SYSTEM FOR ROLLING METAL INTO A FILM

Abstract

A system is provided that is configured to roll metal into a foil. The system includes work rolls arranged in pairs at a distance from each other along a working line to receive the metal between them. The work rolls are configured to press against the metal to roll it into the foil as the metal is fed along the working line between the work rolls or each pair of work rolls. A cooling subsystem is arranged along the working line such that it is in line with the work rolls. The cooling subsystem is configured to cool the metal as it moves along the working line.The cooling subsystem includes cooling rollers configured to guide and transport the metal along the work line to the work rollers, and containing channels configured to receive coolant to cool the cooling rollers and the film in contact with them. The system further includes polymer support elements between adjacent cooling rollers.

Description

INTRODUCTION

[0001] The information provided in this section serves the purpose of providing a general overview of the context of the disclosure. Neither the work of the inventors currently named, to the extent described in this section, nor those aspects of the description that could not otherwise qualify as prior art at the time of filing, are expressly or implicitly recognized as prior art against the present disclosure.

[0002] The present disclosure relates to systems for transferring temperatures below ambient temperature for cold forming processes configured to roll metals into foils, wherein the metals have relatively low melting temperatures.

[0003] Several manufacturing processes involve rolling metals into foils. For example, lithium can be rolled into a thin foil to form the active layer of a battery anode. The lithium foil can be attached to any suitable current collector, such as a copper foil, to form the anode. Indium, tin, lead, and sodium are additional examples of metals that can be rolled into foils. In some cases, the metals may have a relatively low melting point.

[0004] DE 10 2016 222 004 A1 discloses a process for producing thin, metal-based films. The process comprises steps in which a metal is extruded in an extruder to form a pre-film, the pre-film is cooled in a coolant bath, and the pre-film is rolled into the thin film by rolling in a rolling system comprising at least two rolls. US 2021 / 0 060 638 A1 discloses a process for coating flexible substrates with a metal or metal alloy with a low melting point. SUMMARY

[0005] The present disclosure comprises a system configured to roll metal into a foil. The system includes work rolls arranged in pairs at a distance from one another along a working line to receive the metal between them. The work rolls are configured to press against the metal to roll it into the foil as the metal is fed along the working line between the work rolls or to each pair of work rolls. A cooling subsystem is arranged along the working line such that the cooling subsystem is in line with the work rolls. The cooling subsystem is configured to cool the metal as it moves along the working line.The cooling subsystem includes cooling rollers configured to guide and transport the metal along the work line to the work rollers, and within which channels are defined that are configured to receive coolant to cool the cooling rollers and the film in contact with the cooling rollers. The system also includes polymer support elements between adjacent cooling rollers.

[0006] According to further characteristics, the metal contains at least one of lithium, indium, tin, lead and sodium.

[0007] According to further characteristics, the film is configured as an active layer of a battery electrode.

[0008] According to further characteristics, the channels run parallel to an axis of rotation of the cooling rollers and completely through the cooling rollers.

[0009] According to further characteristics, the channels do not run in a straight line relative to the axis of rotation of the cooling rollers.

[0010] According to further characteristics, the channels on the same side of the cooling rollers have an inlet and an outlet.

[0011] According to further features, the cooling subsystem includes a housing located adjacent to the cooling rollers. The housing defines a receptacle configured such that the outer surfaces of the cooling rollers are accessible within the housing, and the coolant present in the receptacle contacts the outer surfaces of the cooling rollers. Gaps are defined between the housing and each of the cooling rollers, providing clearance for the rotation of the cooling rollers and a controlled release of the coolant from the receptacle onto the cooling rollers to cool and lubricate them.

[0012] According to further characteristics, adjacent cooling rollers are arranged offset from each other.

[0013] According to further features, the cooling subsystem includes an upper guide and a lower guide arranged opposite the upper guide, the upper guide and the lower guide being spaced apart to accommodate the metal between them; the upper guide defines perforations configured to direct cooled air through the upper guide to the metal to cool the metal in an air jacket; and the lower guide consists of a thermally conductive material and defines a cooling channel configured to circulate the coolant in the lower guide to cool the metal, with the air jacket pressing the metal against the lower guide.

[0014] According to further features, the cooling subsystem includes an upper guide and a lower guide arranged opposite the upper guide, the upper guide and the lower guide being spaced apart to accommodate the metal between them; the upper guide includes a guide roller made of an insulating material, the guide roller being configured to press the metal against the lower guide; and the lower guide is made of a thermally conductive material and defines a cooling channel configured to circulate the coolant in the lower guide, the guide roller being configured to press the metal against the lower guide.

[0015] According to further features, the cooling subsystem includes an upper guide and a lower guide arranged opposite the upper guide, the upper guide and the lower guide being spaced apart to accommodate the metal between them; the upper guide defines perforations configured to direct cooled air through the upper guide to the metal in order to cool the metal in an air jacket; and the lower guide includes a heat pump configured to cool the metal, with the air jacket pressing the metal against the lower guide.

[0016] According to further features, the cooling subsystem includes an upper guide and a lower guide arranged opposite the upper guide, the upper guide and the lower guide being spaced apart to accommodate the metal between them; the upper guide includes a guide roller made of an insulating material, the guide roller being configured to press the metal against the lower guide; and the lower guide includes a Peltier stage configured to cool the metal, the guide roller being configured to press the metal against the lower guide.

[0017] According to further features, the cooling subsystem includes a load guide through which a primary channel is defined, the working line extending through the primary channel, several upper channels arranged above the primary channel and several lower channels arranged below the primary channel; and the upper and lower channels are configured to direct a coolant to the metal.

[0018] The present disclosure also includes, according to various features, a system configured to roll a metal into a foil. The system comprises: work rolls spaced apart from one another to receive the metal between them, the work rolls being configured to press against the metal to roll the metal into the foil; and a cooling subsystem spaced from the work rolls on a work line configured to feed the metal to the work rolls, the cooling subsystem comprising an upper guide and / or a lower guide on opposite sides of the work line, and the upper guide and / or the lower guide being configured to be cooled by a coolant to cool the metal as the metal moves through the cooling subsystem.

[0019] According to further features, the upper guide and the lower guide contain cooling rollers that define cooling channels configured to circulate the coolant in the cooling rollers.

[0020] According to further features, the upper guide device or the lower guide device is configured to press the metal against the other of the upper guide device and the lower guide device.

[0021] The present disclosure further provides a system configured to roll a metal into a foil. The system includes work rolls spaced apart to receive the metal between them, the work rolls being configured to press against the metal to roll the metal into the foil; and a cooling subsystem spaced from the work rolls on a work line configured to feed the metal to the work rolls, the cooling subsystem comprising an upper guide and a lower guide on opposite sides of the work line, and the upper guide and / or the lower guide being configured to cool the metal as it moves through the cooling subsystem. The metal contains at least one of lithium, indium, tin, lead, and sodium, and the foil is configured as an active layer of a battery electrode.

[0022] According to further features, the upper guide and / or the lower guide contain a heat pump configured to cool the metal.

[0023] Further applications of the present disclosure will become apparent from the detailed description, the claims, and the drawings. The detailed description and the specific examples serve only for illustration and are not intended to limit the scope of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present revelation is more fully understood from the detailed description and the accompanying drawings; they show: Fig. 1 a cross-sectional view of an exemplary battery cell containing current collectors coated with active layers; Fig. 2 an exemplary rolling system according to the present disclosure for rolling a metal into a metallic foil; Fig. 3A a perspective view of an exemplary cooling subsystem according to the present disclosure for cooling the metal; Fig. 3B a perspective view of exemplary cooling rollers of the cooling subsystem of Fig. 3A; Fig. 3C additional exemplary cooling rollers according to the present disclosure; Fig. 3D alternative cooling rollers according to the present disclosure; Fig. 3E further cooling rollers according to the present disclosure; Fig. 3F additional cooling rollers according to the present disclosure; Fig. 4A a perspective view of an additional cooling subsystem according to the present disclosure; Fig. 4B a perspective view of an upper housing and a lower housing of the cooling subsystem of Fig. 4A, wherein the housings interact with cooling rollers; Fig. 4C a cross-sectional view of the upper housing and cooling rollers of Fig. 4B, wherein the upper housing is filled with a coolant; Fig. 4D a gap for spacing between the upper housing and one of the cooling rollers; Fig. 5A a perspective view of another cooling subsystem according to the present disclosure; Fig. 5B a side view of an upper cooling guide and a lower cooling guide of the guide system of Fig. 5A; Fig. 6 a perspective view of a further cooling subsystem according to the present disclosure; Fig. 7 a perspective view of an additional cooling subsystem according to the present disclosure; Fig. 8 a perspective view of a further cooling subsystem according to the present disclosure; Fig. 9 a further cooling subsystem according to the present disclosure; Fig. 10 an additional cooling subsystem according to the present disclosure; and Fig. 11 a side view of another exemplary rolling system according to the present disclosure, which includes a cooling subsystem with offset cooling rolls.

[0025] Reference symbols can be used multiple times in the drawings to identify similar and / or identical elements. DETAILED DESCRIPTION

[0026] The present disclosure comprises a system configured to roll a metal into a foil. The metal can be any suitable metal possessing a relatively low melting point, such as lithium, indium, tin, lead, and / or sodium, etc. The foil can be configured for use in any suitable automotive or non-automotive application. For example, the foil can be used as an active layer of a battery electrode. The battery can be configured for use with a vehicle and can also be configured for non-automotive use.

[0027] Lithium, indium, tin, lead, sodium, and other metals with relatively low melting points exhibit low mechanical strength at room temperature, which poses challenges when rolling such metals into foils. For example, such metals are prone to cracking and breakage during rolling and can stick to the work rolls. The present disclosure includes a cooling subsystem configured to reduce the temperature of the metals before they reach the work rolls and / or between groups of work rolls. The system of the present disclosure provides for rolling the metals below ambient temperatures in a dry environment, maintaining a dew point below the rolling temperature of the metals. Reducing the temperature of metals with relatively low melting points provides increased strength and hardness for the metals, allowing them to be rolled into thinner foils.The present disclosure cools the metal in various ways before it reaches the work rolls, as is described in detail herein.

[0028] Fig. Figure 1 shows an exemplary battery cell 10. The battery cell 10 can be configured for use in any suitable application, such as any suitable automotive or non-automotive application. The battery cell 10 contains C cathode electrodes 20, A anode electrodes 40, and S separators 32, arranged in a predetermined sequence in a stack 12 inserted into a housing 48. C, A, and S are integers, each greater than one. In some examples, A = C + 1. The C cathode electrodes 20-1, 20-2, ... 20-C contain cathode-active layers 24 arranged on one or both sides of the cathode current collectors 26. The A anode electrodes 40-1, 40-2, ... 40-A contain anode-active layers 42 which are arranged on one or both sides of the anode current collectors 46.

[0029] As in Fig. As shown in Figure 2, the anode-active layers 42 can contain a metal 112 that has been rolled into a foil by a rolling system 110 of the present disclosure. The rolling system 110 comprises several work rolls 120 arranged along a working line. The work rolls 120 are generally arranged in pairs at a distance from one another along the working line. The work rolls 120 of each pair are spaced apart to receive the metal 112 and configured to press against the metal 112 to roll it into a foil as the metal 112 is fed along the working line between the rolls 120 or each pair of rolls. The work rolls 120 can be made of any suitable material, including, but not limited to, steel, aluminum, copper, etc. The work rolls 120 can be configured in any suitable manner.For example, the work rolls 120 can be forged, cast, produced by additive manufacturing, or similar processes. Additive manufacturing can be a metal additive manufacturing process followed by machining.

[0030] Fig. Figure 3A shows an exemplary cooling subsystem 210 according to the present disclosure, configured to cool the metal 112. The cooling subsystem 210 can be arranged at any suitable location along the working line of the rolling system 110, such that the cooling subsystem is in line with the work rolls 120. For example, the cooling subsystem 210 can be arranged upstream of all work rolls 120 and / or between one or more pairs of work rolls 120. Several cooling subsystems 210 can be included, such that a cooling subsystem 210 can be arranged between several different pairs of work rolls 120. As shown in Figure 3A, the cooling subsystem 210 can be arranged in a single, continuous manner. Fig. As shown in Figure 2, the cooling subsystem 210, like any of the other cooling subsystems 310, 410, 510, 610, 710 described here, can be identified, for example, by one or more of the downward-pointing arrows of Fig. 2 be arranged.

[0031] The cooling subsystem 210 contains several cooling rolls 220 arranged both above and below the metal 112. The cooling rolls 220 are sufficiently spaced to avoid reducing the thickness of the metal 112 as the metal 112 is guided over the cooling rolls 220 between the upper and lower groups of cooling rolls 220. The cooling rolls 220 are configured to guide and transport the metal 112 along the working line to the work rolls 120. As shown in Fig. As shown in Figure 3B, support elements 222 are arranged between adjacent cooling rollers 220. The support elements 222 can be made of any material suitable for supporting the movement of the metal 112 over the cooling rollers 220, such as any suitable polymer material. The support elements 222 can generally be configured to provide a guide and a support for the metal 112 to be guided over.

[0032] The cooling rolls 220 are cooled by any suitable coolant, which is circulated in cooling channels defined within the cooling rolls 220. Cooling the cooling rolls 220 cools the metal 112 in contact with the cooling rolls 220, which hardens the metal 112 and allows it to be rolled into relatively stronger and thinner foil thicknesses. Examples of a coolant that can be used to cool the cooling rolls 220 include, but are not limited to, silicone oil, liquid N2, liquid Ar, and liquid CO2.

[0033] The coolant can be supplied in any suitable manner, such as with any suitable refrigeration unit 650 (as in the Fig. 9 and Fig. (as shown in Figure 10) can be cooled. The refrigeration unit 650 can be any suitable refrigeration unit or other cooling device configured to cool a coolant to any suitable temperature, such as at least below ambient or room temperature. The temperature can depend on the specific metal 112 being rolled by the rolling system 110. For example, the temperature can be at or below the temperature at which the metal is subject to cracking or breaking during rolling by the rolls 120. More precisely, the refrigeration unit 212 can be configured to circulate coolant in a range from 25 °C to -70 °C. Examples of coolants that can be used to achieve temperatures below -70 °C are liquid argon or liquid nitrogen. The metal being rolled can be at any suitable temperature.For example, the temperature of the metal being rolled can range from -80 °C to 25 °C, such as -40 °C or approximately -40 °C.

[0034] The cooling rollers 220 can be configured in various ways, interacting fluidically with the chiller 650 and being cooled by the coolant. As in Fig. As shown in Figure 3C, the cooling subsystem 210 can, for example, include cooling rollers 220A that define channels 230. The channels 230 are configured to receive chilled coolant from the refrigeration unit 650. The channels 230 are formed in any suitable manner, such as by drilling into forged or cast solid cooling rollers 220A. The channels 230 run completely through the cooling rollers 220A along or parallel to an axis of rotation of the rollers 220A. Each of the channels 230 has an inlet 232 and an outlet 234 at opposite ends of the cooling rollers 220A.

[0035] Fig. Figure 3D shows additional exemplary cooling rollers 220B according to the present disclosure for use with the cooling subsystem 210. The cooling rollers 220B define channels 240 which, in the example shown, extend completely through the cooling rollers 220B from the inlets 242 to the outlets 244 on opposite sides of the cooling rollers 220B. The channels 240 are defined within the rollers 220B during additive manufacturing. The channels 240 do not run in a straight line and generally have a zigzag pattern through the cooling rollers 220B. The channels 240 are configured to receive chilled coolant from the chiller 650.

[0036] As in Fig. As shown in Figure 3E, the cooling subsystem 210 can alternatively include cooling rollers 220C. The cooling rollers 220C are cast around tubes 250, which can be made of copper or any other suitable material. The tubes 250 define channels for the coolant. The tubes 250 each have an inlet 252 and an outlet 254 on the same side of the rollers 220C. Alternatively, the tubes 250 can pass completely through the rollers 220C.

[0037] As in Fig. As shown in Figure 3F, the cooling subsystem 210 can alternatively include cooling rollers 220D. The cooling rollers 220D define channels 260, which are generally porous areas of the rollers 220D, each having an inlet 262 and an outlet 264 on opposite sides of the channels 260. The channels 260 are defined within the rollers 220D during additive manufacturing. The channels 260 are configured to receive the coolant.

[0038] The Fig. Figures 4A-4D show an additional cooling subsystem 310 according to the present disclosure for cooling the metal 112. The cooling subsystem 310 is configured to direct coolant onto an outer surface of the rollers 220. The cooling subsystem 310 includes housings 320 on opposite sides of the metal 112. The housings 320 comprise an upper housing and a lower housing. The housings 320 define receiving devices 322, which are configured to receive coolant, such as coolant cooled by the refrigeration unit 650. As shown in Figure 4A-4D, the cooling subsystem 310 includes housings 322 on opposite sides of the metal 112. The housings 320 comprise an upper housing and a lower housing. The housings 320 define receiving devices 322, which are configured to receive coolant, such as coolant cooled by the refrigeration unit 650. Fig. As shown by way of example in Figure 4C, the housings 320 are configured to support the cooling rollers 220 in any suitable manner that allows the cooling rollers 220 to rotate and be exposed to the coolant 324 in the containers 322 in order to cool the cooling rollers 220 and the metal 112 in contact with the cooling rollers. With reference to Fig. In section 4D, gaps 326 are defined between the housing 320 and the cooling rollers 220 to allow the cooling rollers 220 to rotate and to allow the coolant 324 to flow from the receptacle 322 onto the cooling rollers 220. The gap 326 can have any suitable size. For example, the gap 326 can provide a clearance of 0.1 mm to 0.5 mm for rotation.

[0039] The coolant 324 can be any suitable liquid coolant, such as silicone oil or liquid argon. The coolant 324 is in contact with the outer surface of the cooling rollers 220 to cool them. The gap 326 between the housing 320 and the cooling rollers 220 allows the coolant 324 to seep onto the cooling rollers 220 to lubricate them. If the coolant 324 is liquid argon, vapors of the liquid argon will escape from the gap 326 onto the cooling rollers 220 to provide an inert jacket to prevent moisture contamination. Silicone oil and other inert coolants also prevent side reactions and any possible lithium contamination.

[0040] The Fig. 5A and Fig. Figure 5B shows an additional cooling subsystem 410 in accordance with the present disclosure. The cooling subsystem 410 includes an upper guide 420 and a lower guide 430 arranged opposite the upper guide 420. The upper guide 420 and the lower guide 430 are spaced apart to accommodate the metal 112 between them. The upper guide 420 defines perforations 422 configured to direct cooled air from any suitable source of cooled air to the metal 112. For example, the refrigeration unit 650 may be configured to cool the air. The upper guide 420 may be made of any suitable material, including any suitable metallic material such as stainless steel. The upper guide 420 may be spaced apart from the metal 112 to avoid contact with it.The cooled air, which is guided through the perforations 422, creates an air jacket 424 that presses the metal 112 against the lower guide 430.

[0041] The lower guide 430 is a generally hollow housing made of any suitable thermally conductive material, such as copper or any other suitable thermally conductive alloy. The lower guide 430 serves as a load guide for the metal 112 and may have any suitable coating, such as Teflon, to minimize friction between the metal 112 and the lower guide 430. Any suitable coolant is circulated within the lower guide 430 to cool both the lower guide 430 and the metal 112 pressed against it. The coolant may be, for example, silicone oil. As the metal 112 moves between the upper guide 420 and the lower guide 430, it is cooled by both the air jacket 424 and the lower guide 430.The lower guide 430 can have an inlet 432 and an outlet 434 to circulate the coolant from any suitable source, such as the refrigeration unit 650, within the lower guide 430. To facilitate the movement of the metal 112 over the lower guide 430, the lower guide 430 can have rounded edges at both an underflow and an upflow end. The lower guide 430 can also incorporate any suitable coating, such as Teflon, to minimize friction between the metal 112 and the lower guide 430.

[0042] As in Fig. As shown in Figure 6, the upper guide 430 can be configured as a guide roller 440. The guide roller 440 is configured to press the metal 112 against the lower guide 430 to facilitate cooling of the metal 112 by the lower guide 430. The guide roller 440 can be made of any suitable insulating material. Although only one guide roller 440 is shown, the cooling subsystem 410 can contain any suitable number of guide rollers 440.

[0043] Fig. Figure 7 shows an additional cooling subsystem 510 according to the present disclosure for incorporation into the rolling system 110 to cool the metal 112. The cooling subsystem 510 comprises an upper cooling guide 520 and a lower cooling guide 530. The upper cooling guide 520 is identical to or substantially similar to the upper cooling guide 420. The upper cooling guide 520 defines the perforations 522, which are configured to direct cooled air onto the metal 112 to cool the metal 112 and to create an air jacket that presses the metal 112 into contact with the lower cooling guide 530.

[0044] The lower cooling line 530 is configured as a Peltier stage, designed to be cooled below ambient temperatures and configured to support the metal 112 as a load guide. The lower cooling line 530 is generally a solid-state heat pump operating according to the Peltier effect. The lower cooling line 530 contains an array 540 of p- and n-type semiconductor elements doped with electrical carriers. The semiconductor elements are arranged in the array 540, which is electrically connected in series and thermally in parallel. This array 540 is subsequently attached to an upper ceramic substrate 550 and a lower ceramic substrate 552, located on opposite sides of the array 540 of semiconductor elements. Generally, heat is absorbed by the upper ceramic substrate 550 and transferred to the lower ceramic substrate 552, which acts as a heat sink.Copper conductors are located between the upper ceramic substrate 550 and the assembly 540. Copper conductors are also located between the lower ceramic substrate 552 and the assembly 540.

[0045] The p-type semiconductors of the 540 arrangement are doped with specific atoms that possess fewer electrons than necessary to complete the covalent bonds within the crystal lattice. When a voltage is applied, there is a tendency for conduction electrons to complete the covalent bonds. When conduction electrons do this, they leave behind "holes," which are essentially atoms within the crystal lattice that now carry local positive charges. Electrons then continuously fall into these holes, are repelled by them, and move toward the next available hole. In effect, it is the holes that act as the electrical carriers. Electrons move relatively freely in the copper conductors compared to the semiconductors.When electrons leave the p-type structure and enter the copper on the cold side of the upper ceramic substrate 550, holes are created in the p-type structure as they jump to a higher energy level to match the energy level of the electrons already moving in the copper. The additional energy to create these holes is provided by heat absorption. Meanwhile, the newly created holes move downwards to the copper on the hot side of the lower ceramic substrate 552. Electrons move from the hot side of the copper into the p-type structure and fall into the holes, releasing the excess energy in the form of heat.

[0046] The n-type semiconductors of the 540 arrangement are doped with atoms that provide more electrons than are needed to complete the covalent bonds within the crystal lattice. When a voltage is applied, the extra electrons are easily moved into the conduction band. However, additional energy is required for the n-type electrons to reach the energy level of the incoming electrons from the copper on the cold side. This additional energy is provided by the absorption of heat. Finally, when the electrons leave the hot side of the n-type semiconductors, they can move freely again within the copper, dropping to a lower energy level and releasing heat in the process.Therefore, heat is absorbed on the cold side (the upper ceramic substrate 550) of the n- and p-type elements by the lower cooling guide 530 and heat is released on the hot side (the lower ceramic substrate 552) of the thermoelectric element to cool the metal 112.

[0047] As in Fig. As shown in Figure 8, the upper cooling guide 520 can be configured as a guide roller 560. The guide roller 560 is configured to press the metal 112 against the lower cooling guide 530 to facilitate cooling of the metal 112 by the lower cooling guide 530. The guide roller 560 can be made of any suitable insulating material. Although only one guide roller 560 is shown, the cooling subsystem 510 can contain any suitable number of guide rollers 560.

[0048] Fig. Figure 9 shows an additional cooling subsystem 610 according to the present disclosure for inclusion in the rolling system 110 to cool the metal 112. The cooling subsystem 610 includes a load guide 620, which defines a primary channel 630 for the metal 112 and several coolant channels 640 on opposite sides of the primary channel 630. The coolant channels 640 are fluidically connected to the refrigeration unit 650 to receive cooled coolant from the refrigeration unit 650. The coolant channels 640 are configured to direct coolant to the primary channel 630 to deposit the coolant on opposite sides of the metal 112. The coolant can be any suitable coolant, such as silicone oil. The silicone oil cools the metal 112 and creates a lubricating film to move the metal 112 through the load guide 620.The coolant also acts as a lubricant, enabling the metal 112 to move through the primary channel 630 without adhering to the load guide 620, thus facilitating a continuous process. The load guide 620 can be made of any suitable material, such as any suitable polymer material. The load guide 620 can be formed in any suitable manner, such as by any suitable 3D printing process. The metal 112 can be drawn through the load guide 620 in any suitable manner, such as in a vacuum environment. Therefore, the cooling subsystem 610 can be sealed within any suitable airtight chamber 660. The vacuum also removes any residual moisture to keep the metal 112 inert.

[0049] Fig. Figure 10 shows a cooling subsystem 710 according to the present disclosure, configured to cool the metal 112 with a coolant in the form of chilled inert gas. The gas can be cooled in any suitable manner, such as by the refrigeration machine 650. The cooling subsystem 710 includes a load guide 720, which defines several machined channels 730 configured to direct chilled inert gas to the metal 112 for cooling purposes. The gas is pressurized to keep the metal 112 suspended within the load guide 720.

[0050] Fig.Figure 11 shows an exemplary cooling roller arrangement for any suitable cooling rollers 220, such as cooling rollers 220A, 220B, 220C, etc. The metal 112 can be guided to the cooling rollers 220 by a guide roller 224. The cooling rollers 220 are arranged offset from one another, resulting in a larger area of ​​the metal 112 coming into contact with the cooling rollers 220 and being cooled by them. Therefore, offsetting the cooling rollers 220 generally increases their cooling efficiency. The cooling rollers 220 can be arranged horizontally or, as shown, vertically offset. The cooling rollers 220 are also offset with respect to their axes of rotation.

[0051] In the drawings, the systems of this disclosure are generally depicted as horizontal systems oriented to move from left to right. However, the systems can be oriented in any suitable alternative orientation. For example, the orientation of the entire rolling assembly (including the cooling rolls) can be changed from horizontal to vertical to take advantage of gravity and minimize the tensile force (pulling) induced on the thin lithium foils during rolling. This can reduce the potential for foil tearing during manufacturing.

[0052] The preceding description is merely illustrative and is in no way intended to limit the disclosure, its application, or uses. The comprehensive teachings of the disclosure can be implemented in various forms. While this disclosure contains specific examples, the true scope of protection of the disclosure should therefore not be so limited as to reveal other modifications upon study of the drawings, the description, and the following claims. It is to be understood that one or more steps within a process may be carried out in a different order (or overlapping in time) without altering the principles of the present disclosure.Although each of the embodiments described above has been described with specific features, one or more of these features described with respect to any embodiment of the disclosure may also be implemented in any of the further embodiments and / or combined with its features, even if this combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and permutations of one or more embodiments with each other remain within the scope of protection of this disclosure.

[0053] Spatial and functional relationships between elements (e.g., between modules, circuit elements, semiconductor layers, etc.) are described using various terms, such as "connected," "interlocking," "coupled," "adjacent," "next to," "on top of," "above," "below," and "arranged." Unless explicitly described as "direct," when a relationship between a first and a second element is described in the disclosure above, this relationship can be a direct relationship in which no further intervening elements exist between the first and the second element, or it can be an indirect relationship in which one or more intervening elements (either spatial or functional) exist between the first and the second element.As the expression "at least one of A, B and C" is used here, it should be interpreted as meaning a logical (A OR B OR C) using a non-exclusive logical OR, and should not be interpreted as meaning "at least one of A, at least one of B and at least one of C".

[0054] In the diagrams, the direction of an arrow, indicated by its tip, generally demonstrates the flow of information (such as data or commands) that is relevant for illustration. For example, if element A and element B exchange various pieces of information, but the information transferred from element A to element B is relevant for the illustration, the arrow may point from element A to element B. This unidirectional arrow does not imply that no further information is sent from element B to element A. Furthermore, element B may send requests or acknowledgments of the information sent from element A to element B to element A.

Claims

[1] System configured to roll a metal (112) into a foil, the system comprising: Work rolls (120) arranged in pairs at a distance from each other along a working line to receive the metal (112) between them, the work rolls (120) being configured to press against the metal (112) to roll the metal (112) to the foil while the metal (112) is fed along the working line between the work rolls (120) or each pair of work rolls; a cooling subsystem (210) arranged along the work line such that the cooling subsystem (210) is in line with the work rolls (120), wherein the cooling subsystem (210) is configured to cool the metal (112) as the metal (112) moves along the work line, wherein the cooling subsystem (210) includes cooling rolls (220) configured to guide and transport the metal (112) along the work line to the work rolls (120) and in which channels (230, 240, 250) are defined which are configured to receive coolant to cool the cooling rolls (220) and to cool the film that is in contact with the cooling rolls (220); the system further comprises polymer support elements (222) between adjacent cooling rollers (220). [2] System according to claim 1, wherein the metal (112) contains at least one of lithium, indium, tin, lead and sodium. [3] System according to claim 1, wherein the film is configured as an active layer of a battery electrode. [4] System according to claim 1, wherein the channels (230) run completely through the cooling rollers (220) parallel to an axis of rotation of the cooling rollers (220). [5] System according to claim 1, wherein the channels (240) do not run in a straight line relative to an axis of rotation of the cooling rollers (220). [6] System according to claim 1, wherein the channels (250) have an inlet (252) and an outlet (254) on the same side of the cooling rollers (220). [7] System according to claim 1, wherein the cooling subsystem (210) comprises a housing (320) adjacent to the cooling rollers (220), the housing (320) defining a receptacle (322) configured such that the outer surfaces of the cooling rollers (220) are accessible within the housing (320) and the coolant (324) present in the receptacle (322) comes into contact with the outer surfaces of the cooling rollers (220), and wherein gaps (326) are defined between the housing (320) and each of the cooling rollers (220), providing a clearance for the rotation of the cooling rollers (220) and a controlled release of the coolant (324) from the receptacle (322) onto the cooling rollers (220) to cool and lubricate the cooling rollers (220). [8] System according to claim 1, wherein adjacent cooling rollers (220) are arranged offset from each other.

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