Camera for a motor vehicle and method for constructing a camera

Abstract

A camera (100, 600, 1100, 1300) for a motor vehicle, comprising a lens (101) with a lens housing (102) and at least one optical lens (103); a circuit board (104) with an image sensor (105) arranged on the circuit board (104), wherein the image sensor (105) faces the lens (101) and is optically aligned therewith; and a carrier element (109) which is fastened to the circuit board (104). The carrier element (109) is fastened to the circuit board (104) on a side of the circuit board (105) carrying the image sensor (105); wherein the carrier element (109) has at least three resilient tabs (112) pointing in the axial direction towards the lens (101); wherein the lens housing (102) has a spherical contour (114, 601) against which the resilient tabs (112) are formed; and wherein the resilient tabs (112) are each fastened to the spherical contour (114, 601) of the lens housing (102) by means of a laser weld (402).

Description

The present invention relates to a camera for a motor vehicle and to a method for constructing a camera according to the independent claims.Prior ArtThe procedure for mounting known cameras is often as follows: First, an image sensor is fixed to a printed circuit board and a lens holder is adhesively bonded to the printed circuit board. The positioning and fixing of a lens in the lens holder are then usually carried out. In this case, the objective is actively aligned with the image sensor and permanently fixed in the focused position via an adhesive connection.An alternative to this, without adhesive connections, is known from DE 10 2022 211 411. Disclosed here is a camera for a motor vehicle comprising an objective having at least one optical lens; a camera housing, the objective being fixed to the camera housing; a printed circuit board, having an image sensor arranged on the printed circuit board, the image sensor facing the objective and being optically aligned with it. In this case, the camera furthermore comprises a carrier element which is fastened to the printed circuit board on a side of the printed circuit board facing away from the image sensor by means of at least one soldered connection, and wherein the carrier element is formed in such a way that a gap is formed between the camera housing and the carrier element; and at least one gap bridging element which is fastened by means of laser welded connections at contact points to the carrier element and at contact points to the camera housing.It is an object of the present invention to provide a further alternative for a camera without adhesive connections.Disclosure of the InventionThe present invention is based on a camera for a motor vehicle comprising an objective having an objective housing and at least one optical lens; a printed circuit board having an image sensor arranged on the printed circuit board, wherein the image sensor faces the objective and is optically aligned therewith; and a carrier element which is fastened to the printed circuit board.According to the invention, the carrier element is fastened to the printed circuit board on a side of the printed circuit board carrying the image sensor. In this case, the carrier element has at least three resilient tongues pointing in the axial direction towards the objective. The objective housing furthermore has a spherical contour on which the resilient tabs are formed so as to rest. The resilient tongues are fastened to the spherical contour of the objective housing in each case by means of laser welds.The carrier element is in particular configured as a stamped and bent part. The resilient tabs can be formed in such a way that they partially abut the spherical contour of the objective housing. The resilient tongues of the carrier element are in particular configured such that they abut the spherical contour of the objective housing with an end pointing towards the objective. Each of the at least three resilient tabs in particular bears on a contact point on the spherical contour of the objective housing. In other words, a respective laser weld connection is formed at each of the at least three contact points.The spherical contour of the objective housing can be understood as a rounded or also as a spherical contour.The objective housing can have different shapes. Thus, the objective housing can be round, for example. Thus, the objective housing can be angular, for example.The printed circuit board is configured in particular to record the image sensor. The printed circuit board can accommodate further components, such as a plug of the camera, as well as further electronic components. The camera described here can in particular also have an electrical plug which is designed to electrically connect the printed circuit board. The fact that the image sensor is aligned with the objective means in particular that the image sensor is placed during a method for constructing the camera in such a way that images which are projected onto the image sensor through the objective have the best possible quality.During the construction of the camera, the carrier element can be displaced along a first axis (image vertical, X axis) and along a second axis (image horizontal, Y axis) on the printed circuit board. This can be carried out, for example, in the step of optically aligning the image sensor with the objective. After the optical alignment, the carrier element can then be fastened to the printed circuit board, for example. During the construction of the camera, the objective housing, on the spherical contour of which the resilient tabs of the carrier element abut, can furthermore be displaced along a third axis (focusing, Z axis) and along a first axis of rotation (rotation of the image sensor about the image vertical, X_rot) and a second axis of rotation (rotation of the image sensor about the image horizontal, Y_rot). In such an alignment, the resilient tabs can exert force on the objective housing and thus ensure contact with the contour of the objective housing.The advantage of the invention is that the resilient tabs of the carrier element permit simple alignment of the image sensor with respect to the objective when the camera is constructed. The resilient tabs thus make possible the contact of the carrier element with the objective housing. Due to the flexibility of the resilient tabs, the objective housing and thus also the objective with the image sensor can be aligned easily and precisely during assembly. The resilient tabs allow tolerances to be compensated. The laser welded connections also make possible a good and long-lived fixing. Adhesive connections in the camera can be avoided. Adhesive compounds have the disadvantage of unfavourable behaviour due to expansion in the event of temperature fluctuations, swelling due to moisture and / or ageing of their properties over time. By avoiding such adhesive connections in the camera presented here, it can be achieved that the optical alignment of the image sensor with respect to the objective can be kept constant. Thus, for example, a change in the distance between the image sensor and the objective and a defocusing associated therewith can be avoided even in the case of temperature fluctuations, humidity or over time. The connections between the resilient tabs and the objective housing are of very robust design.In an advantageous embodiment, it is provided that the carrier element is formed in one piece or in multiple pieces. A one-piece carrier element can be aligned easily and precisely on the printed circuit board. A multi-part carrier element offers the advantage that more free surfaces are available on the printed circuit board for further components.In a further advantageous embodiment, it is provided that the objective housing has a radially outwardly projecting collar and has the spherical contour at one end of the collar. The resilient tongues are formed here so as to extend in the axial direction towards the collar by a planar plate of the carrier element fastened to the printed circuit board. In this case, the planar plate of the carrier element has, in particular, a cutout in which the image sensor is arranged.The flat plate of the carrier element can be formed in a quadrilateral or polygonal manner, in particular with rounded corners. This is in particular the case when the camera housing and / or the printed circuit board is / are also designed to be quadrilateral or polygonal. If the flat plate is, for example, rectangular, the carrier element has in particular four resilient straps. If the circuit board is, for example, rectangular and the carrier element is, for example, multi-part, a part of the carrier element can be arranged, for example, in each of the four corners of the circuit board. Each part of the carrier element in this example has at least one resilient tab pointing in the axial direction towards the objective. The flat plate can alternatively also be round. This is the case in particular when the camera housing is also round. The resilient tabs can in this case be arranged distributed around the carrier element.The advantage of this embodiment is that the objective can be aligned very easily in all spatial directions. The brackets fastened to the spherical contour by means of the laser welding can be reinforced and no longer resilient. As a result, in the method for constructing the corresponding camera, an alignment in the X and Y direction may not be necessary under certain circumstances. In particular in the case of a camera housing of quadrilateral or polygonal design, the production process can thus be made more cost-effective. In particular, the multi-part configuration of the carrier element in combination with an objective housing with a radially outwardly projecting collar allows more cost-effective processing.In a further advantageous embodiment, it is provided that the objective housing has the spherical contour at an end facing the image sensor. And wherein the support member comprises a planar plate secured to the circuit board, and wherein the resilient tabs and the plate are interconnected by an L-shaped portion.In this case, the planar plate of the carrier element has, in particular, a cutout in which the image sensor is arranged.The flat plate of the carrier element can be formed in a quadrilateral or polygonal manner, in particular with rounded corners. This is in particular the case when the camera housing and / or the printed circuit board is / are also designed to be quadrilateral or polygonal. If the flat plate is, for example, rectangular, the carrier element has in particular four resilient straps. The flat plate can alternatively also be round. This is the case in particular when the camera housing is also round. The resilient tabs can in this case be arranged distributed around the carrier element. Alternatively, the flat plate of the carrier element can be formed in a quadrilateral or polygonal manner, wherein the L-shaped section forms a round recess, on which the resilient tongues are arranged distributed.The advantage of this embodiment is that here the objective housing can be configured in particular as a rotationally symmetrical component (e.g. a turned part). This is the case in particular when the objective housing and in particular also the camera housing are round. Such an objective housing can be provided cost-effectively. The objective housing can be aligned self-centering and bridging the tolerances with respect to the carrier element during the method for producing the camera.In a further advantageous embodiment, it is provided that the carrier element is fastened to the printed circuit board in a materially bonded or positive-locking manner. A cohesive connection can be, for example, a soldered connection. A cohesive connection can be, for example, a laser weld connection. The advantage of this embodiment is that a simple, cost-effective and robust connection can be formed between the printed circuit board and the carrier element.In a further advantageous embodiment, it is provided that the printed circuit board has at least one passage. In this case, the carrier element has at least one rivet, by means of which it is fastened to the printed circuit board. Alternatively, the carrier element has at least one protuberance which projects into the at least one passage and is fastened in a materially integral manner to a fixing plate arranged on a side of the printed circuit board opposite the image sensor. Alternatively, a press-fit bushing is introduced into the passage, to which the carrier element is fastened in a materially bonded manner.The advantage of this embodiment is that adhesive connections can be avoided here.In a further advantageous embodiment, it is provided that the camera further comprises a rear housing and a front housing. In other words, the camera has a housing comprising a rear housing and a front housing. The rear housing and the front housing are here connected to one another in particular in a materially bonded or positive-locking manner. The front housing here accommodates in particular the lens of the camera. The objective lens can be formed fixed to the front housing. The objective and the front housing can be fastened to one another, for example, by means of a welded or soldered connection. The rear housing here accommodates in particular the printed circuit board and the carrier element.The rear housing can also be understood as a housing cover. Alternatively, the camera has a separate housing cover which is connected to the rear housing on a side of the rear housing facing away from the objective.The advantage of this embodiment is that the housing protects the camera from media entering from the environment of the camera.In a further advantageous embodiment, it is provided that the front housing and the objective housing are formed in one piece. The at least one lens of the objective is arranged in this case in a region of the front housing provided for this purpose. The construction of the camera is thus simplified. A separate fastening of the front housing to the objective housing is not necessary.The invention furthermore relates to a method for constructing a camera, comprising the steps of: providing a printed circuit board having an image sensor arranged thereon; arranging a carrier element on a side carrying the image sensor on the printed circuit board, wherein the carrier element has at least three resilient lugs which are oriented in the arrangement facing away from the image sensor; providing an objective having an objective housing and at least one optical lens, wherein the objective housing has a spherical contour; inserting the objective into the carrier element in such a way that the resilient lugs bear against the spherical contour; optically aligning the image sensor with the objective; fastening the carrier element to the printed circuit board; and fastening the resilient lugs to the spherical contour of the objective housing in each case by means of laser welded connections.When aligning the image sensor optically with the objective, the carrier element can be displaced along a first axis (image vertical, X axis) and along a second axis (image horizontal, Y axis) on the printed circuit board. After the optical alignment, the carrier element can then be fastened to the printed circuit board, for example. When the image sensor is optically aligned with the objective, the objective housing, on whose spherical contour the resilient tabs of the carrier element abut, can furthermore be displaced along a third axis (focusing, Z axis) and along a first axis of rotation (rotation of the image sensor about the image vertical, X_rot) and a second axis of rotation (rotation of the image sensor about the image horizontal, Y_rot). In this case, the resilient tabs can exert force on the objective housing and thus ensure contact with the contour of the objective housing.It is understood that the features mentioned above and those still to be explained below can be used not only in the respectively specified combination, but also in other combinations or alone, without departing from the scope of the present invention.DRAWINGSExemplary embodiments of the present invention are explained in more detail below with reference to the attached drawings. Identical reference numerals in the figures denote identical or identically acting elements. The following are shown: FIG. 1 shows a first exemplary embodiment of a camera in a sectional representation; FIG. 2 shows an exemplary embodiment for positioning a carrier element on a printed circuit board; FIG. 3 is a view of the first embodiment of the camera; FIG. 4 shows a first exemplary embodiment of the optical alignment and the fastening of the carrier element to the printed circuit board and to the objective housing; FIG. 5 is a three-dimensional view of the first embodiment of the camera; FIG. 6 shows a second exemplary embodiment of a camera in a sectional representation; FIG. 7 shows a second exemplary embodiment for positioning a carrier element on a printed circuit board; FIG. 8 shows a second exemplary embodiment of the optical alignment and the fastening of the carrier element to the printed circuit board and to the objective housing; FIG. 9 is a three-dimensional view of the second embodiment of the camera; FIG. 10 shows an exemplary embodiment for positioning a multi-part carrier element on a printed circuit board; FIG. 11 shows a three-dimensional view of the embodiment of the camera with the multi-part carrier element; FIG. 12 shows examples of fastening possibilities of a carrier element to a printed circuit board; FIG. 13 shows a further exemplary embodiment of a camera with a front housing and objective housing formed in one piece.FIG. 1 shows a first exemplary embodiment of a camera 100 in a sectional illustration. The camera 100 comprises the objective 101 with the objective housing 102 and the optical lens 103. The optical lens 103 can be a single optical lens or can also comprise a plurality of optical lenses. The optical lens 103 may be a lens stack, for example. The camera 100 also comprises the printed circuit board 104 with the image sensor 105 arranged thereon. The image sensor 105 faces the objective 101 and is optically aligned therewith. Furthermore, the camera 100 comprises the carrier element 109 which is fastened to the printed circuit board 104. In this case, it is fastened to the printed circuit board 104 on a side of the printed circuit board 104 carrying the image sensor 105. The carrier element 109 has at least three resilient tabs 112 pointing in the axial direction toward the objective 101. The sectional view of the camera 100 shows only two resilient tabs 112 in FIG. 1. The objective housing 102 has a spherical contour 114, against which the resilient tabs 112 are formed so as to rest. The resilient tongues 112 are fastened to the spherical contour 114 of the objective housing 102 in each case by means of a laser weld connection.In the exemplary embodiment shown in FIG. 1, the objective housing 102 is designed such that it has a radially outwardly projecting collar 113. The spherical contour 114 has the objective housing 102 at one end of the collar 113. The resilient tongues 112 of the carrier element 109 are formed so as to extend in the axial direction towards the collar 113 by the planar plate 111 of the carrier element 109 fastened to the printed circuit board 104.It can also be seen that the printed circuit board 104 has a passage 115. A press-fit bushing 110 is inserted in the passage 115. The carrier element 109 is fastened to the press-fit bushing 110 in a materially integral manner. As a result, the carrier element 109 is fastened to the printed circuit board 104. In other words, the carrier element 109 is fastened to the printed circuit board 104 by means of a materially bonded connection.Furthermore, it can be seen in FIG. 1 that the exemplary embodiment of the camera 100 also comprises a housing. The housing is constructed in two parts and has the front housing 106 and the rear housing 107. The rear housing 107 and the front housing 106 can be connected to one another in a materially bonded or form-fitting manner. The rear housing 107, in turn, comprises a passage through which the plug 108 projects. The plug 108 is arranged on the circuit board 104 and is configured to electrically connect the circuit board 104.FIG. 2 shows an exemplary embodiment for positioning a carrier element 109 on a printed circuit board 104. This is in particular the carrier element 109 and the printed circuit board 104 of the exemplary embodiment of the camera 100 from FIG. 1. The carrier element 109 is formed in one piece in this example. The flat plate 111 of the carrier element 109 is also formed in a square manner, with rounded corners. The planar plate 111 has the cutout 201. The recess 201 allows the image sensor 105 to be arranged in the center of the circuit board 104. The carrier element 109 here has four resilient tabs 112- 1 to 112- 4.FIG. 3 shows a view of the first exemplary embodiment of the camera 100 from FIG. 1, wherein the front housing is not shown. This corresponds to the view of the printed circuit board 104 and the carrier element 109 in FIG. 2, except that now the objective housing 102 and the optical lens 103 can also be seen. It can be seen that the resilient tabs 112- 1 to 112- 4 enable the contact of the carrier element 109 with the objective housing 102.FIG. 4 shows a first exemplary embodiment of the optical alignment and the fastening of the carrier element 109 to the printed circuit board 104 and to the lens housing 102 as a step of a method for constructing a camera 100, as was described, for example, in the preceding figures.The optical alignment of the image sensor 105 with respect to the objective 101 is here a step of the method for constructing a camera 100. In advance, the method also has the following steps: providing the printed circuit board 104 with the image sensor 105 arranged thereon; arranging the carrier element 109 on a side carrying the image sensor 105 on the printed circuit board 104, wherein the carrier element 109 has at least three resilient tabs 112 which are oriented in the arrangement facing away from the image sensor 105; providing an objective 101 having an objective housing 102 and at least one optical lens 103, wherein the objective housing 102 has a spherical contour 114; and inserting the objective 101 into the carrier element 109 in such a way that the resilient tabs 112 bear against the spherical contour 114.In the stage of the method shown here, certain parts of the camera are initially still movable relative to one another. Thus, the support member 109 can be slid along the X-axis and along the Y-axis on the circuit board 104. This is indicated by the corresponding double arrow. In addition, the objective 101 and with it the objective housing 102, on whose spherical contour 114 the resilient tabs 112 of the carrier element 109 bear, can be displaced along the Z axis and along the rotational axis X_rot and along the rotational axis Y_rot. This is again indicated by the corresponding double arrow. In this case, the resilient tabs 112 can exert force on the objective housing 102 and thus ensure contact with the contour 114.The support member 109 is fixed to the circuit board 104 after the optical alignment step. For this purpose, press-fit bushes 110 are each introduced into a passage of the printed circuit board 104, and the carrier element 109 and the press-fit bushes 110 are each connected to one another at a contact point by means of a laser weld connection 401. The resilient tongues 112 of the carrier element 109 are also fastened to the spherical contour 114 of the objective housing 102 in each case by means of laser welds 402.FIG. 5 once again shows a three-dimensional view of the first exemplary embodiment of the camera 100, here without a housing, as was constructed, for example, as shown in FIG. 4. It can be seen here that the printed circuit board 104 has three passages into each of which a press-fit bushing 110- 1 to 110- 3 is inserted and to which the carrier element 109 is fastened.FIG. 6 shows a second exemplary embodiment of a camera 600 in a sectional representation. Camera 600 is similar to camera 100 from the first exemplary embodiment, so that mainly the differences from camera 100 will be discussed below.The lens housing 102 of the camera 600 does not have a collar. Rather, the objective housing 102 has the spherical contour 601 at an end facing the image sensor 105. The support member 109 comprises a planar plate 111 fixed to the circuit board 104, and the resilient tabs 112 of the support member 109 and the plate 111 are connected together by means of an L-shaped portion 602.The positioning of the carrier element 109 of the camera 600 on the printed circuit board 104 is shown once again in FIG. 7. This is a plan view of the camera 600, without the housing 106, 107. The planar plate 111 of the carrier element 109 again has a cutout 201, in which the image sensor 105 is arranged. The planar plate 111 is formed as an irregular hexagon. The L-shaped section forms a round recess, on which three resilient tongues 112- 1 to 112- 3 are arranged distributed here. The carrier element 109 shown here is formed in one piece. Alternatively, it can also be formed in multiple parts.FIG. 8 shows a second exemplary embodiment of the optical alignment and the fastening of the carrier element 109 to the printed circuit board 104 and to the lens housing 102 as a step of a method for constructing a camera 600, as has been described, for example, in FIGS. 6 and 7. Just as in the method from FIG. 4, here too the optical alignment of the image sensor 105 with respect to the objective 101 is a step of the method for constructing a camera 600.In the example shown here, the method has the same preliminary steps as were described with reference to FIG. 4.In the stage of the method shown in FIG. 8, certain parts of the camera are again initially still movable relative to one another. Thus, the support member 109 can be slid along the X-axis and along the Y-axis on the circuit board 104. This is indicated by the corresponding double arrow. In addition, the objective 101 and with it the objective housing 102, on whose spherical contour 601 the resilient tabs 112 of the carrier element 109 bear, can be displaced along the Z axis and along the rotational axis X_rot and along the rotational axis Y_rot. This is also indicated by a corresponding double arrow. In this case, the resilient tabs 112 can exert force on the objective housing 102 and thus ensure contact with the contour 601.The support member 109 is fixed to the circuit board 104 after the optical alignment step. For this purpose, press-fit bushes 110 are each introduced into a passage of the printed circuit board 104, and the carrier element 109 and the press-fit bushes 110 are each connected to one another at a contact point by means of a laser weld connection 401. The resilient tongues 112 of the carrier element 109 are also fastened to the spherical contour 601 of the objective housing 102 in each case by means of laser welds 402.FIG. 9 once again shows a three-dimensional view of the camera 600, here without a housing, as was constructed, for example, as shown in FIG. 8. It can be clearly seen here that the printed circuit board 104 has three passages into each of which a press-fit bushing 110- 1 to 110- 3 is inserted and to which the carrier element 109 is fastened.FIG. 10 shows an exemplary embodiment for positioning a multi-part carrier element 109 on a printed circuit board 104. The printed circuit board 104 is formed square in this example, with rounded corners. The carrier element 109 is formed from four individual parts. These individual parts are located in each of the four corners of the circuit board 104. Each of the four parts has a flat plate 111- 1 to 111- 4 in each case. Furthermore, each of the four parts has in each case two tabs which are resilient in the axial direction and point towards an objective in a constructed camera. These are resilient tabs 112-1-A and 112-1-B for the first part, resilient tabs 112-2-A and 112-2-B for the second part, resilient tabs 112-3-A and 112-3-B for the third part, and resilient tabs 112-4-A and 112-4-B for the fourth part.FIG. 11 shows a three-dimensional view of an exemplary embodiment of the camera 1100 having a multipart carrier element, as was described in FIG. 10. In this example, the objective housing 102 again has a radially outwardly projecting collar 113. The spherical contour 114 has the objective housing 102 at one end of the collar 113. The resilient tabs 112 are designed such that they extend from the planar plates, fastened to the printed circuit board 104, of the individual parts of the carrier element 109 in the axial direction toward the collar 113. Not shown here, the camera 1100 may also have a housing, in particular a rear housing and a front housing.FIG. 12 shows examples of possible fastenings of a carrier element 109 to a printed circuit board 104.In example a), the planar plate 111 of the carrier element 109 is fastened to the printed circuit board 104 by means of a soldered connection 1201 in a materially bonded manner. Under certain circumstances, the mobility of the carrier element 109 relative to the printed circuit board 104 along the X axis and along the Y axis is omitted here during the optical alignment step.In example b), the printed circuit board 104 has a passage 115. The carrier element 109 has a rivet 1202, by means of which it is fastened to the printed circuit board 104. Under certain circumstances, the mobility of the carrier element 109 relative to the printed circuit board 104 along the X axis and along the Y axis in the optical alignment step is also omitted here. In example c), the circuit board 104 also has a passage 115. The carrier element 109 has a protuberance 1203 projecting into the passage 115. The protuberance 1203 is fastened in a materially integral manner to a fixing plate 1205 arranged on an opposite side of the printed circuit board 105. In a constructed camera, this opposite side is a side opposite an image sensor. The fastening to the fixing plate 1205 can be realized, for example, by means of a laser weld connection 1204.In example d), the circuit board 104 also has a passage 115. A press-fit bushing 110 is introduced into the passage 115, on which the carrier element 109 or a planar plate 111 of the carrier element 109 is fastened in a materially integral manner. The fastening can be realized, for example, by means of a laser welded connection 401.FIG. 13 shows a further exemplary embodiment of a camera 1300 with a front housing and objective housing formed in one piece. With regard to the carrier element 109 and the fastening of the carrier element 109 to the lens housing 102, the camera 1300 corresponds to the camera 600 from FIG. 6 Here too, the lens housing 102 has a spherical contour 601 at an end facing the image sensor 105. The support member 109 comprises a planar plate 111 fixed to the circuit board 104, and the resilient tabs 112 and the plate 111 are connected together by an L-shaped portion 602.In contrast to the camera 600, in the case of the camera 1300, the lens housing 102 simultaneously also represents the front housing of the camera. In other words, the front housing and the objective housing are formed in one piece. The objective housing 102 has a radially outwardly projecting collar 1301. The collar 1301 does not have the spherical contour 601 in this case. Rather, the rear housing 107 of the camera 1300 is arranged at the end of the collar 1301. The collar 1301 and the rear housing 107 can be connected to one another in a materially bonded or positive-locking manner.References included in the specificationThis list of documents cited by the applicant has been produced in an automated manner and is only included for the better information of the reader. The list is not part of the German patent application or utility model application. The DPMA does not take any adhesion for any faults or omissions.Patent Literature citedDE 10 2022 211 411

[0003]

Claims

Camera (100, 600, 1100, 1300) for a motor vehicle, comprising: • an objective (101) having an objective housing (102) and at least one optical lens (103); • a printed circuit board (104) having an image sensor (105) arranged on the printed circuit board (104), wherein the image sensor (105) faces the objective (101) and is aligned optically with the latter; and • a carrier element (109) which is fastened to the printed circuit board (104); characterized in that • the carrier element (109) is fastened to the printed circuit board (104) on a side of the printed circuit board (104) which carries the image sensor (105); • wherein the carrier element (109) has at least three resilient tongues (112) which point in the axial direction towards the objective (101); • wherein the objective housing (102) has a spherical contour (114, 601), on which the resilient tongues (112) are formed so as to rest; • wherein the resilient tabs (112) are fastened to the spherical contour (114, 601) of the objective housing (102) in each case by means of a laser weld connection (402).Camera (100, 600, 1100, 1300) according to Claim 1, wherein the carrier element (109) is formed in one part or in multiple parts.Camera (100, 1100) according to Claim 1 or 2, wherein the lens housing (102) has a radially outwardly projecting collar (113) and has the spherical contour (114) at one end of the collar (113); and wherein the resilient tongues (112) are formed so as to extend in the axial direction towards the collar (113) by a planar plate (111) of the carrier element (109) fastened to the printed circuit board (104).The camera (600, 1300) according to claim 1 or 2, wherein the lens housing (102) has the spherical contour (601) at an end facing the image sensor (105); and wherein the carrier element (109) has a planar plate (111) fastened to the printed circuit board (104), and wherein the resilient tabs (112) and the plate (111) are connected to one another by means of an L-shaped section (602).Camera (100, 600, 1100, 1300) according to one of the preceding claims, wherein the carrier element (109) is fastened to the printed circuit board (104) in a materially bonded or positive-locking manner.Camera (100, 600, 1300) according to Claim 5, wherein the printed circuit board (104) has at least one passage (115); and wherein the carrier element (109) has at least one rivet (1202), by means of which it is fastened to the printed circuit board (104); or wherein the carrier element (109) has at least one protuberance (1203), which projects into the at least one passage (115) and is fastened in a materially integral manner to a fixing plate (1205) arranged on a side of the printed circuit board (105) opposite the image sensor (105); or wherein a press-in bushing (110), to which the carrier element (109) is fastened in a materially integral manner, is introduced into the passage (115).The camera (100, 600, 1300) of any preceding claim, further comprising a rear housing (107) and a front housing (106).The camera (1300) of claim 7, wherein the front housing (106) and the lens housing (102) are integrally formed.Method for constructing a camera (100, 600, 1100, 1300), comprising the steps: • providing a printed circuit board (104) with an image sensor (105) arranged thereon; • arranging a carrier element (109) on the printed circuit board (104) on a side carrying the image sensor (105), wherein the carrier element (109) has at least three resilient tongues (112) which are oriented in the arrangement facing away from the image sensor (105); • providing an objective (101) having an objective housing (102) and at least one optical lens (103), wherein the objective housing (102) has a spherical contour (114, 601); • introducing the objective (101) into the carrier element (109) in such a way that the resilient tongues (112) bear against the spherical contour (114, 601); • optically aligning the image sensor (105) with the objective (101); • fastening the carrier element (109) to the printed circuit board (104); and • fastening the resilient tabs (112) to the spherical contour (114, 601) of the objective housing (102) in each case by means of a laser weld connection (402).

Images