Sensor system and sensor carrier

Abstract

The present invention relates to a sensor system and a sensor carrier.

Description

The present invention relates to a sensor system, in particular a sensor system for temperature measurement.In such sensor systems, a sensor is often arranged in a housing, for example in order to protect the sensor from mechanical or chemical influences. The measured variable, for example the temperature, reaches the sensor via a housing wall and can then be detected by the sensor. Such a sensor system is known from DE 20 2015 107 162 U1.Depending on the application, it may be particularly desirable for the sensor to respond quickly to a change in the measured variable. The housing is in the way of this goal, since the housing wall as such in most cases represents an obstacle for the measured variable and thus extends the response time. In the case of temperature measurements, it is known to couple the sensor directly to the inside of the housing by means of heat-conducting paste, so that a direct heat conduction is present between the housing wall and the sensor. Nevertheless, even heat-conducting paste delays the response time.It is also known to arrange the sensor on a carrier which is pushed into the housing. DE 39 43 437 A1 discloses such a carrier which is prestressed in the axial direction by a spring force. There, a temperature measuring element is applied to one side of a carrier film with good thermal conductivity. The carrier foil is attached to the carrier and is in heat-conducting contact with the housing on its other side. The structure known from DE 39 43 437 A1 is complex, unstable and prone to errors. Therefore, it is not suitable for precise, modern sensors.It was therefore an object of the invention to provide a reliable sensor system which enables a rapid response of the sensor.The sensor system includes a housing, a sensor carrier, and a sensor. The housing has an inner circumferential surface and an end-face inner contact surface. The sensor carrier is arranged in the housing. The sensor has a sensor surface via which a measured variable can reach the sensor. The sensor carrier has a holding section and a sensor section. The holding portion is in contact with the inner circumferential surface of the housing, whereby the sensor carrier is supported in the radial direction with respect to the housing. The sensor is arranged on the sensor section, in particular in the region of an end face of the sensor section. The holding portion and the sensor portion are tiltable relative to each other. Preferably, the holding section and the sensor section are arranged articulated to one another. The sensor surface is in contact, in particular conductively in contact, with the contact surface, and in particular in such a way that the measurement variable can be transmitted from the contact surface to the sensor surface.In the sensor system, functional division takes place compared to the prior art. The holding section of the sensor carrier ensures that the sensor carrier can assume a defined, stable position with respect to the housing. The sensor section, on which the sensor is arranged, can be tilted or rotated relative to the holding section, preferably it has at least two degrees of freedom with respect to the holding section. In this way, the orientation of the sensor section can be selected such that the sensor surface and the contact surface are in direct contact as fully as possible over the entire surface. The inventors have found that the exact position of the contact surface relative to the inner circumferential surface can deviate due to tolerances. When using a rigid sensor carrier, these deviations cannot be compensated for, so that an air gap occurs between the sensor surface and the contact surface, as a result of which the transmission of the measurement variable is hindered and the response time of the sensor is increased. The relative movability between the holding section and the sensor section ensures that the sensor surface and the contact surface bear against each other over the entire area to the greatest possible extent. The air gap then no longer obstructs the transmission of the measured variable, for example a heat flux, between the sensor surface and the contact surface. The sensor thereby responds more quickly to changes in the measured variable.The housing preferably has a main axis X along which the housing runs. This applies in particular when the housing is elongated. The sensor section is preferably tiltable with respect to the holding section about axes which run perpendicular to the main axis X. The sensor section can also be rotatable about the main axis X relative to the holding section. However, this is often not necessary for the adaptation of the sensor surface and the contact surface. The holding section and the sensor section are preferably arranged one behind the other in the axial direction.The sensor carrier can be both multi-part and one-part. If it is multi-part, the holding section and the sensor section are provided on different parts of the sensor carrier, in particular a holding part and a sensor part. The two-part nature enables a particularly efficient functional separation of the two sections. Thus, the individual parts of the sensor carrier can be connected to one another, for example, by a joint, whereby tilting of the sensor section relative to the holding section is made possible in a simple manner. However, a joint is not absolutely necessary. In the case of one-pieceity, a solid-state joint, in particular a film hinge, can be provided, for example, for separating the two sections from one another. The sensor systems concerned are often very small and the housing can have a diameter of a few millimeters, for example. A one-piece sensor carrier is substantially easier to install here.The holding part and / or the sensor part preferably consist of plastic, in particular a thermosetting plastic and / or a thermoplastic, e.g. polyethylene (PE) or polyphenylene sulfide (PPS), preferably with a fiber reinforcement, in particular glass fibers.The sensor section preferably has an outer diameter D 1 and a height H 1, wherein H 1<D 1. In other words, the sensor section thus has the shape of a disk. As a result, the sensor section can be tilted slightly in the housing even if it has only a slight play in the radial direction. As already mentioned, the holding section brings about a stable positioning of the sensor carrier in the housing. Since the housing is often elongate and has a circular diameter, the holding section preferably has an outer diameter D2and a height H2, wherein H2>D2. In other words, the holding section is therefore likewise embodied to be elongate. Even if the holding section in the housing has a certain clearance in the radial direction, it can nevertheless position the sensor carrier securely in the housing on account of its shape. These dimensioning of the holding section and the sensor section reinforce, in particular in combination, the functional separation of the two sections, the stable positioning on the one hand and the flexible orientation of the sensor section on the other hand. This separation to be performed can be enhanced by making the holding portion longer in the axial direction than the sensor portion (H 2>H 1).The diameters D 1, D 2 of the holding section and the sensor section can be identical (D 1=D 2). This facilitates the handling of the two individual parts during production. Alternatively, the diameter D 1 of the sensor portion may be smaller than the diameter D 2 of the holding portion (D 1<D 2). In this case, the holding portion can be manufactured so as to have only an extremely small clearance or no clearance at all in the housing (press fit). The sensor section is then nevertheless movable in the housing since it has a slightly smaller diameter. The deviation of the diameters is preferably not more than 1% (>0 to 1%), based on D2, and / or not more than 100 μm (>0 μm to 100 μm).The holding section and the sensor section are preferably arranged together in the housing. Often, after the insertion of the two sections into the housing, only one of the two sections is still directly accessible. As a rule, this is the holding section. In order to also enable a clear positioning of the sensor section in the circumferential direction in this case, the holding section and the sensor section are preferably coupled in the circumferential direction. This coupling causes a rotation of one section to result in a rotation of the other section. The coupling can be realized, for example, by means of axial projections which engage in one another. It is also possible that despite the coupling a certain play is provided in the circumferential direction. The two sections can then be rotated relative to one another within the scope of the play. However, a rotation beyond this leads to a co-rotation of the respective other section. The axial projections can also be used for fixing the holding part and the sensor part to one another, in particular in the axial direction. For this purpose, at least one axial protrusion of at least one of the parts is designed such that, in the assembled state, it protrudes into a recess of the other part. In this case, a recess, for example a large bore, can also be provided for a plurality of projections. The projections are then arranged, for example, in a circle, so that they all project into the recess. The parts can then be plugged together in the axial direction and in this way fixed to one another and mounted.As already described, the invention is intended to realize the flatest possible contact of the sensor surface and contact surface. In advantageous refinements, the sensor carrier additionally has an elastic connecting part, via which the holding section and the sensor section are connected to one another. Elastic is understood to mean, in particular, materials having an elastic modulus <2 GPa, preferably ≤500 MPa. An elastomer is preferably used here. The elastic connecting part is used in particular in a multi-part sensor carrier. In this case, it is arranged between the holding part and the sensor part. During assembly, the elastic connecting part has the effect that the sensor surface is pressed uniformly against the contact surface and the sensor is in particular not loaded with a large force on one side. The connection between the holding section and the sensor section, which is produced by the connecting part, can therefore be in particular a connection in the pressure direction. The elastic connecting part is preferably circular, wherein the cross section can be angular, elliptical or circular, for example. An O-ring has proven to be particularly advantageous. The elastic connecting part may be interposed between the holding portion and the sensor portion. In this case, the connecting part is compressed non-uniformly during assembly, but thereby causes a uniform pressing of the sensor surface against the contact surface.An arrangement of the elastic connecting part around the axial projections of at least one of the sections is particularly advantageous. In this way, the elastic connecting part can be pre-assembled on the one part, which simplifies the assembly as a whole and prevents the elastic connecting part from being lost during the assembly. The holding part and the sensor part are preferably fixed to one another by the elastic connecting part, in particular by the elastic connecting part being tensioned around the axial projections, that is to say mounted under tension around the axial projections. For this purpose, the connecting part is preferably dimensioned such that it has to be stretched in order to be fitted over the axial projections. In the assembled state, the material of the connecting part contracts and brings about a fixing of holding part and sensor part by frictional force. This also facilitates the assembly. The axial projections are preferably designed, in particular when used in combination with the elastic connecting part, in such a way that the holding part and the sensor part have play in the radial direction. This facilitates the tilting of the sensor section relative to the holding section. The elastic connecting part in this case ensures the fixing of the parts to one another, whereby, despite the radial play, an assembly of the entire assembly is possible in one step.If an elastic connecting part is provided together with axial projections, the axial projections preferably have a length in the axial direction which is greater than the thickness of the connecting part in the axial direction and in the relaxed state. As a result, the holding part and the sensor part can be inserted into one another even when the elastic connecting part is located between them. The assembly of holding part, sensor part and connecting part (sensor carrier) can thereby be pre-assembled and subsequently arranged in the housing as a whole.Alternatively, it is also possible that the axial projections are shorter or of equal length compared to the thickness of the connecting part in the relaxed state. This is possible in particular when using a circular (circumferential) connecting part with a rectangular cross section (profile). Depending on the configuration, a length may already be sufficient here, for example, which is approximately 50% of the thickness.In advantageous refinements, the sensor carrier is fixed at least partially in the housing by means of an adhesive. This ensures that the sensor carrier no longer changes its position after an initial positioning during manufacture, so that the sensor surface remains connected to the contact surface over the entire service life. Due to the special requirements of sensor systems, in particular those for temperature measurements, not every adhesive is well suited for fixing the sensor carrier. On the one hand, it is advantageous if the adhesive has a high thermal conductivity. In this way, it contributes to the fact that, in the case of a temperature measurement, the measured variable (heat) reaches the sensor as quickly as possible. The adhesive therefore preferably has a thermal conductivity of >20 W / (m·K). In sensor systems for temperature measurement, thermal expansion also inevitably occurs due to the field of application. Therefore, the inventors have found that the adhesive should preferably have an elongation at break of >90%. In this way, the individual parts of the sensor system, in particular the sensor carrier, the housing and the sensor itself, can expand and contract again under the influence of temperature without the adhesive suffering damage. Silicone-based adhesives have proven to be particularly advantageous in this case. This has an elongation at break of 100% and a thermal conductivity of 40 W / (m·K). Within the scope of the invention, the sensor surface is in contact with the contact surface in particular even when adhesive is located between the sensor surface and the contact surface.In advantageous refinements, the sensor carrier has at least one channel for conducting the adhesive during production. The channel can be formed as a groove on an outer side of the sensor carrier and / or as a bore in the sensor carrier. The channel allows the adhesive to flow along the sensor carrier and thereby distribute itself. This achieves a secure connection of the sensor carrier and its individual parts to the housing. The channel can extend partially in the sensor section and partially in the holding section. It is advantageous if the channel has a width in the circumferential direction that is greater than the clearance of the holding section and sensor section in the circumferential direction. In this way, a rotation within the scope of this play does not result in the two channel sections no longer merging into one another. The channel then always remains as a functional channel even in the case of a rotation within the scope of the play. The sensor carrier can furthermore have an annular groove which is arranged in particular on the holding section. The annular groove is connected to the channel, so that the adhesive can also flow from the channel into the annular groove or vice versa. The annular groove allows the adhesive to completely flow around the sensor carrier in the circumferential direction. As a result, the connection of the holding section to the housing is considerably strengthened.The housing is preferably cylindrical and / or has a constant internal cross section in the axial direction, which is in particular round. The constant internal cross section makes it possible to push the sensor carrier from one end to the other of the housing during production. As a result, the housing can be closed at the end, for example, in a first step, and the sensor carrier is only subsequently arranged in the housing.The housing preferably has an outer diameter D 3 of between 5 mm and 20 mm. The wall thickness W of the housing is preferably between 0.2 mm and 1.0 mm.The housing is preferably multi-part, wherein the inner circumferential surface is part of a sleeve section of the housing and the contact surface is part of a cover of the housing. The cover is arranged at one end of the sleeve portion for the purpose of assembly and connected to the sleeve portion. For example, the sleeve section and cover can be connected to one another by laser welding. The invention is particularly suitable for housings produced in this way, since the housing is distorted during laser welding. The inventors have found that this produces deviations which can be compensated for by the invention. The cover is preferably disk-shaped. Sleeve section and cover preferably each have a chamfer in the region of their contact surfaces.The invention is particularly suitable for sensor systems in which the sensor is a temperature sensor and / or a force-sensitive sensor, for example a strain gauge. Both a temperature change and the measured variables of force-sensitive sensors are transmitted through the housing wall. For a rapid response of these sensors, the full-area contact of the sensor surface and contact surface achieved by the invention is of great advantage. The full-surface contact is also of great importance in particular in the case of encapsulated sensors. The sensor is preferably arranged on the end side of the sensor carrier. The sensor is preferably a PTC, a PT 1000, an NTC, a KTY or a hybrid sensor, in particular a combination of a PT 1000 and a heater. The sensor is preferably a thin-film measuring element, such as platinum measuring resistors or other temperature measuring elements, such as silicon measuring elements, or in particular a hybrid sensor, which consists of a combination of platinum measuring resistor and platinum heating element. The sensor section preferably has a recess for the sensor. It is also possible that a plurality of sensors are arranged on the sensor section. An arrangement on the sensor section means in particular that the sensor is accessible from at least one direction, i.e. not completely covered by the sensor section.In advantageous refinements, the sensor system comprises a holder fixedly connected to the housing and / or a marking on the outside of the housing. Optionally, a secondary sensor can also be provided, the positioning of which is optionally fixed relative to the holder or the marking. The secondary sensor can be used, for example, together with the sensor for flow measurement. Alternatively, the secondary sensor can also be used to measure a different physical variable compared to the sensor, for example to measure a vibration. Even if the secondary sensor is not visible from outside the housing, it is then possible to determine exactly where the secondary sensor is located from outside on the basis of the position of the holder or the marking. If the holding section and the sensor section are coupled to one another in the circumferential direction, the sensor carrier and with it the secondary sensor can still be rotated even after being inserted into the housing in such a way that the secondary sensor is fixed in the intended position. This applies in particular if the secondary sensor is arranged on the sensor section.In order to protect the interior of the housing, the sensor carrier and the sensor from dirt during operation, it is advantageously provided that the housing is closed at the end by a closure. The closure can comprise a silicone ring and / or an adhesive bond. The bond may be, for example, an epoxy resin. The housing is preferably hermetically sealed by the closure. Before the closure is attached, sensor lines can also be provided which transmit the sensor data to an evaluation device arranged outside the housing.The preferably present features described with respect to the holding section and the sensor section can also be related in each case to the holding part and the sensor part.The object of the invention is also achieved by a sensor carrier for a sensor system, which has a holding section and a sensor section, wherein the holding section and the sensor section are tiltable relative to one another, and by a sensor system having such a sensor carrier. The sensor carrier may have one or a combination of the features described above.The invention is illustrated and explained below by way of example with reference to the drawings. Shown in: FIG. 1 schematically shows an embodiment of a sensor system, FIG. 2 schematically shows an embodiment of a sensor carrier and a sensor in a cross section, FIG. 3 schematically shows an embodiment of a housing in a cross section, FIG. 4 schematically shows a further embodiment of a sensor systemThe sensor system 100 shown in FIG. 1 comprises a housing 10, a sensor carrier 20 and a sensor 50. the housing 10 is cylindrical and has a constant internal cross section. The housing 10 is elongated and extends along a main axis X. The sensor carrier 20 is arranged in the housing.The sensor carrier 20 comprises a holding section 30 and a sensor section 40, which are arranged one behind the other along the main axis X. In this embodiment, the sensor carrier 20 is multi-part and comprises a holding part 32 and a sensor part 42. the holding section 30 is arranged on the holding part 32 and the sensor section 40 on the sensor part 42. Between the holding section 30 and the sensor section 40, an elastic connecting part 60 in the form of an O-ring is arranged.The housing 10 is closed at the lower end. The bottom of the housing 10 does not run exactly at right angles to the lateral housing wall, which is clear by the angle φ. The holding portion 30 and the sensor portion 40 are tiltable relative to each other. In the schematic illustration of FIG. 1, the two sections 30, 40 are not directly connected to one another. If the sensor carrier 20 is moved into the housing 10 from above, the sensor section 40 can adapt to the angle φ by tilting relative to the holding section 30. The tilting takes place about axes which run perpendicular to the main axis X.A sensor 50 is arranged on a lower side of the sensor section 40. This is pressed against the bottom of the housing 10 when the sensor carrier 20 is introduced into the housing 10.As a result, a sensor surface 51 (see FIG. 2 ) of the sensor 50 and a contact surface 18 (see FIG. 3 ) of the housing 10 are in contact with each other.The sensor carrier 20 is fixed in the housing 10 by means of an adhesive 70. Specifically, the adhesive 70 fixes the sensor 50, the sensor portion 40, the elastic connection part 60, and the holding portion 30 to the housing 10.The sensor section 40 has a cylindrical basic shape with an outer diameter D 1 and a height H 1. The outer diameter D 1 is greater than the height H 1, and the sensor portion is disk-shaped. As a result, the sensor section 40 can also be slightly rotated in the housing 10 about axes running perpendicular to the main axis X. The holding section 30 has a cylindrical basic shape with an outer diameter D 2 and a height H 2. The height H 2 is greater than the outer diameter D 2, and the holding section 30 therefore has an elongate basic shape. As a result, the holding section 30 cannot be tilted / rotated, or can hardly be tilted / rotated, in the housing 10 even at a radial distance from the housing 10 (except for a rotation about the main axis X). Thereby, the holding portion 30 stably holds in the housing 10.By tilting the sensor section 40, the elastic connecting part 60 is compressed on one side. The elastic connecting part 60 thus compensates for the tilting away and brings about a uniform pressing of the sensor 50 against the bottom of the housing 10.The sensor carrier 20 shown in FIG. 2 is suitable for use in a sensor system 100. The sensor carrier 20 is multi-part and has a holding part 32, a sensor part 42 and an elastic connecting part 60.The sensor carrier 20 has a holding section 30 and a sensor section 40. At the end of the sensor section 40, a sensor 50 is arranged in a recess of the sensor section 40. The sensor 50 has a downwardly directed sensor surface 51. The holding portion has a central bore 36 and the sensor portion 40 has a central bore 46. The bores 36, 46 merge into one another. A sensor line 52 runs through the bores 36, 46. Signals of the sensor 50 can be transmitted to an external evaluation device (not shown) via the sensor line 52.Between the sections 30, 40 the elastic connecting part 60 is arranged in the form of an O-ring. Since the sensor carrier 20 is not arranged in a housing 10 of a sensor system 100, the elastic connecting part 60 is relaxed, i.e. not compressed.The holding section 30 has axial projections 34 which point in the direction of the sensor section 40. The sensor section 40 has axial projections 44 which point in the direction of the holding section 30. The holding portion 30 and the sensor portion 40 are coupled around the main axis X in the circumferential direction via the protrusions 34, 44. In this case, there is play in the circumferential direction between the projections 34, 44. A rotation of one of the sections 30, 40 does not lead directly to a rotation of the other section 40, 30 because of the play. Only when the play is used up does a further rotation lead to a co-rotation of the respective other element. The elastic connecting part 60 is stretched around the projections 34, 44. In this way, the elastic connecting part 60 holds the sections 30, 40 together.The axial projections 34, 44 each project into a recess 35, 45 of the other part 32, 42. The axial projections 34, 44 have a length L in the axial direction which is greater than the thickness D of the connecting part 60 in the axial direction in the illustrated, relaxed state of the connecting part 60. As a result, the sensor part 42 can be easily tilted with respect to the holding part 32, which promotes the adaptation of the sensor surface 51 and the contact surface 18.The sensor carrier 20 has a channel 22 in the form of a groove, which runs partially in the holding section 30 and partially in the sensor section 40. After mounting the sensor carrier 20 in a housing (not shown here), an adhesive (likewise not shown here) can be distributed in the channel 22. This leads to a secure and stable fastening of the sensor carrier 20 to all components in the housing.The sensor carrier 20 comprises a secondary sensor 54 which is arranged in a lateral recess of the holding section 30. The secondary sensor 54 may also be disposed in the channel 22 in other embodiments. A secondary sensor line 56 is connected to the secondary sensor 54, which line can likewise be led to the evaluation device.The housing 10 shown in FIG. 3 may be used in a sensor system 100. For example, the sensor carrier 20 from FIG. 2 can be arranged in the housing 10 according to FIG. 3.The housing 10 is elongated, cylindrical and has a constant internal cross section in the axial direction, which is circular. The housing 10 is multi-part and comprises a sleeve section 12 and a cover 14. In other embodiments, the inner peripheral surface 16 may have other shapes, such as a rectangular shape in cross section. The cover 14 forms a contact surface 18 on its side facing the interior of the housing.The housing 10 has a holder 17 which can serve, for example, for fastening the sensor system 100 in a superordinate assembly.If the sensor carrier 20 from FIG. 2 is inserted into the housing 10 from FIG. 3, the holding section 30 of the sensor carrier 20 is in contact with the inner circumferential surface 16 of the housing 10 and the sensor surface 51 of the sensor 50 is in contact with the contact surface 18. If, during the mounting of the cover 14 on the sleeve section 12, a distortion occurs which leads to the contact surface 18 not being arranged exactly perpendicular to the circumferential surface 16, the tilting of the sensor section 40 relative to the holding section 30 and the elastic connecting part 60 ensures that the sensor surface 51 nevertheless lies over the full surface of the contact surface 18. In this way, the sensor carrier 20 is held stably in the housing 10 by means of the holding section 30, and the sensor surface 51 is in contact with the contact surface 18 over its entire surface, so that a measured variable reaches the sensor 50 quickly through the cover 14.Here too, it can be ensured by means of an adhesive (not shown) that the sensor carrier 20 is permanently fixed in the housing 10.The sensor system 100 illustrated in FIG. 4 comprises a sensor carrier 20 which is arranged in a housing 10. The sensor carrier 20 has a holding section 30 and a sensor section 40. In this embodiment, the sensor carrier 20 is formed in one piece. Between the holding section 30 and the sensor section 40, the sensor carrier 20 has a taper 24, whereby it gains flexibility at this point. A so-called solid joint is present. As a result, the sensor portion 40 can be tilted relative to the holding portion 30. A holder 38 is arranged on the holding section 30. The holder 38 is dimensioned such that it can be pressed into the housing 10. In this way, the holding section 30 holds the sensor carrier 20 stably in the housing 10. Deviations of the orientation of the contact surface 18 from the setpoint value can be compensated for by the flexibility of the sensor section 40 with respect to the holding section 30 during assembly.The housing 10 is closed at the end side with respect to the contact surface 18 by a silicone ring 13 and an adhesive bond 15.List of reference characters10 Housing 12 Sleeve section 13 Silicone ring 14 Cover 15 Adhesive 16 Inner circumferential surface 17 Holder 18 Contact surface 20 Sensor carrier 22 Channel 24 Taper 30 Holding section 32 Holding part 34 Axial protrusion 35 Recess 36 Bore 38 Holder 40 Sensor section 42 Sensor part 44 Axial protrusion 45 Recess 46 Bore 50 Sensor 51 Sensor surface 52 Sensor line 54 Secondary sensor 56 Secondary sensor line 60 Elastic connecting part 70 Adhesive 100 Sensor system D Thickness D 1 Outer diameter of the sensor section D 2 Outer diameter of the holding section D 3 Outer diameter of the housing H 1 Height H 2 Height L Length X Main axis φ AngleReferences included in the specificationThis list of documents cited by the applicant has been produced in an automated manner and is only included for the better information of the reader. The list is not part of the German patent application or utility model application. The DPMA does not take any adhesion for any faults or omissions.Patent Literature citedDE 20 2015 107 162 U1

[0002] DE 39 43 437 A1

[0004]

Claims

A sensor system having a housing, a sensor carrier and a sensor, wherein the housing has an inner circumferential surface and an inner contact surface on the end face, wherein the sensor carrier is arranged in the housing and wherein the sensor has a sensor surface via which a measurement variable can enter the sensor, characterized in that the sensor carrier has a holding section and a sensor section, that the holding section is in contact with the inner circumferential surface of the housing, that the sensor is arranged on the sensor section, that the sensor surface is in contact with the contact surface and that the holding section and the sensor section are tiltable relative to one another.Sensor system according to claim 1, characterised in that the sensor carrier is multi-part, wherein the holding section and the sensor section are provided on a holding part and a sensor part of the sensor carrier, or that the sensor carrier is one-part.Sensor system according to one of the preceding claims, characterized in that the sensor section has an outer diameter D1 and a height H1, wherein H1 < D1, and / or in that the holding section has an outer diameter D2 and a height H2, wherein H2 > D2.Sensor system according to one of the preceding claims, characterized in that the sensor section has an outer diameter D1 and the holding section has an outer diameter D2, and in that the diameters D1, D2 of the holding section and the sensor section are identical (D1 = D2) or in that the diameter D1 of the sensor section is smaller than the diameter D2 of the holding section (D1 < D2), in particular by >0 to 1%, based on D2, and / or >0 to 100 μm.Sensor system according to one of the preceding claims, characterized in that the holding part and the sensor part are coupled in the circumferential direction, in particular by means of axial projections, a clearance optionally being provided in the circumferential direction.Sensor system according to one of the preceding claims, characterized in that the sensor carrier has an elastic connecting part, via which the holding part and the sensor part are connected to one another, wherein the elastic connecting part is preferably circular, in particular an O-ring.Sensor system according to claim 6, characterised in that the elastic connecting part is tensioned around the axial projections and fixes the holding part and the sensor part to each other, wherein the axial projections are preferably designed such that the holding part and the sensor part have play in the radial direction.Sensor system according to either of Claims 6 and 7, characterized in that the axial projections have a length in the axial direction which is greater than the thickness of the connecting part in the axial direction and in the relaxed state.Sensor system according to one of the preceding claims, characterized in that the sensor carrier is fixed in the housing by means of an adhesive, wherein the adhesive preferably has an elongation at break of > 90% and / or a thermal conductivity of > 20 W / (m·K) and / or is a silicone.Sensor system according to one of the preceding claims, characterized in that the sensor carrier has at least one channel for discharging the adhesive from the contact surface during assembly, wherein the channel is preferably designed as a groove on the outer side of the sensor carrier and or runs partially in the sensor section and partially in the holding section and / or has a width B in the circumferential direction which is greater than the play of the holding section and sensor section in the circumferential direction.Sensor system according to one of the preceding claims, characterized in that the sensor carrier, in particular the holding section, has an annular groove, which is preferably connected to the channel.Sensor system according to one of the preceding claims, characterized in that the housing is cylindrical and / or has a constant internal cross section in the axial direction.Sensor system according to one of the preceding claims, characterized in that the housing is multi-part, wherein the inner circumferential surface is part of a sleeve section and the contact surface is part of a cover.Sensor system according to one of the preceding claims, characterized in that the sensor is arranged on the end side of the sensor carrier.Sensor system according to one of the preceding claims, characterized in that the sensor is a temperature sensor and / or a force-sensitive sensor.Sensor system according to one of the preceding claims, characterized in that a holder or a marking which is fixedly connected to the housing is provided on the outside of the housing.Sensor system according to one of the preceding claims, characterized in that a secondary sensor is provided, the positioning of which is preferably fixed relative to the holder or the marking.Sensor system according to one of the preceding claims, characterized in that the housing is closed at the end side by a closure which preferably comprises a silicone ring and / or an adhesive bond.Sensor carrier, in particular as defined in one of the preceding claims, for a sensor system having a holding section and a sensor section, wherein the holding section and the sensor section are tiltable relative to each other.

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