (3a), which is a radiation-emitting component, and at least one non-optoelectronic component (3b, 3c) are encapsulated with a potting material (13) in which scattering centers (12) are introduced, and - the area covered by the covering material (15, 16, 17, 18, 19) comprises side surfaces of the optoelectronic device (3a).

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