Electronic device, power module and manufacturing process for a power module

Abstract

A fabrication method for a power module (S100) comprises a die-bonding step (S110) in which a power chip (2) is attached to an inner metal layer (12) of a substrate (1), the substrate (1) comprising an outer metal layer (13) located on the side opposite the inner metal layer (12), the outer metal layer (13) of the substrate (1) being not electrically coupled to the power chip (2). The fabrication method further comprises an encapsulation step (S130) in which the substrate (1) and the power chip (2) are encapsulated in an encapsulation body (4) such that a layout plane (131) of the outer metal layer (13) of the substrate (1) is exposed on the encapsulation body (4) and is coplanar with an adjacent surface of the encapsulation body (4).Ultimately, the manufacturing process comprises a patterning step (S150) in which several deformation sections (512) of multiple heat-conducting pieces (51) are directly attached to the layout plane (131), each deformation section (512) being connected upwards to a structuring section (511) of the heat-conducting piece (51), the area of ​​a first cross-section of the underside of the deformation section (512) being larger than the area of ​​a second cross-section of the structuring section (511). After completion of the patterning step (S150), the multiple structuring sections (511) are arranged at a distance from and adjacent to each other to jointly form a predetermined pattern. Furthermore, the multiple heat-conducting pieces (51) and the layout plane (131) jointly enclose and define a heat-conducting channel (C) through which a heat-conducting medium can flow.

Description

[0001] The present invention relates to a power module, in particular an electronic device, a power module and a manufacturing method for a power module, in which a patterned thermal conductivity layer is provided.

[0002] The demands on the heat dissipation of existing power modules are constantly increasing, so most existing power modules are connected to an external cooling module via a medium (e.g., tin paste or insulating thermal paste) to increase their heat dissipation performance. However, to date, there are no power modules whose heat dissipation performance has been increased through improvements to their own structure.

[0003] DE 10 2014 105 727 A1 relates to semiconductor modules and in particular directly cooled substrates for semiconductor modules and methods for manufacturing such substrates and modules.

[0004] DE 10 2011 089 886 A1 relates to a circuit carrier and a method for manufacturing the said circuit carrier as well as a circuit arrangement with the said circuit carrier.

[0005] In a first aspect, the present invention provides a manufacturing method for a power module according to independent claim 1.

[0006] In a second aspect, the present invention provides a power module according to independent claim 3.

[0007] In a third aspect, the present invention provides an electrical device according to independent claim 9.

[0008] Further embodiments of the respective aspects are described in the dependent claims.

[0009] The embodiments of the present invention disclose a manufacturing method for a power module comprising: a die-bonding step in which a power chip is attached to an inner metal layer of a substrate, the substrate comprising an outer metal layer located on the side opposite the inner metal layer, wherein the outer metal layer of the substrate is not electrically coupled to the power chip; an encapsulation step in which the substrate and the power chip are encapsulated in an encapsulation body such that a layout plane of the outer metal layer of the substrate is exposed on the encapsulation body and is coplanar with an adjacent surface of the encapsulation body;and a patterning step in which several deformation sections of multiple heat-conducting pieces are attached directly to the layout plane, each of the deformation sections being connected upwards to a structuring section of the heat-conducting piece, wherein the area of ​​a first cross-section of the underside of the deformation section is larger than the area of ​​a second cross-section of the structuring section. After the patterning step has been carried out, the multiple structuring sections are arranged at a distance from each other and adjacent to each other in order to jointly form a predetermined pattern.

[0010] The embodiments of the present invention also disclose a power module comprising: a substrate comprising a plate, an inner metal layer formed on one side of the plate, and an outer metal layer formed on the other side of the plate; a power chip attached to the inner metal layer of the substrate and not electrically coupled to the outer metal layer, the outer metal layer having a layout plane facing away from the power chip; an encapsulation body encapsulating the substrate and the power chip, the layout plane of the outer metal layer being exposed on the encapsulation body and being coplanar with an adjacent surface of the encapsulation body;and a patterned heat-conducting layer comprising several heat-conducting pieces directly attached to the layout plane, each of which has: a structuring section, wherein the structuring sections of the several heat-conducting pieces are spaced apart from and adjacent to each other to jointly form a predetermined pattern; and a deformation section, which is connected at the top to the structuring section and at its bottom directly to the layout plane, wherein the area of ​​a first cross-section of the bottom of the deformation section is larger than the area of ​​a second cross-section of the structuring section.

[0011] The exemplary embodiments of the present invention further disclose an electronic device comprising a power module and a liquid cooling module. The power module comprises: a substrate comprising a plate, an inner metal layer formed on one side of the plate, and an outer metal layer formed on the other side of the plate; a power chip attached to the inner metal layer of the substrate and not electrically coupled to the outer metal layer, the outer metal layer having a layout plane facing away from the power chip; an encapsulation body encapsulating the substrate and the power chip, the layout plane of the outer metal layer being exposed on the encapsulation body and being coplanar with an adjacent surface of the encapsulation body;and a patterned thermal interface material comprising several thermal interface pieces directly attached to the layout plane, each of which has: a structuring section, wherein the structuring sections of the several thermal interface pieces are spaced apart and adjacent to each other to collectively form a predetermined pattern; and a deformation section, which is connected at the top to the structuring section and at its bottom directly to the layout plane, wherein the area of ​​a first cross-section of the bottom of the deformation section is larger than the area of ​​a second cross-section of the structuring section. The liquid cooling module is attached to the power module and has a coolant flow channel within which the patterned thermal interface material of the power module is located.

[0012] In summary, the electronic device, the power module, and the manufacturing method for a power module, which are disclosed in the embodiments of the present invention, are able, through the structural differences between the structuring section and the deformation section of each of the heat conductors, to increase the contact area between the patterned heat conductor layer and the layout plane, in the case where the predetermined pattern is formed by the deformation sections, and thus effectively increase the heat transfer efficiency from the outer metal layer to each of the heat conductors.

[0013] For a better understanding of the features and technical content of the present invention, reference is made to the following detailed description of the present invention and the accompanying drawings. However, this description and the accompanying drawings serve only to illustrate the present invention and do not limit the scope of protection of the present invention. Fig. Figure 1 shows a schematic flowchart of a manufacturing process for a power module according to a first embodiment of the present invention. Fig. Figure 2 shows a schematic sectional view of the die-bonding step. Fig. 1. Fig. Figure 3 shows a schematic sectional view of the encapsulation step from Fig. 1. Fig. Figure 4 shows a schematic sectional view of the patterning step. Fig. 1. Fig. Figure 5 shows a three-dimensional schematic representation of the power module. Fig. 4. Fig. Figure 6 shows a schematic sectional view of another variant of the power module. Fig. 4. Fig. Figure 7 shows a three-dimensional schematic representation of a further embodiment of the power module according to the first embodiment of the present invention. Fig. Figure 8 shows a three-dimensional schematic representation of a further embodiment of the power module according to the first embodiment of the present invention. Fig. Figure 9 shows a schematic representation of a reinforcement step of a manufacturing process for a power module according to a second embodiment of the present invention. Fig. Figure 10 shows a schematic sectional view of the power module according to the second embodiment of the present invention and Fig. Figure 11 shows a schematic sectional view of an electronic device according to a third embodiment of the present invention. [First embodiment]

[0014] It will be directed to the Fig. Reference is made to Figures 1 to 8, which show a first embodiment of the present invention. As in Fig. Figures 1 to 5 show that the present embodiment discloses a power module 100 and its manufacturing method S100, wherein the manufacturing method for a power module S100 comprises (in sequence) a die-bonding step S110, an encapsulation step S130 and a patterning step S150.

[0015] Die-Bonding Step S110: As in Fig. 1 and Fig. As shown in Figure 2, a power chip 2 is attached to an inner metal layer 12 of a substrate 1. The substrate 1 comprises an outer metal layer 13 located on the side opposite the inner metal layer 12, the outer metal layer 13 of the substrate 1 not being electrically coupled to the power chip 2.

[0016] In the present embodiment, the inner metal layer 12 and the outer metal layer 13 are located on opposite sides of the substrate 1 and are not electrically coupled to each other, wherein the inner metal layer 12 and the outer metal layer 13 consist of a highly thermally conductive material (e.g. a copper alloy) with a thermal conductivity > 40 W / m·k, while as substrate 1, depending on the actual requirements, a DBC (direct bonded copper) substrate, a DPC (direct plated copper) substrate, an AMB (active metal brazing) substrate or a printed circuit board (PCB) can be used, the present invention not imposing any restrictions in this regard.

[0017] More precisely, in the present embodiment, the outer metal layer 13 comprises a layout plane 131 facing away from the power chip 2, which is provided for carrying out subsequent steps. Furthermore, the specific types and numbers of the inner metal layer 12, the outer metal layer 13, and the power chip 2 can vary depending on the actual requirements. For example, in other embodiments of the present invention not shown here, the outer metal layer 13 and the inner metal layer 12 may each comprise several separate segments, and the power chip 2 may be present multiple times, with the multiple power chips each being attached in different segments of the inner metal layer 12.

[0018] Encapsulation step S130: As in Fig. 1 and Fig. As shown in Figure 3, the substrate 1 and the power chip 2 are encapsulated in an encapsulation body 4 such that the layout plane 131 of the outer metal layer 13 is exposed on the encapsulation body 4 and is connected to an adjacent surface of the encapsulation body 4 (e.g., the top of the encapsulation body 4). Fig. 3) is coplanar. This means that the substrate 1 and the power chip 2 are only exposed to the encapsulation body 4 at layout level 131.

[0019] It should also be mentioned that the die-bonding step S110 in the present embodiment can also serve to attach several connections 3 to the inner metal layer 12 and to couple them electrically to the power chip 2, while the encapsulation step S130 can serve to partially encapsulate each of the connections 3, with another part of each of the connections 3 protruding from the encapsulation body 4.

[0020] Sampling step S150: As in Fig. 1 and Fig. As shown in Figure 4, the undersides of several deformation sections 512 of several heat-conducting pieces 51 are directly attached to the layout plane 131. Each of the deformation sections 512 is connected upwards to a structuring section 511 of the heat-conducting piece 51, wherein the area of ​​a first cross-section of the underside of the deformation section 512 is larger than the area of ​​a second cross-section of the structuring section 511.

[0021] In patterning step S150 of the present embodiment, the area of ​​the first cross-section of the underside of the deformation section 512 is 110% to 150% of the area of ​​the second cross-section of the structuring section 511 and occupies at least 50% of the layout plane 131. The heat-conducting element 51 has a height H relative to the layout plane 131 that is at least three times the thickness T of the outer metal layer 13, although the present invention is not limited to the foregoing.

[0022] Furthermore, each of the heat conductors 51 can be made of a highly thermally conductive material with a thermal conductivity coefficient > 40 W / m·K. For example, each of the heat conductors 51 can be made of a copper alloy, wherein the underside of the deformation section 512 of each of the heat conductors 51 can be welded to the layout plane 131. Alternatively, each of the heat conductors 51 can also be made of an aluminum alloy, wherein the underside of the deformation section 512 of each of the heat conductors 51 is connected to the layout plane 131 by eutectic bonding. Furthermore, each of the heat conductors 51 can be connected to the outer metal layer 13 by laser welding or ultrasonic welding, wherein preferably no medium (e.g., solder or conductive paste) is provided between each of the heat conductors 51 and the layout plane 131.

[0023] Furthermore, after the patterning step S150 has been carried out, the structuring sections 511 of the multiple heat-conducting pieces 51 are arranged at a distance from one another and adjacent to one another in order to jointly form a predetermined pattern. In the present embodiment, the multiple heat-conducting pieces 51 can form several predetermined patterns that differ from one another, according to the actual requirements, by selecting the number, arrangement, and / or construction. That is, each of the heat-conducting pieces 51 is only a part of the predetermined pattern and does not form an independent pattern.

[0024] As in the Fig. As shown in Figures 4 to 8, the power module 100 in the present embodiment comprises a substrate 1, a power chip 2 attached to the substrate 1, several connectors 3 attached to the substrate 1, an encapsulation body 4, and a patterned thermal interface material 5 attached (directly) to the substrate 1. The substrate 1 comprises a plate 11, an inner metal layer 12 formed on one side of the plate 11, and an outer metal layer 13 formed on the other side of the plate 11.

[0025] Furthermore, the plate 11 is a flat insulating plate (e.g., a ceramic plate or a plastic plate), wherein the inner metal layer 12 and the outer metal layer 13 are arranged on opposite sides of the plate 11, and the outer metal layer 13 has a layout plane 131 facing away from the inner metal layer 12 (or the power chip 2). That is, in the present embodiment, the layout plane 131 does not have a structure with height differences.

[0026] The power chip 2 is attached to the inner metal layer 12 of the substrate 1 and is not electrically coupled to the outer metal layer 13, while the multiple connections 3 are attached to the inner metal layer 12 and electrically coupled to the power chip 2. However, the invention is not limited to this. For example, in other embodiments of the present invention not shown here, each of the connections 3 can also be attached to the substrate 1 in a different way (e.g., by plugging it in).

[0027] The encapsulation body 4 encapsulates the substrate 1 and the power chip 2, wherein the layout plane 131 of the outer metal layer 13 is exposed on the encapsulation body 4 and is coplanar with an adjacent surface of the encapsulation body 4. That is, in the present embodiment, the substrate 1 and the power chip 2 are exposed on the encapsulation body 4 only with respect to the layout plane 131. In addition, the encapsulation step S130 comprises the partial encapsulation of each of the terminals 3, with another part of each terminal 3 protruding from the encapsulation body 4.

[0028] The patterned thermal conductivity layer 5 comprises several thermal conductivity pieces 51, with the layout plane 131 as shown in Fig. As shown in Figure 4, it can be a single plane and the multiple heat-conducting pieces 51 are directly attached to the layout plane 131. Alternatively, the layout plane 131 can be, as shown in Fig. Figure 6 also includes several spaced-apart sub-planes 1311, wherein the multiple heat-conducting pieces 51 are directly attached to the multiple sub-planes 1311 of the layout plane 131. It should also be noted that in the present embodiment, each of the heat-conducting pieces 51 has a height H relative to the layout plane 131 that is at least three times the thickness T of the outer metal layer 13.

[0029] More precisely, the multiple heat-conducting pieces 51 and the layout plane 131 can together enclose and define a heat-conducting channel C through which a heat-conducting medium (e.g., a coolant) can flow. Each of the heat-conducting pieces 51 has a structuring section 511 and a deformation section 512 connected to the structuring section 511. The multiple structuring sections 511 are arranged at a distance from and adjacent to each other to jointly form a predefined pattern.

[0030] Furthermore, the underside of the deformation section 512 of each of the heat conductors 51 is directly connected to the layout plane 131, wherein the deformation sections 512 of the multiple heat conductors 51 can be connected to one another or spaced apart from one another, without this constituting a limitation of the present invention. In the present embodiment, the area of ​​a first cross-section of the underside of the deformation section 512 is larger than the area of ​​a second cross-section of the structuring section 511. For example, the area of ​​the first cross-section of the underside of the deformation section 512 of at least one of the heat conductors 51 is 110% to 150% of the area of ​​the second cross-section of the structuring section 511. Furthermore, the area of ​​the first cross-section of the underside of the deformation section 512 occupies at least 50% of the layout plane 131.

[0031] Accordingly, the patterned thermal conductivity layer 5 can, through the structural differences between the structuring section 511 and the deformation section 512 of each of the thermal conductivity pieces 51, increase the contact area between the patterned thermal conductivity layer 5 and the layout plane 131 in the case where the predetermined pattern is formed by the deformation sections 512, and thus effectively increase the heat transfer efficiency from the outer metal layer 13 to each of the thermal conductivity pieces 51.

[0032] Furthermore, the outer metal layer 13 and each of the heat conductors 51 can be made of the highly thermally conductive material, wherein the underside of the deformation section 512 of each of the heat conductors 51 is welded to the layout plane 131. Alternatively, the outer metal layer 13 and each of the heat conductors 51 can be made of a copper alloy or an aluminum alloy, wherein the underside of the deformation section 512 of each of the heat conductors 51 is connected to the layout plane 131 by eutectic bonding.

[0033] As in Fig. 4 and Fig. As shown in Figure 5, each of the heat conductors 51 can essentially have an elongated column shape (e.g., a cylindrical shape), and the multiple heat conductors 51 are arranged parallel to one another. Although the multiple heat conductors 51 are identical in construction in the figure, in other embodiments of the present invention not shown, they may have slight differences from one another depending on the actual requirements (e.g., different height, different diameter, and / or different external shape).

[0034] As in Fig. As shown in Figure 7, each of the heat-conducting pieces 51 can essentially be a C-shaped column and have a C-shaped side surface 513. In at least two of the heat-conducting pieces 51, the C-shaped side surfaces 513 of the two structuring sections 511 are arranged offset, such that part of one C-shaped side surface 513 lies within the space enclosed by the other C-shaped side surface 513, together forming an S-shaped space.

[0035] As in Fig. As shown in Figure 8, each of the heat conductors 51 can essentially be an S-shaped column (or a wave-shaped column), and the multiple heat conductors 51 are arranged parallel to each other in several rows. In each row, two adjacent heat conductors 51 are joined with their ends touching each other, so that each pair of adjacent heat conductors 51 together forms a wave-shaped space. [Second embodiment]

[0036] It will be directed to the Fig. 9 and Fig. Reference is made to reference 10, which shows a second embodiment of the present invention. Since the present embodiment is similar to the first embodiment described above, the similarities between the two embodiments will not be explained again. The differences between the present embodiment and the first embodiment described above can be summarized roughly as follows:

[0037] In the present embodiment, the manufacturing process for a power module S100, after carrying out the die-bonding step S110 and before carrying out the encapsulation step S130, further comprises a reinforcement step S120: Several support columns 7 are connected at one end to the substrate 1 and at the other end to a (plate-shaped) carrier 6, so that the power chip 2 is located between the carrier 6 and the substrate 1.

[0038] Furthermore, in encapsulation step S130, the support 6 and the multiple support columns 7 are embedded in the encapsulation body 4. Additionally, in patterning step S150, the support 6 absorbs an external force through the multiple support columns 7, which is exerted on the substrate 1 by directly attaching each of the heat conductors 51 to the layout plane 131.

[0039] From another perspective, the power module 100 further comprises the carrier 6 and the multiple support columns 7. The carrier 6 is embedded (at a distance from the substrate 1) in the encapsulation body 4, with the power chip 2 located between the carrier 6 and the substrate 1. Furthermore, the multiple support columns 7 are arranged between and connected to the substrate 1 and the carrier 6 and are embedded in the encapsulation body 4. [Third embodiment]

[0040] Out of Fig.A third embodiment of the present invention is described in Section 11. Since the present embodiment is similar to the first and second embodiments described above, the common features of the above embodiments (e.g., the power module 100) are not repeated. The differences between the present embodiment and the first and second embodiments described above are outlined below:

[0041] Specifically, the present embodiment provides an electronic device comprising a power module 100 and a liquid cooling module 200 attached to the power module 100. It should first be noted that the structure of the power module 100 in the present embodiment essentially corresponds to that in the first and second embodiments described above, so that it will not be discussed further here.

[0042] Furthermore, the liquid cooling module 200 has a coolant flow channel 201 within which the patterned thermal conductivity layer 5 of the power module 100 is located. The way in which the liquid cooling module 200 and the power module 100 are connected to each other can be adapted and changed according to the actual requirements without being restricted by the present invention. [Technical effect of the embodiments of the present invention]

[0043] In summary, the electronic device, the power module, and the manufacturing method for a power module, which are disclosed in the embodiments of the present invention, are able, through the structural differences between the structuring section and the deformation section of each of the heat conductors, to increase the contact area between the patterned heat conductor layer and the layout plane, in the case where the predetermined pattern is formed by the deformation sections, and thus effectively increase the heat transfer efficiency from the outer metal layer to each of the heat conductors. Reference symbol list 100 power module 1 substrate 11 plate 12 Inner metal layer 13 Outer metal layer 131 Layout level 1311 Sublevel 2 performance chips 3 connection 4 encapsulation bodies 5 Patterned thermal conductivity layer 51 Heat conductor 511 Structuring section 512 Deformation section 513 C-shaped side surface 6 carriers 7 Support column H height T Thickness C Heat conduction channel 200 liquid cooling module 201 Coolant flow channel S100 manufacturing process for a power module S110 Die-Bonding Step S120 amplification step S130 Encapsulation step S150 sampling step

Claims

A manufacturing process for a power module (S100) comprising: - a die-bonding step (S110) in which a power chip (2) is attached to an inner metal layer (12) of a substrate (1), wherein the substrate (1) comprises an outer metal layer (13) located on the side opposite the inner metal layer (12), the outer metal layer (13) of the substrate (1) not being electrically coupled to the power chip (2); - an encapsulation step (S130) in which the substrate (1) and the power chip (2) are encapsulated in an encapsulation body (4) such that a layout plane (131) of the outer metal layer (13) of the substrate (1) is exposed on the encapsulation body (4) and is coplanar with an adjacent surface of the encapsulation body (4);and a patterning step (S150) in which several deformation sections (512) of several heat-conducting pieces (51) are attached directly to the layout plane (131), each of the deformation sections (512) being connected upwards to a structuring section (511) of the heat-conducting piece (51), wherein the area of ​​a first cross-section of the underside of the deformation section (512) is larger than the area of ​​a second cross-section of the structuring section (511); wherein, after completion of the patterning step (S150), the several structuring sections (511) are arranged at a distance from and adjacent to each other to jointly form a predetermined pattern; wherein the several heat-conducting pieces (51) and the layout plane (131) jointly enclose and define a heat-conducting channel (C) through which a heat-conducting medium can flow. A manufacturing method for a power module (S100) according to claim 1, wherein the manufacturing method for a power module (S100) further comprises a reinforcement step (S120) after carrying out the die-bonding step (S110) and before carrying out the encapsulation step (S130), in which several support columns (7) are connected at one end to the substrate (1) and at the other end to a carrier (6), such that the power chip (2) is located between the carrier (6) and the substrate (1); wherein in the encapsulation step (S130) the carrier (6) and the several support columns (7) are embedded in the encapsulation body (4); wherein in the patterning step (S150) the carrier (6) absorbs an external force through the several support columns (7) which is exerted on the substrate (1) by directly attaching each of the heat conductors (51) to the layout plane (131). Power module (100) comprising: - a substrate (1) comprising a plate (11), an inner metal layer (12) formed on one side of the plate (11) and an outer metal layer (13) formed on the other side of the plate (11); - a power chip (2) attached to the inner metal layer (12) of the substrate (1) and not electrically coupled to the outer metal layer (13), wherein the outer metal layer (13) has a layout plane (131) facing away from the power chip (2); - an encapsulation body (4) encapsulating the substrate (1) and the power chip (2), wherein the layout plane (131) of the outer metal layer (13) is exposed on the encapsulation body (4) and is coplanar with an adjacent surface of the encapsulation body (4);and- a patterned heat-conducting layer (5) comprising several heat-conducting pieces (51) attached directly to the layout plane (131), each heat-conducting piece having:- a structuring section (511), wherein the structuring sections (511) of the several heat-conducting pieces (51) are spaced apart from and adjacent to each other to jointly form a predetermined pattern; and- a deformation section (512) connected upwards to the structuring section (511) and directly to the layout plane (131) at its bottom, wherein the area of ​​a first cross-section of the bottom of the deformation section (512) is larger than the area of ​​a second cross-section of the structuring section (511); wherein the several heat-conducting pieces (51) and the layout plane (131) jointly enclose and define a heat-conducting channel (C) through which a heat-conducting medium can flow.; Power module (100) according to claim 3, wherein each of the heat conductors (51) has an elongated column shape and the multiple heat conductors (51) are arranged parallel to each other. Power module (100) according to claim 3 or 4, wherein in at least two of the heat conduction pieces (51) the two structuring sections (511) each comprise a C-shaped side surface (513), wherein the C-shaped side surfaces (513) of the two structuring sections (511) are arranged offset, such that a part of one C-shaped side surface (513) lies within the space enclosed by the other C-shaped side surface (513) to jointly create an S-shaped space. Power module according to one of claims 3 to 5, wherein the layout plane (131) comprises several spaced-apart subplanes (1311), wherein the several heat conductors (51) are directly attached to the several subplanes (1311) of the layout plane (131). Power module according to one of claims 3 to 6, wherein the power module (100) further comprises: - a carrier (6) embedded in the encapsulation body (4), wherein the power chip (2) is located between the carrier (6) and the substrate (1); and - several support columns (7) arranged between and connected to the substrate (1) and embedded in the encapsulation body (4). Power module (100) according to one of claims 3 to 7, wherein the power module (100) further comprises several connections (3) which are attached to the inner metal layer (12) and electrically coupled to the power chip (2), each of the connections (3) partially protruding from the encapsulation body (4). Electronic device comprising: - a power module (100) comprising: - a substrate (1) comprising a plate (11), an inner metal layer (12) formed on one side of the plate (11), and an outer metal layer (13) formed on the other side of the plate (11); - a power chip (2) attached to the inner metal layer (12) of the substrate (1) and not electrically coupled to the outer metal layer (13), wherein the outer metal layer (13) has a layout plane (131) facing away from the power chip (2); - an encapsulation body (4) encapsulating the substrate (1) and the power chip (2), wherein the layout plane (131) of the outer metal layer (13) is exposed on the encapsulation body (4) and is coplanar with an adjacent surface of the encapsulation body (4);and- a patterned thermal conductivity layer (5) comprising several thermal conductivity pieces (51) attached directly to the layout plane (131), each of which has:- a structuring section (511), wherein the structuring sections (511) of the several thermal conductivity pieces (51) are spaced apart from and adjacent to each other to jointly form a predetermined pattern; and- a deformation section (512) connected upwards to the structuring section (511) and directly to the layout plane (131) at its bottom, wherein the area of ​​a first cross-section of the bottom of the deformation section (512) is larger than the area of ​​a second cross-section of the structuring section (511); and- a liquid cooling module (200) attached to the power module (100) and comprising a coolant flow channel (201) within which the patterned thermal conductivity layer (5) of the power module (100) is located;- wherein the multiple heat-conducting elements (51) and the layout plane (131) together enclose and define a heat-conducting channel (C) through which a heat-conducting medium can flow.;

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