Circuits, methods and computer programs for detecting mechanical stress and monitoring a system

Abstract

A detection circuit (10) designed to detect a mechanical stress of a semiconductor circuit (20), the detection circuit (10) comprising: a stress monitoring module (12) designed to monitor a mechanical stress of the semiconductor circuit (20) and to provide monitoring information regarding a mechanical stress value of the semiconductor circuit (20); and an activation signal generator (14) configured to generate an activation signal comprising activation information regarding the mechanical stress value of the semiconductor circuit (20) when the monitoring information indicates that a criterion of the mechanical stress value is met by the semiconductor circuit (20), wherein the activation signal generator (14) is configured to determine information regarding a rate of change of the mechanical stress value and to generate the activation signal based on the information regarding the rate of change of the mechanical stress value.

Description

TECHNICAL FIELD

[0001] Embodiments relate to circuits, methods and computer programs designed to detect mechanical stress and monitor safety of a system. BACKGROUND

[0002] Electronic circuits and semiconductors are increasingly being used in numerous applications. At the same time, the complexity of these circuits and applications as a whole is also increasing. With the introduction of more and more electronic circuits and semiconductors in applications, safety concerns are increasing. For example, systems or applications used in mass or public transportation, as well as in motor vehicles and aircraft, are relevant to the safe operation of the respective vehicle. The safety or reliability of these systems and applications can determine the safety of their users. International organizations can define functional safety standards for electrical and electronic systems (EE systems), such as ISO 26262 (International Organization for Standardization) or IEC 61508 (International Electrotechnical Commission).One aspect found in these standards is ensuring the independence of blocks that provide redundancy or self-test functionality to achieve a security goal. For example, in the case of independent blocks executing on the same semiconductor carrier layer, coupling effects across the carrier layer can be avoided to achieve independence. Some known concepts can avoid a potential coupling effect by using separate carrier layers to achieve independence of the respective blocks.

[0003] A well-known concept attempts to avoid stress on the blocks or semiconductors involved. Special packages or housings can be used to avoid stress. A stress-resistant housing can significantly increase costs compared to standard packages. Another well-known concept is stress compensation, which is applied, for example, to Hall sensors or bandgap references. Here, stress-induced signals can be measured, and the output of a stress-sensitive circuit can be corrected depending on this measurement. Efforts, for example, in terms of measuring circuits and stress sensors, can generate additional costs. In some applications, high accuracy of measurements can be used, and correction can be limited to a normal operating range of the particular circuit or semiconductor where measurements are taken and compensated.If a defined operating range is significantly exceeded, the precise stress compensation of the measuring circuit may fail and lead to incorrect calculations, disadvantages or possible harmful effects.

[0004] From US 5 723 875 A an integrated semiconductor circuit is known which has a chip test circuit for detecting cracks and other defects in the chip during operation.

[0005] DE 103 39 939 A1 discloses an integrated circuit arrangement on a semiconductor substrate. The circuit arrangement comprises an integrated circuit and a stress-sensitive structure on the semiconductor substrate. SUMMARY

[0006] There is a need to provide an improved concept for a sensing circuit, a safety monitoring circuit, and a method for sensing mechanical stress.

[0007] Such a need can be met by the subject matter of the claims.

[0008] Embodiments provide a detection circuit configured to detect mechanical stress of a semiconductor circuit. The detection circuit includes a stress monitoring module configured to monitor mechanical stress of the semiconductor circuit. The stress monitoring module is further configured to provide monitoring information related to a mechanical stress value of the semiconductor circuit.

[0009] The detection circuit further comprises an activation signal generator configured to generate an activation signal. The activation signal comprises activation information relating to the mechanical stress value of the semiconductor circuit when the monitoring information indicates that the mechanical stress value criterion is met by the semiconductor circuit. Embodiments of the detection circuit provide the activation signal, which may, for example, indicate that the mechanical stress value of the semiconductor exceeds a certain value. The activation signal can therefore be viewed as a warning signal, based on which further safety measures can be implemented.In some embodiments, the activation signal may be used to trigger safety measures, such as turning off components, reducing the power of some components, transferring the semiconductor or a system to a safe state, resetting components, etc.

[0010] In some embodiments, the mechanical stress value criterion may correspond to an exceedance of a stress safety criterion, and the activation signal may include information related to a warning that the stress safety criterion has been exceeded. In some embodiments, the sensing circuit may monitor the stress through at least one resistance or piezoresistance measurement on the semiconductor circuit. To maintain a certain stress safety criterion, which may be defined, for example, by a standard or other system parameters, the measured mechanical stress must not exceed a certain value. If the stress value is exceeded, the stress safety criterion may be considered critical, and the activation signal may be provided.

[0011] In further embodiments, the change in the mechanical stress value or a rate of change of the mechanical stress value can be monitored. The criterion of the mechanical stress value can then correspond to a specific change or rate of change of the stress value that must not be exceeded. For example, certain rates of change of the mechanical stress value can indicate a mechanical failure or fracture of the semiconductor or its carrier layer. Such a change or rate of change of the stress value can be monitored, and when detected, the activation signal can be provided.In some embodiments, the activation signal generator may be configured to generate the activation signal when a mechanical failure of the semiconductor is detected due to a rate of change of the mechanical stress value that exceeds a criterion for the rate of change of the mechanical stress value. Some embodiments may therefore be capable of applying safety measures when a semiconductor breaks or experiences a mechanical failure.

[0012] Embodiments further provide a safety monitoring circuit configured to monitor a system. The safety monitoring circuit includes the detection circuit described above. The safety monitoring circuit further includes a control module configured to receive the activation signal from the activation signal generator and to apply a safety measure to the system when the activation signal is received. Embodiments may provide control over the system so that a failure of a semiconductor in the system may be detected and appropriate safety measures may be applied to the system, for example, to components external to the semiconductor circuit. Embodiments may enable maintenance of a stress safety criterion of the system based on the activation signal.

[0013] In embodiments, the safety measures may correspond to at least a partial shutdown of the system or the semiconductor, a shutdown of power components or drivers for power components, a transition of the system or at least parts thereof into a safety state, etc. In some embodiments, the control module may be designed to transition the semiconductor circuit or the system from a normal operating state to a safe operating state when the activation signal is received. The safe operating state is a state in which the consequences of a failure of the semiconductor circuit are reduced compared to the normal operating state. This means that if the semiconductor circuit fails in the normal operating state, the consequences, for example, for the system, its components, or for a user of the system, may be more severe than in the safe operating state.

[0014] In some embodiments, the safety monitoring circuit may be mounted in a vehicle. The system may include multiple circuits in the vehicle. The control module may be designed to apply a safety measure to at least one circuit of the system when the activation signal is received. Several safety-relevant circuits may be present in a vehicle, and a failure of one circuit may have consequences for the overall safety of the vehicle. In some embodiments, excessive mechanical stress on the semiconductor may lead to the application of a safety measure to other circuits. A stress safety criterion of the vehicle may therefore be maintained while taking into account a possible failure of the semiconductor. For example, a control unit of a vehicle may switch the vehicle into a safety mode, e.g.with a reduced maximum speed, illumination of a warning light, etc., if the activation signal indicates excessive mechanical stress, for example on a brake control semiconductor circuit.

[0015] Embodiments further provide a method for detecting mechanical stress of a semiconductor circuit. The method includes monitoring mechanical stress of the semiconductor circuit and providing monitoring information regarding a mechanical stress value of the semiconductor circuit. The method further includes generating an activation signal that includes activation information regarding the mechanical stress value of the semiconductor circuit when the monitoring information indicates that the mechanical stress value criterion is met by the semiconductor circuit.

[0016] Embodiments may further provide a computer program or a computer program product for performing any of the methods described above when the computer program is executed on a computer, a processor, or programmable hardware. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Some embodiments of devices and / or methods and / or computer programs and / or computer program products are described below only by way of example and with reference to the accompanying figures, of which Fig. 1 shows an embodiment of a detection circuit. Fig. 2 shows an embodiment of a safety monitoring circuit. Fig. 3 shows a block diagram of a flow chart of an embodiment of a method for detecting mechanical stress. DETAILED DESCRIPTION OF THE DRAWINGS

[0018] Various exemplary embodiments will now be described in more detail with reference to the accompanying drawings, in which some exemplary embodiments are illustrated. In the figures, the thicknesses of lines, layers, and / or regions may be exaggerated for clarity.

[0019] Thus, embodiments are illustrated by way of example in the figures and will be described in detail herein, although the exemplary embodiments are susceptible to various modifications and alternative forms. It should be understood, however, that there is no intention to limit the exemplary embodiments to the particular forms disclosed; on the contrary, the exemplary embodiments are intended to cover all modifications, equivalents, and alternatives falling within the scope of the disclosure. Like reference numerals refer to like or similar elements throughout the description of the figures.

[0020] It is clear that when an element is described as being "connected" or "coupled" to another element, it may be directly connected or coupled to the other element, or there may be intervening elements. Conversely, when an element is described as being "directly connected" or "directly coupled" to another element, there are no intervening elements. Other words used to describe the relationship between elements should be understood in a similar way (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.).

[0021] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms "a," "an," and "another" are intended to include the plural forms unless the context clearly dictates otherwise. Further, it is to be understood that the terms "comprises," "comprising," "having," and / or "comprising," when used herein, indicate the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more features, integers, steps, operations, elements, and / or components and / or groups thereof.

[0022] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as one of ordinary skill in the art to which the exemplary embodiments belong. It is further understood that terms, e.g., those defined in commonly used dictionaries, should be understood in a meaning consistent with their meaning in the context of the relevant technology and should not be understood in an idealized or overly formal sense unless expressly defined as such herein.

[0023] Fig. 1 shows an embodiment of a sensing circuit 10 configured to detect mechanical stress on semiconductor circuit 20. The sensing circuit 10 includes a stress monitor 12 configured to monitor mechanical stress on semiconductor circuit 20. The stress monitoring module 12 is further configured to provide monitoring information regarding a mechanical stress value on semiconductor circuit 20. The stress monitoring module 12 may correspond to any means for monitoring a stress value, e.g., it may receive a measurement signal from a stress sensor or may comprise a stress sensor.

[0024] The detection circuit 10 further includes an activation signal generator 14 coupled to the stress monitor 12. The activation signal generator 14 may correspond to a means for generating the activation signal, which may be digital or analog. The activation signal generator 14 is configured to generate an activation signal comprising activation information regarding the mechanical stress value of the semiconductor circuit 20 when the monitoring information indicates that the mechanical stress value criterion is met by the semiconductor circuit 20.

[0025] In the embodiment shown in Fig. 1, and also in the following embodiments, the semiconductor circuit 20 can correspond to any chip or carrier layer. The activation signal can be used to initiate safety measures, for example, deactivating outputs or generating warning signals in the event that the stress on the semiconductor circuit 20 exceeds normal operating conditions. In other words, the activation signal generated by the activation signal generator 14 can be configured to trigger activation of a safety measure. In the embodiments, the stress monitoring module 12 can include a mechanical stress sensor coupled to the semiconductor circuit 20.The stress monitoring module 12 can be configured to provide monitoring information regarding the mechanical stress value of the semiconductor circuit 20 based on at least one resistance or piezoresistance measurement on the semiconductor circuit 20. It can also perform multiple piezoresistance measurements of resistance elements with different orientations relative to the silicon crystal or measurements of resistance elements with different doping types or concentrations. The multiple measurements can be used to monitor multiple safety criteria regarding different directions or types of stress (e.g., linear or shear stress) or can be combined to create an overall stress monitoring criterion.

[0026] In other embodiments, multiple stress sensors may be distributed across the chip. They may be located at locations known to be subject to high stress levels, such as chip corners. In other embodiments, the stress sensor locations may be chosen based on knowledge of potential stress sources, such as near power devices that may excessively heat their surroundings in the event of an overload. In further embodiments, multiple stress sensors may be located near components known to be sensitive to mechanical stress, such as Hall plates or bipolar transistors used in temperature sensors or bandgap references. The safety criterion for generating the activation signal may be generated based on one or a different combination of the multiple stress measurements.

[0027] Further embodiments may reuse stress sensors already integrated on the silicon chip, e.g., the stress compensation sensor used to compensate for the stress dependence of a Hall plate, and additionally pass its information to the activation signal generator as well as to the compensation electronics.

[0028] In other words, in embodiments, the stress monitoring module 12 may be used to determine information about mechanical stress on the surfaces of the semiconductor circuit 20. For example, the mechanical stress may correspond to forces acting on the surfaces of the semiconductor circuit 20 that result in stress. In embodiments, the stress may be determined in multiple components, such as normal components and shear components. In some embodiments, the stress in the material may be the derivative of the force with respect to the area at a particular point in the material. For example, applied stress forces may result in deformations of the material of the semiconductor circuit 20. In some embodiments, the stress monitoring module 12 may result in determining a relative change in a dimension or geometry of the semiconductor circuit 20 under stress.Some embodiments may utilize known material properties and laws, such as the Poisson's ratio. For example, the Poisson's ratio may link height and width to an increase in length of the respective semiconductor circuit material.

[0029] In other words, under shear stress, the geometry of the semiconductor material may change. For example, a shear angle can be considered the deviation of the angle between the edges from rectangular shapes, i.e., from an angle π / 2. Furthermore, Hooke's law describes the relationship between stress and strain or shear for an elastic region. As mentioned previously, Hooke's law can also be used to determine multidimensional deformations of a body under stress, for example, by determining strain and shear angles. In some embodiments, a strain gauge can be used to measure or determine a change in the geometry of the semiconductor circuit 20.For example, the strain gauge may be integrated into or coupled to the semiconductor circuit 20, so that a change in the gauge's geometry also changes its resistance due to the applied stress. This may result in a relationship in which its resistance increases with applied tensile stress. In some embodiments, metal films may be used as resistive elements for these strain gauges.

[0030] In further embodiments, piezoresistivity may be used to determine a mechanical stress of the semiconductor circuit 20. For some materials, a strain factor may turn out to be significantly higher than expected from a mechanical shape variation, which may be due to piezoresistivity. Piezoresistivity describes the dependence of a specific resistance on the applied stress. Such an effect may occur in monocrystalline material, e.g., silicon or germanium, as may be used for the semiconductor circuit 20. Piezoresistivity may be measured along multiple dimensions, for example, with three Cartesian dimensions. Piezoresistivity may be described with a fourth-order tensor related to two second-order tensors.In other words, in embodiments, the piezoresistivity can be used to determine the mechanical stress of the semiconductor circuit 20, and multiple dimensions can be used, such as axial stress, orthogonal stress, and shear stress. The piezoresistivity of the semiconductor circuit 20 can depend on the doping type and doping density of its support layer. Furthermore, in some embodiments, the directions of the piezoresistivity can depend on a direction relative to the crystal orientation. Different wafer materials can have different orientations with respect to the surface, and thus the same arrangement of piezoresistive elements can result in different sensitivities in these directions. In embodiments, resistance measurements can be performed along different spatial dimensions of a support layer of the semiconductor circuit 20.For example, in some embodiments, at least two different spatial dimensions may be used for resistance measurements. This means that measured resistance elements, whether implanted into the carrier layer or a carrier layer themselves, may have spatially spaced contacts on the semiconductor surface 20, with the direction from one contact to others oriented in the at least two different spatial dimensions.

[0031] In some embodiments, the mechanical stress value criterion may correspond to an exceedance of a stress safety criterion. For example, stress safety criteria may be defined in terms of a certain range of mechanical stress that is acceptable without violating the safety integrity of the semiconductor circuit 20 or a system including the semiconductor circuit 20. Furthermore, threshold values ​​or stress safety criteria that separate acceptable mechanical stress values ​​from unacceptable mechanical stress values ​​may be defined. In some embodiments, the activation signal may include information regarding a warning, such as that a stress safety criterion has been exceeded. The activation signal may then serve to trigger safety measures, as described in detail below.

[0032] In further embodiments, the activation signal generator 14 can be configured to determine information regarding a change in the mechanical stress value. This means that some embodiments can respond to changes in the stress value, and thus the stress value criterion can be defined as a maximum change in the stress value relating to a specific period or time span. The activation signal generator 14 can then be configured to generate the activation signal based on the information regarding the change in the stress value. In further embodiments, the activation signal generator 14 can be configured to determine information regarding a rate of change of the mechanical stress value, which corresponds to a time derivative of the stress value or a change in the stress value per unit time of the stress value.For example, the rate of change of the stress value may be high when sudden changes in the stress value occur. The activation signal generator 14 may then be configured to generate the activation signal based on the information regarding the rate of change of the mechanical stress value. Furthermore, in some embodiments, the activation signal generator 14 may be configured to generate the activation signal when a mechanical failure of the semiconductor is detected because a rate of change of the mechanical stress value exceeds a rate of change criterion of the mechanical stress value. That is, in some embodiments, the stress value criterion may correspond to a rate of change criterion of the stress value.When a substrate layer of a semiconductor circuit 20 breaks, cracks or fractures occur and there may be a peak or step in the corresponding rate of change of the stress value.

[0033] In other embodiments, the stress monitor and the activation signal generator may be located on different semiconductors. In such embodiments, the stress monitor could be a piezoresistive sensor located on a power semiconductor and providing an analog output signal to another semiconductor, e.g., a microcontroller, which reads the analog signal via its analog-to-digital converter. In this type of embodiment, the activation signal generator could be part of the control software. In other embodiments, the activation signal generator could be part of the same semiconductor as the stress monitor and could generate a "Chip OK" signal or a code or code sequence that is emitted at defined time intervals to ensure that an activation signal is detected, as well as whether the activation signal generator is malfunctioning due to an overload situation.

[0034] Fig. 2 illustrates one embodiment of a security monitoring circuit 100. The security monitoring circuit is configured to monitor a system. The security monitoring circuit includes a detection circuit 10 as described above. Furthermore, the security monitoring circuit 100 includes a control module 110 configured to receive the activation signal from the activation signal generator 14 of the detection circuit 10. The control module 110 is further configured to apply a security measure to the system when the activation signal is received. The control module 110 may correspond to any means for controlling, e.g., a processing unit, any type of processor, programmable hardware, etc.

[0035] In some embodiments, a measurement of at least one of the relevant stress components, for example, three linear and three shear stress directions, may be performed by the sensing circuit 10. The activation signal generator 14 may be configured to compare these stress values ​​with corresponding tolerance values. If this tolerance value is exceeded, this may lead to the initiation of the safety measure by the safety monitoring circuit 100, which may be defined depending on the respective application. In some embodiments, the stress measurements may be extended to several, for example, up to three, stress components, describing a complete stress state of the silicon chip of the semiconductor circuit 20 with dimensions as described above.The measured stress components can be evaluated separately or they can be combined, for example, through a mathematical equation. In some embodiments, measurements can be extended to detect unacceptable changes in stress, indicating that an unacceptable change in operating conditions has occurred. Reasons could be massive stress from the application environment due to mechanical damage or from internal stress sources, such as temperature expansion due to electrical noise. In embodiments, possible safety measures initiated can include, for example, transitioning the system to a safe state, for example, by switching off output drivers or resetting the entire chip or semiconductor circuit 20. Another possible safety measure would be reporting a fault to a higher-level authority.

[0036] In accordance with the foregoing, the safety monitoring circuit 100 or the control module 110 contained therein may be configured to maintain a stress safety criterion of the system based on the activation signal. This means that the control module 110 is configured to trigger or execute certain actions upon receipt of the activation signal. Some embodiments may be divided into two groups, wherein in the first group, such safety measures may be performed on the chip or a semiconductor circuit itself, such as the deactivation of certain interfaces or connection points. In the second group, safety measures are performed outside the chip or semiconductor circuit 20 on other components or units of the system.

[0037] The system may, for example, be an automotive system, i.e., it may comprise multiple semiconductors implemented in or on a vehicle, such as a car, a van, a truck, etc. In other applications, the system may correspond to a semiconductor system implemented in an aircraft, a train, etc. Other systems may include semiconductor circuits in power plants, computers or computer systems, communication systems, etc. In some embodiments, the control module 110 is configured to at least partially switch the system or semiconductor circuit 20 when the activation signal is received. This means that the safety measure may be triggered by the activation signal. The activation signal may comprise measurement results or may comprise an instruction, which, at least in some embodiments, may be represented by a single bit.A single bit can be used to indicate to the control module 110 that the stress value criterion is met on the semiconductor circuit 20. The activation signal can therefore be considered a warning signal.

[0038] In accordance with general system definitions, the physical signal corresponding to the activation signal may be defined by one or more protocols. In some implementations or applications, the activation signal may correspond to a certain error code indicating that the mechanical stress value criterion on the semiconductor circuit 20 has been met. In some embodiments, the safety measure is applied to the semiconductor circuit 20 itself. For example, power components of the semiconductor circuit may be turned off. In another embodiment, a driver for another power component may be turned off.That is, in some embodiments, the actual safety action may be triggered by the detection circuit 10 on the safety monitoring circuit 100 based on the mechanical stress on the semiconductor circuit 20, but executed outside of the semiconductor circuit 20.

[0039] In further embodiments, the control module 110 may be configured to reset the semiconductor circuit 20 or at least one component of the system when the activation signal is received. In other words, another safety measure is a reset or restart of a component such as the semiconductor circuit 20 or another system component. Other safety measures could include ignoring a sensor signal, for example, from a sensor that measures mechanical stress, and considering another sensor signal from another sensor that can also detect the mechanical stress value of the semiconductor circuit 20. Another safety measure may be interpreting the activation signal as a warning signal for other units or even a user, for example, the driver of a vehicle.Particularly when the system is considered in a vehicle, other functionalities in the vehicle can also be deactivated upon receipt of the activation signal. In further embodiments, driver assistance systems, e.g., an automatic steering function, can be activated or their settings modified upon receipt of the activation signal. This means that, in some embodiments, upon receipt of the activation signal, a warning can be initiated, for example, a warning signal to a driver or a user of the system.

[0040] In a further embodiment, the control module 110 is configured to transition the semiconductor circuit 20 or the system from a normal operating state to a safe operating state upon receipt of the activation signal. The safe operating state is a state in which the consequences of a failure of the semiconductor circuit 20 are reduced compared to the normal operating state. The change of state can be triggered at the semiconductor circuit 20 itself or at another point in the system. In the case of a sensor, for example, i.e., the semiconductor circuit 20 corresponds to a sensor that detects a physical quantity, the activation signal can prevent further use of the sensor signal in the system.Another safety measure would be to inform relevant system components about the faulty sensor, for example, by using a corresponding error code or suppressing the transmission of a "Sensor OK" code. In some embodiments, the safe state or safe operating state may be a system-level state and may depend on the specific system. In other words, it may correspond to different states in different systems. For example, if actuators or actuators are monitored, the respective actuator or actuator may be deactivated upon receipt of the activation signal.

[0041] A safety measure can also be referred to as a fail-silent measure, since in the event of a failure, the respective component is rendered silent. In other embodiments, sensor signals can be ignored, and redundant sensors can be used for which the mechanical stress value criterion has not been met. Such embodiments can be referred to as fail-operational (when the system specification is still met) or fail-degraded (when some specification parameters are relaxed) safety measures. The redundant sensors can be identical or different devices located at a level above the silicon reporting the overload.In other embodiments, the redundant sensor information could be provided by sensors in other regions of the same silicon chip for which the mechanical stress is still within an acceptable range. The control module 110 can then switch to the safe operating state, which can also be an emergency state, and missing information can also be estimated based on other sources. For example, in some embodiments, if a crankshaft sensor fails, an emergency program of a control unit can be started using already known data from a camshaft sensor. Furthermore, in some embodiments, an emergency signal such as an emergency light in a dashboard or cockpit can be activated.

[0042] In further embodiments, the control module 110 may be configured to control at least one additional semiconductor circuit. The control module 110 may further be configured to apply a safety measure to the at least one additional semiconductor circuit when the activation signal is received. For example, in some embodiments, an actuator, such as a driver for an airbag firing tablet, may be monitored. In this case, the safe operating state may be activated by interrupting a current path to the respective actuator. In other words, a switch in a current path or branch may be opened. If a failure is detected, unintentional airbag firing may then be prevented. In general, an error code may be sent to other components of the system so that further system-wide safety measures can be taken.In some embodiments, only an error code may be reported or sent by the system. Then, other components can be warned that the mechanical stress situation on the respective semiconductor circuit 20 was deemed excessive.

[0043] Furthermore, it can be considered that further failures may also affect certain shutdown procedures. Furthermore, in some embodiments, essential functions may not be shut down in order to reduce the stress on the component. For example, in a car in an emergency mode, the maximum speed can be reduced using a control unit. By reducing the maximum speed, mechanical stress in the sense of shocks, distortion, and temperature can be reduced, and an emergency mode of the semiconductor circuit 20 can be enabled. Such safety measures can be applied to functions with low automotive safety integrity levels (ASIL), such as switching a power window to a mode in which the window can only be closed or opened very slowly and thus with reduced maximum force.In further embodiments, the system may include multiple circuits in a vehicle, and the control module 110 may be configured to apply a safety measure to at least one circuit of the system when the activation signal is received.

[0044] Fig.3 shows a block diagram of a flow chart of an embodiment of a method for detecting a mechanical stress of a semiconductor circuit 20. The method comprises monitoring 32 a mechanical stress of the semiconductor circuit 20. The method further comprises providing 34 monitoring information regarding a mechanical stress value of the semiconductor circuit 20. The method further comprises generating 36 an activation signal comprising activation information regarding the mechanical stress value of the semiconductor circuit 20 when the monitoring information indicates that the criterion of the mechanical stress value is met by the semiconductor circuit 20.

[0045] In further embodiments, the method for monitoring a system may be configured in accordance with the above description. The system includes semiconductor circuit 20. The method may then further include receiving the activation signal and applying a security measure to the system when the activation signal is received.

[0046] Embodiments further provide a computer program or a computer program product comprising a computer program for performing one or more of the methods described above when a computer program is executed on a computer, processor, or software-programmable hardware.

[0047] One skilled in the art would readily recognize that steps of the various methods described above may be performed by programmed computers. Some embodiments herein are also intended to cover program storage devices, e.g., digital data storage media that are machine- or computer-readable and encode machine-executable or computer-executable instruction programs, the instructions performing some or all of the acts of the methods described above. The program storage devices may be, e.g., digital memories, magnetic storage media such as magnetic disks and magnetic tapes, hard disk drives, or optically readable digital data storage media.The embodiments are also intended to cover computers programmed to perform the acts of the methods described above, or (field) programmable logic arrays ((F)PLAs) or (field) programmable gate arrays ((F)PGAs) programmed to perform the acts of the methods described above.

[0048] The description and drawings merely illustrate the principles of the disclosure. It is thus understood that those skilled in the art will be able to devise various arrangements that, even if not expressly described and shown herein, embody the principles of the disclosure and are within its spirit and scope. Furthermore, all examples provided herein are expressly intended for educational purposes to enable the reader to better understand the principles of the disclosure and the concepts the inventor(s) contribute to further developing, and are not to be construed as limiting the reader to such particularly recited examples and conditions. Furthermore, all statements herein concerning principles, aspects, and embodiments of the disclosure, as well as specific examples thereof, are intended to include equivalents thereof.

[0049] Functional blocks described as "means for..." (performing a specific function) are to be understood as functional blocks that comprise a circuit designed to perform a specific function. Thus, a "means for something" can also be understood as a "means designed or suitable for something." A means designed to perform a certain function does not necessarily mean that such a means will perform that function (at a specific time).

[0050] Functions of various elements illustrated in the figures, including functional blocks labeled "means," "means for monitoring," "means for generating," "means for controlling," etc., may be provided through the use of dedicated hardware such as "a monitor," "a generator," "a controller," etc., as well as hardware capable of executing software in conjunction with appropriate software. Furthermore, any entity described herein as "means" may correspond to or be embodied as "one or more modules," "one or more devices," "one or more units," etc. When provided by a processor, the functions may be provided by a single dedicated processor, a single shared processor, or multiple individual processors, some of which may be shared.Furthermore, the explicit use of the term "processor" or "controller" should not be understood to refer exclusively to hardware capable of executing software, and may implicitly include, without limitation, digital signal processor (DSP) hardware, a network processor, an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), read-only memory (ROM) for storing software, random-access memory (RAM), and non-volatile memory. Other hardware, conventional and / or custom, may also be included.

[0051] It should be understood by those skilled in the art that all block diagrams herein depict views of exemplary circuits embodying the principles of the disclosure. It is also understood that all flowcharts, sequence diagrams, state transition diagrams, pseudocode, and the like depict various processes substantially embodied in a computer-readable medium and thus executed by a computer or processor, whether or not such a computer or processor is explicitly depicted.

[0052] Further, the following claims are hereby incorporated into the detailed description, each claim may stand on its own as a separate embodiment. While each claim may stand on its own as a separate embodiment, it is understood that although a dependent claim in the claims may refer to a specific combination with one or more other claims, other embodiments may also include a combination of the dependent claim with the subject matter of any other dependent or independent claim. Such combinations are suggested herein unless it is stated that a specific combination is not intended. Furthermore, features of one claim are also intended to be included in another independent claim, even if that claim is not directly dependent on the independent claim.

[0053] It is further noted that methods disclosed in the description or in the claims may be implemented by an apparatus having means for performing each of the respective operations of those methods.

[0054] Furthermore, it is to be understood that the disclosure of multiple acts or functions disclosed in the description or claims should not be construed as occurring in the specific order. Therefore, the disclosure of multiple acts or functions does not limit them to a particular order unless such acts or functions are not interchangeable for technical reasons. Furthermore, in some embodiments, a single act may include or be divided into multiple sub-acts. Such sub-acts may be included in or form a part of the disclosure of that single act unless expressly excluded.

Claims

[1] A detection circuit (10) designed to detect a mechanical stress of a semiconductor circuit (20), the detection circuit (10) comprising: a stress monitoring module (12) designed to monitor a mechanical stress of the semiconductor circuit (20) and to provide monitoring information regarding a mechanical stress value of the semiconductor circuit (20); and an activation signal generator (14) configured to generate an activation signal comprising activation information regarding the mechanical stress value of the semiconductor circuit (20) when the monitoring information indicates that a criterion of the mechanical stress value is met by the semiconductor circuit (20), wherein the activation signal generator (14) is configured to determine information regarding a rate of change of the mechanical stress value and to generate the activation signal based on the information regarding the rate of change of the mechanical stress value. [2] The sensing circuit (10) of claim 1, wherein the stress monitoring module (12) comprises a mechanical stress sensor coupled to the semiconductor circuit (20), and wherein the stress monitoring module (12) is configured to provide the monitoring information regarding the mechanical stress value of the semiconductor circuit (20) based on at least one resistance or piezo resistance measurement on the semiconductor circuit (20). [3] Detection circuit (10) according to claim 2, wherein the resistance measurement is carried out along at least two different spatial dimensions of a carrier layer of the semiconductor circuit (20). [4] Detection circuit (10) according to one of the preceding claims, wherein the criterion of the mechanical stress value corresponds to an exceeding of a stress safety criterion and wherein the activation signal comprises information relating to a warning that the stress safety criterion has been exceeded. [5] Detection circuit (10) according to one of the preceding claims, wherein the activation signal generator (14) is designed to determine information regarding a change in the mechanical stress value and to generate the activation signal based on the information regarding the change in the stress value. [6] The detection circuit (10) of any preceding claim, wherein the activation signal generator (14) is configured to generate the activation signal when a mechanical failure of the semiconductor is detected based on a rate of change of the mechanical stress value that exceeds a rate of change criterion of the mechanical stress value. [7] Detection circuit (10) according to one of the preceding claims, wherein the activation signal generated by the activation signal generator (14) is designed to cause activation of a security measure. [8] A security monitoring circuit (100) designed to monitor a system, comprising: the detection circuit (10) according to any one of the preceding claims; and a control module (110) configured to receive the activation signal from the activation signal generator (14) and to apply a security measure to the system when the activation signal is received. [9] The safety monitoring circuit (100) of claim 8, wherein the control module is configured to maintain a stress safety criterion of the system based on the activation signal. [10] The security monitoring circuit (100) of claim 8 or 9, wherein the control module is configured to at least partially shut down the system or the semiconductor circuit (20) when the activation signal is received. [11] The safety monitoring circuit (100) of any one of claims 8 to 10, wherein the control module is configured to turn off a power component or a driver of a power component of the system when the activation signal is received. [12] Security monitoring circuit (100) according to one of claims 8 to 11, wherein the control module is designed to reset the semiconductor circuit (20) or at least one component of the system when the activation signal is received. [13] Safety monitoring circuit (100) according to one of claims 8 to 12, wherein the control module is designed to transfer the semiconductor circuit (20) or the system from a normal operating state to a safe operating state when the activation signal is received, the safe state being a state in which consequences of a failure of the semiconductor circuit (20) are reduced compared to the normal operating state. [14] The security monitoring circuit (100) of any one of claims 8 to 13, wherein the control module is configured to control at least one additional semiconductor circuit (20), and wherein the control module is configured to apply a security measure to the at least one additional semiconductor circuit (20) when the activation signal is received. [15] The security monitoring circuit (100) of any one of claims 8 to 14, wherein the system comprises a plurality of circuits in a vehicle, and wherein the control module is configured to apply a security measure to at least one circuit of the system when the activation signal is received. [16] A method for detecting a mechanical stress of a semiconductor circuit (20), the method comprising: Monitoring (32) a mechanical stress on the semiconductor circuit (20); Providing (34) monitoring information regarding a mechanical stress value of the semiconductor circuit (20), wherein the information is determined regarding a rate of change of the mechanical stress value; and Generating (36) an activation signal comprising activation information regarding the mechanical stress value of the semiconductor circuit (20) when the monitoring information indicates that a criterion of the mechanical stress value is met by the semiconductor circuit (20), wherein the activation signal is generated based on the information regarding the rate of change of the mechanical stress value. [17] The method of claim 16, configured to monitor a system including the semiconductor circuit (20), the method further comprising: Receiving the activation signal; and Apply a security measure to the system when the activation signal is received.

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