Device and method for cooling an electronic component of a motor vehicle

Abstract

The invention relates to a device and a method for cooling an electronic component (26) of a motor vehicle, comprising at least one cooler (12) with at least one connection surface (16) designed such that the electronic component (26) arranged on a circuit board (24) can be cooled via the connection surface (16), comprising at least one housing (18) which at least partially encloses the circuit board (24), wherein the housing (18) has at least one housing opening (19), wherein at least a part of the cooler (12) is led out of this housing opening (19), and wherein a gap (38) between the electronic component (26) and the connection surface (16) is adjustable in different steps via at least one stepped arrangement (20, 21, 22, 23).

Description

[0001] The invention relates to a device and method for cooling an electronic component of a motor vehicle according to the preamble of the independent claims. State of the art

[0002] From DE 10 2013 206 999 A1, a control unit for a motor vehicle with a thermally conductive housing wall is known. The housing wall is formed from a thermally conductive sheet metal and acts as a heat sink. The thermally conductive housing wall is detachably connected to the housing and has an embossed feature in an area opposite the power semiconductor. This embossing brings the housing wall closer to the power semiconductor, such that the distance, in particular the gap, between the housing wall and the power semiconductor before embossing is greater than the distance, in particular the distance between the housing wall and the surface area, after embossing.

[0003] The invention is based on the objective of ensuring reliable heat dissipation from the electronic component. This objective is achieved by the features of the independent claims. Disclosure of the invention

[0004] By allowing the gap between the electronic component and the mounting surface to be adjusted in different steps via at least one stepped arrangement, the appropriate gap, and in particular a small one, can be easily set for each specific configuration of a control unit. This enables efficient thermal connection of the electronic component to the control unit's heat sink. Simultaneously, a stable and rigid system can be created that does not impair the control unit's resistance to vibration.

[0005] In a suitable further development, it is provided that the stepped arrangement is positioned on the cooler and / or on the electronic component and / or on the housing and / or on a component connected to the electronic component, in particular a printed circuit board. This results in a high degree of freedom for the design, depending on the specific configuration of the particular control unit.

[0006] In a suitable further development, at least one counter surface is provided which interacts with the stepped arrangement to adjust the gap dimension, wherein the counter surface is arranged on the cooler and / or on the electronic component and / or on the housing and / or on a component connected to the electronic component, in particular a printed circuit board. This allows for low mechanical complexity with high stability.

[0007] Particularly preferably, the stepped arrangement comprises several steps and / or plateaus and / or ledges and / or a further stepped arrangement. This allows for adjustment of the gap dimension perpendicular to the surface of the housing.

[0008] In a suitable further development, the stepped arrangement has several steps of different heights. This allows for sufficiently precise and simple adjustment of the gap dimension, depending on the application and requirements.

[0009] In a suitable further development, the gap dimension is adjustable via a relative movement between the cooler and the housing and / or between the mating surface and the stepped arrangement. This allows for particularly easy, even automated, adjustment. The relative movement is most effectively achieved via a linear and / or planar motion parallel to the surface of the connection area and / or via rotation. The desired relative movement can be achieved depending on the installation situation or manufacturing setup.

[0010] In a suitable further development, it is provided that, along the relative movement, particularly during linear movement and / or rotation, the height of the steps of the stepped arrangement and / or the further stepped arrangement changes discretely, in particular increasing or decreasing. This allows for a particularly simple adjustment of the desired gap dimension.

[0011] In a suitable further development, it is provided that the stepped arrangement and / or the counter-surface interacting with the stepped arrangement is located on an edge of the cooler that covers the housing opening. This allows for particularly simple and stable adjustment of the gap dimension and also offers the geometric possibility of an integrated seal for the control unit.

[0012] In a practical further development, the counter surface interacting with the stepped arrangement is designed to project beyond the surface in such a way that it can cover at least parts of the stepped arrangement. This allows for a particularly simple and stable design, especially of the cooler.

[0013] In a practical further development, it is provided that, after the desired gap dimension has been set, at least one connecting element is provided to fix the cooler relative to the electronic component, whereby the connecting element interacts with an oversized through-hole or slotted hole. This allows for different mounting positions of the connecting element relative to the cooler, depending on the relative movement of the cooler relative to the electronic component. The offset can be easily compensated. The stability of the assembly is further increased.

[0014] The subsequent process steps make it particularly easy to further automate the manufacturing process and increase flexibility for different heights or geometries of the electronic component.

[0015] Further appropriate training courses result from other dependent requirements and from the description. Brief description of the drawing

[0016] They show: Fig. 1 Overview of a control unit in side view, Fig. 2 a schematic representation of a gap adjustment by lateral offset, Fig. 3 a top view of a linearly movable cooler as well as Fig. 4 A top view of a rotating adjustable cooler. embodiment of the invention

[0017] The invention is schematically illustrated using an exemplary embodiment and is described in detail below with reference to the drawing.

[0018] In Fig. Figure 1 shows a control unit 10 in a side view. An electronic component 26 requiring heat dissipation is arranged in the center of a printed circuit board 24. Other electronic components 29, also requiring heat dissipation, are arranged on the printed circuit board 24 as examples; however, these components exhibit lower power dissipation than the electronic component 26, which requires particularly reliable heat dissipation or has a particularly low thermal resistance. The electronic component 26 could, for example, be a so-called SIP (System-In-Place) or a component thereof, and / or a so-called System-On-Chip (SoC), or another semiconductor with high power dissipation.

[0019] The printed circuit board 24 can be arranged or soldered onto another printed circuit board 30, for example, the main board. Furthermore, depending on the application, additional printed circuit boards 24 can be provided on the additional printed circuit board 30, each containing at least one electronic component 26 that also generates high power dissipation. For example, the printed circuit board 24 designed as a SIP, which includes a SoC as an electronic component 26, can be soldered onto the printed circuit board 30.

[0020] The circuit board 24 and / or the additional circuit board 30 can be at least partially enclosed by a housing 18. For this purpose, the circuit board 24 and / or the additional circuit board 30 are connected to the housing 18. The housing 18 has an opening 19. A cooler 12 is at least partially accommodated in this opening 19. The cooler 12 protrudes slightly beyond the surface of the housing 18, thus enabling particularly good heat dissipation. The housing 18 can be, for example, a die-cast housing, a sheet metal housing, a plastic housing, etc.

[0021] The cooler 12 serves to dissipate heat from at least the electronic component 26 and also from the other electronic components 29. To minimize thermal resistance, the electronic components 26 and 29 are thermally coupled to the cooler 12 via a thermally conductive material 28. The thermally conductive material 28 is positioned between the electronic components 26 and 29 and a connection surface 16 on the cooler 12, thus thermally connecting the cooler 12 to the electronic component 26 to be cooled. The connection surface 16 is divided into two areas: the one with the narrowest gap 38 or TIM gap (gap for TIM material (TIM: thermal interface materials or thermally conductive material 28; for example, thermally conductive pastes, flexible materials in the form of a cushion or pads, etc.)) to the electronic component 26 and the outer area, which serves to dissipate heat from the other electronic components 29 via thermally conductive material 28.Between the connection surface 16 and the surface of the electronic component 26 to be cooled, a gap dimension 38 to be minimized forms as in the . Fig. 2 is shown in more detail. The smaller this gap dimension 38 is, the better the power loss of the electronic component 26 can be dissipated.

[0022] At least one stepped arrangement 20, 21, 22, 23 with associated counter surface 17 serves to minimize this gap dimension 38. This is achieved by a relative movement between the connection surface 16 of the cooler 12 and the electronic component 26, for example by a lateral (or planar) displacement 32 or by a rotation 36. The stepped arrangement 20, 21, 22, 23 can be attached either directly to the cooler 12 ( Fig. 1) or with a component connected to the cooler 12 and / or with the electronic component 26 itself or with a component permanently connected to the electronic component 26, such as the circuit board 24 and / or the housing 18 ( Fig. 2) or similar arrangement. The stepped arrangement 20, 21, 22, 23 interacts with corresponding counter-surfaces 17. The counter-surface 17 interacting with the stepped arrangement 20, 21, 22, 23 can either be directly attached to the cooler 12 ( Fig. 2) or with a component connected to the cooler 12 and / or with the electronic component 26 itself or with a component permanently connected to the electronic component 26, such as the circuit board 24 and / or the housing 18 ( Fig. 1) or similar arrangements. Typically, several stepped arrangements 20, 21, 22, 23 and corresponding counter surfaces 17 are present. These could, for example, be four support points arranged at the corners (between cooler 12 and housing 18) or three support points for a stable support with a minimal surface area.

[0023] In the exemplary embodiment according to Fig. The counter surfaces 17 are arranged on the housing 18, which in turn is connected to the circuit board 24 on which the electronic component 26 to be cooled is located. The counter surfaces 17 on the housing protrude slightly outwards relative to the surface of the housing 18. The cooler 12 is initially arranged to be movable relative to the electronic component 26 to be cooled, in particular in a direction that influences the gap 38 between the surface of the electronic component 26 to be cooled and the mounting surface 16 of the cooler 12.

[0024] The cooler 12 has a lateral projection 13 that laterally overlaps the surface of the housing 18 and extends beyond the opening 19 of the housing, forming a collar or edge. The stepped arrangement 20, 21 can be arranged, for example, on the projection 13 of the cooler 12 in the form of several steps and discrete changes in distance relative to the connection surface 16 and / or the counter surface 17 or counter surfaces 17.

[0025] In the exemplary embodiment according to Fig. In the case of the stepped arrangement 20, 21 on the cooler 12, for example, there are several, for example three, steps, wherein the steps with different heights d1, d2, d3 are oriented towards the housing 18. On another side of the cooler 12, another stepped arrangement 21 is also arranged, for example in the form of further, for example three, steps with the same heights d1, d2, d3. The two stepped arrangements 20, 21 of the cooler 12, or the two areas with steps, are each oriented upwards or downwards with respect to the plane of the connection surface 16 or with respect to the direction of the temporal displacement 32 and / or a rotation 36 described later. The height d1, d2, d3 of the respective, in particular opposing, steps either increases or decreases continuously, so that a relative movement 32 parallel to the plane of the connection surface 16 leads either to an increase or a decrease in the distance orof the gap dimension 38 between the connection surface 16 and the surface of the electronic component 26 to be cooled.

[0026] The cooler 12 features, for example, protruding surfaces such as cooling fins 14 to efficiently dissipate heat to the surroundings as an air cooler. However, other cooling principles, such as a liquid cooler using circulating water as the cooling medium, are also possible. The cooler 12 can be made of a highly thermally conductive material such as copper, or it can be designed as a vapor chamber (a sealed space filled with a thermally conductive medium, which ensures particularly efficient heat dissipation through phase changes), or similar.

[0027] The exemplary embodiment according to Fig. Figure 2 shows stepped arrangements 22, 23 on the housing 18. These steps project upwards from the top of the housing 18. The stepped arrangements 22, 23 interact with a corresponding counter-surface 17 on the cooler 12. This counter-surface 17 is located on the outside of the projection 13 that covers the opening 19 of the housing 18. This projection 13 terminates in a peripheral region that encompasses the counter-surface 17, which extends towards the housing 18 and thus also covers the other projecting steps of the stepped arrangement 22, 23 without engaging with them.

[0028] Initially, the counter surface 17 is, for example, arranged on the second step from the inside of the stepped arrangement 22, 23, or on a section that results in a relatively large gap 38, compare the bottom drawing of the Fig. 2. The initial positioning on a middle step of the stepped arrangement 22, 23 is particularly advantageous, since the minimum gap dimension 38 can be achieved particularly easily from the middle position, if necessary without a large change in position or displacement 32.

[0029] The distance (gap dimension 38) between the surface of the electronic component 26 and the contact point of the cooler 12 or the connection surface 16 is measured through the opening 19 in the housing 18 after the circuit board 30, 24 has been installed in the housing 18. This allows the determination of which step of the stepped arrangement 22, 23 the cooler 12 can be placed on. This can be done, for example, as shown in Fig. 2, recognizable by a planar movement 32, can be changed. For example, if the cooler 12 is to be positioned deeper in the housing 18 (reducing the gap dimension 38), it is moved a short distance (e.g., a few millimeters depending on the step geometry) further to the left and thus placed on a lower step of the stepped arrangement 22, 23. This results in a current gap dimension 38 (original gap dimension 38 reduced by d1, where d1 represents the height difference of the adjacent steps). If the gap dimension 38 is to be reduced even further, the cooler 12 can be moved further to the left onto a lower step of the stepped arrangement 22, 23 on the housing 18, so that, according to the drawing above, the Fig. 2. A current gap dimension 38 is set from the difference between the original gap dimension 38 and d2 (d2 being a height difference between the original step and the current step). After measuring and precisely positioning, the cooler 12 is conventionally, for example, force-displacement controlled and with thermally conductive material 28 (for example, TIM Dispens), pressed into place, and then fixed, for example, screwed in (for example, using fasteners 34 such as screws as in the Fig. 3 and Fig. 4 shown as examples).

[0030] In plan view according to Fig. Figure 3 shows that a lateral offset or displacement 32 results in an overlap or lateral displacement of the respective electronic components 26; 26.1, 26.2; 29. ​​This overlap or the maximum possible lateral displacement must be chosen so that all electronic components 26; 26.1, 26.2; 29 can be thermally connected adequately in all stages. Fig. Figure 3 further shows that, by way of example, two smaller circuit boards 24.1, 24.2, each with at least one electronic component 26.1, 26.2 requiring cooling, are arranged on the further circuit board 30. For each circuit board 24.1, 24.2, and for each electronic component 26.1, 26.2 requiring cooling, a cooler 12.1, 12.2 is provided with corresponding stepped arrangements 20, 21 in the corner areas (either on the housing 18 or on the cooler 12 as shown in the diagram). Fig. 1 and Fig. 2 described; only the overhang 13 of the cooler 12 is schematically shown transparently, so that the positions of the stepped arrangements 20, 21 are visible) are provided, each of which can be individually moved via a lateral linear movement 32 to adjust the optimal gap dimension 38. Furthermore, fastening means 34 are shown schematically, which, due to the possible displacement of the cooler 12 relative to the housing 18, are each received in an oversized through-hole or in an elongated hole 40. These fastening means 34 serve to finally fix the cooler 12 relative to the electronic component 26 when the suitable gap dimension 38 has been found after the appropriate arrangement of the mating surface 17 on the appropriate step of the stepped arrangement 20, 21. The oversized through-holes or elongated holes 40 (with washer, etc.)) enable different mounting positions of the fastening element 24 depending on different gap dimensions 38 or different lateral displacements 32. Preferably, a corresponding thread is formed in the housing 18 for fastening, wherein the oversized through-hole or the elongated hole 40 is arranged on the cooler 12, through which the fastening element 34 is guided and is screwed to the housing 18, for example.

[0031] In the embodiment according to Fig.4. The gap dimension 38 can be changed by a rotation 36. For this purpose, the cooler 16 arranged in the opening 19 is preferably circular (as is the opening 19). Stepped arrangements 20, 21 are located at the edge regions or projections 13 that cover the housing 18. As already mentioned, the stepped arrangements 20, 21 can be arranged on the cooler 12 and / or on the housing 18 connected to the electronic component 26. In the exemplary embodiment, for example, four stepped arrangements 20, 21 are provided for sufficient mechanical stability. Corresponding fastening means 34 are located between the stepped arrangements 20, 21, with the elongated holes 40 (in particular, partially circular) allowing a certain degree of rotational movement 36 relative to the fastening means 34.

[0032] The stepped arrangements 20, 21, 22, 23 can comprise multiple steps and / or plateaus and / or ledges, so that discrete changes in the gap dimension 38 can be achieved. The contact surfaces between the respective stepped arrangements 20, 21, 22, 23 and the corresponding mating surfaces 17; 22, 23 can be linear, point-shaped, circular, rectangular, etc.

[0033] Along the connection surface 16, an EMC seal (for example made of FIPG (Form in Place Gasket (liquid during assembly)), CIPG (Cured in Place Gasket (cured during assembly), FoF Fabric over Foam (fabric tube over foam core), tape, foam core, springs, etc.) can be inserted or arranged between the cooler 12 and the housing 18 in order to fully shield the housing 18 electrically.

[0034] The electronic components 26 comprise, in particular, high-performance computing cores that perform particularly computationally intensive functions in the motor vehicle. These can include, for example, autonomous or semi-autonomous driving functions, infotainment, communication interfaces between different bus systems (Ethernet, CAN, LIN, etc.) or gateway functionalities, certain security applications for granting authorization, for example, to access the motor vehicle remotely, or other operations in the motor vehicle that require particularly high computing power. The electronic components 26 are preferably high-performance processors, multi-core processors, or highly integrated circuits (SoC, System-on-Chip) characterized by high power dissipation. The two electronic components 26 arranged on the respective circuit boards 24 are preferably designed to be functionally redundant.If one electronic component 26 fails, the other electronic component 26 can take over the functionality of the failing electronic component 26. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] DE 10 2013 206 999 A1

[0002]

Claims

[1] Device for cooling an electronic component (26) of a motor vehicle, comprising at least one cooler (12) with at least one connection surface (16) which is designed such that the electronic component (26) arranged on a printed circuit board (24) can be cooled via the connection surface (16), comprising at least one housing (18) which at least partially encloses the printed circuit board (24), wherein the housing (18) has at least one housing opening (19), wherein at least a part of the cooler (12) is led out of this housing opening (19), wherein a gap dimension (38) between the electronic component (26) and the connection surface (16) is designed to be adjustable in different stages via at least one step-shaped arrangement (20, 21, 22, 23). [2] Device according to claim 1, characterized bythat the step-shaped arrangement (20, 21, 22, 23) is arranged on the cooler (12) and / or on the electronic component (26) and / or on the housing (18) and / or on a component connected to the electronic component (26), in particular a printed circuit board (24, 30). [3] Device according to one of the preceding claims, characterized by that at least one counter surface (17) is provided which cooperates with the stepped arrangement (20, 21, 22, 23) for adjusting the gap size (38), wherein the counter surface (17) is arranged on the cooler (12) and / or on the electronic component (26) and / or on the housing (18) and / or on a component connected to the electronic component (26), in particular a printed circuit board (24, 30). [4] Device according to one of the preceding claims, characterized bythat the step-like arrangement (20, 21, 22, 23) comprises several steps and / or plateaus and / or ledges and / or that a further step-like arrangement (22, 23) is provided. [5] Device according to one of the preceding claims, characterized by that the step-like arrangement (20, 21, 22, 23) has several steps of different heights (d1, d2, d3). [6] Device according to one of the preceding claims, characterized by that the gap size (38) can be changed via a relative movement (32, 36) between the cooler (12) and the housing (18) and / or between the counter surface (17) and the step-shaped arrangement (20, 21, 22, 23). [7] Device according to one of the preceding claims, characterized by that the relative movement takes place via a particularly linear or particularly planar movement (32) parallel to the surface of the connecting surface (16) and / or via a rotation (36). [8] Device according to one of the preceding claims, characterized by that along the relative movement, in particular during a linear movement (32) and / or during a rotation (36), a height of the steps of the step-like arrangement (20, 21, 22, 23) and / or of the further step-like arrangement (22, 23) changes discretely, in particular increases or decreases. [9] Device according to one of the preceding claims, characterized by that the stepped arrangement (20, 21, 22, 23) and / or the counter surface (17) cooperating with the stepped arrangement (20, 21, 22, 23) is arranged on an edge or projection (13) of the cooler (12) covering the housing opening (19). [10] Device according to one of the preceding claims, characterized bythat the counter surface (17) cooperating with the step-shaped arrangement (20, 21, 22, 23) is designed to project relative to the surface in such a way that this counter surface (17) can cover at least parts of the step-shaped arrangement (20, 21, 22, 23). [11] Device according to one of the preceding claims, characterized by that after setting the desired gap size (38), at least one connecting means (34) is provided for fixing the cooler (12) relative to the electronic component (26), in particular by a fixing which compensates for a relative movement and which comprises a connecting means (34) which cooperates with an oversized hole or an elongated hole (40). [12] Method for cooling an electronic component (26) of a motor vehicle, comprising at least one cooler (12) with at least one connection surface (16) which is designed such that the electronic component (26) arranged on a printed circuit board (24) can be cooled via the connection surface (16), comprising at least one housing (18) which at least partially encloses the printed circuit board (24), wherein the housing (18) has at least one housing opening (19), wherein at least a part of the cooler (12) is led out of this housing opening (19), wherein a gap size (38) between the electronic component (26) and the connection surface (16) is set in different stages via at least one step-shaped arrangement (20, 21, 22, 23). [13] Method according to the preceding method claim, further comprising the following steps: measuring the gap size (38), determining a setting of the step-like arrangement (20, 21, 22, 23), in particular of the respective step, applying a relative movement (32, 36) between the cooler (12) and the electronic component (26) to set the desired gap size (38) and / or fixing the cooler (12) relative to the electronic component (26). [14] Method according to one of the preceding method claims, characterized by that the cooler (12) is positioned and / or a thermally conductive material (28) is applied between the cooler (12) and the electronic component (26) and / or that the cooler (12) is pressed onto a thermally conductive material (28) and / or that the cooler (12) is firmly connected to the housing (18) and / or the printed circuit board (24) and / or that a seal, in particular an EMC seal, is introduced between the cooler (12) and the housing (18).

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