switching device

Abstract

Circuit device (1), comprising: a printed circuit board (10); an electronic component (20) mounted on the circuit board (10); and a mounting element (50) on which the circuit board (10) and the one electronic component (20) are mounted, wherein the electronic component (20) comprises a main body (42) and an attachment section (47), the mounting element (50) comprises a base section (51) arranged along the printed circuit board (10) and a retaining rod section (52) extending from the base section (51) and penetrating the printed circuit board (10), and the circuit board (10) is attached to the retaining rod section (52), and the mounting section (47) is attached to the retaining rod section (52), each by means of a fastening element (A), characterized by the fact that the mounting section (47) extends from the main body (42) parallel to the circuit board (10); the retaining rod section (52) penetrates the attachment section (47), and the fastening element (A) is an adhesive.

Description

TECHNICAL AREA

[0001] The technology disclosed in the present description relates to a circuit device. TECHNICAL BACKGROUND

[0002] A circuit device is known that has a printed circuit board and electronic components mounted on the printed circuit board, which serves to establish and interrupt the current flow to electrical components in a vehicle.

[0003] In such a circuit device, some electronic components mounted on the circuit board are relatively large, such as inductors. Large electronic components are mechanically fastened to a circuit board, for example by screwing them in, because with solder there is a risk that cracks will form due to vibrations or similar forces during vehicle movement if their connections are only soldered to traces on the circuit board (see JP 2004 - 253 508 A).

[0004] US 9,788,430 B1 discloses a magnetic device for an electronic circuit comprising a printed circuit board (PCB). A first and a second magnetic component assembly can be electrically connected to the PCB. The second magnetic component assembly can be stacked on top of the first magnetic component assembly. The first magnetic assembly can be positioned between the second magnetic assembly and the PCB. Each magnetic component assembly can comprise a coil, a winding arranged on the coil, and a core extending through the coil. A second coil on the second magnetic component can be positioned either on a first core or on a first coil of the first magnetic component assembly.The stacked configuration of magnetic components can help reduce the space required on the circuit board for the electrical connection of the first and second magnetic component assemblies to the printed circuit board, which can help increase the power density of the magnetic device.

[0005] WO 2017 / 073145A1 discloses a coil arrangement mounted on a printed circuit board with a conductive circuit, wherein a coil is provided with a winding section having a rectangular wire wound on edge, wherein both ends of the rectangular wire have an extension section extending from the winding section in the direction of extension, and a step section extending from the extension section in a cutting direction intersecting the direction of extension, wherein the tip of the step section is formed into a connecting section extending in the direction of extension and connected to the conductive circuit, and wherein a pressure section is also provided for pressing the connecting section towards the side of the conductive circuit.

[0006] JP H05 - 67 043 U discloses a coil arrangement mounted on a printed circuit board with a conductive circuit, wherein a coil is provided with a winding section having a rectangular wire wound on edge, wherein both ends of the rectangular wire have an extension section extending from the winding section in the direction of extension, and a step section extending from the extension section in a cutting direction that intersects the direction of extension, wherein the tip of the step section is formed into a connecting section extending in the direction of extension and connected to the conductive circuit, and wherein a pressure section is also provided for pressing the connecting section towards the side of the conductive circuit.

[0007] US 2003 / 0116671A1 discloses a drum core consisting of a single-flange cylinder constructed such that a cylinder section has a flanged section integrally connected to one end while the other end is empty, and that a coil is wound around the cylinder section; and a counter-flange piece manufactured separately from the single-flange cylinder and having on its inside an engagement hole into which the other end of the cylinder section of the single-flange cylinder is inserted, the counter-flange piece being made of a different material than the single-flange cylinder. SUMMARY Technical Problem

[0008] In the configuration described above, a relatively large space is required around the screw mounting positions to secure the electronic components to the printed circuit board, and conductive circuitry and other electronic components cannot be placed in this space. Consequently, the density (packing density) of the printed circuit board can only be increased to a limited extent. Solution to the problem

[0009] A circuit device disclosed in the present description comprises the features of claim 1.

[0010] Since the space required to attach the electronic components to the circuit board can be reduced compared to a case where the electronic components are attached to the circuit board by screwing them in, the electronic components can be firmly attached to the circuit board according to the configuration described above without hindering an increase in the density (packing density) of the circuit board.

[0011] In the configuration described above, the fastening element is an adhesive. This configuration allows the printed circuit board and the mounting section to be attached to the support rod section cost-effectively and reliably.

[0012] In the configuration described above, one of the electronic components can be an inductor. Alternatively, one of the electronic components can be a transformer. The configuration described above is particularly suitable for mounting a relatively large and heavy electronic component, such as an inductor or a transformer, on a printed circuit board.

[0013] In the configuration described above, the mounting element can also serve as a heat dissipation element. Since the heat dissipation element in this configuration can also act as a mounting point for the circuit board and the single electronic component, an increase in the number of components can be avoided.

[0014] In the configuration described above, the mounting section, or the mounting section and the main body, can also be arranged on the printed circuit board with a gap between them, and another electronic component mounted on the circuit board can also be placed in this gap. This configuration makes it possible to increase the density (packing density) of the circuit device. Advantageous effects of the invention

[0015] According to the circuit device disclosed in the present description, it is possible to firmly attach electronic components to a printed circuit board without hindering an increase in the density (packing density) of the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a perspective view of a circuit device according to one embodiment. Fig. Figure 2 is a top view of the circuit device according to the embodiment. Fig. Figure 3 is a front view of the circuit device according to the embodiment. Fig. Figure 4 is a rear view of the circuit device according to the embodiment. Fig. Figure 5 is a right-side view of the circuit device according to the embodiment. Fig. Figure 6 is a cross-sectional view along a line AA in Fig. 2. Fig. Figure 7 is a cross-sectional view along a line BB in Fig. 2. Fig. Figure 8 is a perspective exploded view of the circuit device according to the embodiment. Fig. Figure 9 is a perspective view of a printed circuit board on which, in this embodiment, other electronic components are mounted. Fig. Figure 10 is a top view of the circuit board, on which other electronic components are mounted in the embodiment. Fig. Figure 11 is a perspective view of an inductor according to the embodiment. Fig. Figure 12 is a top view of the inductor according to the embodiment. Fig. Figure 13 is a front view of the inductor according to the embodiment. Fig. Figure 14 is a right side view of the inductor according to the embodiment. Fig. Figure 15 is a perspective view of a coil and a magnetic core according to the embodiment. Fig. Figure 16 is a perspective view of a heat dissipation element according to the embodiment. Fig. Figure 17 is a perspective view illustrating how the inductor is mounted on the circuit board in the embodiment. Fig. Figure 18 is a perspective view illustrating how the heat dissipation element is assembled with the circuit board on which the inductor is mounted in the embodiment. Fig. Figure 19 is an enlarged partial view of the surroundings of a retaining rod section in a circuit device according to a modification. DESCRIPTION OF THE EXECUTION FORMS

[0016] The following refers to the Fig. Figures 1 to 18 describe an embodiment. A circuit device 1 of the present embodiment is a converter device which is arranged between two power supply systems in a vehicle and converts a voltage between the power supplies.

[0017] As in Fig. As shown in Figure 8, the circuit device 1 comprises a printed circuit board 10, electronic components 20 and 60 which are mounted on the printed circuit board 10, and a heat dissipation element 50 (corresponding to a mounting element) which dissipates heat generated by the printed circuit board 10.

[0018] The printed circuit board 10 has a conventional configuration with conductive traces formed by circuit printing technology on the surface of an insulating board made of a glass-based material or a glass fleece base material. As in Fig. As shown in Figure 9, the circuit board 10 has a pair of first retaining rod insertion openings 11 and a pair of through openings 12.

[0019] The several electronic components 20 and 60 are located on a surface (a mounting surface 10F1: the upper surface in Fig. 4) - attached to the two surfaces front and back - of the circuit board 10.

[0020] One of the electronic components among the several electronic components 20 and 60 is the large inductor 20. The other electronic components 60 are relatively small and light components, such as a field-effect transistor (FET), a small inductor, a capacitor, or a resistor.

[0021] The inductor 20 comprises a coil 21, a magnetic core 31, and an inductor housing 41. As shown in Fig. As shown in Figure 15, the coil 21 is an edge-wound coil formed by winding a rectangular wire into a ring shape. The coil 21 comprises a winding section 22, which is wound so that it forms a tube as a whole, and a pair of connecting conductors 23 extending from the winding section 22 in the same direction (in Fig. 15 downwards) extend along the axial direction of the winding section 22 and are connected to a conductor track of the circuit board 10.

[0022] The magnetic core 31 is made of a magnetic material, such as ferrite, and is used as described in Fig. As shown in Figure 15, it is formed by joining a first core 32A and a second core 32B, which have the same shape and size. As shown in Fig. As shown in Figure 6, the first core 32A has a flat main wall section 33A, a column-like shaft section 34A projecting from a surface of the main wall section 33A toward its counterpart in the form of the second core 32B, and a pair of retaining wall sections 35A projecting in the same direction as the shaft section 34A from a pair of opposing side edges of the main wall section 33A. Similarly, the second core 32B also comprises a main wall section 33B, a shaft section 34B, and a pair of retaining wall sections 35B. The first core 32A and the second core 32B are arranged one above the other, such that the shaft sections 34A and 34B abut each other and the retaining wall sections 35A and 35B abut each other.

[0023] As in Fig. As shown in Figure 6, the coil 21 is arranged between the two main wall sections 33A and 33B such that the winding section 22 is wound around the shaft sections 34A and 34B.

[0024] The inductor housing 41 is made of synthetic resin and comprises, as shown in Fig. Figure 11 shows a housing body 42 (corresponding to a main body) in which the magnetic core 31 and the winding section 22 are received, a pair of mounting sections 47 which project from the housing body 42, and four leg sections 49 which also project from the housing body 42.

[0025] As in the Fig. 12, Fig. 13 and Fig. As shown in Figure 14, the main body of the housing 42 has a rectangular, plate-shaped rear wall section 43 and four wall sections (an upper wall section 44, a lower wall section 45, and a pair of side wall sections 46) extending from four sides of the rear wall section 43 and surrounding the magnetic core 31 and the winding section 22. It also has an opening section 42A on the side opposite the rear wall section 43. The lower wall section 45 is a rectangular, plate-shaped wall section facing the circuit board 10. The upper wall section 44 is a rectangular, plate-shaped wall section arranged parallel to the lower wall section 45 with a gap between them. The pair of side wall sections 46 are rectangular, plate-shaped wall sections connecting the lower wall section 45 and the upper wall section 44, and they are spaced apart from each other.

[0026] As in Fig. As shown in Figure 12, the pair of mounting sections 47 are plate-shaped sections which extend outwards from the pair of side wall sections 46, and each has a second retaining rod insertion opening 48.

[0027] As in Fig. As shown in Figure 14, the four leg sections are 49 column-like sections which extend vertically from the lower wall section 45.

[0028] As in Fig. As shown in Figure 7, the inductor housing 41 is arranged on the printed circuit board 10 such that the lower wall section 45 faces the printed circuit board 10. The four leg sections 49 are in contact with the mounting surface 10F1, and there is a relatively large gap between the main housing body 42 and the printed circuit board 10. The magnetic core 31 and the winding section 22 are contained within the main housing body 42, and the pair of connecting conductors 23 extends from the opening section 42A to the outside of the main body 42 and towards the printed circuit board 10. The distal ends of the pair of connecting conductors 23 are inserted into the pair of through-holes 12 of the printed circuit board 10 and soldered, so that the coil 21 is electrically connected to the conductors of the printed circuit board 10.

[0029] The heat dissipation element 50 is a metal element with high thermal conductivity, such as aluminum or an aluminum alloy, and it exhibits, as shown in Fig. Figure 16 shows a main plate section 51 (corresponding to a base section) and a pair of retaining bar sections 52 projecting from the main plate section 51. The main plate section 51 is a flat, plate-shaped section that is slightly larger than the printed circuit board 10, and, as shown in Fig. Figure 7 shows a relief-like recessed section 53 that can receive the distal ends of the connecting conductors 23. The pair of retaining rod sections 52 are round, rod-shaped sections which are supported by a surface (the upper surface in Fig. 6) of the main plate section 51, which faces the circuit board 10, project perpendicularly to the main plate section 51. The pair of retaining rod sections 52 is formed integrally with the main plate section 51, for example by die casting.

[0030] The main plate section 51 is along the other surface (a heat dissipation surface 10F2: the lower surface in Fig. 6) - arranged on the two surfaces front and back - of the circuit board 10, and is attached to the circuit board 10 by screws. As in Fig. As shown in Figure 6, one of the pair of retaining rod sections 52 is inserted through a first retaining rod insertion opening 11 and a second retaining rod insertion opening 48. On the circuit board 10, the circumferential edge section of the first retaining rod insertion opening 11 and the retaining rod section 52 are connected by an adhesive A (corresponding to a fastening element), and on an attachment section 47, the circumferential edge section of the second retaining rod insertion opening 48 and the retaining rod section 52 are connected by the adhesive A. Similarly, the other retaining rod section 52 is inserted into the other first retaining rod insertion opening 11 and the other second retaining rod insertion opening 48 and is connected to the circuit board 10 and the other attachment section 47 by the adhesive A.

[0031] As in Fig. As shown in Figure 4, other electronic components 60 mounted on the circuit board 10 are arranged in the space between the main housing body 42 and the circuit board 10 and between the two retaining rod sections 52.

[0032] An example of a method for manufacturing the circuit device 1 by assembling the printed circuit board 10, the inductor 20 and the heat dissipation element 50 is described below.

[0033] As in Fig. As shown in Figure 17, two positioning pins P for positioning the inductor 20 are first erected by a soldering device on the circuit board 10, on which other electronic components 60 are mounted. The two positioning pins P are column-like elements, each having an outer diameter that is essentially equal to that of the retaining rod section 52, and they are erected vertically with respect to the circuit board 10 such that each of the two positioning pins P is inserted at one end into the pair of first retaining rod insertion openings 11.

[0034] Next, the inductor 20 is mounted on the circuit board 10. By inserting the two positioning pins P into the two second retaining rod insertion holes 48, the four leg sections 49 are brought into contact with the mounting surface 10F1 of the circuit board 10 while the inductor 20 is positioned. The two connecting conductors 23 are inserted into the two through-holes 12 and connected by soldering.

[0035] Next, the positioning pins P are removed from the circuit board 10, and the circuit board 10 is mounted on the heat dissipation element 50. As shown in Fig. As shown in Figure 18, the two retaining rod sections 52 are inserted into the two first retaining rod insertion openings 11 and the two second retaining rod insertion openings 48 from the side of the heat dissipation surface 10F2, and the printed circuit board 10 is positioned over the main board section 51. The printed circuit board 10 and the main board section 51 are then fastened together by screws (not shown).

[0036] Next, as in Fig. As shown in Figure 1, the adhesive A is applied around the two retaining rod sections 52 on the mounting surface 10F1 of the printed circuit board 10. The adhesive A is also applied around the two retaining rod sections 52 in the mounting sections 47. As the adhesive A cures, the retaining rod sections 52 and the printed circuit board 10, as well as the retaining rod sections 52 and the mounting sections 47, are bonded together.

[0037] As described above, the circuit device 1 according to the present embodiment comprises the printed circuit board 10, the inductor 20 mounted on the printed circuit board 10, and the heat dissipation element 50 to which the printed circuit board 10 and the inductor 20 are mounted. The inductor 20 comprises the main housing body 42 and the mounting sections 47, which extend from the main housing body 42 parallel to the printed circuit board 10. The heat dissipation element 50 comprises the main plate section 51 arranged along the printed circuit board 10 and the retaining rod sections 52, which extend from the main plate section 51 and penetrate the printed circuit board 10 and the mounting sections 47. The printed circuit board 10 and the mounting sections 47 are fastened to the retaining rod sections 52 by the adhesive A.

[0038] Since, according to the configuration described above, the space required to mount the inductor 20 on the printed circuit board 10 can be reduced compared to the case where the inductor 20 is mounted to the printed circuit board 10 by screws, the inductor 20 can be firmly attached to the printed circuit board 10 without compromising the high density (packing density) of the printed circuit board 10. This configuration is particularly suitable for mounting a relatively large and heavy electronic component, such as the inductor 20, to the printed circuit board 10.

[0039] Furthermore, the circuit board 10 and the retaining rod sections 52, as well as the mounting sections 47 and the retaining rod sections 52, are fastened by the adhesive A. In this configuration, screwing the circuit board 10 is unnecessary, and the circuit board 10 and the mounting sections 47 can be attached to the retaining rod sections 52 cost-effectively and reliably.

[0040] The circuit board 10 and the inductor 20 are attached to each other by the heat dissipation element 50. Since, in this configuration, the heat dissipation element 50 can also serve as an element for attaching the circuit board 10 and the inductor 20, an increase in the number of components can be avoided.

[0041] The main housing body 42 of the inductor 20 is arranged with the space between the main housing body 42 and the printed circuit board 10, and other electronic components 60 mounted on the printed circuit board 10 are arranged in the space. With this configuration, it is possible to increase the density (packing density) of the circuit device 1. Other embodiments

[0042] The technology disclosed in the present description is not limited to the embodiments described above and illustrated in the drawings, and also includes, for example, the following various aspects. (1) In the embodiment described above, the printed circuit board 10 and the retaining rod sections 52, as well as the printed circuit board 10 and the mounting sections 47, are fastened by the adhesive A. However, the mounting sections and the retaining rod sections can also be fastened, for example, by screwing nuts onto the retaining rod sections, each of which has a screw thread on its outer circumferential surface. (2) As in Fig.As shown in Figure 19, for example, a basic section of each retaining rod section 71 received in the first retaining rod insertion opening 11 can also be a section with an enlarged diameter 72, which has a larger diameter than the other section (a section with a reduced diameter 73). Since the adhesive A also adheres to a step surface 74 between the section with the reduced diameter 73 and the section with the enlarged diameter 72, the adhesion between the printed circuit board 10 and the retaining rod section 71 can be further enhanced in this configuration. (3) In the embodiment described above, the retaining rod sections 52 are formed integrally with the main plate section 51. However, the retaining rod sections can also be formed separately from the base section, and they can also be attached to the base section by gluing, welding, screwing or the like. (4) The fastening element may not be a heat dissipation element, but it is preferably an element made of a material with a certain strength, such as metal. (5) In the embodiment described above, the inductor 20 is arranged with a gap between the inductor 20 and the printed circuit board 10, and other electronic components 60 mounted on the printed circuit board 10 are arranged in the gap. However, the electronic components can also be arranged in contact with the printed circuit board. (6) In the embodiment described above, one electronic component is a large inductor, but one electronic component can also be a transformer. REFERENCE MARK LIST 1 Circuit device 10 circuit boards 20 inductor 42 Main housing body 47 Installation section 50 Heat dissipation element 51 Main plate section 52 retaining bar section A glue 60 electronic components

Claims

[1] Circuit device (1) comprising: a printed circuit board (10); an electronic component (20) mounted on the circuit board (10); and a mounting element (50) on which the circuit board (10) and the one electronic component (20) are mounted, wherein the electronic component (20) comprises a main body (42) and an attachment section (47), the mounting element (50) comprises a base section (51) arranged along the printed circuit board (10) and a retaining rod section (52) extending from the base section (51) and penetrating the printed circuit board (10), and the circuit board (10) is attached to the retaining rod section (52), and the mounting section (47) is attached to the retaining rod section (52), each by means of a fastening element (A), characterized by , that the mounting section (47) extends from the main body (42) parallel to the circuit board (10); the retaining rod section (52) penetrates the attachment section (47), and the fastening element (A) is an adhesive. [2] Circuit device (1) according to claim 1, wherein one electronic component (20) is an inductor. [3] Circuit device (1) according to claim 1, wherein one electronic component (20) is a transformer. [4] Circuit device (1) according to one of claims 1 to 3, wherein the mounting element (50) is a heat dissipation element. [5] Circuit device (1) according to one of claims 1 to 4, wherein the mounting section (47) or the mounting section (47) and the main body (42) is / are mounted on the circuit board (10) with a gap between them, and another electronic component (60) mounted on the circuit board (10) is arranged in the gap.

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