AUTOMATIC WIRE SOLDERING SYSTEM

Abstract

Automatic wire soldering system, including: a carrier (120) which is configured to load an electrical product (10) to be soldered; a robot (100) which is set up to grasp and move the carrier (120) on which the electrical product (10) is loaded; a solder paste container (200) configured to hold solder paste; and a heating device (220) configured to heat the solder paste contained in the solder paste container (200) so that the solder paste is melted into a liquid, wherein the robot (100) is set up to move wires (11) of the electrical product (10) into the solder paste container (200) in order to solder the wires (11) together with the solder paste in the solder paste container (200).

Description

CROSS-REFERENCE TO RELATED REGISTRATIONS

[0001] This application claims the benefits of Chinese patent application No. 201710352835.7, filed with the State Intellectual Property Office of China on May 18, 2017, the entire disclosure of which is incorporated herein by reference. BACKGROUND OF THE INVENTION AREA OF THE INVENTION

[0002] At least one embodiment of the present invention relates to an automatic wire soldering system. DESCRIPTION OF THE STATE OF THE ART

[0003] In the manufacture of electrical devices, solder paste, such as Tinol, is frequently used to solder a connecting wire or pin of the device. In prior art, such as US 4,766,844 A or US 2015 / 0108202 A1, which describe automated soldering systems, the connecting wire or pin of the electrical device is usually soldered manually. For example, a worker typically uses a metal head to heat solder paste applied to the connecting wire or pin of the electrical device until it melts and liquefies. After the solder paste has hardened, the soldering of the connecting wire or pin of the electrical device is complete.

[0004] However, the efficiency of manual soldering is very low. It is only suitable for soldering a single product and not for soldering mass-produced items. SUMMARY OF THE INVENTION

[0005] The present invention has been made to eliminate or reduce at least one aspect of the aforementioned disadvantages.

[0006] According to one object of the present invention, an automatic wire soldering system is provided which can automatically perform the task of soldering wires of an electrical product. According to one aspect of the present invention, an automatic wire soldering system is provided comprising: a carrier configured to load an electrical product to be soldered; a robot configured to grasp and move the carrier on which the electrical product is loaded; a solder paste container configured to receive solder paste; and a heating device configured to heat the solder paste received in the solder paste container so that the solder paste is melted into a liquid, wherein the robot is configured to move wires of the electrical product into the solder paste container in order to solder the wires together with the solder paste in the solder paste container.

[0007] According to an exemplary embodiment of the present invention, the automatic wire soldering system further comprises a visual detection system configured to detect whether the actual soldering length of a soldered portion of the wires through the solder paste is equal to or greater than a first predetermined length; and wherein, if the actual soldering length is less than the first predetermined length, the robot repeatedly moves the wires into the solder paste container to continue soldering the wires until the actual soldering length is equal to or greater than the first predetermined length.

[0008] According to a further exemplary embodiment of the present invention, the visual detection system is further configured to detect whether the actual solder quality of the soldered part of the wires corresponds to a predetermined solder quality; wherein, if the actual solder quality does not correspond to the predetermined solder quality, the robot repeatedly moves the wires into the solder paste container to continue soldering the wires until the actual solder quality corresponds to the predetermined solder quality.

[0009] According to a further exemplary embodiment of the present invention, the automatic wire soldering system further comprises a cutting mechanism configured to cut off a segment of an end section of the soldered part of the wires, such that the length of the soldered part of the wires is equal to a second predetermined length, which is smaller than the first predetermined length.

[0010] According to a further exemplary embodiment of the present invention, the visual detection system is further configured to detect whether the length of the soldered part of the wires, after the segment of the end section of the soldered part has been cut off, is greater than the second predetermined length; and wherein, if the length of the soldered part of the wires, after the segment of the end section of the soldered part has been cut off, is greater than the second predetermined length, the robot repeatedly moves the wires to the cutting mechanism to repeatedly cut the soldered part of the wires until the length of the soldered part of the wires is equal to the second predetermined length.

[0011] According to a further exemplary embodiment of the present invention, the automatic wire soldering system further comprises a waste recycling container configured to receive the end section cut off from the wires, wherein the waste recycling container is arranged such that the end section cut off from the wires falls directly into the waste recycling container.

[0012] According to a further exemplary embodiment of the present invention, the automatic wire soldering system further comprises a solder paste syringe configured to inject the solder paste into the solder paste container.

[0013] According to a further exemplary embodiment of the present invention, the automatic wire soldering system further comprises a first movement mechanism configured to move the solder paste syringe in a vertical direction to an injection position. An injection opening of the solder paste syringe is inserted into the solder paste container when the solder paste syringe is moved to the injection position.

[0014] According to a further exemplary embodiment of the present invention, the automatic wire soldering system further comprises a second movement mechanism which is configured to move the solder paste container in a horizontal direction towards an injection station. The solder paste container is aligned with the solder paste syringe in the vertical direction when the solder paste container is moved towards the injection station.

[0015] According to a further exemplary embodiment of the present invention, the solder paste syringe further comprises an electric syringe, and the amount of solder paste injected by the solder paste syringe in a single injection completely fills the solder paste container.

[0016] According to a further exemplary embodiment of the present invention, the automatic wire soldering system further comprises a cleaning brush which is configured to remove contaminants from a surface of the solder paste in the solder paste container.

[0017] According to a further exemplary embodiment of the present invention, the automatic wire soldering system further comprises a visual inspection system configured to check whether contaminants are present on the surface of the solder paste in the solder paste container. The cleaning brush is activated to remove the contaminants in a timely manner as soon as they have been checked by the visual inspection system.

[0018] According to a further exemplary embodiment of the present invention, the robot has a gripper which is configured to grasp the carrier on which the electrical product is loaded.

[0019] According to a further exemplary embodiment of the present invention, the wires of the electrical product to be soldered are clamped and attached to the carrier, wherein parts of the wires to be soldered protrude from the carrier and are arranged to be inserted into the solder paste container.

[0020] In the aforementioned exemplary embodiments of the present invention, the automatic wire soldering system can automatically perform the task of soldering wires of the electrical product. This makes it suitable for the automatic soldering of mass-produced electrical products and improves soldering efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and other features of the present invention will become clearer by a detailed description of exemplary embodiments thereof with reference to the accompanying drawings, in which: Figure 1 is an illustrative perspective view of an automatic wire soldering system according to an exemplary embodiment of the present invention; and Figure 2 is an illustrative perspective view of a robot of the automatic wire soldering system from Figure 1. DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS OF THE INVENTION

[0022] Exemplary embodiments of the present disclosure will below be described in detail with reference to the accompanying drawings, the same reference numerals referring to the same elements. However, the present disclosure can be embodied in many different forms and should not be interpreted as being limited to the embodiment set forth herein; rather, these embodiments are provided so that the present disclosure will be accurate and complete and will fully convey the concept of the disclosure to the person skilled in the art.

[0023] For explanatory purposes, numerous specific details are provided in the following detailed description to ensure a complete understanding of the disclosed embodiments. However, it will be evident that one or more embodiments can be realized without these specific details. In other cases, well-known structures and devices are shown schematically to simplify the drawing.

[0024] According to a general concept of the present invention, an automatic wire soldering system is provided, comprising: a carrier configured to load an electrical product to be soldered; a robot configured to grasp and move the carrier on which the electrical product is loaded; a solder paste container configured to receive solder paste; and a heating device configured to heat the solder paste received in the solder paste container so that the solder paste is melted into a liquid, wherein the robot is configured to move wires of the electrical product into the solder paste container in order to solder the wires together with the solder paste in the solder paste container.

[0025] Figure 1 is an illustrative perspective view of an automatic wire soldering system according to an exemplary embodiment of the present invention; and Figure 2 is an illustrative perspective view of a robot 100 of the automatic wire soldering system of Figure 1.

[0026] As in the Fig. As shown in Figures 1-2, the automatic wire soldering system in one embodiment mainly comprises a carrier 120, a robot 100, a solder paste container 200, and a heating device 220. An electrical product 10 to be soldered is loaded onto the carrier 120. The robot 100 is configured to grasp and move the carrier 120 on which the electrical product 10 is loaded. The solder paste container 200 is configured to hold solder paste. The heating device 220 is configured to heat the solder paste contained in the solder paste container 200 so that the solder paste is melted into a liquid.

[0027] As in the Fig. As shown in Figures 1-2, the robot 100, in one embodiment, is a robot with multiple degrees of freedom. The robot 100 is designed to move wires 11 of the electrical product 10 into the solder paste container 200, so that portions of the wires 11 to be soldered together are immersed in the molten solder paste in the solder paste container 200. In this way, the wires 11 can be soldered together by the solder paste in the solder paste container 200.

[0028] As shown in Figure 2, the electrical product 10 in one embodiment has two wires 11 that are to be soldered together. The two wires 11 are held side by side and attached to the carrier 120. As shown in Figure 2, parts of the wires 11 that are to be soldered together protrude from the carrier 120 and are suitable for insertion into the solder paste container 200.

[0029] As shown in Figure 2, in one embodiment the robot 100 has a gripper 110 which is designed to grip the carrier 120 on which the electrical product 10 is loaded.

[0030] As in the Fig. As shown in Figures 1-2, in one embodiment the automatic wire soldering system can further include a visual detection system 500. The visual detection system 500 is configured to detect whether the actual solder length of a soldered portion of the wires 11 through the solder paste is equal to or greater than a first predetermined length. If the actual solder length is less than the first predetermined length, the robot 100 repeatedly moves the wires 11 into the solder paste reservoir 200 to continue soldering the wires 11 until the actual solder length is equal to or greater than the first predetermined length.

[0031] As in the Fig. As shown in Figures 1-2, the visual detection system 500 is also configured in one embodiment to detect whether the actual solder quality of the soldered portion of the wires 11 corresponds to a predetermined solder quality. If the actual solder quality does not correspond to the predetermined solder quality, the robot 100 repeatedly moves the wires 11 into the solder paste container 200 to continue soldering the wires 11 until the actual solder quality reaches the predetermined image quality.

[0032] As in the Fig. As shown in Figures 1-2, the automatic wire soldering system in one embodiment can further comprise a cutting mechanism 400. The cutting mechanism 400 is configured to cut off a segment of an end section of the soldered part of the wires 11, such that the length of the soldered part of the wires 11 is equal to a second predetermined length, which is smaller than the first predetermined length.

[0033] As in the Fig. As shown in Figures 1-2, the visual detection system 500 is also configured in one embodiment to detect whether the length of the soldered portion of the wires 11, after the segment of the end section of the soldered portion has been cut off, is greater than the second predetermined length. If the length of the soldered portion of the wires 11, after the segment of the end section of the soldered portion has been cut off, is greater than the second predetermined length, the robot 100 repeatedly moves the wires 11 to the cutting mechanism 400 to repeatedly cut the soldered portion of the wires 11 until the length of the soldered portion of the wires 11 equals the second predetermined length.

[0034] As in the Fig. As shown in Figures 1-2, in one embodiment the automatic wire soldering system can further include a waste recycling container 410. The waste recycling container 410 is configured to receive the end section cut off the wires 11 by the cutting mechanism 400. In one example, the waste recycling container 410 can be arranged below the cutting mechanism 400 so that the end section cut off the wires 11 can fall directly into the waste recycling container 410.

[0035] As in the Fig. As shown in Figures 1-2, the automatic wire soldering system in one embodiment can include a solder paste syringe 300. The solder paste syringe 300 is configured to inject the solder paste into the solder paste container 200.

[0036] As in the Fig. As shown in Figures 1-2, in one embodiment the automatic wire soldering system can further comprise a first movement mechanism 310. The first movement mechanism 310 is configured to move the solder paste syringe 300 vertically to an injection position. An injection port of the solder paste syringe 300 is inserted into the solder paste container 200 when the solder paste syringe 300 is moved to the injection position.

[0037] As in the Fig. As shown in Figures 1-2, the automatic wire soldering system in one embodiment can further comprise a second movement mechanism 210. The second movement mechanism 210 is configured to move the solder paste container 200 in a horizontal direction towards an injection station. The solder paste container 200 is aligned with the solder paste syringe 300 in the vertical direction as it is moved towards the injection station.

[0038] As in the Fig. As shown in Figures 1-2, the solder paste syringe 300 in one embodiment can include an electric syringe and the amount of solder paste injected by the solder paste syringe 300 in a single injection can completely fill the solder paste container 200.

[0039] As in the Fig. As shown in Figures 1-2, the automatic wire soldering system in one embodiment can further comprise a cleaning brush 230. The cleaning brush 230 is designed to remove contaminants from the surface of the solder paste in the solder paste container 200. In one embodiment, the contaminants can, for example, include oxides that float on the surface of the molten solder paste in the solder paste container 200.

[0040] As in the Fig. As shown in Figures 1-2, in one embodiment the automatic wire soldering system can further include a visual inspection system 240. The visual inspection system 240 is configured to check whether contaminants are present on the surface of the solder paste in the solder paste container 200. The cleaning brush 230 is activated to remove the contaminants promptly after they have been checked by the visual inspection system 240.

[0041] The following describes the work process of the automatic wire soldering system with reference to the Fig. 1 - 2 will be described.

[0042] First, the electrical product 10 is loaded onto the carrier 120; Then the robot 100 moves the carrier 120, on which the electrical product 10 is loaded, through the gripper 110; Then the robot 100 moves the electrical product 10 to insert the parts of the wires 11 to be soldered into the molten solder paste in the solder paste container 200;

[0043] The robot 100 then moves the electrical product 100 near the visual detection system 500, and the visual detection system 500 is operated to detect whether the actual solder length of a soldered portion of the wires 11 through the solder paste is equal to or greater than a predetermined length, and whether the actual solder quality of the soldered portion of the wires 11 corresponds to a predetermined solder quality. If the actual solder length is less than the first predetermined length, or if the actual solder quality does not correspond to the predetermined solder quality, the robot 100 repeatedly moves the wires 11 into the solder paste container 200 to continue soldering the wires 11 until the actual solder length is equal to or greater than the first predetermined length and the actual solder quality reaches the predetermined solder quality.

[0044] Then the cutting mechanism 400 is driven to cut off a segment of the end section of the soldered part of the wires 11.

[0045] Then the visual detection system 500 is operated to detect whether the length of the soldered part of the wires 11, after the segment of the end section of the soldered part has been cut off, is greater than the second predetermined length; if the length of the soldered part of the wires 11, after the segment of the end section of the soldered part has been cut off, is greater than the second predetermined length, the robot 100 repeatedly moves the wires 11 to the cutting mechanism 400 to repeatedly cut the soldered part of the wires 11 until the length of the soldered part of the wires 11 is equal to the second predetermined length.

[0046] In this way, the task of soldering the wires 11 of the electrical product 10 is completed.

[0047] It should be clear to the person skilled in the art that the preceding embodiments are intended to be illustrative and not limiting. For example, the person skilled in the art can make many modifications to the preceding embodiments, and various features described in different embodiments can be freely combined without contradicting each other in terms of configuration or principle.

[0048] Although several exemplary embodiments have been shown and described, it would be desirable for the person skilled in the art that various changes or modifications could be made to these embodiments without departing from the principles and spirit of the disclosure, the scope of which is defined in the claims and their equivalents.

[0049] As used herein, an element referred to in the singular and preceded by the word "an" or "it" shall be understood to mean that multiple elements or steps are not excluded unless such exclusion is expressly stated. Furthermore, references to "an embodiment" of the present invention shall not be construed as excluding the existence of additional embodiments that also include the aforementioned features. Unless expressly stated otherwise, embodiments that "comprise" or "have" an element or elements with a particular property may include additional such elements that do not have that property.

Claims

[1] Automatic wire soldering system comprising: a carrier (120) configured to load an electrical product (10) to be soldered; a robot (100) configured to grip and move the carrier (120) on which the electrical product (10) is loaded; a solder paste container (200) configured to hold a solder paste; and a heating device (220) configured to heat the solder paste contained in the solder paste container (200) so that the solder paste is melted into liquid, wherein the robot (100) is configured to move wires (11) of the electrical product (10) into the solder paste container (200) in order to solder the wires (11) together with the solder paste in the solder paste container (200). [2] The automatic wire soldering system according to claim 1, further comprising: a visual detection system (500) configured to detect whether an actual soldering length of a soldered part of the wires (11) through the solder paste is equal to or greater than a first predetermined length; and wherein, if the actual soldering length is less than the first predetermined length, the robot (100) repeatedly moves the wires (11) into the solder paste container (200) to further solder the wires (11) until the actual soldering length is equal to or greater than the first predetermined length. [3] The automatic wire soldering system according to claim 2, wherein the visual detection system (500) is further configured to detect whether an actual soldering quality of the soldered part of the wires (11) corresponds to a predetermined soldering quality; wherein, if the actual soldering quality does not correspond to the predetermined soldering quality, the robot (100) repeatedly moves the wires (11) into the solder paste container (200) to further solder the wires (11) until the actual soldering quality corresponds to the predetermined soldering quality. [4] The automatic wire soldering system according to claim 3, further comprising: a cutting mechanism (400) configured to cut off a segment of an end portion of the soldered part of the wires (11) such that the length of the soldered part of the wires (11) is equal to a second predetermined length which is smaller than the first predetermined length. [5] The automatic wire soldering system according to claim 4, wherein the visual detection system (500) is further configured to detect whether the length of the soldered part of the wires (11) after the segment of the end portion of the soldered part is cut off is greater than the second predetermined length; and wherein, when the length of the soldered part of the wires (11) after the segment of the end portion of the soldered part is cut off is greater than the second predetermined length, the robot (100) repeatedly moves the wires (11) to the cutting mechanism (400) to repeatedly cut the soldered part of the wires (11) until the length of the soldered part of the wires (11) is equal to the second predetermined length. [6] The automatic wire soldering system according to claim 4, further comprising: a waste recycling container (410) configured to receive the end portion cut off from the wires (11), wherein the waste recycling container (410) is arranged so that the end portion cut off from the wires (11) falls directly into the waste recycling container (410). [7] The automatic wire soldering system according to claim 1, further comprising: a solder paste syringe (300) configured to inject the solder paste into the solder paste container (200). [8] The automatic wire soldering system according to claim 7, further comprising: a first movement mechanism (310) configured to move the solder paste syringe (300) in a vertical direction to an injection position, wherein an injection opening of the solder paste syringe (300) is inserted into the solder paste container (200) when the solder paste syringe (300) is moved to the injection position. [9] The automatic wire soldering system according to claim 8, further comprising: a second movement mechanism (210) configured to move the solder paste container (200) in a horizontal direction to an injection station, wherein the solder paste container (200) is aligned with the solder paste syringe (300) in the vertical direction when the solder paste container (200) is moved to the injection station. [10] The automatic wire soldering system according to claim 7, wherein the amount of solder paste injected from the solder paste syringe (300) in a single injection completely fills the solder paste container (200). [11] The automatic wire soldering system according to claim 1, further comprising: a cleaning brush (230) configured to remove contaminants from a surface of the solder paste in the solder paste container (200). [12] The automatic wire soldering system according to claim 11, further comprising: a visual inspection system (240) configured to check whether there are any impurities on the surface of the solder paste in the solder paste container (200), wherein the cleaning brush (230) is controlled to remove the contaminants in a timely manner as soon as the contaminants are checked by the visual inspection system (240). [13] The automatic wire soldering system according to claim 12, wherein the wires (11) of the electrical product (10) to be soldered are clamped and fixed on the carrier (21), parts of the wires (11) to be soldered together protrude from the carrier (120) and are arranged to be inserted into the solder paste container (200).

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