Tool reference for multi-level referencing and device and method for determining an orientation and / or position of a component therewith

Abstract

Tool reference (200) for determining at least one orientation and / or position of a reference element, wherein the tool reference (200) is attached to the reference element, and including a device for positioning one or more components (600), comprising the tool reference (200), and a method for determining at least one orientation and / or position of a reference element using the tool reference (200) in the device for positioning one or more components (600).

Description

Technical field

[0001] The present disclosure relates to an optical tool reference for determining at least one orientation and / or position of a reference element and a device comprising one or more tool references, wherein the reference element is included in the pick-and-place actuator. In particular, the pick-and-place actuator comprises a gripper, and such a device can be arranged to modify at least one position and / or orientation of the pick-and-place actuator using the at least one upper position and / or upper orientation of the gripper. State of the art

[0002] Similar devices and components are known from the prior art, such as US 2021 / 0195816. This document discloses a device comprising a bondhead with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system attached to the carrier to move the bondhead between a nominal working position and a standby position, a drive attached to the bondhead for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier, and at least one component camera. Either the second drive system is also designed for high-precision corrective movements with the bondhead, or a third drive system is provided for high-precision corrective movements with the substrate. At least one reference mark is attached to the bondhead or to the component gripper.

[0003] In systems that use one or more cameras for alignment, multiple measurements can be performed with one or more substrate cameras (or look-down cameras) and / or one or more component cameras (or look-up cameras). The solution described in US 2021 / 0195816 is arranged so that at least one reference mark can be measured with both a substrate camera and a component camera. However, mechanical inaccuracies and thermal effects can lead to measurement errors in such systems, causing unwanted misalignments between components and substrates. There is an increasing need to further reduce unwanted misalignments as the mounting accuracy that must be achieved consistently increases significantly. Summary of the invention

[0004] The present invention is intended to solve the above-mentioned problems of the prior art. One object of the present invention is to provide an optical tool reference for multi-level referencing according to the features of independent claim 1, an apparatus according to the features of independent claim 8, and a method according to the features of independent claim 12 for determining the orientation and / or position of a component. Further advantageous implementations and embodiments are set forth in the respective subclaims and in the figures. Short description of the characters

[0005] Further advantages and features of the invention are illustrated in the following figures, namely: Fig. 1, which is a schematic front view of the relevant parts of an apparatus for aligning one or more components with one or more substrates before and / or during attachment; Fig. 2, which shows a schematic side view of the relevant parts of the pick and place actuator of a device for aligning one or more components with one or more substrates before and / or during attachment; and Fig. 3, which shows a schematic cross-section of a tool reference arranged to be imaged by one or more under-view cameras. Description of the characters

[0006] The figures illustrate a first axis 910, a second axis 920, and a third axis 930. The first axis 910 is perpendicular to the second axis 920, and the third axis 930 is perpendicular to both the first axis 910 and the second axis 920. In use, the first axis 910 is considered to be directed in the Y direction, the second axis 920 is considered to be directed in the X direction, and the third axis 930 is considered to be directed in the Z direction. Conventionally, in use, the axes in the corresponding directions are therefore referred to as the Y axis 910 and the X axis 920 and are substantially horizontal, level, or approximately horizontal.

[0007] In terms of functionality, the X-axis 920 and the Y-axis 910 can be interchanged. Conventionally, in use, the axis in the corresponding direction is therefore referred to as the Z-axis 930 and is substantially vertical, vertical, or approximately vertical. To clarify the description of the various components, the figures show parts in these conventional orientations. To clarify the description of the various components, some relative terms such as "top," "side," and "bottom" have been used to conform to this convention. "For" should be interpreted as "suitable for."

[0008] The apparatus described in this disclosure can be arranged by one skilled in the art to operate in various deviations from the conventional orientations and nominal coordinate axes.

[0009] Fig. 1 shows a schematic cross-section, viewed from a side, of relevant parts of a device 100 suitable for aligning one or more components 600 with one or more substrates 300 before and / or during attachment according to one of the methods disclosed herein. In particular, the device 100 is viewed with respect to a plane including the X-axis 920, which nominally has a positive left-to-right direction, and the Z-axis 930, which nominally has a positive bottom-to-top direction. The Y-axis 910 is nominally depicted as having a positive direction into the plane of the drawing from the viewer's perspective.

[0010] The device 100 can, for example, be a device for attaching chips, such as a bonding device. The chips are typically rectangular in shape, but round or trapezoidal shapes are also possible.

[0011] In general, a degree of alignment can be corrected if at least a small degree of relative movement in one or more directions is possible between a component 600 and a substrate 300, which may be possible in an initial phase of attachment. This relative movement may be approximately linear along one or more axes 910, 920, 930 and / or rotational about one or more axes 910, 920, 930. No significant degree of alignment is possible after one or more components 600 have been firmly attached to a substrate 300.

[0012] The one or more substrates 300 may include one or more substrate marks (or substrate alignment targets) 340 suitable for determining a position and / or orientation of the one or more substrates 300, wherein one or more components 600 can be mounted and secured with micrometer or submicrometer precision. The one or more substrates 340 may be any suitable object for alignment. A substrate mark 340 may, for example, be one or more structural features of at least one portion of a substrate 300, one or more optical features of at least one portion of a substrate 300, at least one portion of a reference mark, or any combination thereof.

[0013] The methods and apparatus described herein for aligning one or more components 600 are not limited to chips. A component 600 may, for example, be a chip, a semiconductor package, a die, a flip chip, an integrated circuit, another substrate, an optical element, an electronic element, an electro-optical element, or any combination thereof. For example, a component 600 may be attached to a substrate. For example, one or more components 600 may be attached to a substrate 300. For example, a component 600 may be attached to one or more substrates 300.

[0014] During one or more steps of the methods described below, the device may be preconfigured to perform one or more predetermined operations to improve throughput. Additionally or alternatively, the device may be preconfigured to control one or more operations for use.

[0015] The one or more substrates 300 may be one or more metallic substrates, also referred to as one or more lead frames, on which one or more components 600 are soldered onto islands arranged in such a way, which may optionally be adjacent to one another. However, the methods and apparatus described below are not limited to lead frames - the one or more substrates 300 may be any object that has one or more attachable surfaces and one or more devices or attachment positions. A substrate may, for example, be a metallic substrate, a substrate strip, a lead frame, a wafer, another component, or any combination thereof. The one or more substrates 300 may also be referred to as one or more media.

[0016] Fig. 1 shows the apparatus 100, which includes a pick and place actuator 150, an optional feed unit 120 for providing the one or more components 600, and an optional substrate chuck 140 for providing the one or more substrates 300. The feed unit 120 is positioned at a loading position 820 for loading the components and may include a system for handling the components, such as a wafer or a tape. The substrate chuck 140 is positioned at a mounting position 800 for mounting components. Optionally, the apparatus 100 can be configured as a bonding apparatus through suitable modifications, which includes configuring the pick and place actuator 150 as a bonding head.

[0017] Fig. 1 shows an example of a pick and place drive comprising a first drive system 111 for a drive element 130 and a second drive system 112 for the pick and place actuator 150. The second drive system 112 is arranged to provide movement of the pick and place actuator 150 relative to one or more second cameras 510 arranged as overhead cameras. Optionally, the second drive system 112 can be arranged to provide movement of the pick and place actuator 150 using one or more drive guides 115. The second drive system 112 can optionally be attached to the drive element 130 or represent an independent handling system. Any suitable configuration of the drive can comprise the device 100.For example, the first drive system 111 may be arranged to move the drive member 130 positively and negatively along the X-axis 920, and the second drive system 112 may be arranged to move the pick and place actuator 150 positively and negatively along the Y-axis 910, thereby moving the pick and place actuator 150 between the loading position 820 and the mounting position 800.

[0018] In the Fig. In the example illustrated in Figure 1, one or more top view cameras 410 are arranged at a component inspection position 810 of the apparatus 100, and the pick and place actuator 150 is moved over the one or more top view cameras 410 on its way from the component inspection position 820 to the mounting position 800, and one or more bottom view images are captured. Optionally, the pick and place actuator 150 is slowed down or stopped to enable the capture of one or more images.

[0019] As in Fig. 1, the device comprises one or more first cameras 410 arranged as one or more bottom view cameras, and further comprises one or more second cameras 510 arranged as one or more top view cameras. In the context of this disclosure, bottom view means that the camera is directed approximately in the positive direction of the Z-axis 930. In the context of this disclosure, "top view" means that the camera is directed approximately in the negative direction of the Z-axis 930. The one or more bottom view cameras 410 are arranged to record images of a fastening surface of a component during fastening to the gripper 160, wherein the person skilled in the art may also refer to this as a component camera 410.The one or more supervisory cameras 510 may optionally comprise one or more illumination radiation sources 530 and be arranged to illuminate a mounting surface of one or more substrates 300 and to capture images of the one or more substrates, wherein the person skilled in the art may also refer to a substrate camera 510.

[0020] Each camera 410, 510 includes one or more radiation detectors, such as one or more imaging sensors (not shown), and includes one or more optical elements (not shown). The one or more imaging sensors may use any suitable optical detection method, such as CMOS. If necessary, optical beam paths may be deflected using one or more suitably configured deflecting mirrors (not shown). The radiation detectors may be arranged to detect any suitable wavelength, such as a UV (ultraviolet) wavelength, a visible wavelength, an IR (infrared) wavelength, or a combination thereof. In the context of this closure, directing means using one or more physical and / or optical properties to essentially determine an optical beam path.The straightening can be, for example, reflection, bending, transmission or any combination of these.

[0021] As in Fig. 1, the pick and place actuator 150 includes a component gripper 160 arranged to be attached to one or more components 600 in use and to maintain attachment during movements of the pick and place actuator 150 and / or the gripper 160. The gripper 160 is, for example, vacuum-operated, whereby a degree of suction may be used to hold one or more components 600 in the gripper 160; alternatively, the one or more components 600 may be held by electrostatic force or a mechanical gripper. The gripper 160 may be arranged to be rotatable about the Z-axis 930, but it is also possible to rotate the substrate about the Z-axis.

[0022] The device 100 is arranged to provide at least a portion of a processing device (not shown) at the attachment position 800. During the at least a portion of the attachment process, the one or more components 600 are in contact with the one or more substrates 300, whereby one or more processing steps can be performed on at least a portion of the one or more attachment surfaces (not shown) of the one or more components 600 and / or one or more substrates 300. The one or more attachment surfaces are typically at least a portion of a mutual contact area between the one or more components 600 and / or one or more substrates 300.

[0023] In the Fig. 1 and Fig. 2, the working range of the second drive system 112 is typically small or very small compared to the range of motion of the first drive system 111. However, the second drive system 112 can also be arranged to provide a long-range movement between the feed unit 120 and the substrate chuck 140, which moves relative to the pick and place actuator 150. One or more small corrective movements for aligning the one or more components 600 with the one or more substrates 300 can be performed with the second drive system 112 or a drive system for the substrate chuck 140, or any combination thereof.The second drive system 112 is arranged to move the pick and place actuator 150 into one or more processing positions and is arranged to provide high-precision corrective movements of the pick and place actuator 150 in two different directions 910, 920. It is sufficient for this purpose if the working range of a drive system 112 is relatively long along the X-axis 920 and relatively short along the Y-axis 910. The range of movement along the X-axis 920 can be several tens of millimeters, for example, 20 mm or 30 mm or more, while the range of movement along the Y-axis 910 can be only a few micrometers.The device 100 is arranged at the mounting position 800 to move one or more components 600 attached to the gripper 160 along the Z-axis 930 toward one or more substrates 300 and to maintain a position of close proximity between a mounting surface of the one or more components 600 and a mounting surface of the substrate 300 while capturing images. For example, the average distance between the component mounting surface and the substrate mounting surface is 10-200 µm.

[0024] Optionally, the apparatus 100 comprises one or more second cameras arranged as one or more overhead cameras 510 to capture one or more overhead images of a mounting surface of the one or more substrates 300. For the purposes of this disclosure, a overhead image is an image captured by one or more second cameras arranged as one or more overhead cameras 510. Optionally, the one or more overhead cameras 510 may be arranged to determine a substrate mark position and / or orientation of a substrate mark 340 in an area of a substrate 300 on which a component 600 is to be placed and attached. Optionally, the determination may be performed before attaching a component 600 to a substrate 300, during attaching a component 600 to a substrate 300, or after attaching a component 600 to a substrate 300.

[0025] Additionally or alternatively, one or more overhead cameras can be attached to the drive element 130. For example, either one or more underhead cameras or a pick-up and placement actuator is attached to the drive element 130 by means of a retractable and extendable pivot mechanism. The one or more underhead cameras or the pick-up and placement actuator 150 can then be retracted into an image recording position during the movement from the loading position 820 to the mounting position 800, so that one or more images can be taken per underhead camera during the movement.To load one or more components 600 and to take top-down images with one or more bottom-down cameras 410 and to place the one or more components 600, the one or more top-down cameras 410 are preferably extended or rotated into a loading position, and the pick and place actuator 150 is also extended or rotated into its working position.

[0026] Additionally or alternatively, one or more overhead cameras can be attached to the drive element 130. For example, either one or more underhead cameras or a pick-up and placement actuator are attached to the drive element 130 by means of a retractable and extendable pivot mechanism. The one or more underhead cameras or the pick-up and placement actuator 150 can then be retracted into an image recording position during the movement from the loading position 820 to the mounting position 800, so that one or more images can be taken per underhead camera during the movement.To load one or more components 600 and to take top-down images with the one or more under-view cameras 510 and to place the one or more components 600, the one or more under-view cameras 410 are preferably extended or rotated to a ready position, and the pick and place actuator 150 is also extended or rotated to its working position. Fig. 2 shows a schematic cross-section of the already described in connection with Fig. 1 in a side view. In particular, the pick-and-place actuator 150 is viewed looking at a plane including the Y-axis 910, which nominally has a positive left-to-right direction, and the Z-axis 930, which nominally has a positive bottom-to-top direction. The X-axis 920 is nominally shown as having a positive direction out of the drawing, toward the viewer. As shown in Fig. 2, one or more components 600 are retained by the gripper 160. In the illustrated example, the component fixture 100 includes one or more tool references 200 (or optical tool references or multi-stage tool references) fixedly attached to the gripper 160. The one or more tool references 200 are arranged to determine at least one orientation and / or position of a reference element (not shown).

[0027] In the illustrated example, the reference element comprises the pick and place actuator 150, and the one or more tool references 200 are arranged to enable the determination of at least one position and / or orientation of the gripper 160. Optionally, the reference element may also comprise the gripper 160. For the purposes of this disclosure, a bottom view position and / or bottom view orientation is determined by one or more first cameras arranged to represent one or more bottom view cameras. For the purposes of this disclosure, a top view position and / or top view orientation is determined by one or more second cameras arranged as one or more top view cameras.

[0028] In the Fig. 1 and Fig. 2, the first drive system 111 is arranged such that it transports the pick-and-place actuator 150 over relatively long distances, namely from the loading position 820, at which the pick-and-place actuator 150 and the gripper 160 pick up one or more components 600 from the feed unit 120, to the fastening position 800, at which the pick-and-place actuator 150 and the gripper 160 fasten the one or more components 600 to one or more substrates 300. The requirements for the positional accuracy of the first drive system 111 are relatively low; a positional accuracy of + / - 10 µm is generally sufficient. Fig. 1, the first drive system 111 is designed as a so-called “gantry” with two or more mechanically highly stable movement axes, two of which movement axes enable movements of the drive element 130 along the axis 910 and along the axis 920, with both axes running perpendicular to each other.

[0029] Typically, movements of the pick and place actuator 150 along the Z-axis 930 are required to remove a component 600 from the feed unit 120 and also to mount the component 600 in a designated mounting position on one or more substrates 300. This movement along the Z-axis 930 can be performed in many different ways, such as by providing the first drive system 111 with a third, stable or highly stable movement axis arranged to provide movement along the Z-axis 930 of the drive element 130. Additionally or alternatively, the second drive system 112 can be arranged with an additional, high-precision pick and place drive arranged to provide movements of the pick and place actuator 150 along the Z-axis 930.Additionally or alternatively, the pick and place actuator 150 may include a high-precision drive arranged to provide movement of the gripper 160 along the Z-axis 930.

[0030] In the Fig. 1 and Fig. 2, the second drive system 112 is arranged to move the pick and place actuator 150 between the machining positions and also to enable high-precision corrective movements of the pick and place actuator 150 in two different directions along the axis 910 and / or along the axis 920.

[0031] In the Fig. 2, the pick and place actuator 150 optionally includes a drive 113 for rotating the gripper 160 of the component about the Z-axis 930.

[0032] Additionally or alternatively, the feed unit 120 may be arranged to rotate one or more components 600 about the Z-axis 930 to reduce or eliminate at least one degree of angular error. Additionally or alternatively, the substrate holder 140 may be arranged to rotate one or more substrates 300 about the Z-axis 930 to reduce or eliminate at least one degree of angular error.

[0033] Fig. 3 shows a schematic cross-section, viewed from the side, of the one or more tool references 200 rigidly attached to the gripper 160, wherein one or more bottom view cameras 410 are arranged to capture one or more images of the one or more tool references 200. In particular, the one or more tool references 200 are arranged within a field of view (FOV) of the bottom view cameras 440. For the purposes of this disclosure, a bottom view image is an image captured by one or more first cameras arranged as one or more top view cameras. As illustrated, the one or more bottom view cameras 410 are viewed as looking at a plane including the Y-axis 910, which nominally has a positive left-to-right direction, and the Z-axis 930, which nominally has a positive bottom-to-top direction.The X-axis 920 is nominally depicted as having a positive direction out of the drawing, toward the viewer. A field of view, as described below, is an angular range that can be viewed at a given time.

[0034] The one or more tool references 200 are arranged to be able to determine at least one underview position and / or underview orientation of the gripper 160 by one or more underview cameras 410 through direct and / or indirect rigid attachment. For example, the one or more tool references 200 can be attached directly through one or more rigid attachments, for example, by being directly attached to the gripper 160, by being included in the gripper 160, or any combination thereof. For example, the one or more tool references 200 can be attached indirectly through one or more rigid attachments to the gripper 160, for example, by being included in the pick and place actuator 150, by being attached to the pick and place actuator 150, or any combination thereof.

[0035] In the Fig. 2 and Fig. In the example illustrated in Figure 3, the one or more tool references 200 are illustrated as one element. However, the one or more tool references 200 may comprise more than one element rigidly attached to a common gripper 160 at more than one attachment position.

[0036] In the Fig. 2 and Fig. In the example illustrated in Figure 3, the one or more overhead cameras 510 are optionally arranged to capture one or more overhead images of the one or more tool references 200. In particular, the one or more tool references 200 can be positioned in a field of view 540 of the one or more overhead cameras 510.

[0037] Optionally, the one or more bottom view cameras 410 may include one or more illumination radiation sources 430 arranged to provide imaging suitable for capturing images around one or more areas of the one or more tool references 200. Optionally, the one or more top view cameras 510 may include one or more illumination radiation sources 530 arranged to provide illumination radiation suitable for creating top view images of one or more areas of the one or more tool references 200.

[0038] The device is arranged so that the one or more tool references 200 can be recorded by one or more under-view cameras 410.

[0039] Optionally, the device is arranged so that the one or more tool references 200 can be imaged downward by one or more top view cameras 510. For example, bottom view images and top view images can be taken at the same positions of the pick and place actuator 150, at overlapping positions of the pick and place actuator 150, at different positions of the pick and place actuator 150, or any combination thereof. Optionally, the device is arranged so that the bottom view images and the top view images can be taken at the same time, at different times, at overlapping times, or any combination thereof.

[0040] In the Fig. 3, one or more top-view cameras 410 are arranged to capture images comprising two or more reference marks included in the tool reference 200. In particular, two or more reference marks may be positioned within a field of view of the bottom-view camera 440. The tool reference 200 includes a mark carrier 250 having a first surface on a first plane 251 and a second surface on a second plane 252, wherein the second plane 252 is arranged to be positioned at a significant distance from the first plane 251 along the positive Z-axis 930 away from the one or more top-view cameras 410. As described below, the significant distance is predetermined.The tool reference 200 includes one or more first reference marks 261 on or near the first surface on the first plane 251, and includes one or more second reference marks 262 on or near the second surface on the second plane 252. If the one or more reference marks 261, 262 are optionally arranged so that they can also be imaged by one or more supervisory cameras 510, the mark carrier 250 includes one or more transparent imaging portions that are sufficiently transparent to allow the one or more supervisory cameras 510 to image one or more reference marks 261, 262.

[0041] The material used for the mark carrier 250 is preferably selected to have a low or very low coefficient of thermal expansion. If the one or more reference marks 261, 262 are arranged such that they are only imaged by one or more bottom-view cameras, the mark carrier 250 can consist of one or more solid blocks to improve rigidity and stability. It can be advantageous if the one or more reference marks 261, 262 are optionally arranged such that they are also imaged by one or more top-view cameras 510 in order to have at least similar optical and / or physical properties, preferably the same optical and / or physical properties, such as a similar or identical thickness of the one or more transparent regions, as in Fig. 3 shown.

[0042] The one or more reference marks 261, 262 may comprise one or more shapes suitable for determining a position and / or orientation. For example, one or more crosses, one or more annular rings, one or more openings, one or more rectangles, one or more squares, one or more corners, one or more edges, one or more lines, one or more circles, one or more ovals, one or more ellipses, or any combination thereof.

[0043] The one or more first reference marks 261 are arranged to enable one or more first underview images to be taken by the one or more underview cameras 410 when the first plane 251 is located in a field of view 440 of the one or more underview cameras 410, as shown in Fig. 3. The one or more second reference marks 262 are arranged to enable one or more second underview images to be taken by the one or more underview cameras 410 when the second plane 252 is in a field of view 440 of the one or more underview cameras 410, as shown in Fig. 3. The one or more underview cameras 410 are arranged to focus radiation directed toward the one or more underview cameras 410 to capture images.

[0044] Generally, the one or more first bottom view images are arranged to provide a first upward orientation and / or position of the reference element. Generally, the one or more second bottom view images are arranged to provide a second upward orientation and / or position of the reference element. Fig. 3, the reference element is included in the pick and place actuator 150 and arranged to enable the determination of at least one bottom view position and / or bottom view orientation of the gripper 160. In this example, the device is arranged to determine at least one bottom view position and / or bottom view orientation of the gripper 160 relative to the one or more first reference marks 261 using the one or more first top view images and relative to the one or more second reference marks 262 using the one or more second top view images.

[0045] As in the example of Fig. 3, the tool reference 200 comprises two or more surfaces on two or more different levels 251, 252, 253. A tool reference 200 with two different levels 251, 252, 253 can be referred to as "bi-level" or "double-decked". A tool reference 200 with two or more different levels 252, 252, 253 can be referred to as "multi-level" or "multi-decked". In the example of Fig. 3, the marker carrier 250 is depicted as a single element. However, the one or more tool references 200 may include more than one element directly and / or indirectly attached to the reference element.

[0046] If a mark carrier is tilted, the measured values recorded by a camera may have an undesirable offset, which depends on the tilt angle of the mark carrier relative to the optical axis of the camera. If the Fig. 3 is tilted, the images and / or measurements taken by one or more top-view cameras 410 may exhibit an undesirable offset depending on the tilt angle of the mark carrier 250 relative to the optical axis of the bottom-view camera (not shown). If the relevant parameters are known, a predetermined offset can be applied to provide a suitable tilt correction. In practice, however, unpredictable tilts may occur, e.g., due to mechanical tolerances, parasitic motor forces, the linearity of bearings, the stiffness of the system, thermal drifts, manufacturing limitations, static deformations, the inaccuracy of motion drives, and / or the movement of actuators.In this case, a tilt of the camera used and / or a tilt of the pick-and-place actuator 150 and / or a tilt of the gripper 160 may change over time and / or depend on the positions along the first (Y) axis 910 and / or along the second (X) axis 920. In practice, for example, small angular changes of less than 1 millidegree can lead to such undesirable shifts.

[0047] By measuring at least one bottom view position and / or bottom view orientation of at least two reference marks 261, 262, 263 on at least two substantially different planes 251, 252, 253, multiple degrees of freedom, e.g., 6 degrees of freedom (DOF), can be determined for the one or more tool references 200. Since the one or more tool references 200 are arranged to determine at least one bottom view orientation and / or bottom view position of the gripper 160, multiple degrees of freedom, e.g., 6 degrees of freedom (DOF), can be determined for the gripper 150. Similarly, multiple degrees of freedom, e.g., 6 degrees of freedom (DOF), can be determined for elements attached to the gripper 150, such as one or more components 600.

[0048] To measure the one or more first reference marks 261, the first plane 251 is positioned within a field of view 440 of the one or more bottom-view cameras 410, and one or more first bottom-view images are captured by the one or more bottom-view cameras 410. To measure the one or more second reference marks 262, the second plane 252 is positioned within a field of view 440 of the one or more bottom-view cameras 410, and one or more second bottom-view images are captured by the one or more bottom-view cameras 410. The one or more first bottom-view images and the one or more second bottom-view images may be captured in the same field of view, in overlapping fields of view, or in different fields of view. The one or more top-view cameras 410 may be arranged to have sufficient depth of field to image both the first plane 251 and the second plane 252.Additionally or alternatively, the one or more underview cameras 410 may be arranged to change at least one optical and / or physical property to modify a degree of sharpness sufficient to image both the first plane 251 and the second plane 252. Additionally or alternatively, the one or more underview cameras 410 may be arranged to modify at least one position and / or orientation of at least one optical component to modify a degree of focus sufficient to image both the first plane 251 and the second plane 252. Additionally or alternatively, the one or more underview cameras 410 may be arranged to focus simultaneously to image both the first plane 251 and the second plane 252.This can be achieved, for example, by providing one or more optical elements in the one or more under-view cameras 410 such that at least one focal length can be changed between two or more significantly different focus settings. This can be achieved, for example, by providing one or more beam splitters with two or more different optical path lengths to two or more imaging sensors.

[0049] The one or more first top-view images from the one or more bottom-view cameras 410 can be used to determine a first orientation and / or position (TF1) of the one or more first reference marks 261. The one or more second bottom-view images from the one or more bottom-view cameras 410 can be used to determine a second upward orientation and / or a second upward position (TF2) of the one or more second reference marks 261.

[0050] The considerable distance between the one or more first reference marks 261 and the one or more second reference marks 262 means that there is a considerable difference in focal length at optimal sharpness between a first bottom view image and a second bottom view image taken with the same bottom view camera 410. This can also be arranged such that the one or more first reference marks 261 are located in a different top view focal plane than the one or more second reference marks 262. As in the example of Fig. 3, this significant distance difference may be primarily along the third axis (Z) 930. It may also be a significant height difference if the multi-stage optical tool reference 200 is disposed on a substantially flat horizontal surface.

[0051] An average separation distance (Zav) of the one or more first reference marks 261 and the one or more second reference marks 262 can be 1 mm or more, or 3 mm or more, or 5 mm or more, or 6 mm or more, or 10 mm or more, or 25 mm or more.

[0052] At least one average separation distance between the one or more first reference marks 261 on the first plane 251 and the one or more second reference marks 262 on the second plane 252 is predetermined. At least one known average separation distance can be used to determine a degree of unforeseen or unexpected offsets. For example, CAD data of the one or more tool references 200 can be used and / or measurements can be taken before the fixture is installed on a measuring table. Additionally or alternatively, the fixture can be arranged to measure at least one average separation distance after installation (in-situ).

[0053] Measurements of the one or more first reference marks 261 determine at least one TF1-X value and one TF1-Y value using one or more first bottom view images, while measurements of the one or more second reference marks 262 determine at least one TF2-X value and one TF2-Y value. At least one predetermined value of Zav is known. Using these values as a starting point, a suitable iteration algorithm can be used until convergence. For example, the so-called "Kabsch algorithm" can be used with at least one predetermined Zav value to provide a first estimate of the transformation T. The application of T to the at least one predetermined Zav value provides an improved estimate of at least one in-situ Zav value.Using the improved estimate of at least one in situ Zav value together with the measured TF1-X, TF1-Y, TF2-X and TF2-Y values, an iteration can be performed until convergence, which is expected within 5-10 steps.

[0054] After convergence, one or more unforeseen or unexpected tilt values can be used to determine an appropriate alignment correction for subsequent measurements taken at one or more reference marks 261, 262, 263 comprising the one or more tool references 200. Similarly, after convergence, one or more unforeseen or unexpected tilt values can be used to determine an appropriate alignment correction for subsequent measurements made at one or more reference marks attached directly or indirectly to the gripper 160. For example, if Zav is 3 mm and a tool reference tilt of 1 millidegree is measured, a tool reference alignment correction (or gripper alignment correction) of approximately 52 nm can be applied.

[0055] In the Fig. 3, a component 600 has been picked up by the gripper 160 and is thus rigidly attached directly to the gripper 160. The component 600 includes one or more component marks 640 on a component mark plane 641. The one or more component marks 640 are arranged to enable one or more component images by the one or more under-view cameras 410 when the component mark plane 641 is located in a field of view of the one or more under-view cameras 410. The under-view images of the one or more components by the one or more under-view cameras 410 are arranged to provide at least one component orientation and / or component position of the one or more components 600. Under-view images and / or under-view measurements of the one or more component marks 640 can determine at least one CF1-X value and one CF1-Y value.Optionally, one or more gripper alignment corrections determined using the one or more tool references 200 may be applied to at least partially correct, for example, CF1-X and / or CF1-Y.

[0056] In the Fig. 3, the apparatus is arranged such that the first plane 251 is positioned at a significant distance from the component mark plane 641 along the positive Z-axis 930 away from the one or more viewing cameras 410. The significant separation distance between the one or more component marks 640 on the component mark plane 641 and the one or more first reference marks 261 on the first plane 251 may be advantageous for reducing the risk of collision during attachment, particularly when the components 600 are mounted close to one another. For example, the significant separation distance between the component mark plane 641 and the first plane 251 may be 1 mm or more.The significant separation distance between the one or more component marks 640 and the one or more first reference marks 261 means that, with optimal focus, there is a significant focal length difference between a component image and a first bottom-view image when they are recorded with the same bottom-view camera 410. This can also be arranged such that the one or more first reference marks 261 lie in a different top-view focal plane than the one or more component marks 640.

[0057] The one or more first underview images and the one or more second underview images may be captured in the same field of view, in overlapping fields of view, or in different fields of view from the one or more component images. The one or more underview cameras 410 may be positioned such that the depth of field is sufficient to capture both the component mark plane 641 and the first plane 251. Optionally, the one or more underview cameras 410 may be positioned such that they have a sufficient depth of field to image the component mark plane 641, the first plane 251, and the second plane 252.Additionally or alternatively, the one or more underview cameras 410 may be arranged to modify at least one optical and / or physical property to modify a degree of focus sufficient to capture the component mark plane 641, the first plane 251, and optionally the second plane 252. Additionally or alternatively, the one or more underview cameras 410 may be arranged to modify at least one position and / or orientation of at least one optical component to modify a degree of focus sufficient to image the component mark plane 641, the first plane 251, and optionally the second plane 252.This can be achieved, for example, by providing one or more optical elements in the one or more under-view cameras 410 that are arranged such that at least one focal length can be changed between two or more significantly different focal lengths. This can be achieved, for example, by providing one or more beam splitters with two or more different optical path lengths to two or more imaging sensors.

[0058] It may be advantageous to arrange a mean separation distance between the component mark plane 641 and the first plane 251 to be approximately the same as a mean separation distance between the first plane 251 and the second plane 252. This may be advantageous because a degree of undesired tilt of the gripper 160 may result in a degree of undesired offset measured using the one or more optical tool references 200 being similar to a degree of undesired offset when measuring the orientation and / or position of a component relative to the one or more tool references 200.Additionally or alternatively, at least one accuracy requirement for the one or more underview cameras 410 may be reduced if it is arranged to image the one or more component marks 640, the one or more first reference marks 261, and the one or more second reference marks 262.

[0059] In the Fig. 3, the mark carrier 250 has an optional third surface at a third plane 253, and the one or more tool references 200 optionally include one or more third reference marks 263 on or near the third surface at the third plane 253. The one or more third reference marks 263 are arranged to enable one or more third bottom-view shots by the one or more bottom-view cameras 410 when the third plane 253 is arranged within a field of view 440 of the first camera 410. In general, the optional third bottom-view shot(s) are arranged to provide a third bottom-view orientation and / or bottom-view position of the reference element.If the one or more third reference marks 263 are optionally arranged such that they are also imaged by one or more supervisory cameras 510, the mark carrier 250 comprises one or more transparent imaging sections that are sufficiently transparent to the one or more supervisory cameras 510 to image one or more third reference marks 263.

[0060] Optionally, the measurement and / or imaging of the one or more third reference marks 263 can be arranged to provide at least one further top view orientation and / or position of the reference element, which is used to improve the accuracy of the measurements described above using the one or more first reference marks 261 and the one or more second reference marks 262. Additionally or alternatively, the measurement and / or imaging of the one or more third reference marks 263 with the one or more first reference marks 261 can be arranged as described above, but using the one or more third reference marks 263 instead of the one or more second reference marks 262 for a preferably greater separation distance.Additionally or alternatively, the measurement and / or imaging of the one or more third reference marks 263 with the one or more second reference marks 262 may be arranged as described above, but using the one or more third reference marks 263 instead of the one or more first reference marks 261.

[0061] It may be advantageous to arrange the one or more tool references 200 so that they can be measured and imaged only by one or more supervisory cameras 510 instead of the one or more supervisory cameras 410. This may be arranged so that the markings 261, 262, 263 of the one or more tool references 200 are aligned to face the one or more supervisory cameras 510.

[0062] It may be advantageous to maintain the ability of one or more tool references 200 to be measurable and imageable by the one or more supervisory cameras 410 and to provide one or more additional tool references 200 that are only measurable and imageable by the one or more supervisory cameras 510.

[0063] It may be advantageous to Fig. 3 such that they are measurable and imageable by both the one or more underview cameras 510 and the one or more underview cameras 410. For example, the mark carrier 250 may include one or more transparent imaging portions 255. Preferably, an average refractive index (n) of the imaging portions 255 is about 2 or in the range of 1.0 to 3.0; or 1.5 to 2.5; or 1.7 to 2.3; or 1.75 to 2.25; or 1.8 to 2.2; or 1.85 to 2.15; or 1.9 to 2.1; or 1.95 to 2.05. Advantageously, the one or more imaging portions comprise a material selected from the group comprising: a glass, a lanthanum heavy flint glass, a crystal, a plastic, a semiconductor, silicon, a liquid, a metal, or any combination thereof.

[0064] The one or more first reference marks 261 may be arranged to enable one or more first top view images to be taken by the one or more cameras 510 through the one or more imaging sections 255 when the first plane 251 is positioned within a field of view 540 of the one or more cameras 510. The one or more second reference marks 262 may be arranged to enable one or more second top view images to be taken by one or more imaging sections 255 of one or more top view cameras 510 when the second plane 251 is positioned within a field of view 540 of the one or more top view cameras 510. The one or more first top view images taken by one or more top view cameras 510 may be arranged to provide a first top view orientation and / or top view position of the reference element.The one or more second top-view images by one or more top-view cameras 510 may be arranged to provide a second downward orientation and / or position of the reference element. The optional third reference mark(s) 263 may be arranged so that one or more third top-view images of the one or more imaging sections 255 may be taken by the one or more top-view cameras 510 when the third plane 253 is positioned within a field of view 540 of the one or more top-view cameras 510. The one or more third top-view images by the one or more top-view cameras 510 may be arranged to provide a third top-view orientation and / or position of the reference element.

[0065] For example, a transparent mark carrier 250 can be provided on a region of a glass plate. One or more reference marks 261, 262, 263 can be at least partially embedded in a region of a surface of the mark carrier 250 or at least partially recessed. Optionally, one or more reference marks 261, 262, 263 can be completely embedded in a region of a surface of the mark carrier 250. For example, transparent areas of the imaging can be provided in a metal layer, such as chromium, that has been applied to a surface of a glass plate. In addition, the one or more reference marks 261, 262, 263 can be provided by selectively etching or masking a metal layer, such as chromium, that has been applied to the surface of a glass plate. The material used for the mark carrier 250, such asGlass must be sufficiently transparent for the radiation used for the overhead images.

[0066] As described above, the one or more overhead cameras 410 may be arranged to determine at least one component position and / or orientation of one or more component marks 640. Optionally, the determination may be performed before a component 600 is attached to the gripper 160, during attachment to the gripper 160, or after attachment to the gripper 160. Any suitable component mark 640 may be used. A component mark 640 may, for example, be a structural feature of at least one portion of a component, an optical feature of at least one portion of a component 600, at least one portion of a reference mark, or any combination thereof.

[0067] The device described here and all variants and embodiments described below are suitable for carrying out the methods disclosed below.

[0068] The tool reference(s) described herein is / are suitable for performing at least one alignment or calibration method, wherein at least one orientation and / or position of a reference element attached to one or more tool reference(s) described herein.

[0069] For example, a method for performing at least one alignment or calibration method comprises the following steps: creating one or more first bottom view images using the one or more first cameras 410; creating one or more second bottom view images using the one or more first cameras 410; determining a first top view orientation and / or position of the reference element using the one or more first bottom view images; and determining a second bottom view orientation and / or position of the reference element using the one or more second bottom view images.

[0070] Additionally or alternatively, if the mark carrier 250 comprises one or more transparent overhead images 255, a method for performing at least one alignment or calibration procedure may comprise: taking one or more first overhead images using the one or more second cameras 510; taking one or more second overhead images using the one or more second cameras 510; determining a first overhead orientation and / or overhead position of the reference element using the one or more first overhead images; and determining a second overhead orientation and / or overhead position of the reference element using the one or more second overhead images.

[0071] The one or more tool references described herein are also suitable for positioning one or more components 600 using a pick and place actuator 150, wherein: the pick and place actuator 150 includes a gripper 160 for releasably attaching to the one or more components 600; and the reference element of one or more tool references described herein is included in the pick and place actuator 150.

[0072] For example, a method for positioning one or more components 600 includes the following steps: using one or more first cameras 410 as one or more bottom view cameras to take one or more first image captures of the one or more first reference marks 261; using the one or more first cameras 410 to take the one or more second image captures of the one or more second reference marks 262; and determining at least one bottom view orientation and / or bottom view position of the gripper 160 using the one or more first image captures and / or one or more second image captures.

[0073] Optionally, the method for positioning one or more components may include: changing at least one position and / or orientation of the pick and place actuator 150 using the at least one bottom view orientation and / or bottom view position of the gripper 160.

[0074] Optionally, if the one or more components 600 include one or more component marks 640 on a component mark level 641, wherein the one or more component marks 640 are arranged to enable one or more component shots by the one or more first cameras 410, the method for positioning one or more components 600 may further comprise: attaching the one or more components 600 to the gripper 160; using the one or more first cameras 410 to take one or more component shots of the one or more component marks 640; and determining at least one of a component orientation and a component position using the one or more component shots.Optionally, the method for positioning one or more components 600 may include: changing at least one position and / or orientation of the gripper 160 using the at least one component orientation and / or component position.

[0075] The tool references described below are also suitable for positioning one or more components 600 and aligning the one or more components 600 with one or more substrates 300 prior to attachment.

[0076] For example, a method for aligning the one or more components 600 with one or more substrates 300 prior to attachment includes the following steps: providing the one or more substrates 300 at an attachment location 800, wherein the one or more substrates 300 include one or more substrate marks 340; using the one or more first cameras 410 arranged as one or more bottom-view cameras to capture one or more first bottom-view images of the one or more first reference marks 261 and to capture one or more second bottom-view images of the one or more second reference marks 262; determining a first top-view orientation and / or position using the one or more first bottom-view images of the one or more first reference marks 261;Determining a second top view orientation and / or position using the one or more second bottom view images of the one or more second reference marks 262; Determining an alignment correction of the gripper using the first top view orientation and / or position with the second top view orientation and / or position; Moving the gripper 160 to the mounting position 800; Using the one or more downward-facing cameras at the mounting position 800 to take one or more substrate mark images of the one or more substrate marks 340; Determining a substrate mark orientation and / or position using the one or more substrate mark images of the one or more substrate marks 340; and Determining an alignment correction of the substrate marks using the substrate mark position and / or orientation.

[0077] Optionally, the method for aligning the one or more components 600 with one or more substrates 300 prior to attachment may further comprise: changing at least one orientation and / or position of the gripper 160 relative to the substrate 300 based on the alignment correction of the gripper. Optionally, the method for aligning the one or more components 600 with one or more substrates 300 prior to attachment may further comprise: changing at least one orientation and / or position of the gripper 160 relative to the substrate 300 based on the alignment correction of the component mark. Optionally, the method for aligning the one or more components 600 with one or more substrates 300 prior to attachment may also comprise: attaching the one or more components 600 to the one or more substrates 300.

[0078] Optionally, if the mark carrier 250 includes one or more transparent imaging portions 255, the method for aligning the one or more components 600 with one or more substrates 300 prior to attachment may also include: using the one or more second cameras 510 arranged to take one or more first top view images of the one or more first reference marks 261 and to take one or more second top view images of the one or more second reference marks 262; determining a first top view orientation and / or position using the one or more first top view images of the one or more first reference marks 261; determining a second top view orientation and / or position using the one or more second top view images of the one or more second reference marks 262;and determining a further alignment correction for the gripper using the first top view orientation and / or top view position with the second top view orientation and / or top view position. Optionally, the method for aligning the one or more components 600 with one or more substrates 300 prior to attachment may further comprise: changing at least one orientation and / or position of the gripper 160 based on the further alignment correction of the gripper;

[0079] The embodiments described above relate to methods for attaching one or more components 600 and one or more substrates 300 using an apparatus 100, to provide one example. The alignment methods and the attachment apparatus described above can be adapted through obvious modifications to provide any other processing methods or any other apparatus.

[0080] The pick and place actuator 150 is in Fig.2 as an assembly, with an approximate cross-sectional extent represented by a dashed line. While many functions and features are described in this disclosure as including, attached to, or connected to a pick and place actuator, these are merely examples. One skilled in the art may configure and arrange one or more of these functions and features to be only partially included in, or only partially attached to, or only partially connected to a pick and place actuator. List of reference symbols

[0081] No. Short name 100 component fastening device 111 first drive system 112 second drive system 113 Drive for gripper rotation 115 Drive guide 120 feeding unit 130 drive element 140 Substrate Chuck 150 Pick-up and placement actuator 160 component grippers 200 Tool Reference 250 brand carriers 251 first level 252 second level 253 third level 255 Figure section 261 first reference mark on a first level 262 second reference mark on a second level 263 third reference mark on a third level 300 substrate 340 substrate brand 410 first camera arranged as under-view camera 430 Illumination radiation source for an under-view camera 440 Field of view of the under-view camera 510 second camera arranged as a surveillance camera 530 Illumination radiation source for a surveillance camera 540 Field of view of the surveillance camera 600 components 640 component brand 641 Component brand level 800 mounting position 810 Component inspection position 820 loading position 910 first axis in Y direction 920 second axis in X-direction 930 third axis in Z direction QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] US 2021 / 0195816 [0002, 0003]

Claims

[1] Tool reference (200) for determining at least one orientation and / or position of a reference element, wherein the tool reference (200) is attached to the reference element, wherein the tool reference (200) comprises: - a mark carrier (250) having a first surface on a first plane (251) and a second surface on a second plane (252); - one or more first reference marks (261) on or near the first surface on the first plane (251); and - one or more second reference marks (262) on or near the second surface on the second plane (252); wherein the one or more first reference marks (261) are arranged to enable one or more first bottom view images to be taken by one or more first cameras (410); wherein the one or more second reference marks (262) are arranged to enable one or more second bottom view images to be taken by the one or more first cameras (410); wherein the one or more first bottom view images are arranged to provide a first top view orientation and / or position of the reference element; wherein the one or more second bottom view images are arranged to provide a second top view orientation and / or position of the reference element; and wherein the one or more first reference marks (261) on the first plane (251) and the one or more second reference marks (262) on the second plane (252) have an average separation distance of 1 mm or more, 3 mm or more, 5 mm or more, 10 mm or more, or 25 mm or more. [2] Tool reference (200) according to one of the preceding claims, wherein the mark carrier (250) has a third surface on a third plane (253), wherein the tool reference (200) comprises one or more third reference marks (263) on or near the third surface on the third plane (253), wherein the one or more third reference marks (263) are arranged to enable one or more third top view images to be taken by the one or more first cameras (410), wherein the one or more third reference marks are arranged by the one or more first cameras (410) to provide a third top view orientation and / or position of the reference element. [3] Tool reference (200) according to one of the preceding claims, wherein the mark carrier (250) comprises one or more transparent imaging sections (255), wherein the one or more first reference marks (261) are arranged to enable one or more first top view images to be taken by one or more second cameras (510) through the one or more imaging sections (255); wherein the one or more second reference marks (262) are arranged to enable one or more second top view images to be taken by the one or more second cameras (510) through the one or more imaging sections (255); wherein the one or more first top view images are arranged to provide a first top view orientation and / or top view position of the reference element, and;wherein the one or more second view receptacles are arranged to provide a second view orientation and / or view position of the reference element; [4] The tool reference (200) of claim 3, wherein the tool reference (200) comprises one or more third reference marks (263) on or near the third surface in the third plane (253), wherein the one or more third reference marks (263) are arranged to enable one or more third top view orientations to be made by the one or more second cameras (510) through the one or more imaging sections (255), and wherein the one or more third top view orientations are arranged to provide a third top view orientation and / or top view position of the reference element. [5] The tool reference (200) of claim 3 or claim 4, wherein the one or more transparent imaging portions (255) comprise a material selected from the group comprising: a glass, a crystal, a plastic, a semiconductor, silicon, a liquid, a metal, or any combination thereof. [6] The tool reference (200) of any preceding claim, wherein the tool reference (200) comprises one or more code marks arranged to enable one or more code frames to be captured by an imaging sensor, the one or more code frames being arranged to provide one or more parameters of the one or more code marks selected from the group comprising: an orientation, a position, a parameter, a value, a number, or any combination thereof. [7] Tool reference (200) according to one of the preceding claims, wherein the tool reference (200) comprises an illumination radiation source arranged to provide radiation for one or more camera shots. [8] Device (100) for positioning one or more components (600), the device (100) comprising: - a pick and place actuator (150), wherein the pick and place actuator (150) comprises a gripper (160) for releasably attaching to the one or more components (600); - one or more tool references (200) according to any one of claims 1 to 8, wherein the reference element is included in the pick and place actuator (150), and wherein the one or more tool references (200) are arranged to enable at least one bottom view orientation and / or bottom view position of the gripper (160) to be determined; - one or more first cameras (410) arranged as one or more bottom-view cameras to take one or more first shots around the one or more first reference marks (261), and further arranged to take the one or more second shots around the one or more second reference marks (262); and wherein the device (100) is arranged to change at least one position and / or orientation of the picking and placing actuator (150) using the at least one bottom-view position and / or bottom-view orientation of the gripper (160). [9] The apparatus (100) of claim 8, wherein the one or more components (600) comprise one or more component markers (640) on a component marker plane (641), wherein after attaching the one or more components (600) to the gripper (160), the one or more component markers (640) are arranged to enable one or more component images to be taken by the one or more first cameras (410), the one or more component images being arranged to provide at least one orientation and / or position of the one or more components (600), and wherein the apparatus (100) is arranged to modify at least one position and / or orientation of the picking and placing actuator (150) using the at least one position and / or orientation of the one or more components (600). [10] The apparatus (100) of claim 8 or claim 9, wherein the pick and place actuator (150) is arranged to be located at a mounting position (800), the apparatus (100) comprising a substrate chuck (140) for providing one or more substrates (300) at the mounting position (800); and wherein the apparatus (100) is arranged to align one or more components (600) with one or more substrates (300) prior to mounting using the at least one bottom view position and / or bottom view orientation of the gripper (160). [11] Device (100) according to claim 10, wherein the device (100) comprises one or more second cameras (510) arranged as one or more supervisory cameras to record one or more first supervisory images of the one or more first reference marks (261), and which are further arranged to record one or more second supervisory images of the one or more second reference marks (262), wherein the one or more first supervisory images are arranged to provide a first supervisory orientation and / or supervisory position of the reference element, wherein the one or more second supervisory images are arranged to provide a second supervisory orientation and / or supervisory position of the reference element, and wherein the device (100) is arrangedto modify at least one position and / or orientation of the pick and place actuator (150) using at least one top view orientation and / or top view position of the gripper (160). [12] A method for determining at least one orientation and / or position of a reference member attached to one or more tool references (200), wherein the one or more tool references (200) comprise a mark carrier (250) having a first surface on a first plane (251) and a second surface on a second plane (252); one or more first reference marks (261) on or near the first surface on the first plane (251);and one or more second reference marks (262) on or near the second surface on the second plane (252), wherein the one or more first reference marks (261) are arranged to enable one or more first bottom view images to be taken by one or more first cameras (410), wherein the one or more second reference marks (262) are arranged to enable one or more second bottom view images to be taken by the one or more first cameras (410), wherein the one or more first reference marks (261) on the first plane (251) and the one or more second reference marks (262) on the second plane (252) have an average separation distance of 1 mm or more, or of 3 mm or more, or of 5 mm or more, or of 10 mm or more, or of 25 mm or more, the method comprising the following steps:; - taking one or more first under-view shots using the one or more first cameras (410); - taking one or more second under-view shots using the one or more first cameras (410); - determining a first bottom view orientation and / or bottom view position of the reference element using the one or more first bottom view images; and - Determining a second bottom view orientation and / or bottom view position of the reference element using the one or more second bottom view images. [13] The method of claim 12, wherein the mark carrier (250) comprises one or more transparent imaging sections (255), wherein the one or more first reference marks (261) are arranged to enable one or more first top-view images to be taken by one or more second cameras (510) through the one or more imaging sections (255), and wherein the one or more second reference marks (262) are arranged to enable one or more second top-view images to be taken by the one or more second cameras (510) through the one or more imaging sections (255); the method further comprising: - taking one or more first overhead shots using the one or more second cameras (510); - taking one or more second overhead shots using the one or more second cameras (510); - determining a first top view orientation and / or top view position of the reference element using the one or more first top view images; and - Determining a second top view orientation and / or top view position of the reference element using the one or more second top view images. [14] A method for positioning one or more components (600) using a pick and place actuator (150), wherein the pick and place actuator (150) comprises a gripper (160) for releasably attaching to the one or more components (600), and the reference element of one or more tool references (200) according to one of claims 1 to 8 is included in the pick and place actuator (150), the method comprising the following steps: - using one or more first cameras (410) as one or more under-view cameras to take one or more first images of the one or more first reference marks (261); - using the one or more first cameras (410) to take the one or more second bottom view images of the one or more second reference marks (262); - determining at least one bottom view orientation and / or position of the gripper (160) using the one or more first bottom view images and / or the one or more second bottom view images; and - Changing at least one position and / or orientation of the pick and place actuator (150) using the at least one bottom view orientation and / or bottom view position of the gripper (160). [15] The method of claim 14, wherein the one or more components (600) comprise one or more component marks (640) on a component mark level (641), the one or more component marks (640) being arranged to enable one or more component shots to be captured by the one or more first cameras (410), the method further comprising: - attaching the one or more components (600) to the gripper (160); - using the one or more first cameras (410) to capture one or more component images of the one or more component brands (640); - Determining at least one orientation and / or position of the component using the one or more component receptacles; and - Changing at least one position and / or orientation of the gripper (160) using the at least one orientation and / or position of the component. [16] A method for aligning one or more components (600) with one or more substrates (300) prior to attachment, comprising the method for positioning one or more components according to any one of claims 14 to 15, the method further comprising the following steps: - providing the one or more substrates (300) at a mounting position (800), wherein the one or more substrates (300) comprise one or more substrate marks (340); - using the one or more first cameras (410) arranged as one or more underview cameras to take one or more first underview images of the one or more first reference marks (261) and to take one or more second underview images of the one or more second reference marks (262); - determining a first bottom view orientation and / or a first position using the one or more first bottom view images of the one or more first reference marks (261); - determining a second bottom view orientation and / or a second position using the one or more second bottom view images of the one or more second reference marks (262); - determining an alignment correction of the gripper using the first bottom view orientation and / or bottom view position with the second bottom view orientation and / or bottom view position; - moving the gripper (160) into the fastening position (800); - using the one or more supervisory cameras at the mounting position (800) to take one or more substrate mark images of the one or more substrate marks (340); - determining an orientation and / or position of a substrate mark using the one or more substrate mark recordings of the one or more substrate marks (340); and - Determining an alignment correction of the substrate marks using the substrate mark position and / or orientation. [17] The method of claim 16, wherein the method further comprises changing at least one orientation and / or position of the gripper (160) relative to the substrate (300) based on the alignment correction of the gripper. [18] The method of any one of claims 16 to 17, wherein the method further comprises changing at least one orientation and / or position of the gripper (160) relative to the substrate (300) based on the alignment correction of the substrate marks. [19] The method of any one of claims 16 to 18, further comprising attaching the one or more components (600) to the one or more substrates (300). [20] The method of any one of claims 16 to 18, wherein the one or more first reference marks (261) are arranged to enable one or more first top-view images to be taken by one or more second cameras (510) through the one or more imaging sections (255), and wherein the one or more second reference marks (262) are arranged to enable one or more second top-view images to be taken by the one or more second cameras (510) through the one or more imaging sections (255), the method further comprising the steps of: - using the one or more second cameras (510) arranged as one or more supervisory cameras to take one or more first supervisory images of the one or more first reference marks (261) and to take one or more second supervisory images of the one or more second reference marks (262); - determining a first top view orientation and / or bottom view position using the one or more first top view images of the one or more first reference marks (261); - determining a second downward view orientation and / or position using the one or more second view images of the one or more second reference marks (262); and - Determining a further alignment correction of the gripper using the first top view orientation and / or top view position with the second top view orientation and / or the second top view position. [21] The method of claim 20, wherein the method further comprises changing at least one orientation and / or position of the gripper (160) based on the further alignment correction of the gripper.

Images