REDUNDANT SWITCHING DEVICE

Abstract

Redundant switching device with a first system circuit (L1) and a second system circuit (L2) of identical function in order to design the function redundantly, wherein the redundant switching device comprises: - a substrate (30, 310, 320) which is divided into a first region (A1) in which at least a part of the first system circuit (L1) is provided, and a second region (A2) in which at least a part of the second system circuit (L2) is provided, and has a surface, wherein both the first region (A1) and the second region (A2) have a printed wiring (P12, P13, P22, P23, P181, P182, P191, P192); - a first mounting component (IC1, MOS1) included in the first system circuit (L1), having three or more pins and being surface-mounted on one surface of the substrate (30, 310, 320); and - a second assembly component (IC2, MOS2) which is included in the second system circuit (L2), has an identical number of pins as the first assembly component (IC1, MOS1) and has an identical function as the first assembly component (IC1, MOS1) and is surface-mounted on one surface of the substrate (30, 310, 320), wherein - a placement of numbers assigned to the respective pins of the first assembly component (IC1, MOS1) according to function is defined as a first pin placement with respect to a center point (C1) of the first assembly component (IC1, MOS1); - a placement of numbers assigned to the respective pins of the second assembly component (IC2, MOS2) according to function is defined as a second pin placement with respect to a center point (C2) of the second assembly component (IC2, MOS2); - the second pin placement is a mirror image of the first pin placement; - the first system circuit (L1) and the second system circuit (L2) control the supply of electrical energy to a motor (80) having a rotating shaft (870); - the first system circuit (L1) and the second system circuit (L2) each comprise a power conversion circuit (120, 220) which converts a supplied electrical energy to output the converted electrical energy to the motor (80); - the first system circuit (L1) and the second system circuit (L2) each have a control circuit (170, 270, 176, 276) that controls an operation of the energy conversion circuit (120, 220); and - the first assembly component (IC1, MOS1) and the second assembly component (IC2, MOS2) each comprise an integrated circuit component (IC1, IC2) which is contained in the control circuit (170, 270, 176, 276).

Description

[0001] The present disclosure relates to a redundant switching device having a redundant function.

[0002] JP 2017-191093 A discloses a redundant switching device in which functional redundancy is realized by providing a first system circuit (hereinafter also referred to as a first system circuit) and a second system circuit (hereinafter also referred to as a second system circuit) with the same function. In the above device, the first system circuit and the second system circuit each comprise a microcomputer with the same function.

[0003] In a conventional configuration, a first mounting component such as a microcomputer included in the first system circuit and a second mounting component such as a microcomputer included in the second system circuit may be mounted on a single common substrate. Moreover, the above substrate may be divided into a first region in which the first mounting component (mounting component) is provided and a second region in which the second mounting component is provided. In this case, it may be ideal that a printed wiring pattern formed in the first region and a printed wiring pattern formed in the second region have an identical wiring length and an identical width.This is because an impedance of the printed wiring and a noise emitted by the printed wiring can be made identical between the two systems.

[0004] If the impedance varies between the two systems, the amount of heat generated in the printed wiring may be different between the two systems, and a heat radiation design appropriate for a system with a larger amount of heat generation may be required. If the emission noise level varies between the two systems, a noise countermeasure appropriate for a system with a higher noise level may be required.

[0005] DE 10 2011 056 920 A1 further discloses a controller for controlling an electric motor, in which both a first and a second inverter circuit in different power supply lines supply power to an electric motor. A custom IC has a first pre-driver circuit for outputting control signals to the first inverter circuit and a second pre-driver circuit for outputting control signals to the second inverter circuit. A microcomputer for outputting operating signals to the first and second pre-driver circuits is mounted on a control circuit board along a center line. A distance between the center line and the first inverter circuit and a distance between the center line and the second inverter circuit are equal to each other.First and second output terminals of the microcomputer and first and second input and output terminals of the custom IC are symmetrical with respect to the center line.

[0006] US 2016 / 0 362 127 A1 relates to an electronic control unit that controls the drive of an electric motor, an electric power steering device that uses the electronic control unit, and a vehicle equipped with the electric power steering device. A drive device and an electric power steering device having the drive device are further disclosed in DE 10 2015 214 463 A1.

[0007] It is an object of the present disclosure to provide a redundant switching device capable of reducing variations in the shape and size of printed wiring in both systems.

[0008] The problem is solved by the subject matter of the independent claims. Advantageous further developments are specified in the dependent claims.

[0009] According to the invention, the pattern of printed wiring connected to each pin of the first mounting component is referred to as a first pattern. The pattern of printed wiring connected to each pin of the second mounting component is referred to as a second pattern.

[0010] In the device according to a first aspect, pin placement between the second mounting component and the first mounting component is mirror-inverted. For this reason, the first pattern and the second pattern can be easily designed to have a shape and size that are mirror-inverted with respect to a boundary line between the first region and the second region as an axis of symmetry. Therefore, variation in impedance in both patterns and variation in noise level in both patterns can be reduced. For this reason, optimization of a heat radiation design and noise countermeasures can be promoted.

[0011] In the device according to a second aspect, the second mounting component and the first mounting component have the same pin placement, and a first mounting direction and a second mounting direction are different from each other. For this reason, the first pattern and the second pattern can be easily designed to have a shape and size that are mirror-inverted with respect to a boundary line between the first region and the second region as an axis of symmetry. Therefore, a variation in impedance in both patterns and a variation in noise level in both patterns can be reduced. For this reason, optimization of a heat radiation design and a noise countermeasure can be promoted.

[0012] Objects, features, and advantages of the present disclosure will become more apparent from the following detailed description with reference to the accompanying drawings. In the drawings: Fig. 1 is a schematic diagram of a configuration illustrating a steering system according to a first embodiment; Fig. 2 a cross-sectional view of a steering system of Fig. 1 applied drive device; Fig. 3 a circuit diagram of the Fig. 2 shown drive device; Fig. 4 a bottom view of a drive device of Fig. 2 applied inverters viewed from one side of a motor; Fig. 5 a plan view of the drive device of Fig. 2 applied inverters viewed from an opposite side of the motor; Fig. 6 is a cross-sectional view of the inverter according to the first embodiment; Fig. 7 is a schematic diagram illustrating a pattern of printed wiring according to the first embodiment; Fig. 8 an enlarged view of Fig. 7; Fig. 9 is a diagram illustrating a difference in manufacturing process between a first assembly component and a second assembly component; Fig. 10 is a schematic diagram illustrating a pattern of printed wiring according to a second embodiment; Fig. 11 an enlarged view of Fig. 10; and Fig. 12 is a schematic diagram illustrating a pattern of printed wiring according to a third embodiment.

[0013] Several embodiments of the present disclosure are described below with reference to the drawings. Corresponding components in each embodiment are designated by the same reference numerals and may not be described repeatedly. While only a part of the configuration is described in each embodiment, the configuration of the other embodiments described above may be applied to other parts of the configuration. (First embodiment)

[0014] As in Fig. As shown in FIG. 1, a drive device 1 of the present embodiment includes an electric motor 80 and an electronic control unit (ECU) 10 as a power conversion device. The ECU 10 corresponds to an example of the power conversion device. The drive device 1 is applied to an electric power steering (EPS) device 8 for assisting a steering operation of a vehicle. Fig. 1 shows an overall configuration of a steering system 90 with the EPS 8. The steering system 90 includes a steering wheel 91 as a steering element, a steering shaft 92, a gear transmission 96, a rack shaft 97, wheels 98, the EPS 8 and the like.

[0015] The steering wheel 91 is connected to the steering shaft 92. The steering shaft 92 is provided with a torque sensor 94 for detecting a steering torque. The torque sensor 94 has two torque detection units 941 and 942 provided for each system. The detection values ​​of the torque detection units 941 and 942 are sent to the microcomputers 170 and 270, which are corresponding microcomputers (see Fig. 3). The gear train 96 is provided at a tip of the steering shaft 92. The gear train 96 is engaged with the rack shaft 97. The pair of wheels 98 are connected to both ends of the rack shaft 97 via tie rods or the like.

[0016] When a driver operates or turns the steering wheel 91, the steering shaft 92 connected to the steering wheel 91 rotates. A rotational movement of the steering shaft 92 is converted into a linear movement of the rack shaft 97 by the gear transmission 96. The pair of wheels 98 are steered at an angle corresponding to the displacement amount of the rack shaft 97.

[0017] The EPS 8 includes the drive device 1 and a reduction gear 89 as a power transmission section for reducing a rotational speed of the motor 80 and transmitting the rotational speed to the steering shaft 92. The steering shaft 92 is a drive target of the EPS 8.

[0018] As in the Fig. 2 and Fig. As shown in Figure 3, motor 80 is a brushless three-phase motor. Motor 80 provides some or all of the torque required for steering and is driven by energy supplied by batteries 199 and 299 to rotate reduction gear 89 forward and reverse.

[0019] The motor 80 includes a first winding 180 and a second winding 280 as a winding set. The windings 180 and 280 have equivalent electrical properties and are wound on a common stator 840 at electrical angles offset by 30 degrees. In response to the above configuration, the windings 180 and 280 are controlled to be excited with a phase current whose phase φ is shifted by 30 degrees.

[0020] A combination of configurations related to power supply control of the first winding 180 is referred to as a first system circuit L1, and a combination of configurations related to power supply control of the second winding 280 is referred to as a second system circuit L2. The configuration of the first system circuit L1 is mainly numbered in the 100s. The configuration of the second system circuit L2 is mainly numbered in the 200s. The configurations that are substantially the same in the system circuits L1 and L2 are numbered such that the last two digits are the same, and a description of these configurations is omitted where appropriate.

[0021] As in Fig. As shown in Figure 2, the drive device 1 has the ECU 10 integrated on one side of the motor 80 in the axial direction, which is a so-called "electromechanically integrated type" (also referred to as a machine / electricity integral type device). The ECU 10 is provided on the other side of the reduction gear 89 with respect to the motor 80. The ECU 10 is arranged coaxially with a center line Ax of a rotating shaft 870. With the electromechanically integrated type, the ECU 10 and the motor 80 can be efficiently installed in a vehicle with limited installation space. Hereinafter, when simply referred to as "axial direction" or "radial direction," these directions describe the axial direction or radial direction of the motor 80.

[0022] The motor 80 includes a stator 840, a rotor 860, a rotating shaft 870, and a housing 830 that houses the stator 840, the rotor 860, the rotating shaft 870, and the like. The stator 840 is fixed to the housing 830, and the windings 180 and 280 are wound around the stator 840. The rotor 860 is disposed radially inside the stator 840 and is rotatable relative to the stator 840.

[0023] The rotating shaft 870 is fitted into the rotor 860 and rotates integrally with the rotor 860. The rotating shaft 870 is rotatably supported in the housing 830 via bearings 835 and 836. One end of the rotating shaft 870 on the ECU 10 side protrudes from the housing 830 toward the ECU 10 side. A magnet 875 as a detection target is provided at the end of the rotating shaft 870 on the ECU 10 side.

[0024] The housing 830 includes a cylindrical housing 834, a rear frame end 837 at one end of the housing 834, and a front frame end 838 at the other end of the housing 834.

[0025] An opening 837a is provided in the rear frame end 837 through which the rotary shaft 870 is inserted and arranged. A lead wire insertion hole 839 is provided in the rear frame end 837. A lead wire 285 connected to each phase of the windings 180 and 280 is inserted into the lead wire insertion hole 839. The lead wire 285 is led out of the lead wire insertion hole 839 to the ECU 10. The lead wire 285 is connected through motor wire connecting portions 186 and 286 (see Fig. 4 and Fig. 5) and connected to a substrate 30 by solder or the like.

[0026] The ECU 10 includes the substrate 30 and various electronic components mounted on the substrate 30. The substrate 30 is connected to the substrate by screws or bolts inserted via substrate connecting portions 155 and 255 (see Fig. 2) attached to a surface of the rear frame end 837 opposite the motor 80. The screws or bolts 259 are constructed of a conductive material. A surface of the substrate 30 on the side of the motor 80 is defined as a motor surface 301, and the surface of the substrate 30 on the side opposite the motor 80 is defined as a cover surface 302. The cover 460 is formed in a substantially cylindrical shape with a bottom and fits radially outward toward the rear frame end 837. The cover 460 is provided to cover the substrate 30 and protect the ECU 10 from external influences and prevent dust, water, or the like from entering the ECU 10. An opening 461 is provided on a side surface of the cover 460.

[0027] The connector 350 has connector terminals, such as a first power supply terminal, a first ground terminal, a first signal terminal, a second power supply terminal, a second ground terminal, and a second signal terminal. The first power supply terminal, the first ground terminal, and the first signal terminal are inserted from the motor surface 301 side of the substrate 30 and electrically connected to a first power supply terminal connecting portion 151, a first ground terminal connecting portion 152, and a first signal terminal connecting portion 153 (see Fig. 4 and Fig. 5). The second power supply terminal, the second ground terminal, and the second signal terminal are inserted from the motor surface 301 side of the substrate 30 and electrically connected to the second power supply terminal connecting portion 251, the second ground terminal connecting portion 252, and the second signal terminal connecting portion 253 (see Fig. 4 and Fig. 5).

[0028] Fig. 3 shows a circuit arrangement of the drive device 1. The ECU 10 includes a first inverter 120, first motor relays 127 to 129, first power supply relays 131 and 132, a first capacitor 134, and a first coil 135 provided corresponding to the first winding 180. The ECU 10 further includes a second inverter 220, second motor relays 227 to 229, second power supply relays 231 and 232, a second capacitor 234, and a second coil 235 provided corresponding to the second winding 280.

[0029] The first inverter 120 and the like of the first system circuit L1 are supplied with electrical power from the first battery 199. The second inverter 220 and the like of the second system circuit L2 are supplied with electrical power from the second battery 299. In the present embodiment, the ground is also separated by the first system circuit L1 and the second system circuit L2. The first microcomputer 170 controls the power supply to the first winding 180, and the second microcomputer 270 controls the power supply to the second winding 280.

[0030] In other words, in the present embodiment, the first system circuit L1 and the second system circuit L2 are provided independently of each other in a fully redundant configuration. The ECU 10, redundantly designed as described above, corresponds to a "redundant switching device." The redundant switching device includes a power conversion circuit for converting supplied power to output the converted power to the motor 80, and a control circuit for controlling the operation of the power conversion circuit.

[0031] The first inverter 120 is a three-phase inverter, and the first switching elements 121 to 126 are bridge-connected. The switching elements 121 to 123 are connected to a high-potential side to form an upper arm H. The switching elements 124 to 126 are connected to a low-potential side to form a lower arm L. A node of the paired U-phase switching elements 121 and 124 is connected to one end of a first U-phase coil 181. A node of the paired V-phase switching elements 122 and 125 is connected to one end of a first V-phase coil 182. A node of the paired W-phase switching elements 123 and 126 is connected to one end of a first W-phase coil 183. The other ends of the coils 181 to 183 are connected to each other.Shunt resistors 137 to 139, which are current detecting elements for detecting currents flowing in the coils 181 to 183, are provided on the low potential side of the switching elements 124 to 126, respectively. The high potential side is also referred to as a high electric potential side, and a low potential side is also referred to as a low electric potential side.

[0032] The second inverter 220 has the same configuration as the first inverter 120. In other words, the switching elements 221 to 223 are connected to a high-potential side to form an upper arm H. The switching elements 224 to 226 are connected to a low-potential side to form a lower arm L. The output points of the upper and lower-arm circuits of the respective UVW phases are connected to the respective UVW-phase coils. Shunt resistors 237 to 239, which are current detection elements for detecting currents flowing in the coils 281 to 283, are provided on the low-potential side of the switching elements 224 to 226.

[0033] These shunt resistors 137 to 139 and 237 to 239 correspond to a "current detection circuit" for detecting a current flowing through an arm of each phase. A current value detected by the current detection circuit is input to microcomputers 170 and 270. Microcomputers 170 and 270 correspond to a "control circuit" that controls the operation of inverters 120 and 220 based on the current value detected by the current detection circuit.

[0034] The first motor relays 127 to 129 are located between the first inverter 120 and the first winding 180 and are provided so that the first inverter 120 and the first winding 180 can be disconnected and connected to each other. The U-phase motor relay 127 is provided between the node of the switching elements 121 and 124 and the U-phase coil 181. The V-phase motor relay 128 is provided between the node of the switching elements 122 and 125 and the V-phase coil 182. The W-phase motor relay 129 is provided between the node of the switching elements 123 and 126 and the W-phase coil 183. The second motor relays 227 to 229 have the same configuration as the first motor relays 127 to 129 and are provided for the respective UVW phases.

[0035] The first power supply relays 131 and 132 are connected in series with the parasitic diodes facing opposite directions and are provided between the first battery 199 and the first inverter 120. The second power supply relays 231 and 232 are connected in series with the parasitic diodes facing opposite directions and are provided between the second battery 299 and the second inverter 220. This prevents current from flowing in the reverse direction and protects the ECU 10 when the batteries 199 and 299 are incorrectly connected in the reverse direction.

[0036] The driver preamplifier 176 outputs a drive signal based on a control signal from the first microcomputer 170. The first switching elements 121 to 126, the first motor relays 127 to 129, and the first power supply relays 131 and 132 are controlled to be turned on and off in accordance with the drive signal. The driver preamplifier 276 of the second system circuit L2 operates in the same manner as the driver preamplifier 176 of the first system circuit L1. In other words, the second switching elements 221 to 226, the second motor relays 227 to 229, and the second power supply relays 231 and 232 are turned on and off by the driver preamplifier 276. To avoid complicating the drawings, control lines to the motor relays and the power supply relays are shown in Fig. 3 omitted.

[0037] The first capacitor 134 is connected in parallel with the first inverter 120, and the second capacitor 234 is connected in parallel with the second inverter 220. The capacitors 134 and 234 are formed, for example, from aluminum electrolytic capacitors. The first coil 135 is provided between the first battery 199 and the first power supply relay 131, and the second coil 235 is provided between the second battery 299 and the second power supply relay 231.

[0038] The first capacitor 134 and the first coil 135, as well as the second capacitor 234 and the second coil 235, each form a filter circuit. These filter circuits reduce noise transmitted from other devices sharing batteries 199 and 299. Furthermore, the filter circuits reduce noise transmitted from the drive device 1 to the other devices sharing batteries 199 and 299. Furthermore, the capacitors 134 and 234 store electrical charges, thus helping to supply power to the inverters 120 and 220.

[0039] An inter-system ground connection capacitor 41 connects a first system ground G1 and a second system ground G2. A first electromechanical connection capacitor 142 connects the first system ground G1 and the housing 830 of the motor 80. A second electromechanical connection capacitor 242 connects the second system ground G2 and the housing 830. The capacitors 41, 142, and 242 are constructed, for example, from ceramic capacitors.

[0040] The motor surface 301 of the substrate 30 is in Fig. 4, and the cover surface 302 is shown in Fig. 5. For the sake of description, the arrangement of the cover surface 302 is reversed, and the first system circuit L1 is shown on a left side, and the second system circuit L2 is shown on a right side of a paper plane.

[0041] As in Fig. As shown in Figure 4, the switching elements 121 to 126 and 221 to 226, as well as the shunt resistors 137 to 139 and 237 to 239, are mounted on the motor surface 301 of the substrate 30. The motor relays 127 to 129 and 227 to 229, as well as the power supply relays 131, 132, 231, and 232, are mounted on the motor surface 301. Furthermore, integrated circuits 175 and 275, as well as a rotation angle sensor 29 (sensor element) are mounted on the motor surface 301. The integrated IC 175 includes the driver preamplifier 176, and the integrated IC 275 includes the driver preamplifier 276. The rotation angle sensor 29 detects a change in a magnetic field by the magnet 875 provided on the rotation shaft 870 and outputs a detection signal corresponding to a rotation angle of the rotation shaft 870.

[0042] As in Fig. 5, the capacitors 134 and 234 and the coils 135 and 235 are mounted on the cover surface 302 of the substrate 30. Furthermore, the inter-system ground connection capacitor 41, the electromechanical connection capacitors 142 and 242 (see Fig. 3) and the microcomputers 170 and 270 are mounted on the cover surface 302.

[0043] As in the Fig. 4 and Fig. As shown in Figure 5, the substrate 30 is electrically separated into two parts by a slit 305. One region is referred to as a first region A1, and the other region is referred to as a second region A2. Components related to the first system circuit L1 are mounted on the motor surface 301 and the cover surface 302 of the first region A1. Components related to the second system circuit L2 are mounted on the motor surface 301 and the cover surface 302 of the second region A2. The slit 305 is a boundary line defining both of the regions, where the boundary line is a straight line passing through the center of the substrate 30. The first region A1 and the second region A2 are separated to have the same area.

[0044] The rotation angle sensor 29 is located on the boundary line between the first area A1 and the second area A2. The rotation angle sensor 29 is arranged in a region of the substrate 30 facing the opening 837a of the rear frame end 837 (opening facing region). The rotation angle sensor 29 is mounted on the motor surface 301 across the slot 305. The inter-system ground connection capacitor 41 is mounted on the cover surface 302 across the slot 305 and connects the first system ground G1 and the second system ground G2.

[0045] The first electromechanical connection capacitor 142 connects a ground pattern P13 of the first system circuit L1 (see Fig. 5) and a housing connection pattern 157. The second electromechanical connection capacitor 242 connects a ground pattern P23 of the second system circuit L2 (see Fig. 5) and a housing connection pattern 257. The housing 830 is connected to the vehicle ground. In other words, capacitors 41, 142, and 242 are all capacitors for connecting between the grounds. Furthermore, it may be conceivable that the inter-system ground connection capacitor 41 establishes a connection between the grounds of the power supply circuits L1 and L2 of the system circuit.

[0046] In the present embodiment, the drive device 1 is applied to the EPS 8, and a large current is supplied in a short time, so that switching noise and ringing noise may be generated. The above-described noise N is mainly generated in a circuit of the ECU 10, and the generated noise may propagate to the vehicle side via the connector 350 and the motor 80. Therefore, the ground of the substrate 30 and the case 830 are electrically connected to each other by means of screws and bolts to form a noise feedback path from the motor 80 to the ECU 10. As a result, noise generated in the circuit of the ECU 10 is fed back to a noise source and the propagation of the noise to the vehicle side is prevented.

[0047] As in Fig. As shown in Figure 6, a multilayer substrate is used as the substrate 30 of the present embodiment. A plurality of wiring layers, a plurality of insulating layers 34, surface resist layers 37, vias, and the like are formed in the substrate 30. Conductive wirings are provided in the wiring layers. The insulating layer 34, which has an electrically insulating property, is arranged between the adjacent wiring layers.

[0048] The wiring layers include surface layers 31 and 32 and inner layers 33. The surface layers 31 and 32 are the outermost layers of all wiring layers. The inner layers 33 are layers located within the entire wiring layers. In an example of Fig. 6, the inner layers 33 comprise four layers (multiple layers). The surface layers 31 and 32 are covered with surface resist layers 37. The surface resist layer 37 covering the surface layer 31 forms the motor surface 301. The surface resist layer 37 covering the surface layer 32 forms the cover surface 302.

[0049] The vias include through holes (not shown) and inner vias 35a and 36a. The through holes are shaped to penetrate all of the surface layers 31, 32, and the inner layers 33 (all wiring layers). The inner vias 35a are shaped to extend over one of the surface layers 31 and 32 and an inner layer 33 adjacent to the one surface layer. The inner via 36a is shaped to extend over all of the inner layers 33 except for the surface layers 31 and 32. The inner vias 35a are formed by laser processing, and the inner via 36a is formed by drilling.

[0050] The inner surfaces of the through holes and the inner via 36a are subjected to plating 36 as conductive elements. The plating 36 is cylindrically shaped to create a space inside. A non-conductive element (not shown) is "packaged" inside the cylinder of the inner via 36a. In contrast, a conductive element is "buried" in each of the inner vias 35a. The conductive element has a solid shape and is also referred to as a solid via 35. The solid vias 35 and the plating 36 electrically connect wiring patterns formed in any wiring layers. Specific examples of a material of the plating 36 and the solid vias 35 include copper.

[0051] A part of the wiring pattern formed in the wiring layer functions as a wiring for connecting the Fig. 3. The wiring patterns include the ground patterns P13 and P23, as well as the power supply patterns P11, P12, P21, and P22. (Details on the mass pattern)

[0052] The ground patterns P13 and P23 form part of the grounds G1 and G2 and are electrically connected to the above-described ground terminal connecting portions 152 and 252. The ground patterns P13 and P23 are electrically connected to the electromechanical connection capacitors 142 and 242 and the inter-system ground connection capacitor 41 in the surface layer 32 on the cover surface 302 side. The respective ground patterns P13 and P23 are electrically connected to low-potential side terminals of the capacitors 134 and 234 and the shunt resistors 137 to 139 and 237 to 239 in the surface layer 31 on the motor surface 301 side.

[0053] The Fig. 4 and Fig. The ground patterns P13 and P23 shown in Figure 5 are parts of the ground patterns provided in all of the wiring layers, and the other ground patterns are omitted from the drawings. The ground patterns P13 and P23 are provided on the inner layer 33.

[0054] The ground patterns of the same system circuits provided in different wiring layers are connected to each other by several solid vias 35 and the plating 36. For example, in Fig. 6, the ground pattern P13 of the inner layer 33 and the ground pattern P13 provided on the surface layer 31 are connected to each other by the plurality of solid vias 35 and the plating 36. For example, in the Fig. 4 and Fig. 5, the ground pattern of the surface layer 31 (not shown) connected to the low-potential side terminals of the shunt resistors 137 to 239 and the ground patterns P13 and P23 of the inner layer 33 are connected to each other by the plurality of solid vias 35.

[0055] The ground pattern P13 of the first system circuit L1 is shaped to include the entirety of the power supply relays 131 and 132, the switching elements 121 to 126, and the shunt resistors 137 to 139 when viewed from the direction perpendicular to the board surface of the substrate 30 (board surface normal). Similarly, the ground pattern P23 of the second system circuit L2 is shaped to include the entirety of the power supply relays 231 and 232, the switching elements 221 to 226, and the shunt resistors 237 to 239 when viewed from the direction perpendicular to the board surface. In other words, all of the components such as the power supply relays 231 and 232, the switching elements 221 to 226, and the shunt resistors 237 to 239 are overlapped with the ground patterns P13 and P23 when viewed from the direction perpendicular to the plate surface.

[0056] The coils 135 and 235 and the capacitors 134 and 234 provided on the cover surface 302 are also completely overlapped with the ground patterns P13 and P23 when viewed from the direction perpendicular to the plate surface. The group of components overlapped with the ground patterns P13 and P23 among the components provided on the surface layers 31 and 32 is referred to as ground pattern overlap components. The solid vias 35 connected to the ground pattern overlap component are also overlapped with the ground patterns P13 and P23. For example, as shown in the Fig. 4 and Fig. 5, the solid vias 35 connected to the shunt resistors 237 to 239 and the solid vias 35 connected to the power supply relay 131 also completely overlap with the ground patterns P13 and P23 when viewed from the direction perpendicular to the board surface. (Details on the energy supply pattern)

[0057] The power supply patterns P11 to P22 are connected to the high-potential side of the inverters 120 and 220 to supply electrical power. The power supply patterns P11 to P22 of the respective system circuits are electrically connected to the high-potential side terminals of the capacitors 134 and 234 and the power supply relays 132 and 232 in the surface layer 31 on the motor surface 301 side. The power supply patterns P11 to P22 of the respective system circuits are electrically connected to the high-potential side terminals of the switching elements 121 to 123 and 221 to 223.

[0058] The Fig. 4 and Fig. The power supply patterns P11 to P22 shown in Figure 5 are part of the power supply patterns provided in each of the wiring layers; other power supply patterns are omitted from the drawings. The power supply patterns P11 and P21 shown are provided on the surface layer 32 on the cover surface 302 side. The power supply patterns P12 and P22 shown are provided on the surface layer 31 on the motor surface 301 side.

[0059] The power supply patterns of the same system circuits provided in different wiring layers are connected to each other by the multiple solid vias 35 and the plating 36. For example, in the Fig. 4 and Fig. 5, the power supply patterns P12 and P22 of the surface layer 31 to which the first power supply relays 131 and 231 are connected, and the power supply patterns P11 and P21 of the surface layer 32 are connected to each other via the plurality of solid vias 35 and the plating 36.

[0060] The power supply pattern P11 of the first system circuit L1, provided on the surface layer 32, is shaped to include the entirety of the power supply terminal connecting portion 151 and the coil 135 when viewed from the direction perpendicular to the board surface. The power supply pattern P21 of the second system circuit L2, provided on the surface layer 32, is similarly shaped to include the entirety of the power supply terminal connecting portion 251 and the coil 235 when viewed from the direction perpendicular to the board surface. In other words, the entirety of the power supply terminal connecting portions 151 and 251 and the coils 135 and 235 overlap with the power supply patterns P11 and P21 when viewed from the direction perpendicular to the board surface.

[0061] The power supply pattern P12 of the first system circuit L1 provided on the surface layer 31 is shaped to include the entirety of the switching elements 121 to 123 and the power supply relays 131 and 132 when viewed from the direction perpendicular to the board surface. Similarly, the power supply pattern P22 of the second system circuit L2 provided on the surface layer 31 is shaped to include the entirety of the switching elements 221 to 223 and the power supply relays 231 and 232 when viewed from the direction perpendicular to the board surface. In other words, the switching elements 121 to 223 and the power supply relays 131 to 232 are completely overlapped with the power supply patterns P12 and P22 when viewed from the direction perpendicular to the board surface.

[0062] Of the components on the surface layer 31, the component group overlapped with the power supply patterns P12 and P22 is referred to as power supply pattern overlap components. The solid vias 35 connected to the power supply pattern overlap components are also overlapped with the power supply patterns P12 and P22. For example, as shown in the Fig. 4 and Fig. 5, the solid vias 35 connected to the power supply relays 131 and 231 also overlap with the power supply patterns P11 to P22 when viewed from the direction perpendicular to the board surface.

[0063] The ground pattern P13 of the first system circuit L1 is shaped so that, when viewed from the direction perpendicular to the board surface, it encompasses the entirety of the power supply patterns P11 and P12 of the first system circuit L1. Similarly, the ground pattern P23 of the second system circuit L2 is shaped so that, when viewed from the direction perpendicular to the board surface, it encompasses the entirety of the power supply patterns P21 and P22 of the second system circuit L2. In other words, the entirety of the power supply patterns P11 to P22 overlap with the ground patterns P13 and P23 when viewed from the direction perpendicular to the board surface.

[0064] Of the multiple wiring layers, when the surface layer 31 on the motor surface 301 side is defined as the "first layer" and the inner layer 33 adjacent to the first layer is defined as the "second layer," an area of ​​each pattern has the following size ratio. In the first system circuit L1, an area of ​​the second-layer ground pattern portion, which is the ground pattern P13 provided in the second layer, is larger than an area of ​​the first-layer power supply pattern portion, which is the power supply pattern P12 provided in the first layer.

[0065] When the surface layer 32 on the cover surface 302 side is defined as the “first layer,” the area of ​​the second-layer ground pattern portion, which is the ground pattern P13 provided in the second layer, is larger than the area of ​​the first-layer power supply pattern portion, which is the power supply pattern P11 provided in the first layer.

[0066] The rotation angle sensor 29 is arranged in a region of the substrate 30 facing the opening 837a through which the rotary shaft 870 is inserted and positioned (opening facing region). The power supply pattern and the ground pattern are arranged at positions that do not overlap with the rotation angle sensor 29 when viewed from the direction perpendicular to the disk surface. (Details about surface mount component SMD)

[0067] Hereinafter, the power supply relays, switching elements, motor relays, integrated ICs, and microcomputers are collectively referred to as surface-mounted components (SMD). Further, among the surface-mounted components (SMD), components in the first system circuit L1 are referred to as first mounting components, and components in the second system circuit L2 are referred to as second mounting components. Furthermore, among the first mounting components included in the first system circuit L1, the switching elements included in the power conversion circuit are collectively referred to as a first MOS1. Among the second mounting components included in the second system circuit L2, the switching elements included in the power conversion circuit are collectively referred to as a second MOS2.The integrated circuit components in the control circuit, among the first assembly components included in the first system circuit L1, are collectively referred to as a first IC1. Among the second assembly components included in the second system circuit L2, the integrated circuit components included in the control circuit are collectively referred to as a second IC2.

[0068] These SMD surface-mount components have a rectangular shape when viewed from the direction perpendicular to the board surface. As described above, the boundary line separating the first region A1 and the second region A2 of the substrate 30 is a straight line. The SMD surface-mount component is mounted in a direction in which one side of the rectangle is parallel to the boundary line.

[0069] As in the Fig. 7 and Fig. As shown in Figure 8, a center point C2 of the second IC2 is located at a position where a center point C1 of the first IC1 is inverted with respect to the boundary line as an axis of symmetry, when viewed from the direction perpendicular to the plate surface. In short, the first IC1 and the second IC2 are arranged to have a positional relationship that is inverted with respect to the boundary line as an axis of symmetry. In the same way, the first MOS1 and the second MOS2 are arranged to have a positional relationship that is inverted with respect to the boundary line as an axis of symmetry.

[0070] The surface-mount component (SMD) has three or more terminals (pins). For example, the first MOS1 and the second MOS2 each have a gate terminal, a source terminal, a drain terminal, and an output terminal, such as a temperature sensor integrated into the MOS.

[0071] For example, as in Fig. As shown in Figure 7, the first IC1 has multiple terminals (first pins PIN1) and the second IC2 has multiple terminals (second pins PIN2). The first pins PIN1 and the second pins PIN2 include multiple sensor signal terminal groups for inputs from various sensors such as the rotation angle sensor 29. The first pins PIN1 and the second pins PIN2 include multiple voltage monitoring terminal groups that receive detection signals for monitoring voltages at respective sections. The first pins PIN1 and the second pins PIN2 include multiple input terminal groups that receive arithmetic values ​​calculated from other microcomputers. The first pins PIN1 and the second pins PIN2 include multiple output terminal groups that output arithmetic values ​​through these first and second pins PIN1 and PIN2.

[0072] In an example from Fig. 8, a positional relationship (also referred to as the first pin placement) of the plurality of first pins PIN1 and a positional relationship (also referred to as the second pin placement) of the plurality of second pins PIN1 are mirror images of each other. "Pin placement" is described below. The term "placement" can also be referred to as "arrangement."

[0073] The first pins PIN1 and the second pins PIN2 in Fig. 8 assigned numbers indicate consecutive numbers assigned to each of the pins for each function, and are assigned clockwise or counterclockwise sequentially when viewed from the direction perpendicular to the board surface. In an example of the IC from Fig. 8, consecutive numbers from “1” to “80” are assigned to 80 pins. In an example of the MOS of Fig. 8, the consecutive numbers from “1” to “6” are assigned to six pins.

[0074] The placement of the plurality of first pins PIN1 with respect to a center point C1 of the first IC1 is referred to as a first pin placement. The placement of the plurality of second pins PIN2 with respect to the center point C2 of the second IC2 is referred to as a second pin placement. The first pin placement is a placement in which pin numbers are sequentially assigned clockwise as viewed from the motor surface 301 side. The second pin placement is a placement in which pin numbers are sequentially assigned counterclockwise as viewed from the motor surface 301 side. In other words, the second pin placement is a placement in which the first pin placement is a mirror image.

[0075] Fig. Figure 9 shows a schematic diagram illustrating an example of a method for manufacturing the mirror-image pin placement. First, two components ICx of the same surface-mounted component SMD are prepared in a state before pin bending. Next, the pins of a prepared first component ICx are bent to manufacture a first IC1.

[0076] The pins of a prepared second component ICx are bent in the opposite direction to that of the first mounting component, thereby producing a second IC2. The top and bottom directions of the second IC2 are then reversed, i.e., the second IC2 is flipped. As a result, the first pin placement and the second pin placement have a mirror-inverted placement relationship. The first IC1 and the second IC2, fabricated as described above, are then surface-mounted on the substrate 30.

[0077] The other surface mounted components SMD such as the first MOS1 and the second MOS2 are also manufactured using the same processes as in Fig. 9. In other words, the bending direction of the pins is reversed, so that the surface mount component SMD is manufactured with the placement ratio where the first pin placement and the second pin placement are mirror images.

[0078] In an example from Fig. 8, the second mounting direction in which the second IC2 is mounted on the substrate 30 coincides with the first mounting direction in which the first IC1 is mounted on the substrate 30. The "mounting direction" is described below.

[0079] A pin with a predetermined function among the first reference pins 1 is defined as a first reference pin. A pin with a predetermined function among the second reference pins 2 is defined as a second reference pin. In the example of Fig. 8, pins numbered "1" correspond to the first reference pin and the second reference pin. The predetermined function is, for example, the function of the voltage monitoring terminal described above.

[0080] The position of the first reference pin around the center point C1 of the first IC1 in a direction relative to the substrate 30 of the first IC1 mounted on the substrate 30 corresponds to the first mounting direction. The position of the second reference pin around the center point C2 of the second IC2 in the direction relative to the substrate 30 of the second IC2 mounted on the substrate 30 corresponds to the second mounting direction.

[0081] Incidentally, the other surface-mounted SMD components, such as the first MOS1 and the second MOS2, have the same pin placement and mounting direction as the first IC1 and the second IC2. In other words, the first pin placement and the second pin placement are mirror images, and the first mounting direction and the second mounting direction are consistent with each other.

[0082] The first mounting component and the second mounting component are positioned so that they have an inverted positional relationship with respect to the boundary line as an axis of symmetry. Furthermore, in the first mounting component and the second mounting component, the first pin placement and the second pin placement are mirror images of each other, and the first mounting direction and the second mounting direction are consistent with each other. (Wiring pattern details)

[0083] As in the Fig. 4 and Fig. As shown in Figure 5, the power wiring patterns P11 to P13 and P21 to P23, as well as the control wiring patterns P181, P182, P191, and P192, are provided on the printed wiring formed on the substrate 30. In the following description, the control wiring patterns P181 and P191 in the first system circuit L1 are referred to as first patterns among the control wiring patterns P181, P182, P191, and P192. The control wiring patterns P281 and P291 included in the second system circuit L2 are referred to as second patterns.

[0084] One end of the first pattern is connected to each of the first pins PIN1 of the first IC1, and the other end of the first pattern is connected to each of the first pins of the first MOS1. Similarly, one end of the second pattern is connected to each of the second pins PIN2 of the second IC2, and the other end of the second pattern is connected to each of the second pins of the second MOS2. Fig. 8 The pattern shown by solid lines is located on the surface layer 31, and the pattern shown by dashed lines is located on the inner layer 33. The pattern of the surface layer 31 and the pattern of the inner layer 33 are connected to each other by the solid vias 35.

[0085] The first patterns and the second patterns may have shapes and sizes (widths) that are mirror-inverted as much as possible in the first area A1 and the second area A2.

[0086] Mirroring the first patterns and the second patterns can facilitate the impedance of the printed wiring between the first area A1 and the second area A2 to be identical. In other words, the impedance variation in these two areas can be reduced. If the impedance variation can be reduced, the variation between the amount of heat generated in the first patterns and the amount of heat generated in the second patterns can be reduced. Therefore, the required amount of heat radiation can be reduced when designing the heat radiation according to a system with a large amount of heat generation. This makes it possible to promote optimal heat radiation design.

[0087] Mirroring the first patterns and the second patterns can facilitate the identical noise emitted by the printed circuit board between the first area A1 and the second area A2. This makes it possible to reduce the variation in emission noise in the two areas. If the variation in emission noise can be reduced, the variation between an emission noise level generated in the first patterns and an emission noise level generated in the second patterns can be reduced. Therefore, the required noise level for noise countermeasures corresponding to a system with a high noise level can be reduced. For this reason, optimal noise countermeasures can be promoted.

[0088] From the viewpoint of improving the detection accuracy of the rotation angle sensor 29, it may be desirable to provide the first patterns and the second patterns as mirror images.

[0089] For example, a magnetic flux M1 is generated by a current flowing in a pattern closest to the slot 305 (boundary line) among the control wiring patterns P181 (first pattern). The magnetic flux M1 is generated on the rotation angle sensor 29 in a direction from the back to the front in the drawings. On the other hand, a current flows in a pattern closest to the slot 305 (boundary line) among the control current patterns P281 (second pattern), thereby generating a magnetic flux M2. The magnetic flux M2 is generated on the rotation angle sensor 29 in a direction from the front to the back in the drawings.

[0090] Therefore, the magnetic flux M1 and the magnetic flux M2 on the rotation angle sensor 29 are opposite and cancel each other out. This can prevent the magnetic fluxes M1 and M2 generated by the current flowing through the control wiring patterns P181 and P281 from deteriorating the detection accuracy of the rotation angle sensor 29.

[0091] The mutual cancellation of the magnetic fluxes between the entire plurality of first patterns and the entire plurality of second patterns can be promoted. This can reduce the emission noise emitted by the entire substrate 30.

[0092] According to the present embodiment, the pin placement (first pin placement) of the first IC1 used in the first system circuit L1 and the pin placement (second pin placement) of the second IC2 used in the second system circuit L2 are mirror-inverted as described above. This makes it possible to easily design the control wiring patterns P181 and P191 (first patterns) of the first system circuit L1 and the control wiring patterns P281 and P291 (second patterns) of the second system circuit L2 to approximate their mirror-image shapes and sizes.

[0093] Therefore, in the first region A1 and the second region A2, the variation in impedance of the two patterns can be inhibited, and the optimal heat radiation design can be promoted as described above. Furthermore, in the first region A1 and the second region A2, the variation in emission noise of the two patterns can be inhibited, and the optimal noise countermeasure can be promoted as described above. Furthermore, the magnetic flux M1 generated in the first region A1 and the magnetic flux M2 generated in the second region A2 can be promoted to cancel each other. This can reduce the emission noise emitted from the entire substrate 30.

[0094] Furthermore, in the present embodiment, the direction (second mounting direction) of the second mounting component on the substrate 30 coincides with the direction obtained by mirroring the direction (first mounting direction) of the first mounting component on the substrate 30. For this reason, compared to the case where the second mounting direction deviates from the first mounting direction, the first patterns and the second patterns can be promoted to approximate mirroring.

[0095] Furthermore, in the present embodiment, the boundary line between the first region A1 and the second region A2 is a straight line. The center point C2 of the second mounting component, when viewed from the direction perpendicular to the board surface, is located at a position where the center point C1 of the first mounting component is inverted with respect to the boundary line as an axis of symmetry. In other words, the position of the second mounting component on the substrate 30 coincides with the inverted position of the first mounting component. For this reason, compared with the case where the position of the second mounting component deviates from the inverted position of the first mounting component, the first patterns and the second patterns can be promoted to approximate mirror image.

[0096] Furthermore, in the present embodiment, the rotation angle sensor 29 is mounted on one surface side of the substrate 30 and positioned on the boundary line between the first region A1 and the second region A2. For this reason, the magnetic flux M1 generated in the first region A1 and the magnetic flux M2 generated in the second region A2 can be promoted to cancel each other. This can suppress the influence of the magnetic flux on the rotation angle sensor 29 by the two patterns, and prevent the decrease in the detection accuracy of the rotation angle sensor 29.

[0097] Further, in the present embodiment, the printed wiring formed on the substrate 30 includes both the power wiring patterns P12, P13, P22, and P23 included in the power conversion circuit and the control wiring patterns P181, P182, P191, and P192 included in the control circuit.

[0098] When the first patterns and the second patterns are mirror images of the pattern connecting the power conversion circuit and the control circuit, the pattern placement constraint is large compared to when both patterns in the power conversion circuit and the control circuit are mirror images. Therefore, when the surface-mounted component SMD with mirrored pin placement is used in the substrate 30 with the two patterns as in the present embodiment, the above-mentioned advantage that both patterns can be easily mirrored can be remarkable.

[0099] Furthermore, in the present embodiment, the first mounting component and the second mounting component include the first IC1 and the second IC2 (integrated circuit components), respectively. The first mounting component and the second mounting component include the first MOS1 and the second MOS2 (switching elements) included in the power conversion circuit, respectively.

[0100] The number of terminals of integrated circuit components tends to be larger than that of switching elements. For this reason, the use of the integrated circuit component with the mirrored pin placement as in the present embodiment remarkably brings about the above-mentioned advantage that both patterns can be easily mirrored. Furthermore, the electric power switching element tends to have greater restrictions on the mounting position and mounting direction compared to the integrated circuit component. For this reason, the use of the power switching element with the mirrored or mirror inversion pin placement as in the present embodiment remarkably brings about the above-mentioned advantage that both patterns can be easily mirrored.

[0101] Furthermore, in the present embodiment, the power conversion circuit included in the redundant switching device supplies electric power to the motor 80 of the EPS 8 to generate steering force of the vehicle. Since the motor 80 for the EPS 8 has a characteristic of instantaneous flow of large current, emission noise is likely to occur. For this reason, the emission noise suppression effect can be achieved according to the present embodiment.

[0102] According to the present embodiment, in the first system circuit L1, the power supply patterns P11 and P12 corresponding to the first-layer power supply pattern portion and the ground pattern P13 corresponding to the second-layer ground pattern portion are arranged so as to overlap when viewed from the direction perpendicular to the board surface. For this reason, a loop formed by the power supply patterns P11 and P12 and the ground pattern P13 is reduced when viewed from the direction perpendicular to the board surface. For this reason, a loop formed by the power supply patterns P11 and P12 and the ground pattern P13 is reduced when viewed from the direction perpendicular to the board surface.

[0103] In the second system circuit L2, the power supply patterns P21 and P22 corresponding to the first-layer power supply pattern portion and the ground pattern P23 corresponding to the second-layer ground pattern portion are arranged so that they overlap when viewed from the direction perpendicular to the plate surface. Therefore, a loop formed by the power supply patterns P21 and P22 and the ground pattern P23 is reduced when viewed from the direction perpendicular to the plate surface.

[0104] In any system, both loop patterns can be prevented from acting as an antenna. Therefore, the noise generated by switching the inverter circuit can be prevented from being radiated as emission noise, which is an electromagnetic wave. In addition to the switching noise described above, electromagnetic noise caused by a large current flowing in both patterns is also suppressed by reducing the loop.

[0105] When wiring the power wiring patterns P12, P13, P22, and P23, the wiring for transmitting impedance may be thickened to reduce heat generation caused by a large current. If the wiring is thickened, a wiring width and wiring pitch may become large due to a limitation in substrate manufacturing, so that fine wiring cannot be formed. For this reason, it may be unsuitable to wire the control wiring patterns P181, P182, P191, and P192, which require a high-density layout. Consequently, when both the power conversion circuit and the control circuit are provided on the same substrate, in order to achieve downsizing, the power wiring pattern and the control wiring pattern are mixed on the same substrate. Therefore, both reducing the impedance and downsizing the wiring may be required.

[0106] According to the present embodiment, a multilayer substrate is used as the substrate 30, on which both the power wiring patterns P12, P13, P22, and P23 and the control wiring patterns P181, P182, P191, and P192 are provided. The power wiring patterns arranged in different layers of the multilayer substrate are electrically connected to each other by solid conductive elements (solid vias 35) provided in the vias 35a.

[0107] This makes it possible to provide the power wiring pattern of multiple layers with an impedance equivalent to that of only one (single) layer of thick wiring. Since the via is a solid or solid via, the impedance can be further reduced compared to the case of a foil-type via. In other words, the impedance can be lowered without thickening the power wiring pattern, and the heat generation caused by a large current flowing through the power wiring pattern can be reduced. Furthermore, since thickening of the power wiring pattern can be prevented, the wiring widths and wiring pitches of the control wiring patterns P181, P182, P191, and P192 can be reduced, so that fine wiring can be achieved. (Second embodiment)

[0108] In the first embodiment, the surface mount component SMD with the mirrored pin placement is used as the first mounting component and the second mounting component. In contrast, in the present embodiment, as shown in the Fig. 10 and Fig. 11, a surface-mount component (SMD) with the same pin placement is used for a first mounting component and a second mounting component. Specifically, a first pin placement is a placement in which the pin numbers are assigned sequentially in a clockwise direction from one side of the motor face 301. A second pin placement is also a placement in which the pin numbers are assigned sequentially in a clockwise direction from the side of the motor face 301, as in the first pin placement.

[0109] In the first embodiment, a second mounting direction coincides with a direction obtained by mirroring the first mounting direction. In the present embodiment, the two mounting components are mounted such that the first mounting direction and the second mounting direction are different from each other.

[0110] In the first embodiment, the center point C2 of the second IC2 is located at a position where the center point C1 of the first IC1 is inverted with respect to the boundary line as an axis of symmetry. In other words, the first IC1 and the second IC2 are arranged to have a positional relationship in which the first IC1 and the second IC2 are inverted with respect to the boundary line as an axis of symmetry. In contrast, in the present embodiment, the center point C2 of the second IC2 is located at a position different from the position obtained when the center point C1 of the first IC1 is inverted with the boundary line as an axis of symmetry. In other words, the first IC1 and the second IC2 are arranged in an asymmetrical positional relationship.

[0111] In an example from Fig. 10, the first MOS1 and the second MOS2, similar to the first embodiment, are arranged to have a positional relationship in which the first MOS1 and the second MOS2 are inverted with respect to the boundary line as an axis of symmetry. The pin placements and mounting directions of the first MOS1 and the second MOS2 are the same as those of the MOSs of the first embodiment.

[0112] According to the present embodiment, as described above, in the first IC1 used for the first system circuit L1 and the second IC2 used for the second system circuit L2, the following relationship is satisfied.

[0113] In other words, the first pin placement and the second pin placement are identical. The first mounting direction and the second mounting direction are different.

[0114] This allows the first patterns of the first system circuit L1 and the second patterns of the second system circuit L2 to be easily designed to approximate their mirror-image shapes and sizes. Therefore, the impedance variation of both the patterns in the first region A1 and the second region A2 can be inhibited, and the optimal heat radiation design as described above can be promoted. Furthermore, in the first region A1 and the second region A2, the variation in emission noise of the two patterns can be inhibited, and the optimal noise countermeasure as described above can be promoted. Furthermore, the magnetic flux M1 generated in the first region A1 and the magnetic flux M2 generated in the second region A2 can be promoted to cancel each other out. This can reduce the emission noise emitted from the entire substrate 30.

[0115] Furthermore, in the present embodiment, the first pin placement and the second pin placement are identical, and the first IC1 and the second IC2 are arranged in an asymmetrical positional relationship. Therefore, the first patterns and the second patterns can be designed to approximate a mirror-image shape and size. (Third embodiment)

[0116] In the first embodiment, both the integrated circuit components (IC1, IC2) and the switching elements (MOS1, MOS2) are mounted on a substrate 30. In contrast, in the present embodiment, as shown in Fig. 12, a control substrate 310 on which integrated circuit components are mounted and a power substrate 320 on which switching elements are mounted are provided separately. In an example of Fig. 12, a rotation angle sensor 29 is mounted on a power substrate 320, but may also be mounted on the control substrate 310.

[0117] Control wiring patterns P181 and P281 are provided on the control substrate (control circuit substrate) 310 and the power substrate (power circuit substrate) 320, respectively. Power wiring patterns are provided on the power substrate 320, not on the control substrate 310. The control wiring patterns P181 and P281 provided on the control substrate 310 and the control wiring patterns P181 and P281 provided on the power substrate 320 are connected to each other by wire harnesses H1 and H2.

[0118] As the first mounting component and the second mounting component mounted on the power substrate 320, SMD surface-mount components with a mirror-image pin placement are used in the same manner as in the first embodiment. Furthermore, as the first mounting component and the second mounting component mounted on the control substrate 310, SMD surface-mount components with the mirror-image pin placement are used. (Other embodiments)

[0119] Although several embodiments of the present disclosure are described above, not only the combinations of the configurations explicitly shown in the description of each embodiment, but also the configurations of several embodiments are partially combinable even if the combination is not explicitly shown, especially if the combination does not cause any difficulty. Unspecified combinations of the configurations described in the several embodiments and modification examples are also disclosed in the following description.

[0120] In each of the above embodiments, the rectangular SMD surface-mount component is mounted in a direction in which one side of a rectangle is parallel to the boundary line. The rectangular SMD surface-mount component may be mounted in a direction in which all four sides of the rectangle intersect the boundary line.

[0121] In each of the above embodiments, the number of pins of the first mounting component and the second mounting component is the same, and the number of pins used is also the same. Although the number of pins is the same, the number of pins used may be different.

[0122] The redundant switching device according to each of the above embodiments is made redundant by the two system circuits, ie, the first system circuit L1 (first system circuit) and the second system circuit L2 (second system circuit), but may be made redundant by three or more circuit systems.

[0123] In each of the above embodiments, the first mounting component and the second mounting component are surface mount components SMD, but may also be insert mount components.

[0124] In an example from Fig. 12, both the control substrate 310 and the power substrate 320 are divided into a first region A1 and a second region A2. However, either the control substrate 310 or the power substrate 320 may be divided into a first region A1 and a second region A2. Instead of making both the control circuit and the power conversion circuit redundant, either the control circuit or the power conversion circuit may be made redundant, and the other of the two may be non-redundant.

[0125] In each of the above embodiments, the boundary line formed by the slot 305 is a straight line, but may also be a combination of several straight lines, a curve, or a combination of curve and straight lines.

[0126] In the first embodiment, the second mounting direction coincides with the direction in which the first mounting direction is mirrored. The second mounting direction may differ from the first mounting direction.

[0127] In the first embodiment, the position of the second mounting component on the substrate 30 coincides with the reversed position of the first mounting component. The position of the second mounting component may differ from the reversed position of the first mounting component.

[0128] In each of the above embodiments, the rotation angle sensor 29 is located on the boundary line between the first region A1 and the second region A2. The rotation angle sensor 29 may be arranged at a position different from the boundary line. Furthermore, the rotation angle sensor 29 may be attached to a part other than the substrate 30, or the rotation angle sensor 29 may be omitted.

[0129] In the example of Fig. 2, the opening 837a is provided in the rear frame end 837, and the rotation shaft 870 is inserted through the opening 837a. The magnet 875 attached to the tip of the rotation shaft 870 is exposed through the opening 837a and faces the rotation angle sensor 29. The opening 837a may be eliminated, and a part of the rear frame end 837 may be inserted between the rotation angle sensor 29 and the magnet 875. In this case, too, the rotation angle sensor 29 may be arranged on the center line Ax of the rotation shaft 870.

[0130] In the embodiment of Fig. 1, the power conversion device includes the motor 80 for the EPS 8 as a power supply target. Another motor, such as a motor for driving the vehicle, may be a power supply target. In the first embodiment, a circuit constituting the inverters 120 and 220 is applied to the power conversion circuit provided on the substrate 30, but a boosting circuit may also be applied.

[0131] In the embodiment of Fig. 3, the switching elements 121 to 126, the motor relays 127 to 129, and the power supply relays 131 and 132 are all MOSFETs. An IGBT, a thyristor, or the like may be used. The power supply relays 131 and 132 may be mechanical relays. Furthermore, the second system circuit L2, like the first system circuit L1, may be an IGBT, a thyristor, or a mechanical relay instead of the MOSFET.

[0132] Although the Fig. 3 has an inter-system ground connection capacitor 41, the inter-system ground connection capacitor 41 may be eliminated (omitted). Although the Fig. 3 includes electromechanical connection capacitors 142 and 242, these electromechanical connection capacitors 142 and 242 may be eliminated. In this case, the ground pattern for each system or the power supply pattern for each system may be omitted from being divided and arranged in each area separated by the slot 305.

[0133] The inter-system ground connection capacitor 41 is mounted on the substrate 30 and electrically connects the ground of each system. This makes it possible to form a path for returning the noise propagated to the other system side via the motor windings 180 and 280, etc., to the host system circuit on the substrate 20. The electromechanical connection capacitors 142 and 242 connect the case connection patterns 156, 157, 256, and 257 to the ground pattern of the substrate 30. This makes it possible to form a low-impedance path for returning the noise propagated to the motor 80 side to the ECU 10 including the inverters 120 and 220. This can reduce the propagation of noise to the outside of the drive device 1, such as a vehicle.

[0134] In the first embodiment, a control circuit is provided for each of the power conversion circuits of the two system circuits, and the control circuit is also configured in two system circuits. A control circuit may be provided jointly for each of the power conversion circuits of the two system circuits, and the control circuit may be configured as only one (single) system circuit. Furthermore, all of the circuits, including the power conversion circuit, may be configured as one system.

[0135] Although various embodiments, configurations, and aspects of a redundant switching device of the present disclosure are described above by way of example, the embodiments, configurations, and aspects of the present disclosure are not limited to those described above. For example, embodiments, configurations, and aspects resulting from a suitable combination of technical elements disclosed in various embodiments, configurations, and aspects are also within the scope of the embodiments, configurations, and aspects of the present disclosure.

Claims

[1] Redundant switching device with a first system circuit (L1) and a second system circuit (L2) of identical function in order to design the function redundantly, wherein the redundant switching device comprises: - a substrate (30, 310, 320) which is divided into a first region (A1) in which at least a part of the first system circuit (L1) is provided, and a second region (A2) in which at least a part of the second system circuit (L2) is provided, and has a surface, wherein both the first region (A1) and the second region (A2) have a printed wiring (P12, P13, P22, P23, P181, P182, P191, P192); - a first mounting component (IC1, MOS1) included in the first system circuit (L1), having three or more pins and being surface-mounted on one surface of the substrate (30, 310, 320); and - a second assembly component (IC2, MOS2) which is included in the second system circuit (L2), has an identical number of pins as the first assembly component (IC1, MOS1) and has an identical function as the first assembly component (IC1, MOS1) and is surface-mounted on one surface of the substrate (30, 310, 320), wherein - a placement of numbers assigned to the respective pins of the first assembly component (IC1, MOS1) according to function is defined as a first pin placement with respect to a center point (C1) of the first assembly component (IC1, MOS1); - a placement of numbers assigned to the respective pins of the second assembly component (IC2, MOS2) according to function is defined as a second pin placement with respect to a center point (C2) of the second assembly component (IC2, MOS2); - the second pin placement is a mirror image of the first pin placement; - the first system circuit (L1) and the second system circuit (L2) control the supply of electrical energy to a motor (80) having a rotating shaft (870); - the first system circuit (L1) and the second system circuit (L2) each comprise a power conversion circuit (120, 220) which converts a supplied electrical energy to output the converted electrical energy to the motor (80); - the first system circuit (L1) and the second system circuit (L2) each have a control circuit (170, 270, 176, 276) that controls an operation of the energy conversion circuit (120, 220); and - the first assembly component (IC1, MOS1) and the second assembly component (IC2, MOS2) each comprise an integrated circuit component (IC1, IC2) which is contained in the control circuit (170, 270, 176, 276). [2] Redundant switching device according to claim 1, wherein - the pins of the first assembly component (IC1, MOS1) have a first reference pin having a predetermined function; - the pins of the second assembly component (IC2, MOS2) have a second reference pin having the predetermined function; - a direction of the first mounting component (IC1, MOS1) on the substrate (30, 310, 320), which is determined by a position of the first reference pin around a center of the first mounting component (IC1, MOS1), is defined as a first mounting direction; - a direction of the second mounting component (IC2, MOS2) on the substrate (30, 310, 320), which is determined by a position of the second reference pin around a center of the second mounting component (IC2, MOS2), is defined as a second mounting direction; and - the second mounting direction corresponds to a mirror image of the first mounting direction. [3] Redundant switching device with a first system circuit (L1) and a second system circuit (L2) of identical function in order to design the function redundantly, wherein the redundant switching device comprises: - a substrate (30, 310, 320) which is divided into a first region (A1) in which at least a part of the first system circuit (L1) is provided, and a second region (A2) in which at least a part of the second system circuit (L2) is provided, and has a surface, wherein both the first region (A1) and the second region (A2) have a printed wiring (P12, P13, P22, P23, P181, P182, P191, P192); - a first mounting component (IC1, MOS1) included in the first system circuit (L1), having three or more pins and being surface-mounted on one surface of the substrate (30, 310, 320); and - a second assembly component (IC2, MOS2) which is included in the second system circuit (L2), has an identical number of pins as the first assembly component (IC1, MOS1) and has an identical function as the first assembly component (IC1, MOS1) and is surface-mounted on one surface of the substrate (30, 310, 320), wherein - a placement of numbers assigned to the respective pins of the first assembly component (IC1, MOS1) according to function is defined as a first pin placement with respect to a center point (C1) of the first assembly component (IC1, MOS1); - a placement of numbers assigned to the respective pins of the second assembly component (IC2, MOS2) according to function is defined as a second pin placement with respect to a center point (C2) of the second assembly component (IC2, MOS2); - the first pin placement is identical to the second pin placement; - the pins included in the first assembly component (IC1, MOS1) have a first reference pin with a predetermined function; - the pins included in the second assembly component (IC2, MOS2) have a second reference pin with the predetermined function; - a direction of the first mounting component (IC1, MOS1) on the substrate (30, 310, 320), which is determined by a position of the first reference pin around a center of the first mounting component (IC1, MOS1), is defined as a first mounting direction; - a direction of the second mounting component (IC2, MOS2) on the substrate (30, 310, 320), which is determined by a position of the second reference pin around a center of the second mounting component (IC2, MOS2), is defined as a second mounting direction; - the first mounting direction and the second mounting direction are different from each other; - a boundary line between the first area (A1) and the second area (A2) is a straight line; and - the center point (C2) of the second mounting component (IC2) is located at a position different from the position obtained when the center point (C1) of the first mounting component (IC1) is inverted with the boundary line as an axis of symmetry. [4] Redundant switching device according to claim 3, wherein - the first system circuit (L1) and the second system circuit (L2) control the supply of electrical energy to a motor (80) having a rotating shaft (870); - the first system circuit (L1) and the second system circuit (L2) each comprise a power conversion circuit (120, 220) which converts a supplied electrical energy to output the converted electrical energy to the motor (80); and - the first system circuit (L1) and the second system circuit (L2) each have a control circuit (170, 270, 176, 276) which controls an operation of the energy conversion circuit (120, 220). [5] Redundant switching device according to claim 4, further comprising: - a sensor element (29) mounted on one surface of the substrate (30, 310, 320) and detecting a rotation angle of the rotary shaft (870), wherein - at least a part of the sensor element (29) is positioned on a boundary line between the first region (A1) and the second region (A2). [6] Redundant switching device according to claim 4 or 5, wherein - the power conversion circuit (120, 220) has a power wiring pattern (P12, P13, P22, P23); - the control circuit (170, 270, 176, 276) has a control wiring pattern (P181, P182, P191, P192); and - the printed wiring provided on the substrate (30, 310, 320) contains both the power wiring pattern (P12, P13, P22, P23) and the control wiring pattern (P181, P182, P191, P192). [7] Redundant switching device according to one of claims 4 to 6, wherein the first mounting component (IC1, MOS1) and the second mounting component (IC2, MOS2) each comprise an integrated circuit component (IC1, IC2) included in the control circuit (170, 270, 176, 276). [8] Redundant switching device according to one of claims 4 to 7, wherein the first mounting component (IC1, MOS1) and the second mounting component (IC2, MOS2) each comprise a switching element (MOS1, MOS2) included in the power conversion circuit (120, 220). [9] Redundant switching device according to claim 1 or 2, further comprising: - a sensor element (29) mounted on one surface of the substrate (30, 310, 320) and detecting a rotation angle of the rotary shaft (870), wherein - at least a part of the sensor element (29) is positioned on a boundary line between the first region (A1) and the second region (A2). [10] Redundant switching device according to one of claims 1, 2 or 9, wherein - the power conversion circuit (120, 220) has a power wiring pattern (P12, P13, P22, P23); - the control circuit (170, 270, 176, 276) has a control wiring pattern (P181, P182, P191, P192); and - the printed wiring provided on the substrate (30, 310, 320) contains both the power wiring pattern (P12, P13, P22, P23) and the control wiring pattern (P181, P182, P191, P192). [11] Redundant switching device according to one of claims 1, 2, 9 or 10, wherein the first mounting component (IC1, MOS1) and the second mounting component (IC2, MOS2) each comprise a switching element (MOS1, MOS2) included in the power conversion circuit (120, 220).

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